CN1870881A - Electromagnetic wave shielding film and method for producing same - Google Patents
Electromagnetic wave shielding film and method for producing same Download PDFInfo
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- CN1870881A CN1870881A CNA2006100841498A CN200610084149A CN1870881A CN 1870881 A CN1870881 A CN 1870881A CN A2006100841498 A CNA2006100841498 A CN A2006100841498A CN 200610084149 A CN200610084149 A CN 200610084149A CN 1870881 A CN1870881 A CN 1870881A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides an electromagnetic wave shielding film comprising: an optical grade transparency of 87% or more of the film substrate; and a metal mesh layer on at least one surface of the film substrate. The present invention also provides a method of manufacturing an electromagnetic wave-shielding film, comprising the steps of: forming a conductive layer on the surface of the film substrate by using a physical vapor deposition method; forming a metal layer on the conductive layer by using an electroplating process; and forming a metal mesh pattern on the film substrate by a photolithography process. Compared with the existing electromagnetic wave shielding film and the manufacturing method thereof, the invention not only has the advantages of reducing the metal consumption of electromagnetic wave shielding and avoiding the use of curing adhesive between the metal layer and the film substrate, but also can reduce the process steps, thereby effectively reducing the industrial production cost and improving the production efficiency.
Description
Technical field
The present invention relates to the shield technology of electromagnetic radiation, particularly a kind of high grade of transparency electromagnetic shielded film and manufacture method thereof that is applicable to the electromagnetic-wave leakage that suppresses display device.
Background technology
Known various electronic products (for example cathode ray tube (CRT) display, LCD and plasma TV etc.) in use can see through the electromagnetic radiation that shell or display screen are launched harmful various wavelength at present, this radiation will produce injury to human body, if it is particularly long-time near radiation source, may cause various physiological maladies, for example the increasing of cytopathy degree, the malignant disease such as cancer, thyroid gland enlargement, leukaemia, eyes are dry and astringent and cervical spondylosis etc.
In order to prevent the electromagnetic radiation leakage of display, way all covers or forms the high transparent membrane of one deck maskable electromagnetic radiation in screen surface at present.For example wherein a kind of mode is utilize to solidify glue (its thickness for example is about 10 microns) thickness is surpassed on optical-grade transparent polyethylene terephthalate (PET) film that 6 microns calendering copper film or electrolysis copper film stick on light transmittance higher (for example more than 90%), do the etching of copper film net metal afterwards again, to form metal trellis layer at the PET film surface.Though this mode is feasible, because the calendering copper film of suitability for industrialized production and electrolysis copper film are very expensive, its thickness generally will reach 8 microns-12 microns or thicker, and the required metal layer thickness of electromagnetic wave shielding has been wasted resource and increased cost head and shoulders above.In addition, the curing glue that is bonded together used between metal film and PET film all can be discharged the organic volatile of contaminated environment because of heat raises in production process and in using later on, thereby health is produced injurious effects.
Another kind of electromagnetic shielded film adopts a kind of grenadine that is woven into by polymeric material, adopts on this grenadine " chemical plating " method plate metallized skin, and it is attached on the PET film of optical clear level with the formation electromagnetic shielding film with solidifying glue." but chemical plating " is acknowledged as and can causes great harm to environment, and needs to consume a large amount of hydropower resources and electric power.In addition, the grenadine that this method is produced need use on the optics PET film that the curing glue that contains organic volatile at high transmission rate, and assembly and organism fever in the time of also can using because of display screen and causing pasted the hostile environment that the curing glue that uses discharges and the organic volatile of human body.At last, the grenadine of polymer braiding is subjected to the restriction in line of material footpath and the yarn shape of braiding to be column, even if therefore still restrict after the metallization and influenced ELECTROMAGNETIC RADIATION SHIELDING effect and visual effect.
Summary of the invention
An object of the present invention is to provide a kind of electromagnetic shielded film, it can reduce the consumption of shielded metal and solidified glue and so on organic volatile pollution on the environment.
Above-mentioned purpose of the present invention realizes by following technical proposal:
A kind of electromagnetic shielded film comprises:
Film substrate; And
Be positioned at least one surperficial metal stratum reticulare of described film substrate.
Preferably, in above-mentioned electromagnetic shielded film, described film substrate is a light transmittance more than or equal to 87% plastic film, and thickness is 1～500 micron.
Preferably, in above-mentioned electromagnetic shielded film, described metal stratum reticulare is made by single metal or alloy, and thickness is 2.5～4 microns, and surface coverage has anti oxidation layer.
Preferably, in above-mentioned electromagnetic shielded film, further comprise the release liners that is coated in another surface of described film substrate and covers this back-adhesive film laminar surface.
