JPH11260271A - Manufacture of electromagnetic wave shielding plate and the electromagnetic wave shielding plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electromagnetic wave shielding plate which is provided with a mesh formed from a metal thin film that can cope with such aspects as quality and productivity. SOLUTION: This manufacturing method of an electromagnetic wave shielding plate that is used by installing it in front of a display and has an electromagnetic wave shielding property and transparency, by forming a conductive substance into a predetermined shape on one or both of the surfaces of a transparent board. In this case, this method comprises sequentially (a) a recessed part forming process to form recessed parts having a predetermined shape on one or both of the surfaces of the transparent board, (b) a conductive thin film forming process to form, on the recessed part formation side surface of the transparent board including the recessed part formation surface, and a conductive thin film on which metal can be electrodeposited, (c) a paste filling process to fill an etching-resistance resin paste only in the recessed parts, (d) an etching process to remove the conductive thin film in only a region exposed from the etching-resistance resin paste through etching, (e) a paste removing process to remove the etching-resistant resin paste remaining in the recessed parts, and an electrodepositing process to form a conductive metal on the conductive thin film by means of electropositing, after the paste removing process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method in which a conductive metal thin film is formed by plating on a conductive thin film used on a front surface of a display in order to shield electromagnetic waves generated from an electromagnetic wave source such as a display electron tube. The present invention relates to a method for manufacturing an electromagnetic wave shielding plate and an electromagnetic wave shielding plate.

[0002]

2. Description of the Related Art Conventionally, an electronic device for generating an electromagnetic wave used directly by a person in close proximity, for example, an electronic tube for a display such as a plasma display, has a standardized intensity of electromagnetic wave emission in consideration of the adverse effect of the electromagnetic wave on the human body. It is required to keep within. Further, in a plasma display panel (hereinafter also referred to as a PDP), light emission uses plasma discharge, so that the frequency band is 30 MHz to 13 MHz.
In order to leak unnecessary electromagnetic waves of 0 MHz to the outside, it is required to suppress the electromagnetic waves as much as possible so as not to adversely affect other devices (for example, information processing devices and the like). In response to these demands, generally, in order to remove or attenuate electromagnetic waves flowing out of the device from an electronic device that generates electromagnetic waves,
An electromagnetic wave shield that covers an outer peripheral portion of an electronic device or the like that generates an electromagnetic wave with a suitable conductive member is employed. In a display panel such as a plasma display panel, an electromagnetic wave shielding plate having good transparency is generally provided on the front surface of the display.

The basic structure of the electromagnetic wave shielding plate is relatively simple. For example, a transparent conductive film such as an indium-tin oxide film (ITO film) is formed on a transparent glass or plastic substrate by vapor deposition or sputtering. A transparent glass or plastic substrate on which a suitable metal screen such as a wire mesh is adhered, or a transparent glass or plastic substrate with a metal thin film on the entire surface by electroless plating or evaporation. Is formed, and the metal thin film is processed by a photolithography method or the like to provide a mesh made of a fine metal thin film.

An electromagnetic wave shielding plate in which an ITO film is formed on a transparent substrate is excellent in transparency, generally has a light transmittance of about 90%, and can form a uniform film on the entire surface of the substrate. Therefore, when used for a display or the like, there is no concern about occurrence of moire or the like due to the electromagnetic wave shielding plate. However, in the case of an electromagnetic wave shielding plate having an ITO film formed on a transparent substrate, a vapor deposition or sputtering technique is used to form the ITO film, so that a manufacturing apparatus is expensive and productivity is generally inferior. Therefore, there is a problem that the price of the electromagnetic wave shielding plate itself as a product becomes expensive. Further, the electromagnetic wave shielding plate having an ITO film formed on a transparent substrate has a conductivity that is at least one order of magnitude lower than that of an electromagnetic wave shielding plate having a mesh made of a metal thin film, and therefore, the electromagnetic wave emission is relatively weak. It is effective for target objects, but when used for strong objects, there is a problem that the shielding function is insufficient, leaked electromagnetic waves are emitted, and it may not be possible to meet the standard value. is there.
In the electromagnetic wave shielding plate in which the ITO film is formed on the transparent substrate, the conductivity is improved to some extent by increasing the thickness of the ITO film in order to increase the conductivity, but in this case, the transparency is significantly reduced. The problem occurs. In addition, there is a problem that the manufacturing cost becomes higher due to the further increase in thickness.

When an electromagnetic wave shielding plate in which a metal screen is attached to a transparent glass or plastic substrate surface is used,
Alternatively, when an appropriate metal screen such as a wire mesh is directly adhered to the display surface, it is simple and the cost is low, but the transmittance of an effective mesh (100-200 mesh) metal screen is 50%. % Or less,
It has the serious drawback of extremely dark displays.

