JP2006140346A - Electromagnetic wave shielding member and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding member excellent in visibility owing to the good contrast used especially for the front of a display capable of forming the pattern of a conductive layer and a black color layer at a low cost while satisfying both of high transparency and favorable conductivity. <P>SOLUTION: The electromagnetic wave shielding member is a structure body consisting of a conductive metal layer 3, a black color layer 2, and a transparent plastic support medium 1. A geometric configuration pattern whose opening rate is 50% or more is formed at the time of forming the conductive metal layer 3 and the black color layer 2 by a vacuum process. The vacuum process is performed by a vacuum deposition method, a sputtering method, an ion plating method or the like. It is useful to a translucent electromagnetic wave shielding member for plasma-display panels. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention provides an electromagnetic wave shielding member having a patterned conductive metal layer and a black layer having excellent conductivity and transparency, and a method for producing the same.

Various methods have been proposed in the past for shielding electromagnetic waves on surfaces to be shielded such as walls of public facilities, halls, hospitals, schools, corporate buildings, houses, glass surfaces or resin panel surfaces, or display surfaces of devices that generate electromagnetic waves. ing. For example, a method of applying an electromagnetic shielding coating over the surface to be shielded, a method of bonding a metal foil on the surface to be shielded, an electromagnetic shielding sheet formed by thermally laminating a metal-plated fiber mesh on a resin plate, Generally, a method of bonding to a surface, a method of bonding conductive fibers knitted in a mesh shape to a surface to be shielded, and the like are performed.
Among these, in the case of shielding electromagnetic waves on the surface to be shielded such as a transparent glass surface, a transparent resin panel surface, a display surface of a CRT or a PDP, it is required to be as thin as possible, and the light transmittance is contrary to this. There is a demand for an electromagnetic shielding sheet that can balance electromagnetic shielding with a good balance.
As such an electromagnetic wave shielding member, a metal or metal oxide is deposited on a transparent substrate to form a thin film conductive layer (see Patent Document 1 and Patent Document 2), and metal-plated good conductivity An electromagnetic wave shielding material in which a fiber mesh itself or an electrically conductive fiber mesh is embedded in a transparent substrate (see Patent Document 3 and Patent Document 4), and a conductive resin containing a metal powder or the like printed directly on a transparent substrate A shielding material (see Patent Document 5 and Patent Document 6), a conductive layer formed by electroless plating after pattern printing of an electroless plating catalyst paint on a flat substrate (see Patent Document 7 and Patent Document 8), base A metal layer laminated on a material is etched into a mesh shape by a photolithographic method to form an electromagnetic wave shielding layer (see Patent Document 9).

JP-A-1-278800 JP-A-5-323101 JP-A-5-327274 Japanese Patent Laid-Open No. 5-269912 JP 62-57297 A JP-A-2-52499 Japanese Patent Laid-Open No. 5-288989 JP 11-170420 A Japanese Patent Laid-Open No. 10-41682

However, the method of forming a thin film conductive layer by vapor-depositing a metal or metal oxide on a transparent substrate is a surface resistance of the conductive layer when the film thickness is such that transparency can be achieved (several hundred to 2,000 mm). Was too large, so that the electromagnetic wave shielding property was insufficient.
Electromagnetic wave shielding material made of metal-plated fiber mesh or electromagnetic wave shielding material in which a conductive fiber mesh is embedded in a transparent substrate has a sufficiently large electromagnetic wave shielding effect, but conductive fibers are used to prevent electromagnetic wave leakage. Since the fiber diameter necessary for the regular arrangement is too large, the fibers are visible (hereinafter referred to as visibility) and are not suitable for display applications. In addition, in the electromagnetic wave shielding material in which a conductive fiber mesh is embedded in a transparent base material, during thermal lamination in the manufacturing process, distortion occurs between the fiber mesh and the resin plate, and the perspective image is distorted. There have been problems such as cracking in the plating layer during heat laminating and deterioration of electromagnetic shielding performance. In addition, the thickness of the fibers to which conductivity is imparted is limited to about 50 μm due to the manufacturing method, and it is difficult to reduce the diameter, to improve the transparency, or to reduce the thickness of the entire electromagnetic shielding sheet. There was a problem that was difficult.
Similarly, in the case of an electromagnetic shielding material in which a conductive resin containing a metal powder or the like is directly printed on a transparent substrate, the line width is around 100 μm due to the limit of printing accuracy, and visibility is not suitable. It was.
In the above-mentioned Patent Document 7, a transparent resin layer is formed on a transparent substrate such as polycarbonate having a thickness of about 2 mm, and a copper mesh pattern is formed thereon by electroless plating to produce a shielding member. However, it is necessary to roughen the surface of the transparent substrate in order to ensure adhesion of electroless plating. As this roughening means, generally a highly toxic oxidizing agent such as chromic acid or permanganic acid must be used, and this method makes it difficult to perform satisfactory roughening with a resin other than ABS. Even if the electromagnetic wave shielding property and transparency can be achieved by this method, it is difficult to reduce the thickness of the transparent substrate, and it is not suitable as a method for thinning (for example, forming a film). Furthermore, if the transparent substrate is thick, it cannot be brought into close contact with the display, and electromagnetic wave leakage increases from there. On the production side, the shielding material cannot be made of a scroll or the like, so that it is bulky and is not suitable for automation.

Moreover, although the method of forming a conductive layer by electroless plating is described in, for example, Patent Document 8 described above, the line width of the formed conductive layer is thickened or oozed, and in particular, transparency is required. However, the electromagnetic wave shielding member used for such applications has a problem of poor appearance. In addition, the electroless plating has a problem of increasing cost. Furthermore, since the size of the electromagnetic wave shielding member depends on the size of the plating line, when producing an electromagnetic wave shielding sheet having a large dimension of about 2 m in width, the electromagnetic wave shielding sheets 2 to 3 provided for the plating line are used. It is necessary to join the sheets, and there is a risk that electromagnetic waves may leak from the joints and cannot be shielded sufficiently.
Furthermore, the electromagnetic wave shielding member produced by utilizing the photolithographic method as described in Patent Document 9 can also provide excellent electromagnetic wave shielding properties and transparency, but as a method for producing it. Since it is necessary to apply a photolithographic method including an etching process for each electromagnetic wave shielding member, there is a problem that the number of processes increases as a whole and the cost is increased.

  The present invention provides an electromagnetic wave shielding member having both high transparency and good conductivity and capable of forming a conductor layer pattern at a low cost. Moreover, the black layer is formed, the contrast used especially for the front surface of a display is good, and the electromagnetic wave shielding member excellent in visibility is provided.

