JP2001210988A - Method for manufacturing electromagnetic-wave screening member, and the member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electromagnetic-wave screening member having the mesh made of a metallic thin film used as an electromagnetic-wave screening plate which can deal enough with product qualities and has a good productivity. SOLUTION: A manufacturing method of an electromagnetic-wave screening member has a laminated-member forming process, a masking process, and an etching process. In the lamented-member forming process (a), a band-wisely continuing metallic foil and a band-wisely continuing film base-material are stuck on each other to form a band-wisely continuing laminated member. While carrying continuously or intermittently the laminated member, in the masking process (b), an etching-resistant resist mask for etching the metallic foil of the laminated member to form a mesh, etc., is so formed along the longitudinal direction of the metallic foil continuously or intermittently as to cover therewith the opposite-side surface of the metallic foil to the side of the film base-material. Successively, in the etching process (c), the exposed portions of the metallic foil from the openings of the resist mask to the external are etched to form the mesh made of a metallic thin film, etc. Further, after the etching process, by providing an adhesive layer on the surface of the mesh made of the metallic thin film, there is performed a lamination process for laminating on the adhesive layer a silicon separator (a silicon-processed PET film having an easily peeled quality.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electromagnetic wave shielding member using a metal thin film mesh. More specifically, the present invention relates to a method for manufacturing an electromagnetic wave shielding member using a metal thin film mesh for shielding electromagnetic waves generated from an electromagnetic wave generation source such as a display electron tube.

[0002]

2. Description of the Related Art Conventionally, an electronic device for generating an electromagnetic wave used directly by a person in close proximity, for example, an electronic tube for a display such as a plasma display, has a standardized intensity of electromagnetic wave emission in consideration of the adverse effect of the electromagnetic wave on the human body. It is required to keep within. Further, in a plasma display panel (hereinafter also referred to as a PDP), light emission uses plasma discharge, so that the frequency band is 30 MHz to 13 MHz.
In order to leak unnecessary electromagnetic waves of 0 MHz to the outside, it is required to suppress the electromagnetic waves as much as possible so as not to adversely affect other devices (for example, information processing devices and the like). In response to these demands, generally, in order to remove or attenuate electromagnetic waves flowing out of the device from an electronic device that generates electromagnetic waves,
An electromagnetic wave shield that covers an outer peripheral portion of an electronic device or the like that generates an electromagnetic wave with a suitable conductive member is employed. In a display panel such as a plasma display panel, an electromagnetic wave shielding plate having good transparency is generally provided on the front surface of the display.

The basic structure of the electromagnetic wave shielding plate is relatively simple. For example, a transparent conductive film such as an indium-tin oxide film (ITO film) is formed on a transparent glass or plastic substrate by vapor deposition or sputtering. A transparent glass or plastic substrate on which a suitable metal screen such as a wire mesh is adhered, or a transparent glass or plastic substrate with a metal thin film on the entire surface by electroless plating or evaporation. Is formed, and the metal thin film is processed by a photolithography method or the like to provide a mesh made of a fine metal thin film.

An electromagnetic wave shielding plate in which an ITO film is formed on a transparent substrate is excellent in transparency, generally has a light transmittance of about 90%, and can form a uniform film on the entire surface of the substrate. Therefore, when used for a display or the like, there is no concern about occurrence of moire or the like due to the electromagnetic wave shielding plate. However, in an electromagnetic wave shielding plate in which an ITO film is formed on a transparent substrate, since a vapor deposition, a sputtering, and a technique are used to form the ITO film, a manufacturing apparatus is expensive, and productivity is generally poor. Therefore, there is a problem that the price of the electromagnetic wave shielding plate itself as a product becomes high. Further, the electromagnetic wave shielding plate having an ITO film formed on a transparent substrate has a conductivity that is at least one order of magnitude lower than that of an electromagnetic wave shielding plate having a mesh made of a metal thin film, and therefore, the electromagnetic wave emission is relatively weak. Although effective for target objects, when used for strong objects, there is a problem that the shielding function becomes insufficient, leaked electromagnetic waves are emitted, and it may not be possible to satisfy the standard value. is there. In the electromagnetic wave shielding plate in which the ITO film is formed on the transparent substrate, the conductivity is improved to some extent by increasing the thickness of the ITO film in order to increase the conductivity, but in this case, the transparency is significantly reduced. The problem occurs. In addition, there is a problem that the manufacturing cost becomes higher due to the further increase in thickness.

When an electromagnetic wave shielding plate in which a metal screen is attached to a transparent glass or plastic substrate surface is used,
Alternatively, when an appropriate metal screen such as a wire mesh is directly adhered to the display surface, it is simple and the cost is low, but the transmittance of an effective mesh (100-200 mesh) metal screen is 50%. % Or less,
It has the serious drawback of extremely dark displays.

[0006] In addition, since a mesh formed of a metal thin film is formed on the surface of a transparent glass or plastic substrate, the outer shape is processed by etching using photolithography, so that fine processing is possible and a high aperture ratio (high transmittance) is obtained. rate)
Since the mesh can be formed and the mesh is formed by a metal thin film, the conductivity is very high as compared with the above-mentioned ITO film and the like, and an advantage that strong electromagnetic wave emission can be shielded. Have. However, the manufacturing process is complicated and complicated, the productivity is low, and the production cost is inevitable.