[0006] In addition, since a mesh formed of a metal thin film is formed on the surface of a transparent glass or plastic substrate, the outer shape is processed by etching using photolithography, so that fine processing is possible and a high aperture ratio (high transmittance) is obtained. rate)
Since the mesh can be formed and the mesh is formed by a metal thin film, the conductivity is very high as compared with the above-mentioned ITO film and the like, and an advantage that strong electromagnetic wave emission can be shielded. Have. However, the manufacturing process is complicated and complicated, the productivity is low, and the production cost is inevitable.

[0007] As described above, each electromagnetic wave shielding plate has advantages and disadvantages, and is selected and used according to the application. Among them, an electromagnetic wave shielding plate in which a mesh made of a metal thin film is formed on the surface of a transparent glass or plastic substrate is good in terms of electromagnetic wave shielding and light transmission, and has recently been placed on the front of a display panel such as a plasma display panel. , And has been used for electromagnetic wave shielding.

Here, an electromagnetic wave shielding plate in which a mesh made of a metal thin film is formed on a transparent glass or plastic substrate surface is shown in FIG. 6 and will be briefly described. FIG. 6A is a plan view of the electromagnetic wave shielding plate, and FIG. 6B is a plan view of A1 in FIG.
FIG. 6C is a cross-sectional view taken along line -A2, and is an enlarged view of a part of the mesh portion. FIGS. 6A and 6C show the X direction and the Y direction for clarifying the positional relationship and the mesh shape.
The direction is displayed. The electromagnetic wave shielding plate shown in FIG.
An electromagnetic wave shielding plate for electromagnetic wave shielding used to be placed on the front of a display such as P, and having a grounding frame portion and a mesh portion formed on one surface of a transparent substrate.
Is formed of the same metal thin film as the mesh portion around the outer periphery of the mesh portion 410 so as to surround the screen area of the display when used on the front of the display. The mesh part 410 has a plurality of lines 470 provided in parallel in the Y and X directions at predetermined pitches Px and Py, respectively, as shown partially enlarged in FIG. And 450 groups of lines.

[0009]

For this reason, the electromagnetic wave shielding plate provided with a mesh made of a metal thin film on a transparent substrate as shown in FIG. 6 has a large quantity in view of its transparency and electromagnetic wave shielding properties. As a result, a method for efficiently producing the electromagnetic wave shielding plate with high productivity has been required. According to the present invention, there is provided a method of manufacturing an electromagnetic shielding plate having electromagnetic wave shielding and transparency by forming a conductive metal thin film on a conductive thin film of a predetermined shape on one or both surfaces of a transparent substrate. However, it is an object of the present invention to provide a manufacturing method which can sufficiently cope with quality and productivity.

[0010]

A method of manufacturing an electromagnetic wave shielding plate according to the present invention is used by being placed on the front of a display.
A method for producing an electromagnetic wave shielding plate having an electromagnetic wave shielding property and a see-through property by forming a conductive substance in a predetermined shape on one or both surfaces of a transparent substrate, comprising: (a) one or both surfaces of a transparent substrate in order; A concave portion forming step of forming a concave portion of a predetermined shape,
(B) including a concave portion forming surface, on the concave portion forming side surface of the transparent substrate,
A conductive thin film forming step of forming a conductive thin film capable of electrodepositing a metal, (c) a paste filling step of filling only the concave portions with an etching resistant resin paste, and (d) an etching resistant resin paste of the conductive thin film. After the etching step of removing only the exposed region by etching, (e) a paste removing step of removing the etching resistant resin paste remaining in the concave portion, and (f) a paste removing step, a conductive thin film is formed. An electrodeposition step of electrodepositing a conductive metal thereon. Then, after the paste filling step described above, if necessary, a wiping process,
A plasma etching process is performed. In the above, the conductive thin film is formed by vacuum deposition, sputtering, or electroless plating. In the above, the thickness of the conductive thin film is in the range of 500 to 3 μm. Further, in the above, the formation of the concave portion on the transparent substrate is a convex press, machining such as cutting, or
By etching using photolithography technology,
It is characterized by being directly processed and formed on a transparent substrate. Alternatively, a transparent resin layer for forming a concave portion is provided on the concave portion forming side of the transparent substrate, and the concave portion is formed in the resin layer.
Further, in the above description, the transparent substrate is provided by providing a transparent resin layer in which a concave portion is formed in advance on the carrier film surface, and transferring the resin layer to a transparent base plate material such that the concave portion side is on the outside. It is characterized by being. Further, the transparent substrate is made of glass or plastic alone, or a laminate thereof. In the above, the concave portion is formed only on one surface of the transparent substrate, and the concave portion is formed on the one surface in a mesh shape. Also,
In the above, the concave portions are formed on both surfaces of the transparent substrate, and the concave portions on both surfaces are provided in a large number in parallel lines for each surface, and the concave portions on both surfaces are provided at a predetermined angle with respect to each other. When the substrate is viewed through transmission, the recesses on both sides are meshed together.