The present invention relates to the following.
1. A structure composed of a conductive metal layer, a black layer, and a transparent plastic support is characterized by forming a geometric pattern having an aperture ratio of 50% or more when forming the conductive metal layer and the black layer by a vacuum process. An electromagnetic wave shielding member.
2. In a structure composed of a conductive metal layer, a black layer, and a transparent plastic support, a geometric figure pattern having an aperture ratio of 50% or more is formed in the formation of the conductive metal layer and the black layer by a vacuum process. An electromagnetic wave shielding member, wherein a conductive metal layer is laminated on the substrate by plating.
3. In a structure consisting of a conductive metal layer, a black layer, and a transparent plastic support, a geometric figure pattern having an aperture ratio of 50% or more is formed by forming a conductive metal layer by a vacuum process, and a black layer is laminated separately. An electromagnetic wave shielding member.
4). In a structure composed of a conductive metal layer, a black layer, and a transparent plastic support, a geometrical pattern having an aperture ratio of 50% or more is formed when the conductive metal layer is formed by a vacuum process, and further conductive by plating. Electromagnetic wave shielding member obtained by laminating a black layer after thickening the conductive metal layer.
5. After forming a reversible resin layer having a reverse pattern of a geometric figure on a transparent plastic support and laminating a black layer or a conductive metal layer by a vacuum process, the black resin layer is formed on the resin layer. A method for producing an electromagnetic wave shielding member, comprising peeling together with a layer or a conductive metal layer.
6). Item 6. The method for producing an electromagnetic wave shielding member according to Item 5, wherein the method for forming the peelable resin is a printing method.
7). An electromagnetic shielding member comprising: a mask having a reverse pattern of a geometric figure on a transparent plastic support; and forming a conductive metal layer or a black layer by a vacuum process, and then peeling the mask. Method.
8). Item 7 is characterized in that when a conductive metal layer or a black layer is formed on a transparent plastic support by a vacuum process, a mask comprising a mesh screen layer and a resin layer having a reverse pattern of a geometric figure pattern is used. The manufacturing method of the electromagnetic wave shielding member of description.
9. Item 7 is a mask in which when a conductive metal layer or a black layer is formed on a transparent plastic support by a vacuum process, each element in the mask made of a reverse pattern of a geometric figure pattern is connected by a thin line. The manufacturing method of the electromagnetic wave shielding member as described in 1 ..
10. Item 8. The electromagnetic wave shielding member according to Item 7, wherein when the conductive metal layer or the black layer having a geometric figure pattern is formed on the transparent plastic support, the mask mounting, layer formation, and mask peeling steps are repeatedly formed. Production method.
11. A conductive metal layer or a black layer is selectively formed in a portion where the oil is not applied by a vacuum process after the oil is applied in a reverse pattern of the geometric figure on the transparent plastic support. Manufacturing method of electromagnetic wave shielding member.
12 A method for producing an electromagnetic wave shielding member, comprising forming a conductive metal film or a black layer on a transparent plastic support by the method according to any one of Items 5 to 11 and then laminating the conductive metal layer by plating. .
13. Item 13. A method for producing an electromagnetic wave shielding member, comprising forming a conductive metal film by the method according to any one of Items 5 to 12 and laminating a black layer on a transparent plastic support.
14 Item 5. The electromagnetic wave shielding member according to any one of Items 1 to 4, wherein a method for forming each layer by a vacuum process is any one of a vacuum deposition method, a sputtering method, and an ion plating method.
15. Item 5. The electromagnetic wave shielding member according to any one of Items 1 to 4, wherein the line width of the geometric figure drawn with the conductive metal layer or the black layer is 40 µm or less, the line interval is 100 µm or more, and the line thickness is 20 µm or less.
16. An electromagnetic wave shielding member in which a resin layer is laminated so as to cover part or all of a conductive metal layer or a black layer on a structure comprising a conductive metal layer, a black layer, and a transparent plastic support.
17. Item 17. The electromagnetic wave shielding member according to any one of Items 1 to 4, and 14 to 16, wherein the plastic support is a polyethylene terephthalate film, a polycarbonate film, or a polyether sulfone film.
18. Item 1 to Item 4 or Item 14 to Item 17, wherein the metal constituting the conductive metal layer contains at least one metal having a volume resistivity of 20 μΩ / cm or less at 20 ° C. The electromagnetic wave shielding member as described.
19. Item 19. A light-transmitting electromagnetic wave shielding member for a plasma display panel according to any one of Items 1 to 4, and 14 to 18.

  The electromagnetic wave shielding member obtained by the present invention is formed by simultaneously patterning a conductive metal layer by a vacuum process, and is produced by depositing the conductive metal layer by plating as necessary, and has both high transparency and good conductivity. At the same time, the pattern of the conductor layer can be formed at a low cost. Further, by forming the black layer, a member having good contrast and excellent visibility can be efficiently produced particularly when applied as an electromagnetic wave shielding member used for the front surface of the display.

  The present invention is described in detail below. First, it shows using a drawing. FIG. 1 is an example of a cross-sectional view of an electromagnetic wave shielding member obtained by using the present invention. (A) is a cross section of an electromagnetic wave shielding member obtained by laminating a black layer and a conductive metal layer on a transparent plastic support using a vacuum process. (B) is a cross section of an electromagnetic wave shielding member obtained by laminating a black layer and a conductive metal layer on a transparent plastic support using a vacuum process and then further laminating a conductive metal layer by plating. (C) is a cross section of an electromagnetic wave shielding member obtained by forming a conductive metal layer on a transparent plastic support using a vacuum process and laminating a black layer separately by blackening or printing. (D) is obtained by forming a conductive metal layer on a transparent plastic support using a vacuum process, further laminating a conductive metal layer by plating, and laminating a black layer separately by blackening or printing. It is a cross section of the obtained electromagnetic wave shielding member. A conductive metal layer 3 is laminated on the transparent support 1 via a black layer 2 (a). Further, another conductive metal layer 4 is laminated on the conductive metal layer 3 (b). In addition, conductive metal layers 3 and 4 are sequentially laminated on the transparent support 1, and a black layer 2 is laminated thereon.

  FIG. 2 is a cross-sectional view of an electromagnetic wave shielding member obtained by coating a resin layer on the electromagnetic wave shielding member obtained by using the present invention. In the transparent support 1, a conductive metal layer 5 having a black layer is laminated, and this is shown by the resin layer 6.