[0007] As described above, each electromagnetic wave shielding plate has advantages and disadvantages, and is selected and used according to the application. Among them, an electromagnetic wave shielding plate in which a mesh made of a metal thin film is formed on the surface of a transparent glass or plastic substrate is good in terms of electromagnetic wave shielding and light transmission, and has recently been placed on the front of a display panel such as a plasma display panel. , And has been used for electromagnetic wave shielding.

Here, an electromagnetic wave shielding member in which a mesh made of a metal thin film is formed on the surface of a transparent glass or plastic substrate is shown in FIG. 4 and will be briefly described. FIG. 4A is a plan view of an electromagnetic wave shielding member, and FIG. 4B is a plan view of FIG.
4A is a sectional view taken along line A1-A2, and FIG. 4C is an enlarged view of a part of the mesh portion. 4A and 4C show the X direction and the Y direction for clarifying the positional relationship and the mesh shape. The electromagnetic wave shielding member shown in FIG. 4 is an electromagnetic wave shielding member for an electromagnetic wave shielding plate which is used in front of a display such as a PDP and has a grounding frame portion and a mesh portion formed on one surface of a transparent base material. The grounding frame portion 415 is formed of the same metal thin film as the mesh portion around the outside of the mesh portion 410 so as to surround the screen area of the display when used on the front of the display. The mesh section 410 has the shape shown in FIG.
As shown in (c), a plurality of lines 470 and 450 arranged in parallel in the Y and X directions at predetermined pitches Px and Py, respectively. The mesh shape is not limited to that shown in FIG.

FIG. 5A shows an example in which an electromagnetic wave shielding plate 500 using the electromagnetic wave shielding member shown in FIG. 4 is used by placing it on the front surface of a PDP, and FIG. FIG. 5 is an enlarged cross-sectional view of an electromagnetic wave shielding (shielding) region (corresponding to a B0 portion) in FIG. Electromagnetic wave shielding plate 50
The electromagnetic wave shielding (shielding) area of 0 (corresponding to B0 part)
As shown in FIG. 5B, on the viewer side of the transparent glass substrate 510, an NIR layer (near infrared absorption layer) 530 and the electromagnetic wave shielding member 4 shown in FIG.
00, a first AR layer (anti-reflection layer) film 540, and a second glass layer 540 on the PDP 570 side of the transparent glass substrate 510.
The AR layer (antireflection layer) film 520 is provided. In FIG. 5, reference numeral 500 denotes a display front plate;
400 is an electromagnetic wave shielding member, 410 is a mesh part, 43
0 is a transparent substrate, 510 is a glass substrate, 520 is the second A
R layer film, 521 is a film, 523 is a hard coat layer, 525 is an AR layer (antireflection layer), 527 is an antifouling layer, 530 is an NIR layer (near infrared absorption layer), 540 is a first AR layer film, 541 is a film, 543 is a hard coat layer, 545 is an AR layer (antireflection layer), 547 is an antifouling layer, 551, 553, and 555 are adhesive layers, 570 is a PDP (plasma display), 571 is a mounting boss, and 573. Is a screw, 572 is a base, 574 is a mounting bracket, 575 is a front part of the housing, 576 is a rear part of the housing, and 577 is a housing.

[0010]

Therefore, an electromagnetic wave shielding member for an electromagnetic wave shielding plate provided with a mesh made of a metal thin film on a transparent substrate as shown in FIG. From now on, it is required in large quantities,
As a result, a method for efficiently producing the electromagnetic wave shielding plate with high productivity has been required. The present invention corresponds to this, and is a method of manufacturing an electromagnetic shielding member provided with a metal thin film mesh used for an electromagnetic wave shielding plate, and provides a manufacturing method which can sufficiently cope with quality and has high productivity. It is assumed that.

[0011]