The electromagnetic wave shielding plate of the present invention is characterized by being manufactured by the method of manufacturing an electromagnetic wave shielding plate of the present invention.

[0012]

According to the method of manufacturing an electromagnetic wave shielding plate of the present invention, it is possible to provide a method of manufacturing an electromagnetic wave shielding plate that can sufficiently cope with quality and productivity by adopting such a configuration. Specifically, in order, (a) a concave portion forming step of forming a concave portion of a predetermined shape on one or both surfaces of a transparent substrate;
(B) including a concave portion forming surface, on the concave portion forming side surface of the transparent substrate,
A conductive thin film forming step of forming a conductive thin film capable of electrodepositing a metal, (c) a paste filling step of filling only the concave portions with an etching resistant resin paste, and (d) an etching resistant resin paste of the conductive thin film. After the etching step of removing only the exposed region by etching, (e) a paste removing step of removing the etching resistant resin paste remaining in the concave portion, and (f) a paste removing step, a conductive thin film is formed. This is achieved by having an electrodeposition step of electrodepositing a conductive metal thereon.

After the paste filling step, if necessary, a wiping process and a plasma etching process are performed.
This makes it possible to remove a thin paste residue that has protruded from the recess. As a method for forming a concave portion on a transparent substrate,
Examples include mechanical processing such as convex pressing and cutting, and etching processing using an etching resistant film by photolithography technology. Processing by these can be fine processing. The width of the concave portion is about 5 to 50 μm, preferably 10 to 20 μm. The depth of the recess is preferably 3 to 20 μm. In addition, in the electrodeposition step of the conductive metal thin film, since the line width is large, it is preferable to form a narrow concave portion in consideration of the target line width (for example, 5 to 10 μm). A transparent resin layer for forming the concave portion is provided on the concave portion forming side of the transparent substrate, and by forming the concave portion in the resin layer, the degree of freedom in forming the concave portion and further in all the steps is increased. To make it bigger. For example, a transparent substrate is formed by previously providing a transparent resin layer having a concave portion formed on a carrier film surface, and transferring the resin layer to a transparent base plate material such that the concave portion is on the outside. Thereby, an appropriate printing method or a photolithography method can be used when forming the concave portion, and by being able to process in a long roll shape, the process control can be easily performed or mass productivity can be improved.
As a result, the cost of the product can be reduced. In addition, as a transparent substrate, glass or a plastic simple substance, a laminated body of these, etc. are mentioned.

Since the conductive thin film has a thickness of 500 to 3 μm, it can be formed relatively easily by vacuum deposition, sputtering, or electroless plating, thereby facilitating the etching process, and has a high conductivity in the electrodeposition process. This enables the formation of a metal thin film.

[0015]

Embodiments of the present invention will be described with reference to the drawings. First, an embodiment of a method for manufacturing an electromagnetic wave shielding plate of the present invention will be described. FIG. 1 is a manufacturing process sectional view showing a first example of an embodiment of a method of manufacturing an electromagnetic wave shielding plate of the present invention, and FIG. 2 is a manufacturing process sectional view showing a second example of the embodiment. All show the manufacturing process of the electromagnetic wave shielding plate for electromagnetic wave shielding used on the front of a display such as a PDP. FIGS. 1 and 2 show only a step of forming a conductive metal thin film serving as an electromagnetic wave shielding part for easy understanding. 1 and 2,
110 is a transparent substrate, 120 is a concave portion, 125 is a concave portion forming surface, 130 is a conductive thin film, 140 is a resin paste, 15
0 is a conductive metal thin film, 160 is a protective film, 210A is a transparent substrate, 210 is a transparent base material, 220 is a concave portion, 22
5 is a concave surface, 230 is a conductive thin film, 240 is a resin paste, 250 is a conductive metal thin film, 260 is a protective film, 2
70 is a transparent resin layer, and 280 is a carrier film. A first example of an embodiment of the method of manufacturing an electromagnetic wave shielding plate shown in FIG. 1 described below based on FIG. 1 based on FIG. 1 is made of a single material such as glass or plastic. A mesh-shaped concave portion is formed only on one surface of a transparent substrate, and a conductive material is formed in a mesh shape in the concave portion. First, a transparent substrate 110 is prepared (FIG. 1A,
A predetermined mesh-shaped recess 1 only on one side of the transparent substrate 110
20 is formed. (FIG. 1 (b)) The formation of the recess is usually
Mechanical processing such as convex press or cutting, or etching using an etching-resistant film by photolithography is employed in terms of fine processing. The width of the recess is about 5 to 50 μm, preferably 10 to 20 μm.
m. The depth of the recess is preferably 3 to 20 μm.
The shape of the concave portion is not limited to the V-shaped groove, but may be a U-shaped or other shape. In the electrodeposition step of the conductive metal thin film, the line width is large, so that the target line width is 5 to 10 times larger.
It is preferable to form a recess having a thickness of μm. Transparent substrate 1
As the plastic film as 10, specifically, a triacetyl cellulose film, a diacetyl cellulose film, an acetate butyrate cellulose film, a polyether sulfone film, a polyacrylic resin, a polyurethane resin film, a polyester film, a polycarbonate film, , A polysulfone film, a polyether film, a trimethylpentene film, a polyetherketone film, a (meth) acrylonitrile film and the like can be used, and a biaxially stretched polyester is particularly preferable because it has excellent transparency and durability. The thickness is usually preferably about 8 μm to 1000 μm, but is not limited thereto. The light transmittance of the transparent film is ideally 100%, but it is preferable to select a light transmittance of 80% or more.