  The conductive metal layer described in the present invention refers to a layer made of a conductive metal. Since the electromagnetic wave shielding member shields the electromagnetic wave by changing the electromagnetic wave into an electric current and flowing it to the ground, it is preferable that the conductivity is higher. The type of metal is not particularly limited, but it is preferable that at least one type of metal having a volume resistivity (specific resistance) at 20 ° C. of 20 μΩ / cm or less is included. Examples of such metal species include silver (1.62 μΩ / cm), copper (1.72 μΩ / cm), gold (2.4 μΩ / cm), aluminum (2.75 μΩ / cm), tungsten (5.5 μΩ). / Cm), nickel (7.24 [mu] [Omega] / cm), iron (9.0 [mu] [Omega] / cm), chromium (17 [mu] [Omega] / cm, all values at 20 [deg.] C.), etc., but are not particularly limited thereto. If possible, the volume resistivity is more preferably 10 μΩ / cm, and further preferably 5 μΩ / cm. In order to exhibit electromagnetic wave shielding properties, it is preferable to have high conductivity. Therefore, it is preferable to use the above-mentioned metal as a main component, but when the surface is colored to improve the appearance and contrast. Since a single metal cannot be used, an alloy with another metal or an oxide thereof may be used. In view of the availability and price of metals, it is particularly preferable to use copper, aluminum or the like.

  The black layer in the present invention is formed for ensuring visibility including antireflection and the like. The front surface of the electromagnetic wave shielding member is preferably black because it satisfies requirements such as high contrast and a black screen when the display is turned off. Accordingly, it is preferable that at least the surface of the electromagnetic wave shielding member that is viewed in use is a black layer.

As a method for forming the conductive metal layer or the black layer, it is preferable to have at least one layer formed using a vacuum process. The vacuum process is a method using a vacuum technique, and examples thereof include a vacuum deposition method, a sputtering method, and an ion plating method.
The vacuum deposition method is a method in which a substance is heated and evaporated in a vacuum chamber evacuated to a vacuum, and is received and adhered to a flat surface to form a metal film. Various methods can be used as the vapor deposition method, but the electron beam method is preferable in order to form a relatively thick film.
In the method of forming indium oxide or silver as the transparent conductive film, it has been difficult to form a thick film because the thickness of the film for maintaining transparency is limited. However, in this method, since the patterning is performed when the conductive metal layer is formed, the film can be thickened.
Sputtering is a method in which a substance is evaporated by utilizing the phenomenon that when ions on a solid surface are irradiated with accelerated ion particles, the ions and atoms on the solid surface exchange momentum and atoms are ejected from the solid surface. This is a method of forming a metal film.
The ion plating method is a method of forming a film using ions as in sputtering, but is a method of forming a film by depositing ions themselves. The atomized atoms are ionized using plasma, and energy is applied to the atom to attach it to the object.
Vacuum deposition, sputtering, and ion plating can be used as both methods for forming the conductive metal layer and the black layer. The order may be either. The conductive metal layer and the black layer may be stacked in this order, or the black layer and the conductive metal layer may be stacked in this order. Alternatively, only the conductive metal layer may be formed by a vacuum process, and the black layer may be formed by another method. In order to shorten the manufacturing time, it is preferable to form at least a part of the conductive metal layer by a vacuum process.

The transparent plastic support described in the present invention is a transparent plastic film, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate, polyolefins such as polyethylene, polypropylene, polystyrene and EVA, A film made of vinyl resin such as vinyl chloride and polyvinylidene chloride, plastics such as polysulfone, polyethersulfone, polycarbonate, polyamide, polyimide, and acrylic resin, and has a total visible light transmittance of 70% or more, including colorless or colored. A length of 1 mm or less is preferable. These can be used as a single layer, but may be used as a multilayer film in which two or more layers are combined. Among these, a polyethylene terephthalate film, a polycarbonate film, or a polyether sulfone film is preferable in terms of transparency, heat resistance, ease of handling, and cost. The thickness of the plastic film is more preferably 5 to 500 μm. When the thickness is less than 5 μm, the handleability deteriorates, and when it exceeds 500 μm, the transmittance of visible light decreases. 10 to 200 μm is more preferable. Moreover, an antireflection layer and a near-infrared shielding layer may be formed on or included in the plastic support. Moreover, it is also possible to raise the electroconductivity of the whole film using a transparent conductive film.
These films may be subjected to surface treatment or the like in order to improve the adhesion to the conductive metal layer. As a surface treatment method, primer coating treatment, plasma treatment or corona discharge treatment is generally used, but a metal such as nickel having good adhesion to a plastic film is made thin to the extent that transparency is not affected. It is also possible to take a film. In this case, the thickness of the film is preferably 100 mm or less.

  Geometric figures include triangles such as regular triangles, isosceles triangles, right triangles, squares, rectangles, rhombuses, parallelograms, trapezoidal squares, (positive) hexagons, (positive) octagons, (positive) twelve It is a combination of (positive) n squares such as squares, (positive) decagons, circles, ellipses, stars, etc., and these units can be used alone or in combination of two or more. is there. From the viewpoint of electromagnetic shielding properties, the triangle is the most effective, but from the point of view of visible light transmission, the aperture ratio increases as the n number of (positive) n-gons increases with the same line width. In view of this, the aperture ratio needs to be 50% or more, and more preferably 60% or more. The aperture ratio is a percentage of the ratio of the area obtained by subtracting the area of the conductive metal layer or the black layer of the geometric figure drawn with the conductive metal layer or the black layer from the effective area of the electromagnetic shielding member. When the area of the display screen is the effective area of the electromagnetic wave shielding transparent member, the screen can be seen.

  When forming a conductive metal layer by a vacuum process, if it is assumed that it takes time because the target thickness is thick, a conductive metal layer may be further laminated thereon by plating. As the plating method, both electroplating and electroless plating can be used. When electroless plating is used, plating can be performed by thinly laminating a metal that serves as a seeder when forming the conductive metal layer. Usually, it is preferable to use electroplating in consideration of the deposition rate of plating. As a plating method, a known method can be used. As the plating method, the method described in “Practical Plating for On-Site Engineers”, edited by Japan Plating Association, Tsuji Shoten, p87-504 (1986) can be referred to.

  The method for laminating the black layer is not limited to the method by a vacuum process, and may be formed by plating, oxidation treatment of the metal layer surface, or by printing black ink or carbon paste. You may let them. When blackening by plating or oxidation treatment, a metal oxide or a metal sulfide is preferable, and not only one kind of metal but also an alloy of a plurality of metals may be laminated.

