JPH11288927A - 排気配管加熱用手段を備えた半導体製造装置 - Google Patents
排気配管加熱用手段を備えた半導体製造装置Info
- Publication number
- JPH11288927A JPH11288927A JP9323598A JP9323598A JPH11288927A JP H11288927 A JPH11288927 A JP H11288927A JP 9323598 A JP9323598 A JP 9323598A JP 9323598 A JP9323598 A JP 9323598A JP H11288927 A JPH11288927 A JP H11288927A
- Authority
- JP
- Japan
- Prior art keywords
- exhaust pipe
- heater
- exhaust
- manufacturing apparatus
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 40
- 239000004065 semiconductor Substances 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 239000006227 byproduct Substances 0.000 claims abstract description 25
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 15
- 239000002994 raw material Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002210 silicon-based material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 16
- 238000009825 accumulation Methods 0.000 abstract description 4
- 238000007689 inspection Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 4
- 239000000047 product Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 11
- 229920002379 silicone rubber Polymers 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 239000004945 silicone rubber Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- 235000019270 ammonium chloride Nutrition 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Chemical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9323598A JPH11288927A (ja) | 1998-04-06 | 1998-04-06 | 排気配管加熱用手段を備えた半導体製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9323598A JPH11288927A (ja) | 1998-04-06 | 1998-04-06 | 排気配管加熱用手段を備えた半導体製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11288927A true JPH11288927A (ja) | 1999-10-19 |
| JPH11288927A5 JPH11288927A5 (enExample) | 2005-09-22 |
Family
ID=14076878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9323598A Pending JPH11288927A (ja) | 1998-04-06 | 1998-04-06 | 排気配管加熱用手段を備えた半導体製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11288927A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100904025B1 (ko) * | 2008-11-24 | 2009-06-22 | 문제운 | 반도체 설비의 가스배출관 냉각용 자켓 및 그 제조방법 |
| JP2009176942A (ja) * | 2008-01-24 | 2009-08-06 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| CN113430644A (zh) * | 2021-06-22 | 2021-09-24 | 北京北方华创微电子装备有限公司 | 排气装置及半导体设备 |
| WO2023002595A1 (ja) * | 2021-07-21 | 2023-01-26 | 株式会社Kokusai Electric | ヒータアセンブリ、基板処理装置及び半導体装置の製造方法 |
-
1998
- 1998-04-06 JP JP9323598A patent/JPH11288927A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009176942A (ja) * | 2008-01-24 | 2009-08-06 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| KR100904025B1 (ko) * | 2008-11-24 | 2009-06-22 | 문제운 | 반도체 설비의 가스배출관 냉각용 자켓 및 그 제조방법 |
| CN113430644A (zh) * | 2021-06-22 | 2021-09-24 | 北京北方华创微电子装备有限公司 | 排气装置及半导体设备 |
| CN113430644B (zh) * | 2021-06-22 | 2023-09-08 | 北京北方华创微电子装备有限公司 | 排气装置及半导体设备 |
| WO2023002595A1 (ja) * | 2021-07-21 | 2023-01-26 | 株式会社Kokusai Electric | ヒータアセンブリ、基板処理装置及び半導体装置の製造方法 |
| KR20240038653A (ko) * | 2021-07-21 | 2024-03-25 | 가부시키가이샤 코쿠사이 엘렉트릭 | 히터 어셈블리, 기판 처리 장치 및 반도체 장치의 제조 방법 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Effective date: 20050331 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050414 |
|
| A977 | Report on retrieval |
Effective date: 20050727 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20060404 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060725 |