Then, a conductive thin film 130 capable of electrodepositing metal is provided on the side surface of the transparent substrate where the concave portion is formed, including the concave portion forming surface 125.
To form (FIG. 1 (c)) The conductive thin film 130 has a thickness of 500 to 3 μm and is formed by vacuum evaporation, sputtering, and electroless plating in order to facilitate etching in a later step and enable electrodeposition. Conductive thin film 13
0 is preferably a metal thin film such as copper from the viewpoint of processability. Next, only the concave portion 120 is filled with the etching-resistant resin paste 140 by a squeegee method, and dried. (FIG. 1 (d)) Thereafter, if necessary, excess resin paste 140 is removed by wiping or ashing by plasma etching. Examples of the etching-resistant resin paste 140 include, but are not limited to, inexpensive general printing inks (preferably, resist inks) or curable water-soluble casein, PVA, waxes, and the like. Conductive thin film 130 in later process
It is preferable to use a material that can withstand the above etching and has good releasability. Next, only the conductive thin film 130 exposed from the etching-resistant resin paste 140 is removed by etching. (FIG. 1E) An acid solution or an alkali solution such as a ferric chloride solution is used for etching. Next, the etching-resistant resin paste 1 remaining in the recess 120 is formed.
Remove 40. (FIG. 1F) Alkaline water and warm water can be used for the resin paste 140 made of a water-soluble resin (casein, PVA, etc.), which is convenient. An organic solvent is used for removing inks. Thereafter, if necessary, the surface of the conductive thin film 130 is exposed, and a pre-electrodeposition treatment using an acid or alkali aqueous solution is performed, and then a conductive metal thin film 150 is formed on the conductive thin film 130 by electrodeposition. (Figure 1
(G) Copper is the best as the conductive metal thin film 150 to be formed by electrodeposition, but is not necessarily limited thereto. still,
The thickness of the metal thin film for effectively shielding electromagnetic waves is preferably as large as possible in terms of shielding electromagnetic waves, but is preferably about 0.2 to 10 μm.

In this manner, the conductive metal thin film 150 for shielding electromagnetic waves is formed on one surface of the transparent substrate 110, and thereafter, the surface of the metal thin film 150 is subjected to a blackening treatment. (FIG. 1 (h)) This is for obtaining an anti-reflection effect when used in front of a display such as a PDP. Then, after washing and drying, for surface smoothing and protection,
A protective film treatment is performed. (FIG. 1 (i)) The protective film preferably contains a surface hardener and an infrared absorber.

In the case of a grounding frame usually provided around a conductive metal thin film serving as an electromagnetic wave shielding part, a part of the conductive thin film 130 is covered with an etching resistant resist in a predetermined shape, and the conductive thin film in the recess is formed. When performing electrodeposition on 130,
At the same time, it may be formed by forming a metal thin film.
Alternatively, after etching the conductive thin film 130 and before performing electrodeposition on the conductive thin film 130 in the concave portion, a conductive thin film is formed in a predetermined shape to a thickness of about 500 ° to 1 μm by sputtering or vacuum evaporation, and A metal thin film may be further formed at the time of electrodeposition, but the method is not limited thereto.