The method for manufacturing an electromagnetic wave shielding member according to the present invention is a member for an electromagnetic wave shielding plate used to be placed on the front surface of a display. A method for manufacturing an electromagnetic wave shielding member having electromagnetic wave shielding properties and see-through properties, in which (a) a strip-shaped continuous metal foil and a strip-shaped continuous film base material are bonded to each other. In succession, a lamination member forming process of forming a lamination member, and while continuously or intermittently conveying the lamination member, in order,
(B) An etching-resistant resist mask for forming a mesh or the like by etching the metal foil of the laminated member is continuously formed along the longitudinal direction so as to cover the surface of the metal foil which is not on the film substrate side. Or an intermittent masking process, and (c) an etching process of etching a metal foil portion exposed from an opening of the resist mask to form a mesh or the like made of a metal thin film. Things. In the above, after the etching process, a lamination process is performed in which an adhesive layer is provided on the mesh surface made of a metal thin film and a silicon separator (a silicon-treated easily peelable PET film) is laminated. It is assumed that. Further, in the above, the lamination member forming treatment is performed by laminating a strip-shaped continuous metal foil on a surface of a strip-shaped continuous film base, and laminating the metal foil and the film base together and forming a continuous strip. It is characterized by a lamination process for forming a member. In addition, at the time of lamination processing, as the film substrate 110 requiring an adhesive,
Examples of the film substrate 110 that does not require an adhesive during lamination include ethylene vinyl acetate, ethylene acrylate resin, ethylene ethyl acrylate, and ionomer resin. Alternatively, in the above, the lamination member forming process is characterized in that one surface of the metal foil continuous in a belt shape is formed by coating a resin by a coating method such as extrusion coating or hot melt coating. Is what you do. Incidentally, examples of the extrusion coating material include polyolefin and polyester. Examples of the hot melt coating material include a resin mainly containing ethylene vinyl acetate, a resin mainly containing polyester, and a resin mainly containing polyamide. In the above, the metal foil is an iron material having a thickness of 20 μm to 100 μm, and the etching treatment is performed using a ferric chloride solution as an etching solution. Further, in the above, prior to lamination, blackening treatment is performed on both surfaces or one surface of the metal foil made of an iron material in advance. Further, in the above, the transparent film substrate is a PET film (polyethylene terephthalate film). In the masking process described above, a resist is applied to the surface of the metal foil, and after drying, the resist is contact-exposed with a predetermined pattern plate, and a resist pattern having a predetermined shape is formed on the metal foil surface through a development process. And baking the resist pattern if necessary. Further, in the above method, after the etching treatment, the resist pattern is peeled off and, if necessary, a cleaning treatment is performed, and then a blackening treatment is performed on the mesh surface made of the exposed metal thin film. In the above, after laminating a silicon separator (silicone-treated easily peelable PET film), an NIR layer (near infrared absorbing layer) ) Is formed, and an AR layer film having an AR layer (anti-reflection layer) formed on one surface of the film is laminated in this order, and the laminating step is transparent. After laminating the NIR layer film on the non-mesh side of the film base via an adhesive layer, the AR layer film is further laminated on the NIR layer film via an adhesive layer. It is a feature.

An electromagnetic wave shielding member according to the present invention is characterized by being manufactured by the method for manufacturing an electromagnetic wave shielding member according to the present invention.

[0013]

The method for manufacturing an electromagnetic wave shielding member of the present invention is a method for manufacturing an electromagnetic wave shielding member provided with a metal thin film mesh used for an electromagnetic wave shielding plate by adopting such a structure. And can provide a production method with good productivity. As a result, a large number of electromagnetic wave shielding plates having both good transparency and good electromagnetic wave shielding properties for a display such as a PDP as shown in FIG. 4 can be provided at an early stage. Specifically, (a) a lamination member forming process for forming a lamination member, in which a metal foil continuous in a band shape and a film base material continuous in a band shape are bonded to each other to form a lamination member, and While intermittently transporting, (b) an etching-resistant resist mask for etching the metal foil of the laminated member to form a mesh or the like is applied so as to cover the surface of the metal foil that is not on the film substrate side. A masking process for forming the metal foil continuously or intermittently along its longitudinal direction; and (c) etching a metal foil portion exposed from the opening of the resist mask to form a mesh or the like made of a metal thin film. After the etching treatment, an adhesive layer is disposed on the mesh surface made of a metal thin film, and a silicon separator (silicone treatment) is applied. The PET film) of the easily peelable by performing the laminating process of laminating a, thereby enabling this. That is, the masking process and the etching process can be performed in an integrated line, as in the case of producing a shadow mask for a color TV cathode-ray tube from a steel material continuous in a belt shape. Then, a lamination member forming process is performed by laminating a strip-shaped continuous metal foil on the surface of the strip-shaped continuous film base material, and forming a laminated member in which the metal foil and the film base material are bonded to be continuous in a strip shape. In the case of the lamination process, the operation is simple, and the metal foil can be continuously and efficiently etched. In particular, in the masking process, a resist is applied to the surface of the metal foil, and after drying, the resist is exposed in close contact with a predetermined pattern plate, and a resist pattern of a predetermined shape is formed on the metal foil surface through a development process. In this case, the resist pattern is subjected to a baking process in accordance with the above, so that it is a fine plate-making process using a resist, and it is possible to cope with quality and mass production.

The metal foil is an iron material having a thickness of 20 μm to 100 μm. Since the etching process uses a ferric chloride solution as an etching solution, the etching solution can be easily circulated and used. It is easy to do it continuously. As the iron material, a low-carbon steel containing almost no Ni (low-carbon rimmed steel, low-carbon aluminum killed steel, etc.) is preferable in terms of etching treatment, but is not limited thereto. When the iron material is a Ni—Fe alloy such as an invar material (42% Ni—Fe alloy), Ni is mixed into the etching solution, so that it is necessary to manage the etching solution accordingly. Further, since the metal foil is an iron material (low-carbon steel, Ni-Fe alloy), it is possible to produce a metal foil having particularly excellent magnetic wave shielding properties. Further, when the thickness of the metal foil is 20 μm or less, the etching process becomes difficult, and when the thickness is larger than 100 μm, the substantial opening becomes small and the viewing angle becomes narrow.
The range of m is preferred.