The invention described in the above item 6 is a method generally called lift-off, in which a pattern is formed using a resin on a transparent plastic support, a conductive metal layer is formed thereon, and the first is formed later. This is a method of peeling a resin pattern. Since the conductive metal layer formed on the resin is peeled together when the resin is peeled off, patterning is possible by leaving the pattern of the conductive metal layer only in the portion where the resin layer is not formed. Therefore, it is necessary to form the resin in the reverse pattern of the geometric figure pattern.
As the peelable resin, a solvent-soluble resin, an alkali-soluble resist, or the like can be used. The solvent-soluble resin is preferably a heat-resistant resin that can withstand the heat during formation of the conductive metal layer, for example, a polyimide ether resin, a polyamide resin, a polyamideimide resin, a polybenzimidazole resin, a polyhydantoin resin, a polyparaban resin, or a solvent-resistant resin. There is a melt type polyimide resin. Silicone grease or oil-based ink can also be used. As the alkali-soluble resin, a general resist can be used. Examples of the binder polymer constituting the resist include the following. Natural rubber, polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene, poly-2-heptyl-1,3-butadiene, poly-2-t-butyl-1,3-butadiene, poly-1,3- (Di) enes such as butadiene, polyoxyethylene, polyoxypropylene, polyvinyl ethyl ether, polyvinyl hexyl ether, polyethers such as polyvinyl butyl ether, polyesters such as polyvinyl acetate and polyvinyl propionate, polyurethane, ethyl cellulose, poly Vinyl chloride, polyacrylonitrile, polymethacrylonitrile, polysulfone, polysulfide, polyethyl acrylate, polybutyl acrylate, poly-2-ethylhexyl acrylate, poly-t-butyl acrylate, poly-3-eth Xylpropyl acrylate, polyoxycarbonyl tetramethacrylate, polymethyl acrylate, polyisopropyl methacrylate, polydodecyl methacrylate, polytetradecyl methacrylate, poly-n-propyl methacrylate, poly-3,3,5-trimethylcyclohexyl methacrylate, polyethyl methacrylate, Poly (meth) acrylic acid esters such as poly-2-nitro-2-methylpropyl methacrylate, poly-1,1-diethylpropyl methacrylate, and polymethyl methacrylate can be used. Furthermore, epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate, or the like can be used as a copolymerizable monomer other than acrylic resin and acrylic. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent from the viewpoint of wettability to the conductive metal layer. As the epoxy acrylate, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl Alcohol diglycidyl ether, resorcinol diglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether (Meth) acrylic acid adducts such as A polymer that reacts like an epoxy acrylate or originally has a hydroxyl group in the molecule is effective in improving wettability and adhesion. These copolymer resins can be used in combination of two or more as required. Besides these, thermosetting resins such as phenol resin, melamine resin, epoxy resin, xylene resin and the like can be applied, and these polymers may be copolymerized as required, Two or more kinds can be blended and used. These binder polymers can usually be used by dissolving in a general-purpose solvent or stirring and mixing with the following additives without solvent. In addition to binder polymer, dispersant, thixotropic agent, antifoaming agent, leveling agent, diluent, plasticizer, antioxidant, metal deactivator, coupling agent, filler, conductive Additives such as conductive particles may be blended.