Another object of the present invention provides a kind of method of making electromagnetic shielded film, and it can reduce the contained organic volatile pollution on the environment of solidified glue that uses between the consumption of shielded metal and shielded metal and the film substrate.
Above-mentioned purpose of the present invention realizes by following technical proposal:
A kind of method of making electromagnetic shielded film comprises following steps:
Utilize physical vaporous deposition to form conductive layer on the film substrate surface;
Utilize electroplating technology on described conductive layer, to form metal level; And
On described film substrate, form metal mesh pattern with photoetching process.
Above-mentioned purpose of the present invention also realizes by following technical proposal:
A kind of method of making electromagnetic shielded film comprises following steps:
Utilize electroplating technology to have at surface deposition on the film substrate of conductive layer and form metal level; And
On described film substrate, form metal mesh pattern with photoetching process.
Preferably, in said method, described conductive layer and metal level are made of copper, and the step of described formation metal mesh pattern comprises:
Form photoresist layer at described layer on surface of metal;
The film that is printed with waffle-like pattern is covered described photoresist layer surface;
Make described photoresist layer exposure imaging to form the pattern corresponding with described net-like pattern; And
The metal level and the conductive layer area that do not cover described photoresist on the described film substrate are carried out etching to form described metal mesh pattern.
Preferably, in said method, described film substrate is a light transmittance more than or equal to 87% plastic film, and thickness is 1～500 micron, and described conductive layer and metal level are made of single metal or alloy, and gross thickness is 2.5～4 microns.
Preferably, in said method, between the step of step that forms described metal level and formation metal mesh pattern, comprise the following step:
The film substrate that is electroplate with described metal level is contacted, to form anti oxidation layer at described layer on surface of metal with antioxidant;
Do not deposit on the surface of described conductive layer or the described metal level at described film substrate and to apply the gum rete; And
Cover release liners at described back-adhesive film laminar surface.
A further object of the invention provides a kind of display device, comprises:
Display screen; And
Above-mentioned electromagnetic shielded film covers described display screen surface.
Compare with aforementioned existing electromagnetic shielded film and manufacture method thereof, the present invention is except having the metal consumption that reduces electromagnetic wave shielding and avoiding the advantage of metal level and the intermembranous use curing of PET glue, can also reduce processing step, thereby effectively reduce the industrial production cost and enhance productivity.In addition, compared with prior art, it is original 1/2 to 1/3 that metal layer thickness of the present invention reduces to, and reduced being etched into the required time of net-like pattern structure, therefore helps suppressing the trapezoidal phenomenon that metal etch produces because of the pickling overlong time.
The accompanying drawing summary
Below by preferred embodiment and accompanying drawing the present invention is done to set forth more fully, wherein:
Fig. 1 is the cross section view according to the electromagnetic shielded film of a preferred embodiment of the present invention;
Fig. 2 shows the pattern of the metal level in the electromagnetic shielded film shown in Figure 1;
Fig. 3 a and 3b are the electromagnetic wave shielding performance test result of electromagnetic shielded film shown in Figure 1.
Embodiment
Below by Fig. 1 electromagnetic shielded film according to a preferred embodiment of the present invention is described, suppose that present embodiment is used to shield the electromagnetic radiation of display screen.
Referring to Fig. 1, electromagnetic shielded film 1 is a lamination layer structure, mainly comprises film substrate 11, is positioned at film substrate 11 one of them surperficial metal stratum reticulare 12, covers the anti oxidation layer 13 on metal stratum reticulare 12 surfaces, the release liners 15 that is coated in film substrate 11 another surperficial gum retes 14 and covers these gum rete 14 surfaces.
In order to prevent burning, in the present embodiment, for example can on metal stratum reticulare 12, form one deck anti oxidation layer 13 by copper antioxidant being coated on the metal stratum reticulare 12.
In the present embodiment, utilize automatic double surface gluer not form the transparent one deck gum rete 14 of surface-coated of metal level, then use release liners 15 (for example siliceous release liners) to cover gum rete 14 again at film substrate 11.When using, open release liners 15 and the side that electromagnetic shielded film 1 is coated with gum rete 14 is attached to the surface (for example inner surface) of display screen, make display screen relative, metal frame 12a ground connection with aforementioned mesh-like area.
Fig. 3 a and 3b are the electromagnetic wave shielding performance test result according to the electromagnetic shielded film of present embodiment, wherein, method of testing is stipulated by CNS GB9254-98, result shown in Fig. 3 a is that 3.5 microns and metal wire directly are 10 microns situation corresponding to the wire netting layer thickness, result shown in Fig. 3 b is that 3.5 microns and metal wire directly are 30 microns situation corresponding to the wire netting layer thickness, abscissa among the figure is a frequency, and ordinate is an electromagnetic radiation intensity.As shown in the figure, the electromagnetic radiation intensity of the electromagnetic shielded film of present embodiment under two kinds of line footpaths all is lower than under the horizontal line, also promptly do not surpass the electromagnetic radiation intensity of GB GB9254-98 regulation.