Prior to the lamination member forming process,
By performing blackening treatment on both surfaces or one surface of a metal foil made of an iron material, reflection on the blackened surface of the metal foil can be prevented. In this case, the blackening process is usually performed in a steam or gas atmosphere for a predetermined time and at a predetermined temperature to form an oxide film (black film) of about 1 μm to 2 μm. (Blackened film). In particular, when the blackening process is performed on both surfaces prior to the lamination member forming process, the blackening process does not need to be performed later, and the workability is improved. Prior to the lamination member forming process, if the blackening process has not been performed on both sides or one side of the metal foil made of iron material in advance, after the etching process, the resist pattern is peeled off and washed, if necessary. After the treatment, the mesh surface made of the exposed metal thin film may be subjected to a blackening treatment by a chemical treatment or the like, but the workability is poor.

Since the transparent film substrate is a PET film (polyethylene terephthalate film), it can withstand each treatment.

After laminating a silicon separator (silicone-treated easily peelable PET film), an NIR layer (near-infrared absorbing layer) is formed on one side of the film on the non-mesh side of the transparent film substrate. By having a laminating step of laminating the formed NIR layer film and the AR layer film having an AR layer (anti-reflection layer) on one side of the film in this order, in addition to the electromagnetic wave shielding function, the near-infrared absorption function and the reflection This makes it possible to produce a member having a prevention function.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a manufacturing process flow chart showing an embodiment of a method for manufacturing an electromagnetic wave shielding member of the present invention, and FIG. 2 is a masking process, an etching process, and a silicon separator (an easily peelable PET film subjected to a silicone process). 3) is a partial cross-sectional view for explaining a laminating process for laminating the laminated member, and FIG. 3 (a) is a diagram showing a positional relationship between a mesh portion of the electromagnetic wave shielding member and a grounding frame portion formed with the laminating member. FIG. 3B is a diagram showing a mesh portion and a grounding frame portion, and FIGS. 3C and 3D are cross-sectional views showing a layer configuration of a member for shielding electromagnetic waves to be manufactured. Each of FIG. 2 and FIGS. 3C and 3D correspond to FIG.
It is sectional drawing in the P1-P2 position of (b). Figure 1,
2 and 3, 110 is a film substrate, 120 is a metal foil, 120A is a mesh part, 120B is a grounding frame part, 1
20C is a processed part, 130 is an adhesive layer, 135 is an adhesive layer,
140 is a silicon separator (protective film), 1
50 is an NIR layer film, 151 is a film, 152 is an NIR layer, 160 is an AR layer film, 161 is a film, 162 is a hard coat layer, 163 is an antireflection layer,
64 is an antifouling layer, 170 and 175 are adhesive layers, and 190 is a laminated member (laminated member). In FIG. 1, S11
0 to S220 indicate processing steps.

First, a first example of an embodiment of a method of manufacturing an electromagnetic wave shielding member of the present invention will be described with reference to FIG. This example is a member for producing an electromagnetic wave shielding plate for electromagnetic wave shielding used to be placed on the front surface of a display such as a PDP shown in FIG. 5, and is formed by laminating a mesh made of a metal thin film on one surface of a transparent film base material. In a manufacturing method for mass-producing an electromagnetic wave shielding member having a shielding property and a see-through property, an iron material (low carbon steel) having a thickness in a range of 20 μm to 100 μm is used as a metal foil for forming a mesh made of a metal thin film. It is used. First, a continuous film base material supplied in a rolled state (S110)
In a stretched state (S111), and a continuous metal foil (S) supplied in a rolled state.
120) is stretched without loosening (S121), a metal foil 120 continuous in a band shape is laminated on one surface of the film substrate 110 continuous in a band shape (S130), and the film substrate 110 and the metal foil 120 are attached. The lamination member 190 is formed so as to be continuous in a band shape. (S14
0) Lamination can be performed with a laminating roll having two rolls as a pair. In this example, the metal foil 12
Reference numeral 0 denotes an iron material, which is made of low carbon steel containing almost no Ni, and both surfaces of which are blackened by a blackening process before lamination. In the blackening treatment, usually, an iron material is exposed to a predetermined temperature (about 450 to 470 ° C) for a predetermined time (about 10 to 20 minutes) in steam, and an oxide film (blackening) of about 1 to 2 µm is exposed. The oxide film (blackened film) formed by chemical treatment such as concentrated nitric acid may be used. The film substrate 110 is not particularly limited as long as it has good transparency, withstands processing, and has good stability.
A film is used. As described above, at the time of the laminating process S130, examples of the film substrate 110 that requires an adhesive include polyester and polyethylene. As the film substrate 110 that does not require an adhesive at the time of the laminating process S130, Examples include ethylene vinyl acetate, ethylene acrylic acid resin, ethylene ethyl acrylate, and ionomer resin.

Then, while continuously or intermittently transporting the laminating member 190, the metal foil of the laminating member is etched in order to form a mesh or the like while being stretched without loosening. A masking process (S150) for forming a resist mask continuously or intermittently along the longitudinal direction of the metal foil, and etching of the metal foil portion exposed from the resist mask to form a mesh or the like made of a metal thin film. Then, an etching process (S160) is performed. As shown in FIG. 3A, in the longitudinal direction of the laminating member 190, an etched portion 120C such as a mesh is imposed on a metal foil at a predetermined interval. In this example, the etched portion 120C is formed as shown in FIG.
The mesh part 120A and the grounding frame part 120B shown in FIG.
It consisted of The mesh part 120A is an electromagnetic wave shielding area.