As a method for patterning the peelable resin layer, various methods such as a photolithography method can be used. For example, a printing method can be used. The printing method is not limited to this, but various methods such as screen printing, ink jet printing, intaglio printing, letterpress printing, offset printing, gravure printing, flexographic printing can be used. In consideration of this, intaglio offset printing, relief reversal offset printing, ink jet printing and the like are suitable, and in order to print a finer pattern, it is preferable to use relief reversal offset printing.
In the present invention, a mask formed when the conductive metal layer is formed may be used. The mask is mounted on a transparent plastic support, and after the conductive metal layer or black layer is laminated, the mask is peeled off. Although it is useful to use a metal mask or a ceramic mask from the viewpoint of heat resistance and hardness, in order to form a finer pattern, a mask as described below can be prepared and used.
As a configuration of the mask, a resin layer may be laminated on the mesh screen in a pattern opposite to the geometric figure pattern, and this may be used as a mask. The mesh screen is preferably made by weaving fine filaments such as stainless steel or steel, or chemically synthesized monofilament fibers such as polyester or nylon, with warp and weft, and stretching the mesh around a frame. From the viewpoint of heat resistance and rigidity, it is more preferable to use a fine metal wire. The resin constituting the reverse pattern of the geometric figure pattern is preferably a heat-resistant photosensitive resin that can withstand the heat during the formation of the conductive metal layer, such as a polyimide ether resin, a polyamide resin, a polyamideimide resin, or a polybenzimidazole resin. , Polyhydantoin resins, polyparaban resins and polyimide resins.
As a method for forming the resin layer on the mesh screen, various known methods can be used. For example, the following method can be used. For example, a photosensitive resin is directly applied to a mesh screen to form a photosensitive film, and an original plate on which a pattern of a geometric figure is drawn is exposed and then developed. The photosensitive resin in the drawing portion falls off in the developing water washing step, and the mesh fibers are exposed, and a desired mask is produced. As another manufacturing method, a photosensitive resin is coated on a peelable film, and a master disk on which a pattern of a geometric figure is drawn is exposed and developed. Next, the pattern of the photosensitive resin formed in the film which has peelability is affixed on a mesh screen, and only the film which has peelability is peeled after drying, and the pattern produced previously is transferred. At this time, if the line direction of the geometric figure pattern matches the line direction of the mesh, the mesh line may interfere with the adhesion of the metal onto the transparent plastic support. It is preferable to shift the angle. Moreover, when laminating | stacking a mesh screen and resin, it is preferable that it is the structure where the mesh screen layer is partly or entirely embedded in the resin layer. If both layers are simply laminated, the resin layer is easily peeled off, and may be peeled off while the conductive metal layer is formed. Furthermore, a structure in which the mesh screen layer is completely embedded is more preferable.
When a mask composed of a mesh screen layer and a resin layer is attached and the conductive metal layer is laminated by a vacuum process, the mask is adhered to a plastic support. At that time, the conductive metal layer is laminated on a portion other than the resin layer of the mask, and the metal layer is formed on the lower part of the mesh screen. Therefore, the mesh screen layer of the mask is brought into close contact with the transparent plastic support. It is preferable. As a specific form, FIG. 3 is an example showing the configuration of a mask composed of a screen mesh layer 7 and a resin layer 8 to be mounted when a conductive metal layer or a black layer is formed using a vacuum process in the present invention. An example where the geometric figure pattern is a quadrangle is shown. 3, (a) is a partial plan view of the mask, and (b) is an example of the mask when the screen mesh layer 7 is entirely embedded in the resin layer 8 in the xy cross section of (a). It is sectional drawing. (C) is sectional drawing of an example of the mask in case the screen mesh layer 7 is partially embedded in the resin layer 8 in the xy cross section of (a). When a metal is deposited by a vacuum process such as vapor deposition or sputtering, the mesh screen layer does not get in the way unless it is in contact with the transparent plastic support because the metal wraps around when it hits the object.
As another mask configuration, a mask in which island-like substances (hereinafter referred to as elements) in a mask formed of a reverse pattern of a geometric figure pattern are connected by thin lines may be used. FIG. 4 is a perspective view of an example of a mask in which each element 9 in a mask composed of a reverse pattern of a geometric figure pattern to be attached when a conductive metal layer or a black layer is formed using a vacuum process is connected by a thin line 10. It is a figure, Comprising: An example in case a geometric figure pattern is a rectangle is shown. In other words, each element of the reverse pattern of the geometric figure pattern exists independently from the frame, and each element is disjoint if there is nothing to anchor. A thin line supports this. The thin wire needs a certain level of strength to support each element, and is preferably made of a metal such as stainless steel. The optimum thickness of the thin wire varies depending on the material and size of the element and the distance between the elements, but is preferably 1 to 40 μm. If it is thinner than that, the strength is insufficient to support each element, and if it is too thick, it may prevent the metal from adhering. The thickness is more preferably 3 μm to 20 μm, further preferably 5 μm to 15 μm. Further, it is preferable to provide a thin line on the top of each element (on the side not in contact with the transparent plastic support) because it does not hinder the adhesion of metal.
When using a mask in the present invention, there are a step of attaching a mask, a step of forming a conductive metal layer or a black layer, and a step of peeling off the mask. Is complicated. Therefore, it is preferable that each step can be performed continuously. An example of the process performed continuously is shown in FIG. FIG. 5 is a schematic view of an apparatus for continuously performing mask mounting, conductive metal layer formation, and mask peeling processes in the apparatus. The raw film 12 as a transparent plastic support is unwound from the film unwinding roll 11, and the film 12 and the mask 13 are brought into close contact with the contact roll 14. At this time, it is preferable to apply tension so that the film 12 and the mask 13 which are in contact with each other are not loosened and peeled off. A conductive metal layer is formed on the support roll 15 while the film and the mask 13 are in close contact with each other. In the step of forming the conductive metal layer, the vacuum process described herein is adopted. However, since heat is often applied, it is more preferable to have a mechanism for cooling the support roll 15 (not shown). After the formation of the conductive metal layer, the mask 13 and the film 12 are peeled off, and the mask 13 is circulated and brought into close contact with the film 12 again. When the mask 13 is flexible, the above steps can be taken. After the conductive metal layer is formed, the film 12 peeled off from the mask 13 is taken up by a film take-up roll 16. In the vacuum process, the metal source or ion source 17 is adjusted.
In the present invention, it is assumed that it is difficult to maintain the mask as described above because the target pattern is fine. In that case, after applying the mask with a part of the reverse pattern of the geometric figure pattern, forming the conductive metal layer, and removing the mask, another part of the reverse pattern of the geometric figure pattern is drawn. The same process is repeated using the mask. Thus, the process from mask mounting to peeling can be repeated a plurality of times to form a desired geometric pattern.
The present invention also applies an electromagnetic wave to a transparent plastic substrate before the formation of the conductive metal layer and performs patterning, and selectively forms a conductive metal layer or a black layer on a portion where the oil is not applied, thereby forming an electromagnetic wave. A shielding member can be produced. Various patterning materials can be used. For example, in addition to ester oil, glycol oil, fluorine oil, hydrocarbon oil, silicone oil, liquid paraffin, and the like can be used. Since the oil is evaporated at the portion where the oil is applied by heat when the metal is attached, the conductive metal layer at that portion is prevented from attaching.
A known method can be used as an oil patterning method. For example, as described in Japanese Patent Application Laid-Open No. 2001-313227, oil that has been heated and vaporized is sprayed from pores processed into a shape to be patterned and is supported by a plastic. An oil pattern can be formed on the body. At this time, if the injection is intermittently performed and the timing is adjusted, not only the band shape but also the geometric figure pattern can be patterned. Further, as described in JP-A-2000-144375, a mask forming roll having a pattern formed on the surface from an oil adhering roll in which an oil-impregnated cloth-like substance such as felt or a porous nonwoven fabric is wound on the surface is provided. It is also possible to use a method of transferring oil onto the plastic support via. FIG. 6 shows an example of a patterning method for a film in that case. In this case, as shown in FIG. 6A, the patterning method includes a mask forming roll 19, an oil adhering roll 18, and a backup roll 20, and the raw film 21 runs while being sandwiched between the mask forming roll and the backup roll. To do. As shown in FIG. 6B, the surface 23 of the mask forming roll is formed with convex portions 24 that are reverse patterns of the geometric figure pattern to be formed. As a method of supplying oil to the oil adhering roll, although not shown, a separate oil reservoir may be prepared and impregnated into a cloth-like substance or non-woven fabric on the surface of the oil adhering roll. You may spray on the oil adhesion roll surface. In the apparatus of this figure, oil is transferred from the oil adhesion roll to the convex part of the mask forming roll, and oil 22 is transferred from the oil adhesion roll surface to the film 21 surface.
It is also possible to perform patterning by printing using oil as ink. As the printing method at this time, the known methods mentioned above can be used. The apparatus for patterning these oils 22 is preferably incorporated in an apparatus for forming a conductive metal layer by a vacuum process.