In the process of the first example of the embodiment shown in FIG. 1, the mesh-shaped concave portion 120 is formed only on one side of the transparent substrate 110, and the metal thin film 150 is formed only on this one side. When the transparent substrate is viewed through transmission, the concave portions are formed on the transparent substrate 1 such that the concave portions on both sides are meshed together.
A large number of parallel lines may be provided for each of the ten surfaces. In this case, the process shown in FIG. 1 only needs to be performed on both surfaces of the transparent substrate 110, and the same manufacturing is possible.

Next, a second example of the embodiment will be described with reference to FIG. In the second example, the following processing is performed on a transparent plate 210 on which a conductive metal thin film 250 having a predetermined shape is formed. A transparent resin layer 270 having a recess 220 formed thereon is provided in advance on the surface of the carrier film 280, and the resin layer 270 is formed by transferring the resin layer 270 to the surface of the transparent base plate 210 such that the recess 220 is on the outside. After the transfer, the conductive metal thin film 150 is formed in the concave portion 220. In addition, instead of the carrier film 280,
Other substrates may be used. First, a transparent resin layer 270 in which a concave portion 220 is formed in advance on the surface of the carrier film 280 (actually, a male type (convex portion) is fixedly provided) is provided. (FIG. 2 (a2)) Next, the entire transparent resin layer 270 in which the recess 220 is formed is transferred to one surface of a transparent base plate 210 (FIG. 2 (a1)) prepared from the carrier film 280 side, and a transparent base is formed. The transparent substrate 210 is composed of the plate material 210 and the transparent resin layer 270. (FIG. 2B) The formation of the concave portion in the transparent resin layer 270 is usually performed by a convex press or the like, and thereafter, the transparent resin layer 270 is placed on the carrier film 280 with the side surface on which the concave portion is formed. The transparent resin layer 270 is laminated on the film 280, and an adhesive is provided on the other side of the transparent resin layer 270 that is not the concave side.
Then, the transparent resin layer 270 is transferred from the carrier film 280 to the transparent base plate 210 via the adhesive. After the transfer, a curing treatment of the adhesive is performed as necessary. Hereinafter, as in the first example of the embodiment, the conductive thin film 230 is formed in the concave portion 220.
(C)) Only the recesses were filled with the etching resistant paste 240 by the squeegee method and dried (FIG. 2 (d)).
Then, the conductive thin film 2 is used as an etching resistant mask.
The portion exposed from the paste 240 of FIG. 30 is removed by etching (FIG. 2E), and the paste is removed (FIG. 2E).
(F)) A conductive metal thin film 250 is electrodeposited on the remaining conductive thin film 230. (FIG. 2 (g)) As the material of the transparent resin layer 270, the same plastic material as mentioned for the material of the transparent substrate 110 in the first example can be used, and in particular, biaxially stretched polyester is transparent and durable. It is preferable because it is excellent. Transparent base plate 210
For example, glass or plastic described in the first example can be used. At the time of electrodeposition, a pre-electrodeposition treatment is performed if necessary. Further, similarly to the first example, the surface of the metal thin film 250 is blackened (FIG. 2 (h)), and a protective film forming process is performed. (FIG. 2 (i)) The shape of each part, processing conditions, and the like are the same as in the first example.
As in the first example, the grounding frame portion usually provided around the conductive metal thin film serving as the electromagnetic wave shield portion is formed by covering a part of the conductive thin film 230 with an etching resistant resist in a predetermined shape. When electrodeposition is performed on the conductive thin film 230, a metal thin film may be formed at the same time. Alternatively, after etching the conductive thin film 230 and before performing electrodeposition on the conductive thin film 230 in the concave portion, a conductive thin film is formed in a predetermined shape to a thickness of about 500 ° to 1 μm by sputtering or vacuum evaporation, and A metal thin film may be further formed at the time of electrodeposition, but the present invention is not limited thereto.