As the masking treatment, for example, a photosensitive resist such as casein, PVA or the like is applied on the metal foil 120 (S151), dried (S152), and contact-exposed with a predetermined pattern plate (S153). Develop with water (S15
4) Perform hardening treatment and baking (S15)
5), a series of processes. The coating of the resist is usually performed by applying a resist such as water-soluble casein, PVA, or gelatin to both surfaces or one surface (metal foil side) by dipping (dipping), curtain coating, or pouring while transporting the laminated member. . In the case of casein resist, baking is preferably performed at about 200 to 300 ° C., but in order to prevent the laminate member 190 from warping or curling, the processing temperature is reduced as much as possible and curing is performed. When the dry film resist is a photosensitive resist, the workability of the resist coating step (S151) can be improved. Further, the etching process uses a ferric chloride solution as an etching solution, so that the etching solution can be easily circulated and used, and the etching process can be performed continuously. In this example, the masking process (S150) and the etching process (S160) are performed in a state where the lamination member 190 is stretched without loosening, but the masking process (S150) and the etching process (S160)
This is basically the same as the case where a shadow mask for a color TV cathode-ray tube, particularly a thin plate (20 μm to 80 μm) is etched from one side from a strip of steel material. That is, the masking process and the etching process can be performed in an integrated line, and the metal foil of the laminated member in which the metal foil and the film are bonded to each other in a strip shape can be etched continuously and with high productivity.

Next, after the etching process (S160),
After a washing process or the like, an adhesive layer (corresponding to 135 in FIG. 3) is provided on the metal foil surface on which the mesh is formed, and a silicon separator (an easily peelable PET film subjected to silicone treatment) is laminated. (S180) The adhesive layer is provided by a roll coater, a die coater, a blade coater, or the like. When used for an electromagnetic wave shielding plate, the silicon separator is peeled off from the adhesive layer and is a temporary protective film. This state is shown in FIG.
An electromagnetic wave shielding member having a layer configuration shown in FIG.

Next, after laminating the NIR layer film 150 via the adhesive layer (S190), the AR layer film 160 is further laminated thereon via the adhesive layer. (S200) As each adhesive layer, a material having good transparency such as acrylic is used. As a commercially available product, for example, an adhesive (manufactured by Lintec, product number PSA-
4). NIR layer film (1 in FIG. 3 (d))
50) is a film in which an NIR layer (near-infrared absorbing layer) is disposed on a transparent film. In a commercially available film, No. 2832 manufactured by Toyobo Co., Ltd. made of a polyethylene terephthalate (PET) film coated with an NIR layer is used. Generally known. The NIR layer (near-infrared absorbing layer) is not particularly limited, but has sharp absorption in the near-infrared region, high light transmittance in the visible region, and large absorption at a specific wavelength in the visible region. There is no one. A layer or the like in which one or more dyes having a maximum absorption wavelength at a light wavelength of 800 nm to 1000 nm is dissolved in a binder resin is used as an NIR layer (near infrared absorption layer), and has a thickness of about 1 to 50 μm. Examples of the dye include a cyanine compound, a phthalocyanine compound, a naphthalocyanine compound, a naphthoquinone compound, an anthraquinine compound, and a dithiol complex. As the binder resin, a polyester resin, a polyurethane resin, an acrylic resin, or the like is used. Epoxy by UV or heating,
A crosslinkable curing type binder utilizing a reaction of acrylate, methacrylate, isocyanate group or the like is also used. As a solvent for coating, a cyclic ether or ketone that dissolves the above-mentioned dye, for example, tetrahydrofuran, dioxane, cyclohexane,
Cyclopentanone and the like are used. The AR layer film usually has a layer structure as shown by 160 in FIG.
This is a film in which an AR layer is provided on a transparent film.
The AR layer (antireflection layer) is for preventing reflection of visible light, and its structure is known to be a single layer or a multi-layer. Are generally laminated alternately. The material of the antireflection layer is not particularly limited. The antireflection layer is formed by a dry method such as sputtering or vapor deposition, or by wet coating. In addition, as a high refractive index layer, Ti oxide, zirconium, etc. are mentioned. Silicon oxide is generally used as the low refractive index layer.

The hard coat layer 162 in the AR layer film (corresponding to 160 in FIG. 3C) is DPH.
A, polyfunctional acrylates such as polyester acrylates such as TMPTA and PETA, urethane acrylates and epoxy acrylates can be formed by heat curing or curing by ionizing radiation. Here, “having a hard performance” or “hard coat” means JI
A pencil hardness test showing a hardness of H or more in a pencil hardness test indicated by SK5400. The antifouling layer 164 laminated on the AR layer (163 in FIG. 3 (c)) is provided with a water-repellent and oil-repellent coating, and is made of a fluorine-based material such as siloxane or a fluorine-containing alkylsilyl compound. Fouling coatings.