Such a geometric figure pattern preferably has a line width of 40 μm or less and a line interval of 100 μm or more. Further, the line width is more preferably 25 μm or less from the viewpoint of non-visibility of the geometric figure, and the line interval is more preferably 120 μm or more from the viewpoint of visible light transmittance. The line width is preferably 40 μm or less, and preferably 25 μm or less. If the line width is too small, the surface resistance becomes too large and the shielding effect is poor, so that the line width is preferably 1 μm or more. The larger the line spacing, the better the aperture ratio and the visible light transmittance. If the line interval becomes too large, the electromagnetic wave shielding property is deteriorated. Therefore, the line interval is preferably set to 1000 μm (1 mm) or less. When the line interval is complicated by a combination of geometric figures or the like, the area is converted into a square area with the repetition unit as a reference, and the length of one side is set as the line interval.
Further, the thickness of the line formed by the vacuum process and plating is preferably 20 μm or less, and as the electromagnetic wave shielding member on the front surface of the display, the thinner the thickness, the better the viewing angle of the display. Further, the time required for forming the conductive metal layer by the vacuum process or deposition by plating is also shortened, so the thickness is preferably 15 μm or less, and more preferably 10 μm or less. In particular, the thickness of the conductive metal layer formed by a vacuum process is preferably 8 μm or less because it takes time to form a film. If the thickness is too thin, the surface resistance becomes too large and the shielding effect is inferior, and the strength of the pattern of the conductor layer is inferior and peeling becomes difficult, so the total thickness of the conductive metal layer is preferably 0.5 μm or more, preferably 1 μm or more. Is more preferable.
For example, when the same shape is produced by photolithography, when the copper foil and the base film are bonded together, the roughened surface of the copper foil is transferred to the base film, so that the obtained member becomes opaque and becomes transparent. Therefore, it is indispensable to provide a resin layer on the surface. However, in the electromagnetic wave shielding member produced according to the present invention, since the surface of the adhesive support is not roughened, the lamination of the resin layer is not essential. However, the conductive metal layer and the black layer obtained in the present invention are preferably provided with a resin layer for protection on a part or the entire surface thereof.
Various methods can be used as the method for providing the resin layer. For example, as described in JP-A-2002-259490, a resin layer that flows by heating or pressurizing is used for insulating geometry. A method of forming a resin layer by embedding in voids obtained by reflecting the shape of a geometric pattern, or a resin layer that is cured by irradiation with active energy rays as described in JP-A No. 2002-259491 For example, a method may be used in which a resin layer is formed by applying an active energy ray to be cured after the coating is applied so as to fill the voids obtained by reflecting the shape of the insulating geometric figure pattern.

  EXAMPLES Next, the present invention will be specifically described using examples, but the present invention is not limited thereto. In the following, the line width, pitch, and aperture ratio were measured based on micrographs. The visible light transmittance was measured using a double beam spectrophotometer (200-10 type, manufactured by Hitachi, Ltd.), and the transmittance was measured at 400 to 700 nm, and the average value was used. The presence or absence of pattern abnormality was determined by visual observation. The electromagnetic shielding properties were measured at a frequency of 300 MHz using the Advantest method. The number of processes is counted as one process that can be performed by the same apparatus, and the process that needs to be changed is counted as another process. Visibility was actually evaluated by pasting on the front surface of the plasma display module.

A negative photosensitive polyimide (CT427L, manufactured by Kyocera Chemical Co., Ltd.) is applied in liquid form to a screen mesh made of stainless steel wire (thickness 12 μm, pitch 30 μm) on a polyethylene terephthalate film (A-4100, manufactured by Toyobo Co., Ltd., 100 μm). Development was performed after exposure using a predetermined mask. A mask (groove width 20 μm, line pitch 300 μm) was attached, and the mask was peeled after 5 μm of copper was deposited by vacuum deposition. Next, the surface was blackened by treatment at 80 ° C. for 10 minutes with a blackening solution having the following composition. The following (resin composition 1) was coated on the metal layer side of the obtained electromagnetic wave shielding member and heated at 100 ° C. for 5 hours. The electromagnetic wave shielding member had a line width of 20 μm and a pitch of 300 μm.
(Blackening treatment solution 1 (aqueous solution))
・ Sodium chlorite 30g / L
・ Sodium hydroxide 10g / L
・ Sodium triphosphate 5g / L
(Resin composition 1)
-YD-8125 (manufactured by Tohto Kasei Co., Ltd.) 100 parts by weight-IPDI (manufactured by Hitachi Chemical Co., Ltd.) 12.5 parts by weight-0.3 parts by weight of 2-ethyl-4-methylimidazole-330 parts by weight of MEK-cyclohexanone 15 parts by weight

A reverse pattern of the lattice (groove width 20 μm, pitch) using a relief printing offset printing with an ink resist (RAYCAST, manufactured by Hitachi Chemical Co., Ltd.) on a polyethersulfone film (Sumilite FS-1300, manufactured by Sumitomo Bakelite Co., Ltd., 100 μm). 250 μm). Then, after prebaking at 90 ° C. for 15 minutes, ultraviolet rays were applied at 90 mJ / cm ² with a high-pressure mercury lamp. Then, copper oxide was continuously formed by sputtering at 0.1 μm and copper at 0.8 μm, and then the resist was peeled off. On the line formed by sputtering, 5 μm of copper was deposited by electroplating. (Metal composition 1) was coated on the metal layer side of the obtained electromagnetic wave shielding member and heated at 100 ° C. for 5 minutes.

Polyethylene terephthalate film (A-4100, manufactured by Toyobo Co., Ltd., 100 μm), fluorine-based oil (Crytox, manufactured by DuPont Co., Ltd.) as a patterning material, and a reverse-grid pattern (groove width 20 μm, pitch 300 μm) Then, the film was formed through a mask forming roll (these rolls were incorporated in a vapor deposition machine), and then copper (thickness 1 μm) was formed by vapor deposition. Thereafter, copper was thickened by electrolytic copper plating to 8 μm thick, and then black ink (Every Ohm 101S, manufactured by Nippon Graphite Industries Co., Ltd.) was printed thereon on the metal layer made of copper by 0.5 μm letterpress reverse printing. (Resin composition 2) was coated from the black layer side of the obtained electromagnetic wave shielding member, and irradiated with 1 J / cm 2 of ultraviolet rays using an ultraviolet lamp. The electromagnetic wave shielding member had a line width of 35 μm and a pitch of 300 μm (resin composition 2).
-Polypropylene glycol diacrylate (NK ester APG-700, manufactured by Shin-Nakamura Chemical Co., Ltd.) 100 parts by weight-Trimethylolpropane trimethacrylate (NK ester TMPT, manufactured by Shin-Nakamura Chemical Co., Ltd.) 50 parts by weight-Benzophenone 5.5 parts by weight・ Michler ketone 1.2 parts by weight

  Polycarbonate film (Macro hole DE, Bayer KK, 75 μm) diluted with silicone grease (SH7071, Toray Silicone KK) with solvent to adjust the viscosity of the reverse lattice pattern (groove width 30 μm) by inkjet printing , Pitch 250 μm). Thereafter, tin oxide was continuously laminated by 0.2 μm and copper by 5 μm by ion plating. The silicone layer and the metal layer thereon were peeled off by ultrasonic cleaning using toluene. The obtained electromagnetic wave shielding member had a line width of 30 μm and a pitch of 250 μm.