Next, an embodiment of the electromagnetic wave shielding plate of the present invention will be described. FIG. 3A is a schematic perspective view showing a first example of the embodiment of the electromagnetic wave shielding plate of the present invention, and FIG.
FIG. 3 is an enlarged view of a part of the mesh portion.
(C) is a diagram showing a cross section taken along line A3-A4 in FIG. 3 (b), FIG. 4 is a schematic perspective view showing a second example of the embodiment, and FIGS. 4 (b) and (a) are diagrams. FIG. 4B is a partially enlarged view of the shape of the metal thin film line on the B1 side in FIG.
(B) is a partially enlarged view of the shape of the metal thin film line on the B2 side in FIG. 4 (a), and FIG. 4 (c) is a view in FIG.
(A), FIG. 4 (b) is a diagram showing a mesh formed by the metal thin film line of (b), FIG. 5 (a) is a schematic perspective view showing a third example of the embodiment, FIG. 5B is an enlarged view of a part of the mesh portion, and FIG.
FIG. 6 is a diagram showing a cross section taken along line C3-C4 in FIG. 3 to 5 show an electromagnetic wave shielding plate for electromagnetic wave shielding which is used in front of a display such as a PDP. 3, 4, and 5, 110 is a transparent substrate, 130 is a conductive thin film, 140 is a resin paste,
50 is a conductive metal thin film, 155 is a blackened portion, 160 is a protective film, 190 is a mesh, 193 and 195 are lines, 19
7 is a ground frame, 210A is a transparent substrate, 210 is a transparent base material, 230 is a conductive thin film, 240 is a resin paste, 250 is a conductive metal thin film, 260 is a protective film, 270
Is a transparent resin layer, 280 is a carrier film, 290 is a mesh, 293 and 295 are lines.

A first example of the embodiment of the electromagnetic wave shielding plate of the present invention shown in FIG. 3 is manufactured by the manufacturing process shown in FIG. 1, and has a mesh-shaped metal thin film 150 provided on one surface thereof. The structure of a cross section taken along line A3-A4 in FIG. 3B is as shown in FIG. The mesh 190 made of the conductive metal thin film 150 is provided only on the A1 side surface, and the transparent substrate 110 remains on the A2 side surface.

FIG. 4 shows a second embodiment of the electromagnetic wave shielding plate according to the present invention, in which a single transparent substrate 110 is provided with concave portions on both surfaces and is formed of a conductive metal thin film 150 on both surfaces. A group of lines parallel to each other is provided. As shown in FIG. 4C, when the B2 side is viewed from the B1 side, the conductive metal thin film 15 on both surfaces of the transparent substrate 110 is formed.
The group of the line 193 and the group of the line 195 made of 0 form a mesh. Even in this manner, an electromagnetic wave shielding effect can be obtained.

The third embodiment of the electromagnetic wave shielding plate of the present invention shown in FIG. 5 is manufactured by the manufacturing process shown in FIG.
Is formed by transferring the transparent resin layer 270 with the concave portion 220 facing outward, and forming a mesh 290 made of the conductive metal thin film 250 in the concave portion. The mesh 290 made of the conductive metal thin film 250 is provided only on the C1 side surface, and the transparent base plate 210 remains on the C2 side surface.

[0025]

Next, the present invention will be further described with reference to specific examples of the present invention. The example uses the manufacturing method of the first example of the embodiment of the manufacturing method of the electromagnetic wave shielding plate shown in FIG. 1, and is used for the plasma display of the first example of the embodiment of the electromagnetic wave shielding plate shown in FIG. 3. An electromagnetic wave shielding plate was manufactured. An embodiment of the method for manufacturing an electromagnetic wave shielding plate will be described with reference to FIG. 1, and an embodiment of the electromagnetic wave shielding plate will be described with reference to FIG. First, an embodiment of a method for manufacturing an electromagnetic wave shielding plate will be described. (Example 1) First, a single glass substrate was used as the transparent substrate 110 (FIG. 1 (a)), and one surface thereof was formed into a V-shaped groove with a width of 15 μm and a depth of 10 μm by mechanical cutting. A recess 120 is formed (FIG. 1B), and electroless plating is performed under the following plating conditions, and a conductive film made of a copper thin film is formed on the entire side surface on which the recess 120 is formed, including the recess forming surface 125 of the transparent substrate 110. A thin film 130 was formed to a thickness of 1000 mm (FIG. 1 (c)). (Plating conditions) Bath composition: OPC750M (manufactured by Okuno Pharmaceutical Co., Ltd.) OPC750MA 100 ml / l OPC750MB 100 ml / l OPC750MC 2-5 ml / l Liquid temperature 50 ° C. Next, only the concave portion 120 is filled with the etching resistant resin paste 140. (FIG. 1 (d)) For forming the etching resistant resin paste 140, a general-purpose etching resist (acrylic) for screen printing, which is easily available for processing a printed circuit board, was used. The squeegee method was used to fill the recesses in the same manner as the screen, and after filling, the coating was once dried, and then the ground frame (such as terminals for external contacts) was subjected to protection printing by screen printing. Next, the exposed copper thin film is removed by etching using ferric chloride (38 ° Baume solution) (FIG. 1E), and after etching, an etching resist (resin paste 140)
Was dissolved and removed with an aqueous alkali solution (FIG. 1 (f)) to form a mesh for shielding electromagnetic waves with a copper thin film and a frame for grounding (terminals and the like). Next, the formed conductive thin film 130
On top, copper was laminated with a thickness of 8 μm using the following electrodeposition solution. (FIG. 1 (g)) (electrodeposition solution composition) bath composition: copper pyrophosphate bath _{Cu 2 P 2 O 7 · 3H} 2 O 49g / l K 4 P 2 O 7 340g / l MH 4 OH (28%) 3ml / L pH 8.8 P ratio (P ₂ O ₇ ⁴⁻ / Cu ²⁺ ) 7.0 Solution temperature 55 ° C. Then, the surface of plated copper (corresponding to conductive metal thin film 150) is blackened. The treatment was performed to form an antireflection film.
(FIG. 1 (h)) The blackening treatment is a sulfide-based treatment agent Kovar Black CuO.
(Manufactured by Isolate Chemical Laboratory Co., Ltd.). Further, for the purpose of protecting the surface, a curable acrylic resin, Iupima UVH6000 (manufactured by Mitsubishi Chemical Corporation) was applied and cured to obtain a wear-resistant surface. (Fig. 1 (i))