In the above-described embodiments, only the single face at the PET film forms the metal stratum reticulare, in order to strengthen electromagnetic shielding effect, also can form the metal stratum reticulare on two surfaces of PET film.
The manufacture method of above-mentioned electromagnetic shielded film is below described.
At first in step 1, form conductive layer on PET film substrate surface, the formation method can adopt physical vaporous deposition (physical vapor deposition) technology, plates mode continuously at copper or the tin-indium alloy (ITO) of PET film substrate surface attachment thickness less than 1000 with magnetron sputtering under vacuum environment.In the present embodiment, follow-up photoetching process adopts metal copper layer as conductive layer here for convenience.In order to enhance productivity, when plating, vacuum can make two volume PET films stretching and winding forward simultaneously, two-sidedly synchronously the outside one side of this two volume film is done the plating of individual layer vacuum magnetic-control sputtering, therefore the PET package film that two volumes all have the single face conductive layer is produced in inter-sync at one time.If all form the metal stratum reticulare, the two sides of monovolume film can be carried out simultaneously the vacuum magnetic-control sputtering plating to form conductive layer on two surfaces of film.When electromagnetic shielded film is used for display screen, should guarantee certain transparency, can adopt light transmittance more than or equal to 87% clear PET web-like film for this reason, thickness is between 1 micron～500 microns.
Then in step 2, utilize existing continous way electrolytic plating process re-plating thickening metal on the film substrate of the existing conductive metal layer of single face that step 1 obtains, make the gross thickness of metal level increase to required thickness, this thickness is 2.5 microns～4 microns in the present embodiment.
Enter step 3 subsequently, the film after the plating is immersed in the antioxidant solution to form anti oxidation layer at layer on surface of metal.
Then enter step 4, utilize automatic double surface gluer continuously the PET film substrate not the one side of electroplated metal layer coat transparent gum rete.In step 5, on the gum rete, cover the siliceous release liners of one deck.In step 6, seal the surface that the PET film substrate covers release liners with the waterproof paster paper self-adhesive tape.
Subsequently, in step 7, be about the photoresistance glue of 1 millimeter at the layer on surface of metal coating thickness of PET film substrate.In step 8, in the vacuum suction mode printing is counted 12, the above negative film film of 000ppi entirely is seated on the exposure machine sheet glass, is printed with net-like pattern on this film, for example intersection as shown in Figure 2 and frame pattern.
Then enter step 9, use wavelength to develop to realize plane exposure than the sheet glass of short deep UV light source scanning photoetching machine, chemical inhibitor in those photoresistance glue that do not blocked by film will be changed over a kind of emulsion by deep UV, and these emulsion are developed agent flushing back and just form stealthy net-like pattern with the identical thickness of lines of the negative film film that uses that exposes.
Enter step 10 subsequently, the package film that will handle through step 9 continuously or cut into and put into behind the monolithic in the etching machines eroding the zone of those direct exposed copper metals, thereby form required metal mesh pattern or metal stratum reticulare shown in Figure 1.
Also can obtain the film substrate that the surface is pre-formed conductive layer from the market, therefore in another one embodiment of the present invention, step 1 can be omitted.This base material that is pre-formed conductive layer for example comprises that the thickness of being produced by the Tiannuo Photoelectric Material Co., Ltd., Shandong that is positioned at Jinan China that is numbered TN-PET1-125-35-DNC is 125 microns clear PET web-like film.
In the step 4 of the foregoing description, for improving the transparency of electromagnetic shielded film, also can with common method for printing screen the PET film substrate not the one side of electroplated metal layer apply the gum rete, this rete has the identical pattern of metal mesh pattern that forms with above-mentioned steps 10 etchings, line footpath and etched metal wire quite even thinner, thicknesses of layers is generally less than 10 microns.
Therefore in addition, conductive layer and metal level all are made of copper in the foregoing description, but conductive layer also can adopt tin-indium alloy (ITO), and this alloy is transparent, can only erode metal level in step 9 and keep tin-indium alloy layer as conductive layer.
No matter the present invention uses at the place ahead or the rear of display screen (for example screen glass or fexible film), all do not hinder effect in electromagnetic wave shielding.If require higher masking value standard, then can be with the two-sided metal mesh pattern that all forms of the PET film of optical grade high transmission rate (more than 87%).Particularly, can utilize above-mentioned steps 1～3 all to form metal copper layer on two surfaces of PET film, utilize above-mentioned steps 7～10 to form metal mesh pattern then, utilize above-mentioned steps 4 and 5 to form gum layer and release liners on a metal mesh pattern therein at last.
Therefore in the present invention, film substrate surface is owing to form conductive layer, therefore can utilize electroplating technology and avoids using any gumminess curing agent that metal level and film-substrate are bonded together, and helps reducing organic volatilization.In addition, need not use the gumminess curing agent also to improve the transparency of electromagnetic shielded film, therefore can reduce requirement PET Film Optics light transmittance.For example the present invention not necessarily to use light transmittance more than 92% the PET film and only need use the optics level PET film of 87-87% light transmittance can satisfy the requirement of transparency.
More than by specific embodiment the present invention is described; but should be understood that; for those skilled in the art; on the basis of reading above-mentioned specification description; need not performing creative labour can be under the prerequisite that does not depart from the present invention's spirit and essence; make variations and modifications with regard to above-mentioned example, so protection scope of the present invention is defined by the following claims.
Claims (10)
1, a kind of electromagnetic shielded film is characterized in that, comprises:
Film substrate; And
Be positioned at least one surperficial metal stratum reticulare of described film substrate.
2, electromagnetic shielded film as claimed in claim 1, wherein, described film substrate is a light transmittance more than or equal to 87% plastic film, thickness is 1～500 micron.
3, electromagnetic shielded film as claimed in claim 1, wherein, described metal stratum reticulare is made by single metal or alloy, and thickness is 2.5～4 microns, and surface coverage has anti oxidation layer.
4, electromagnetic shielded film as claimed in claim 1 wherein, further comprises gum rete that is coated on surface of described film substrate or the described metal level and the release liners that covers this back-adhesive film laminar surface.
5, a kind of display device is characterized in that, comprises:
Display screen; And
As any described electromagnetic shielded film among the claim 1-4, cover described display screen surface.
6, a kind of method of making electromagnetic shielded film is characterized in that, comprises following steps:
Utilize physical vaporous deposition to form conductive layer on the film substrate surface;
Utilize electroplating technology on described conductive layer, to form metal level; And
On described film substrate, form metal mesh pattern with photoetching process.
7, a kind of method of making electromagnetic shielded film is characterized in that, comprises following steps:
Utilize electroplating technology to have at surface deposition on the film substrate of conductive layer and form metal level; And
On described film substrate, form metal mesh pattern with photoetching process.
8, as claim 6 or 7 described methods, wherein, the step of described formation metal mesh pattern comprises:
Form photoresist layer at described layer on surface of metal;
The film that is printed with net-like pattern is covered described photoresist layer surface;
Make described photoresist layer exposure imaging to form the pattern corresponding with described net-like pattern; And
Etching is carried out to form described metal mesh pattern in the metal level zone that does not cover described photoresist on the described film substrate.
9, as claim 6 or 7 described methods, wherein, described film substrate is a light transmittance more than or equal to 87% plastic film, and thickness is 1～500 micron, and described conductive layer and metal level are made of single metal or alloy, and gross thickness is 2.5～4 microns.
10,, wherein, between the step that forms metal level and formation metal mesh pattern, comprise the following step as claim 6 or 7 described methods:
The film substrate that is electroplate with described metal level is contacted, to form anti oxidation layer at described layer on surface of metal with antioxidant;
Do not deposit on the surface of described conductive layer or the described conductive layer at described film substrate and to apply the gum rete; And
Cover release liners at described back-adhesive film laminar surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100841498A CN1870881A (en) | 2006-05-25 | 2006-05-25 | Electromagnetic wave shielding film and method for producing same |
| PCT/CN2007/001545 WO2007137486A1 (en) | 2006-05-25 | 2007-05-14 | Electromagnetic shielded film and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100841498A CN1870881A (en) | 2006-05-25 | 2006-05-25 | Electromagnetic wave shielding film and method for producing same |
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| CN1870881A true CN1870881A (en) | 2006-11-29 |
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| CNA2006100841498A Pending CN1870881A (en) | 2006-05-25 | 2006-05-25 | Electromagnetic wave shielding film and method for producing same |
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| Country | Link |
|---|---|
| CN (1) | CN1870881A (en) |
| WO (1) | WO2007137486A1 (en) |
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| CN1123011C (en) * | 1998-08-10 | 2003-10-01 | 住友电木株式会社 | Shielding transparent body for electromagnetic wave |
| JP2002246788A (en) * | 2000-12-12 | 2002-08-30 | Nisshinbo Ind Inc | Transparent electromagnetic radiation shielding material |
| CN2659097Y (en) * | 2003-11-07 | 2004-11-24 | 钢铁研究总院 | Convenient adhering membrane with multifunction protection |
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