The AR layer is laminated, and the electromagnetic wave shielding member manufactured is cut in a state where it is stretched to each position without loosening (S210), and the electromagnetic wave having the layer structure shown in FIG. Obtain a shielding member. (S220)

The obtained electromagnetic wave shielding member having the layer structure shown in FIG. 3D is attached to one surface of a transparent base material such as a glass substrate, and the transparent base material An AR layer film (corresponding to 160 in FIG. 3 (c)) is attached to the other surface to form an electromagnetic wave shielding plate. As the transparent substrate, a glass, polyacrylic resin, or polycarbonate resin substrate is suitably used, and a plastic film may be used as necessary. Examples of plastic film materials include triacetyl cellulose film, diacetyl cellulose film, acetate butyrate cellulose film, polyether sulfone film, polyacrylic resin film, polyurethane resin film, polyester film, polycarbonate film, polysulfone film, polysulfone film Ether film,
A trimethylpentene film, a polyetherketone film, a (meth) acrylonitrile film, and the like can be used, and a biaxially stretched polyester is particularly preferable because it has excellent transparency and durability. Its thickness is usually 8 μm
Those having a thickness of about 1000 μm are preferable. An important substrate having a rigidity of 1 to 10 mm is used for a large display, and a suitable display having a thickness of 0.01 m is used for a small display for a character display tube.
A plastic film of m to 0.5 mm is used by being attached to a display. The light transmittance of the transparent substrate is ideally 100%, but it is preferable to select a light transmittance of 80% or more.

(Modification) Lamination process S130 of this example
First, the blackening process is not performed on both surfaces of the metal foil 120, and the etching process is performed in the same manner as in this example (S160).
After that, a blackening process for blackening the surface of the metal foil 120 is performed, and then a laminating process for laminating a silicon separator (silicone-treated easily peelable PET film) is performed in the same manner as in this example. What performs the following can be mentioned as a modification. Further, before the cutting process (S210), it is also possible to adopt a form in which the process is temporarily stopped by winding up in a roll shape as necessary. In some cases, the laminating member 190
A slitting process for setting the width to a predetermined width by a masking process (S
190) can also be performed before. In this embodiment, the metal foil is made of an iron material. However, the present invention can be applied to a case where the metal foil is made of a copper foil. In this case, in the blackening treatment, the copper foil surface is generally oxidized or sulfurized by a chemical treatment to blacken the surface.
Also, after laminating the NIR layer film (S190), in some cases, a protective film is attached and cut,
Another modification in which this is used as an electromagnetic wave shielding member can also be mentioned.

Next, a second example of the embodiment of the method for manufacturing an electromagnetic wave shielding member of the present invention will be described with reference to FIG.
In the second example, a resin is coated on one surface of a strip-shaped continuous metal foil by a coating method such as extrusion coating or hot melt coating instead of the lamination member forming process in the first example (S135).
This is a laminated member forming process for obtaining a laminated member (S140). As mentioned earlier, the extrusion coating materials include polyolefins and polyesters.The hot melt coating materials include
Examples of the resin include a resin mainly containing ethylene vinyl acetate, a resin mainly containing polyester, and a resin mainly containing polyamide. Except for the lamination member forming process, this is the same as the first example, and the description is omitted.

Next, a third embodiment of the method for manufacturing an electromagnetic wave shielding member according to the present invention will be described with reference to FIG.
This example is also a member for producing an electromagnetic wave shielding plate for electromagnetic wave shielding used in front of a display such as a PDP, as shown in FIG. 5, as in the first example. A member for electromagnetic wave shielding and see-through electromagnetic wave shielding having a laminated mesh consisting of, in a manufacturing method for mass production, as a metal foil for forming a mesh made of a metal thin film, a thickness of 20μm ~ 100μm range. In this example, which uses an iron material (low-carbon steel), similarly to the first example, after performing a laminating process (S180) for laminating a silicon separator (a silicon-treated easily peelable PET film). Then, cutting is performed for each region corresponding to the electromagnetic wave shielding member production region (S185),
As the single-wafer state, the NIR layer film and the AR layer film corresponding to the single-wafer state are sequentially laminated via an adhesive layer (S195, S205) to produce an electromagnetic wave shielding member (S220). Things. Material of each part,
The processing method is the same as in the first example, and the description is omitted.

The cutting process (S185) of this embodiment (layer structure corresponding to FIG. 3 (c)) is used as it is as an electromagnetic wave shielding member.
Transparent substrate (glass substrate etc.) together with IR layer film
And an electromagnetic wave shielding plate may be attached.