A reverse pattern of the lattice (groove width of 15 μm, pitch) using relief printing offset printing of an ink resist (RAYCAST, manufactured by Hitachi Chemical Co., Ltd.) on a polyethersulfone film (Sumilite FS-1300, manufactured by Sumitomo Bakelite Co., Ltd., 100 μm) 150 μm). Then, after prebaking at 90 ° C. for 15 minutes, ultraviolet rays were applied at 90 mJ / cm ² with a high-pressure mercury lamp. Then, copper oxide 0.1 μm and aluminum 8 μm were continuously laminated by sputtering, and then the mask was peeled off together with the metal layer formed thereon. (Metal composition 1) was coated on the metal layer side of the obtained electromagnetic wave shielding member and heated at 100 ° C. for 5 hours. The electromagnetic wave shielding member had a line width of 15 μm and a pitch of 150 μm.

  A negative photosensitive polyimide (CT427L, manufactured by Kyocera Chemical Co., Ltd.) is applied in liquid form to a screen mesh made of stainless steel wire (thickness 10 μm, pitch 25 μm) on a polycarbonate film (Macro Hall DE, Bayer Corporation, 75 μm). Development was performed after exposure using a mask. A mask (groove width 20 μm, line pitch 400 μm) was attached, and silver was deposited by 1 μm by electron beam evaporation. After removing the mask, copper was deposited by electroplating to a thickness of 5 μm, and a black layer was formed using (Blackening Treatment Solution 1). The obtained electromagnetic wave shielding member had a line width of 30 μm and a pitch of 400 μm.

(Comparative Example 1)
On the surface of a polyethylene terephthalate film (A-4100, manufactured by Toyobo Co., Ltd., 100 μm), a primer (HP-1, manufactured by Hitachi Chemical Co., Ltd., coating thickness: 1 μm), adhesive (SN-10, manufactured by Electrochemical Industry Co., Ltd.) , 30 μm) and the roughened surface of the 20 μm thick electrolytic copper foil (with the black layer formed of (blackening treatment liquid 1)) were laminated by heating lamination. A copper mesh pattern with a line width of 20 μm and a line pitch of 280 μm is passed through a photolithographic process (resist film application-exposure-development-chemical etching-resist film peeling) using a chemical etching method to the obtained PET film with copper foil. It formed on the film and the electromagnetic wave shielding member was obtained. At this time point, the visible light transmittance was 38%. The surface on which the metal layer was formed was coated with (resin composition 2) and irradiated with 1 J / cm 2 of ultraviolet rays using an ultraviolet lamp.

(Comparative Example 2)
Primer (HP-1, Hitachi Chemical Co., Ltd., coating thickness 1 μm) and adhesive (Byron UR-1400, Toyobo Co., Ltd.) on the surface of polyethersulfone film (Sumilite FS-1300, manufactured by Sumitomo Bakelite Co., Ltd., 100 μm) A grid pattern (line width 40 μm, line pitch 350 μm, line thickness 1 μm) of silver paste (Epimar EM-4500, manufactured by Hitachi Chemical Co., Ltd.) using an intaglio offset method on an adhesive film sequentially coated with 30 μm). Formed. A carbon paste (DY-150H-30, manufactured by Toyobo Co., Ltd.) was formed thereon by printing (line thickness 0.5 μm), and the paste resin was cured at 150 ° C. for 1 hour to obtain an electromagnetic wave shielding member. .

(Comparative Example 3)
An electromagnetic wave shielding member was obtained in the same manner as in Example 3 except that the blackening treatment was not performed. The obtained electromagnetic wave shielding member had a line width of 35 μm and a pitch of 300 μm.
The results of evaluating the aperture ratio, visible light transmittance, presence / absence of pattern abnormality, visibility, and shielding performance at 300 MHz for the pattern of the conductor layer obtained as described above are shown in a separate table.

In Example 1, a metal layer was formed by vapor deposition using a mask composed of a screen mesh layer and a resin layer, and then a blackening treatment was performed. In Example 2, resist ink was formed on a transparent plastic support by printing, and copper oxide and copper were continuously formed on the transparent plastic support by sputtering in the same apparatus. Thus, when laminating | stacking a metal layer using the formation method which passes through a vacuum process, it is preferable to form a metal layer continuously in the same process without a processing cost. In Example 3, oil is printed on the reverse pattern of the lattice reflecting the shape of the mask forming roll (see FIG. 6B), a metal layer is formed by vapor deposition, and copper is deposited thereon by electroplating. Further, blackening treatment is performed with black ink. Example 4 is an example in which patterning is performed in the same manner as in Example 2, and a black layer and a metal layer are formed by ion plating. Example 5 is an example in which patterning was performed in the same manner as in Example 2 and aluminum was sputtered as the metal layer. In Example 6, a metal layer made of silver was formed by vapor deposition using a mask made of a screen mesh layer and a resin layer in the same manner as in Example 1, and then copper was deposited by plating, followed by blackening treatment. It is a thing. In all of Examples 1 to 6, there was no problem in visible light transmittance, shielding properties, and pattern abnormality, and the visibility was good.
Comparative Example 1 is an example in which a copper foil and a transparent plastic support are bonded together and an electromagnetic wave shielding member is obtained by etching through a photo process. Although the electromagnetic wave shielding property was good, it was opaque unless the resin was coated. There is also a problem that the number of processes is large and the cost for mass production is high. In Comparative Example 2, a conductive metal layer was formed by intaglio offset printing using silver paste, but the line width was set to 40 μm because a thin width such as 20 μm could not be formed. Still, it was faint, wire breakage occurred, and it was found by microscopic observation that the lines were blurred. Also, the line thickness was only about 1 μm, and the electromagnetic wave shielding property was only about −15 dB because of poor conductivity. The comparative example 3 is an example when a black layer is not formed. The gloss of copper was reflected and the line was visually recognized, so the visibility was poor.