(Embodiment 2) In Embodiment 2, the transparent substrate 11
0, a single acrylic plate was used (FIG. 1 (a)), and one surface thereof was formed with a concave portion by a convex (hereinafter also referred to as male) press (FIG. 1 (b)), and was transparent. Substrate 1
Formation of a conductive mesh and blackening treatment after forming a concave portion on
The provision of wear resistance and the like were performed in the same manner as in Example 1 to produce a lightweight transparent plastic electromagnetic wave shielding plate. The formation of the concave portion on the transparent substrate 110 made of an acrylic plate will be briefly described below. The male press plate is a flat mirror-plated copper plate that is machined to a width of 15 μm and a depth of 20 μm.
Next, a thin Ni-plated (using a sulfamic acid bath) was used as a master plate. The mother plate was plated with the copper of Example 1 to a thickness of 200 μm, and after plating, the copper plated portion was peeled off, and Ni plating was further performed to a thickness of 5 μm for the purpose of strengthening the surface to obtain a male press plate. 5m in the actual pressing process
A mold press plate pressed onto a m-thick smooth iron plate was used after being fixed via an adhesive. 5 mm as a transparent material for forming recesses
Using a thick acrylic plate (thermoplastic transparent plastic plate) in a clean environment at 250 ° C. with the above-mentioned male press plate, and after cooling, take out the acrylic transparent plate with concave portions (see FIG. 1). (Corresponding to the transparent substrate 110 shown).

Example 3 In Example 3, the manufacturing method of the first example of the method of manufacturing the electromagnetic wave shielding plate shown in FIG. 2 was used, and the method of manufacturing the electromagnetic wave shielding plate shown in FIG. A third example of an electromagnetic wave shielding plate for a plasma display is manufactured. As the transparent substrate 210A, a 5 mm thick acrylic plate is used as the transparent resin layer 210, and a 0.2 mm thick PET film (corresponding to the transparent resin layer 270) having a concave portion formed on one surface of the plate is provided on one surface of the plate. The one that was attached so that the concave portion was on the outside was used. The formation of the recess 220 in the PET film (transparent resin layer 270) was performed as follows. In Example 2, the separated male master plate for press was wound around a cylinder having a diameter of 40 cm and fixed, and the cylinder was used to form a 0.2 mm thick PET.
A hot roll press was performed on the film surface at a surface temperature of 300 ° C. to produce a PET film having long winding concave portions. In this case, the hot press speed can be increased and the efficiency can be increased, but since it is peeled off from the press roll before cooling, there is no precise reproducibility of the master plate as in Example 2, but it can be sufficiently put to practical use. . This long-wound PET film is cut into an appropriate area, and is stuck evenly with the concave side facing out so that air bubbles do not enter the 5 mm thick acrylic plate surface,
A transparent substrate having a concave portion was prepared.

Next, an embodiment of the electromagnetic wave shielding plate will be described. The electromagnetic wave shielding plate of the embodiment is manufactured by the method of manufacturing the electromagnetic wave shielding plate of the above embodiment, and as shown in FIG. 3A, a transparent substrate 1 made of a transparent glass substrate alone.
10 only in the concave portion on one surface (A1 side surface)
A metal thin film 15 made of a copper thin film electrodeposited to a thickness of about 8 μm on the conductive thin film 130 made of a thick copper thin film.
This is provided with a mesh composed of 0 (including the blackened portion 155). The width of the conductive metal thin film 150 (including the blackened portion 155) (the width of the lines 193 and 195) is 30 μm,
The pitch of the line 193 is 280 μm, and the pitch of the line 195 is 280 μm. This electromagnetic wave shielding plate is 450
Visible light transmittance of 60% or more in the range of nm to 650 nm 2
Practical ones with an attenuation rate of 20 dB or more for electromagnetic waves of 0 MHz to 10000 MHz were obtained.