FIGS. 2A and 2B show cross sections of the characteristic portion (cross sections at positions P1-P2 in FIG. 3B) in each processing up to the laminating processing (S180) in the first and third examples. A brief description will be given based on this. Each drawing in FIG. 2 shows a cross section taken along line P1-P2 in FIG. FIG. 2 shows a lamination process S1 such as an ET film.
It is a figure in the case of using an adhesive at 30 o'clock. By laminating (S130 in FIG. 1), the film substrate 110
A metal foil 120 is provided on one surface of FIG. 2A via an adhesive layer 130 (FIG. 2B).
Further, a photosensitive resist is applied on the metal foil 120, dried (FIG. 2 (c)), and then subjected to close contact exposure with a predetermined pattern plate, developed and baked (FIG. 2 (d)). As shown in FIG. 7, a resist pattern 180 having a predetermined shape is formed. Next, using the resist pattern 180 as an etching resistant mask, the metal foil 120 is etched from one side (FIG. 2 (e)), and further subjected to a cleaning process and the like, and then an adhesive layer 135 is provided on the metal foil 120 surface. The silicon separator 140 is laminated through 135. (Fig. 2 (g))

[0032]

The present invention will be further described with reference to examples. In the present embodiment, the method of manufacturing the electromagnetic shielding member of the first example of the embodiment shown in FIG. 1 is performed. FIG.
In the first example of the embodiment shown in FIG. 1, a PET film (A4300, manufactured by Toyobo Co., Ltd.) having a thickness of 125 μm and a width of 800 mm as a film substrate, a width of 800 mm, a thickness of 2
An iron material (SF-25, manufactured by Toyo Steel Co., Ltd.) made of 5 μm low-carbon aluminum-killed steel was used as a metal foil, and both of them were laminated with a thermosetting adhesive layer Takedac A310 (Takeda Pharmaceutical Co., Ltd.) Made)
Laminated. In addition, iron material (low carbon aluminum killed steel)
Before the lamination, the surface of the iron material was
Exposure was performed at a temperature of 60 ° C. for 15 minutes, and the surface was oxidized and blackened.

Next, a masking process and an etching process are performed. From a steel material continuous in a strip shape, a shadow mask for a color TV cathode-ray tube is formed into a thin plate (20 μm to 80 μm).
From the one side, and from the masking process to the etching process, were performed in an integrated line (hereinafter also referred to as SM line) in which the steel material was stretched and processed. Laminate 1 using casein as a photosensitive resist
90 was conveyed, and the coating was applied so as to cover one surface (the metal foil side) of the entire surface by pouring. The pattern plate has a shape for forming a mesh portion 120A and a grounding frame portion 120B as shown in FIG. 3B, and has a mesh angle of 30 degrees, a mesh line width of 20 μm, and a mesh pitch (FIG. 4).
(Corresponding to Px and Py) of 200 μm.
After the contact exposure (S153) in the baking frame of the line, water development (S154), a hardening treatment and the like are performed.
Baking was performed at 0 ° C. (S155) Next, the laminate member 190 is kept at 60 ° C.
Using a ferrous chloride solution of 2 ° Baume as an etchant, a spray was applied to the metal foil using a resist pattern as an etching resistant mask by spraying, and the exposed area was etched to form a mesh portion and a grounding frame portion. .

Next, on the SM line,
After washing with water and stripping the resist with an alkaline solution, and further performing a washing treatment and the like, roll coating on the metal foil surface using an acrylic-based highly transparent adhesive (manufactured by Lintec, product number PSA-4) To a thickness of 40 μm, and furthermore, in order to make the film easily peelable, a 38 μm-thick PET film (manufactured by Teijin Limited, G
2) was laminated as a protective film. This protective film is also called a silicon separator.

Next, a transparent substrate (P of 125 μm thickness)
One side of the exposed side of the (ET film) 110 is PE
A commercially available NIR film having a NIR layer disposed on a T film, No. 2832 manufactured by Toyobo Co., Ltd., a saturated polyester resin) adhesive layer (Vylon-300 manufactured by Toyobo Co., Ltd.)
And laminated.

Next, on one surface of a PET film (A4350, manufactured by Toyobo Co., Ltd.) having a thickness of 188 μm, an AR layer was formed by sputtering an AR layer on the hard coat layer as follows. NIR through the agent layer (Toyobo Co., Byron-300)
Laminated on the layer film. The hard coat layer is made of an ionizing radiation curable resin (manufactured by Dainichi Seika Co., Ltd., PET D-3).
1: trade name) was applied so as to have a dry thickness of about 6 μm, and was cured with an electron beam having an acceleration voltage of 175 KV and an irradiation amount of 10 Mrad, and was about 6 μm thick. The AR layer is made of ITO of 27 nm, SiO2 of 24 nm,
Of 75 nm and SiO2 of 92 nm by sputtering.

Then, cutting was performed using a cutter to obtain an electromagnetic shielding member having a layer structure shown in FIG. 3D having an electromagnetic wave shielding function, a near-infrared absorption function, and an antireflection function.
In addition, in order to reduce the cutting amount of the metal foil part, the periphery of the grounding frame part was previously made into a through hole for the most part, and a part of the connection part was provided in advance.

[0038]

As described above, the present invention relates to a method for manufacturing an electromagnetic shielding member provided with a metal thin film mesh, which is used for an electromagnetic wave shielding plate and is used on a front surface of a display such as a PDP. It is possible to provide a production method with sufficient quality and high productivity.

[Brief description of the drawings]

FIG. 1 is a manufacturing process flow chart showing an embodiment of a method for manufacturing an electromagnetic wave shielding member of the present invention.

FIG. 2 Masking process, etching process, silicon
Partial cross-sectional view for explaining a laminating process for laminating a separator (a silicon film-treated easily peelable PET film).