It is an example of sectional drawing of the electromagnetic wave shielding member obtained using this invention. (A) It is a cross section of the electromagnetic wave shielding member obtained by laminating | stacking a black layer and an electroconductive metal layer on a transparent plastic support body using the vacuum process. (B) It is the cross section of the electromagnetic wave shielding member obtained by laminating | stacking a black metal layer and a conductive metal layer on a transparent plastic support body using a vacuum process, and also laminating | stacking a conductive metal layer by plating. (C) A cross section of an electromagnetic wave shielding member obtained by forming a conductive metal layer on a transparent plastic support using a vacuum process and laminating a black layer separately by blackening or printing. (D) Obtained by forming a conductive metal layer on a transparent plastic support using a vacuum process, further laminating a conductive metal layer by plating, and laminating a black layer separately by blackening or printing, etc. 3 is a cross section of an electromagnetic wave shielding member. It is sectional drawing of the electromagnetic wave shielding member obtained by coating the resin layer on the electromagnetic wave shielding member obtained using this invention. It is an example which shows the structure of the mask which consists of a screen mesh layer and resin layer with which it mounts | wears when forming a conductive metal layer or a black layer using a vacuum process in this invention. (A) is a partial top view of a mask. (B) It is sectional drawing of an example of a mask in case the screen mesh is entirely embedded in the resin layer in the xy cross section of (a). (C) It is sectional drawing of an example of the mask in case the screen mesh is partially embedded in the resin layer in the xy cross section of (a). It is a perspective view of an example of the mask in which each element in the mask which consists of the reverse pattern of the geometric figure pattern with which it mounts | wears when forming a conductive metal layer or a black layer using a vacuum process in this invention is connected by the thin line. . It is a schematic diagram of the apparatus for performing the process of mask mounting | wearing, electroconductive metal layer formation, and mask peeling continuously in an apparatus. (A) It is a schematic diagram of the apparatus which patterns oil on a transparent plastic support body, before forming a conductive metal layer or a black layer using a vacuum process in this invention. (B) It is an example of the enlarged view of the surface of a mask formation roll in (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transparent support body, 2 Black layer, 3 Conductive metal layer 1, 4 Conductive metal layer 2, 5 Conductive metal layer + Black layer, 6 Resin layer, 7 Mesh screen layer, 8 Resin layer, 9 Each of mask Element, 10 Fine wire, 11 Film winding roll, 12 Film, 13 Mask, 14 Adhesion roll, 15 Support roll, 16 Film winding roll, 17 Metal source or ion source, 18 Oil adhesion roll, 19 Mask forming roll, 20 Backup Roll, 21 Film, 22 Oil, 23 Roll surface, 24 Convex

Claims (19)

A structure composed of a conductive metal layer, a black layer, and a transparent plastic support is characterized by forming a geometric pattern having an aperture ratio of 50% or more when forming the conductive metal layer and the black layer by a vacuum process. An electromagnetic wave shielding member. In a structure composed of a conductive metal layer, a black layer, and a transparent plastic support, a geometric figure pattern having an aperture ratio of 50% or more is formed in the formation of the conductive metal layer and the black layer by a vacuum process. An electromagnetic wave shielding member, wherein a conductive metal layer is laminated on the substrate by plating. In a structure consisting of a conductive metal layer, a black layer, and a transparent plastic support, a geometric figure pattern having an aperture ratio of 50% or more is formed by forming a conductive metal layer by a vacuum process, and a black layer is laminated separately. An electromagnetic wave shielding member. In a structure composed of a conductive metal layer, a black layer, and a transparent plastic support, a geometrical pattern having an aperture ratio of 50% or more is formed when the conductive metal layer is formed by a vacuum process, and further conductive by plating. Electromagnetic wave shielding member obtained by laminating a black layer after thickening the conductive metal layer. After forming a reversible resin layer having a reverse pattern of a geometric figure on a transparent plastic support and laminating a black layer or a conductive metal layer by a vacuum process, the black resin layer is formed on the resin layer. A method for producing an electromagnetic wave shielding member, comprising peeling together with a layer or a conductive metal layer. The method for producing an electromagnetic wave shielding member according to claim 5, wherein the method for forming the peelable resin is a printing method. An electromagnetic shielding member comprising: a mask having a reverse pattern of a geometric figure on a transparent plastic support; and forming a conductive metal layer or a black layer by a vacuum process, and then peeling the mask. Method. 8. A mask comprising a mesh screen layer and a resin layer having a reverse pattern of a geometric figure pattern is used when a conductive metal layer or a black layer is formed on a transparent plastic support by a vacuum process. The manufacturing method of the electromagnetic wave shielding member as described in any one of. A mask in which each element in a mask made of a reverse pattern of a geometric figure pattern is connected by a thin line when forming a conductive metal layer or a black layer on a transparent plastic support by a vacuum process. A method for producing the electromagnetic wave shielding member according to claim 7. 8. The electromagnetic wave shielding member according to claim 7, wherein when the conductive metal layer or the black layer having a geometric figure pattern is formed on the transparent plastic support, the mask mounting, layer formation, and mask peeling steps are repeated a plurality of times. Manufacturing method. A conductive metal layer or a black layer is selectively formed in a portion where the oil is not applied by a vacuum process after the oil is applied on the transparent plastic support in the reverse pattern of the geometric figure pattern. Manufacturing method of electromagnetic wave shielding member. An electromagnetic wave shielding member comprising: forming a conductive metal film or a black layer on a transparent plastic support by the method according to any one of claims 5 to 11; and laminating the conductive metal layer by plating. Production method. A method for producing an electromagnetic wave shielding member, comprising forming a conductive metal film on a transparent plastic support by the method according to any one of claims 5 to 12 and then laminating a black layer. The electromagnetic wave shielding member according to any one of claims 1 to 4, wherein a method for forming each layer by a vacuum process is any one of a vacuum vapor deposition method, a sputtering method, and an ion plating method. The electromagnetic wave shielding according to any one of claims 1 to 4, wherein a line width of a geometric figure drawn with a conductive metal layer or a black layer is 40 µm or less, a line interval is 100 µm or more, and a line thickness is 20 µm or less. Element. An electromagnetic wave shielding member in which a resin layer is laminated so as to cover part or all of a conductive metal layer or a black layer on a structure comprising a conductive metal layer, a black layer, and a transparent plastic support. The electromagnetic wave shielding member according to any one of claims 1 to 4, and 14 to 16, wherein the plastic support is a polyethylene terephthalate film, a polycarbonate film, or a polyether sulfone film. The metal composing the conductive metal layer contains at least one metal having a volume resistivity at 20 ° C. of 20 μΩ / cm or less. The electromagnetic wave shielding member according to any one of the above. The translucent electromagnetic wave shielding member for a plasma display panel according to any one of claims 1 to 4, and 14 to 18.

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