[0029]

As described above, the present invention is an electromagnetic wave shielding plate having an electromagnetic wave shielding property and a light transmitting property which is used on the front surface of a display such as a PDP, and sufficiently satisfies quality and productivity. An electromagnetic wave shielding plate that can be provided and a method of manufacturing the same can be provided.

[Brief description of the drawings]

FIG. 1 is a process chart showing a first example of an embodiment of a method for manufacturing an electromagnetic wave shielding plate of the present invention.

FIG. 2 is a process diagram showing a second example of the embodiment of the method for manufacturing an electromagnetic wave shielding plate of the present invention.

FIG. 3 is a schematic diagram showing a first example of an embodiment of the electromagnetic wave shielding plate of the present invention.

FIG. 4 is a schematic view showing a second example of the embodiment of the electromagnetic wave shielding plate of the present invention.

FIG. 5 is a schematic view showing a third example of the embodiment of the electromagnetic wave shielding plate of the present invention.

FIG. 6 is a view for explaining an electromagnetic wave shielding plate using a mesh made of a metal thin film.

[Explanation of symbols]

 Reference Signs List 110 transparent substrate 120 concave portion 125 concave portion forming surface 130 conductive thin film 140 resin paste 150 conductive metal thin film 155 blackened portion 160 protective film 190 mesh 193, 195 line 197 grounding frame portion 210A transparent substrate 210 transparent base material 220 Concave part 225 Concave part forming surface 230 Conductive thin film 240 Resin paste 250 Conductive metal thin film 255 Blackened part 260 Protective film 270 Transparent resin layer 280 Carrier film 290 mesh 293, 295 Line 297 Grounding frame part 600 Electromagnetic wave shielding plate 610 Mesh part 615 Grounding frame 617 Metal thin film 630 Transparent substrate 650, 670 line

Claims (11)

[Claims] 1. A method for manufacturing an electromagnetic wave shielding plate having electromagnetic wave shielding properties and transparency by forming a conductive substance in a predetermined shape on one or both sides of a transparent substrate used on a front surface of a display. In order, (a) a concave portion forming step of forming a concave portion of a predetermined shape on one or both surfaces of a transparent substrate; and (b) a concave portion forming surface, and a metal electrodepositable conductive material is formed on the concave portion forming side surface of the transparent substrate. A conductive thin film forming step of forming a thin film, (c) a paste filling step of filling only recesses with an etching resistant resin paste, and (d) a region of the conductive thin film exposed only from the etching resistant resin paste. After the etching step of removing by etching, (e) a paste removing step of removing the etching-resistant resin paste remaining in the recess, and (f) a paste removing step, a conductive layer is formed on the conductive thin film. An electrodeposition step of electrodepositing a conductive metal. 2. After the paste filling step according to claim 1,
A method of manufacturing an electromagnetic wave shielding plate, wherein a wiping process and a plasma etching process are performed as necessary. 3. The method according to claim 1, wherein the conductive thin film is formed by vacuum deposition, sputtering, or electroless plating. 4. The method according to claim 1, wherein the conductive thin film has a thickness of 500 to 3 μm. 5. The transparent substrate according to claim 1, wherein the concave portion is formed on the transparent substrate by machining such as convex pressing or cutting, or by etching using a photolithography technique. A method for producing an electromagnetic wave shielding plate. 6. The electromagnetic wave shielding plate according to claim 5, wherein a transparent resin layer for forming the concave portion is provided on the concave portion forming side of the transparent substrate, and the concave portion is formed in the resin layer. Manufacturing method. 7. A transparent base plate material according to claim 1, wherein the transparent substrate is provided with a transparent resin layer in which a concave portion is formed in advance on a carrier film surface, and the resin layer has a concave portion facing outside. A method for producing an electromagnetic wave shielding plate, wherein the electromagnetic wave shielding plate is formed by being transferred to a substrate. 8. The method for manufacturing an electromagnetic wave shielding plate according to claim 1, wherein the transparent substrate is glass or plastic alone or a laminate thereof. 9. The method for manufacturing an electromagnetic wave shielding plate according to claim 1, wherein the concave portion is formed only on one surface of the transparent substrate, and the concave portion is formed on the one surface in a mesh shape. 10. A transparent substrate according to claim 1, wherein a plurality of concave portions are formed on both surfaces of the transparent substrate. Wherein the recesses on both sides are meshed when viewed through a transparent substrate. 11. An electromagnetic wave shielding plate produced according to claim 1.