FIG. 3A is a diagram showing a positional relationship between a mesh part and a grounding frame part of an electromagnetic wave shielding member formed with a laminate member, and FIG. 3B is a view showing a mesh part and a grounding frame. FIG. 3C and FIG. 3D are cross-sectional views showing the layer structure of the manufactured electromagnetic wave shielding member.

FIG. 4 is a view for explaining an electromagnetic wave shielding member.

FIG. 5 is a diagram for explaining a use form of the electromagnetic wave shielding plate.

[Explanation of symbols]

110 Film base material 120 Metal foil 120A Mesh part 120B Grounding frame part 120C Processing part 130 Adhesive layer 135 Adhesive layer 140 Silicon separator (protective film) 150 NIR layer film 151 Film 152 NIR layer 160 AR layer film 161 Film 162 Hard coat layer 163 Antireflection layer 164 Antifouling layer 170, 175 Adhesive layer 190 Laminated member (laminated member) 400 Electromagnetic wave shielding plate 410 Mesh portion 415 Grounding frame portion 417 Metal thin film 430 Transparent substrate 450, 470 line

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Fumihiro Arakawa 1-1-1, Ichigaya-Kaga-cho, Shinjuku-ku, Tokyo F-term in Dai Nippon Printing Co., Ltd. (reference) 2K009 AA03 AA15 BB23 BB24 CC02 DD01 DD02 DD03 DD04 DD08 DD12 EE00 EE03 5C028 AA01 AA10 5C040 GH10 MA08 MA26 5E321 AA04 BB25 BB41 CC16 GG05 GH01

Claims (12)

[Claims] 1. A member for an electromagnetic wave shielding plate used on a front surface of a display, comprising a mesh made of a metal thin film laminated on one surface of a transparent film base material and having an electromagnetic wave shielding property and a see-through property. A manufacturing method for manufacturing, comprising: (a) a laminating member forming process for forming a laminating member, wherein a strip-shaped continuous metal foil and a strip-shaped continuous film base material are bonded together to form a stacked member; While transporting the laminated member continuously or intermittently,
(B) An etching-resistant resist mask for forming a mesh or the like by etching the metal foil of the laminated member is continuously formed along the longitudinal direction so as to cover the surface of the metal foil which is not on the film substrate side. Or an intermittent masking process, and (c) an etching process of etching a metal foil portion exposed from an opening of the resist mask to form a mesh or the like made of a metal thin film. A method for manufacturing an electromagnetic wave shielding member. 2. A laminating process according to claim 1, wherein after the etching process, an adhesive layer is provided on the mesh surface made of the metal thin film, and a silicon separator (silicone-treated easily peelable PET film) is laminated. A method for producing an electromagnetic wave shielding member. 3. The laminating member forming process according to claim 1, wherein the strip-shaped continuous metal foil is laminated on the surface of the strip-shaped continuous film base, and the metal foil and the film base are bonded to each other. A method for producing an electromagnetic wave shielding member, which is a lamination process for forming a laminated member that is continuous in a band shape. 4. The method according to claim 1, wherein the laminating member is formed by coating a resin on one surface of a metal foil that is continuous in a strip shape by a coating method such as extrusion coating or hot melt coating. A method for producing an electromagnetic wave shielding member, characterized in that: 5. The method according to claim 1, wherein the metal foil is
A method for manufacturing a member for shielding electromagnetic waves, comprising using an iron material having a thickness of 20 μm to 100 μm and using a ferric chloride solution as an etching solution. 6. The electromagnetic wave shielding member according to claim 1, wherein blackening treatment is performed on both surfaces or one surface of the metal foil made of an iron material prior to the lamination member forming process. Production method. 7. The method for producing an electromagnetic wave shielding member according to claim 1, wherein the transparent film substrate is a PET film (polyethylene terephthalate film). 8. The masking process according to claim 1, wherein a resist is applied to a surface of the metal foil, dried, and then the resist is exposed in close contact with a predetermined pattern plate, and then subjected to a development process to form a resist pattern having a predetermined shape. On the metal foil surface,
A method for manufacturing an electromagnetic wave shielding member, wherein a baking process is performed on a resist pattern as necessary. 9. The method according to claim 1, wherein after the etching process, the resist pattern is peeled and removed, a cleaning process is performed as necessary, and a blackening process is performed on the mesh surface made of the exposed metal thin film. A method for producing a member for shielding electromagnetic waves. 10. The method according to claim 2, wherein after a laminating treatment for laminating a silicon separator (silicone-treated easily peelable PET film), the transparent film substrate is coated on one side of the film other than the mesh side. An electromagnetic wave shield comprising a laminating step of laminating an NIR layer film having an NIR layer (near infrared absorbing layer) formed thereon and an AR layer film having an AR layer (anti-reflection layer) formed on one surface of the film in this order. Manufacturing method of the member for use. 11. The laminating step according to claim 10, wherein the NIR layer film is laminated via an adhesive layer on a surface of the transparent film substrate that is not on the mesh side,
A method for manufacturing an electromagnetic wave shielding member, further comprising laminating an AR layer film on an NIR layer film via an adhesive layer. 12. An electromagnetic wave shielding member manufactured by the method for manufacturing an electromagnetic wave shielding member according to claim 1. Description: