KR100629861B1 - A method for manufacturing base film unit for electromagnetic wave shield filter and a base film unit for electromagnetic wave shield filter according to the method - Google Patents

Abstract

A method for manufacturing a base film unit for electromagnetic wave shield filter and a base film unit for electromagnetic wave shield filter according to the same are provided to increase resolution and contrast by improving light transmittance. A seed metal layer(40a) is formed by depositing a seed metal on a base film(30) by using a chemical vapor deposition method and a physical vapor deposition method. A first metal layer(50a) is formed on the seed metal layer. The seed metal layer and the first metal layer are processed by a predetermined pattern. The predetermined pattern is formed on the seed metal layer and the first metal layer. A second metal layer(60) is formed on the first metal layer. The seed metal layer is formed with nickel. The base film is formed with a plate-shaped PET(Poly-Ethylene-Terephtalate). The first and second metal layers are formed of copper. The predetermined pattern is formed by a laser process.

Description

A method for manufacturing base film unit for electromagnetic wave shield filter and a base film unit for electromagnetic wave shield filter according to the method}

1 is a schematic cross-sectional view of a base film unit for an electromagnetic wave filter according to a conventional example.

FIG. 2 is a schematic cross-sectional view of an electromagnetic wave filter including the base film unit shown in FIG. 1.

Figure 3 is a schematic cross-sectional view of the base film unit for electromagnetic wave filter in accordance with an embodiment of the present invention.

4 and 5 are cross-sectional views for explaining a process of manufacturing the base film unit for an electromagnetic wave filter shown in FIG.

6 is a schematic cross-sectional view of an electromagnetic wave filter including the base film unit shown in FIG. 3.

<Description of the symbols for the main parts of the drawings>

30 ... base film 40, 40a ... seed metal layer

50, 50a ... first metal layer 60, 60a ... second metal layer

71 Synthetic resin 72 Near-infrared layer

73 ... Color correction dye layer 74, 82 ... Anti-reflective layer

81 ... Adhesive layer 82 ... Glass

The present invention relates to a method for manufacturing a base film unit for an electromagnetic wave filter, and a base film unit for an electromagnetic wave filter manufactured by the method, and more particularly, to a plasma display panel (PDP), a liquid crystal display (LCD), and the like. The present invention relates to a method for manufacturing a base film unit for an electromagnetic wave blocking filter, which is used in the same flat display element and to block electromagnetic waves generated by the flat display element, and to a base film unit for an electromagnetic wave filtering filter manufactured by the method.

Flat display devices such as plasma display panels (PDPs) and liquid crystal displays (LCDs), which are rapidly spreading in recent years, emit electromagnetic waves that may not only be harmful to the human body when the image is implemented, but may also cause malfunction of peripheral electronic devices. Will radiate. Therefore, in order to prevent the radiation of electromagnetic waves, an electromagnetic wave blocking filter as shown in FIG. 2 is attached to the front surface of the flat panel display device.

The electromagnetic wave filter 1 as described above is generally manufactured by processing a base film unit 10 corresponding to a raw material by a final processing company. An example of the base film unit is well illustrated in FIG. 1. 1 and 2, the base film unit 10 for the electromagnetic wave filter is a base film (2) made of a plate-shaped polyethylene (terephtalate) (PET) and an adhesive is coated on the front surface of the base film (2) The formed adhesive layer 3 and a copper layer 4a having a lattice mesh pattern formed on the adhesive layer 3 are included. The lattice mesh pattern has a structure in which a base film 2, an adhesive layer 3, and a copper layer 4 made of copper lamination are laminated as shown in FIG. The copper layer is formed by forming a predetermined pattern using a photoresist or a printable resist material as well described in Japanese Patent Laid-Open No. 2000-323890, and then removing a part of the copper layer 4 by metal etching. do. Therefore, the mesh pattern is formed on the processed copper layer 4a. In the case of metal etching, the adhesive layer 3 is generally not removed.

The final processing company blackens the base film unit 10 on which the mesh pattern is formed, and a thermoplastic resin such as an acrylic resin, an epoxy resin, a urethane resin, a thermosetting resin, and an ultraviolet ray on a portion where the mesh pattern is formed. Transparent synthetic resin 71 such as (UV) curable resin is filled and dried as shown in FIG. 2. Subsequently, a near infrared blocking layer 72, a color correction dye layer 73, and an anti-reflection layer 74 are disposed on the entire surface of the base film unit 10 filled with the synthetic resin 71. ), And a pressure sensitive adhesive (81), a glass (82), and an anti-reflection layer (83) are sequentially stacked on the rear surface of the base film unit. The illustrated electromagnetic wave filter 1 is finally manufactured. In some cases, the electromagnetic wave blocking filter 1 may be configured such that the glass 82 is not provided.

By the way, in the electromagnetic wave filter 1 comprised as mentioned above, in order to laminate | stack the copper layer 4 on the base film 2, the adhesive layer 3 is formed in the whole surface of the base film 2, and metal etching is carried out. Since the adhesive layer 3 is not removed, the light generated when the image is implemented in the flat panel display device having the electromagnetic wave filter 1 shown in FIG. 2 is passed through a portion where a mesh pattern is formed. Inevitably, the adhesive layer 3 must pass through the process. Therefore, there is a limit in increasing the transmittance of light generated from the flat panel display device to a predetermined level or more, and thus there is a problem that the image implemented by the flat panel display device appears dark. In addition, in the process of forming the adhesive layer 3 on the base film 2, foreign substances and the like are contaminated between the base film 2 and the adhesive layer 3, such as the resolution and contrast of the flat panel display device. There is also a problem that causes degradation.

In forming a mesh pattern on the copper layer of the base film unit, a material that causes environmental pollution such as a photoresist or printable resist material and a metal etching solution is used. There is a problem that must be handled separately. In addition, since the plate-like copper layer is finally etched into a copper layer having a pattern, the etched portion of the copper layer is a waste of the material, there is also a disadvantage that the manufacturing cost of the base film unit increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to block the electromagnetic waves and to improve the light transmittance when implementing the image of the flat panel display device, thereby improving the resolution and contrast of the flat panel display device. It is to provide a manufacturing method of a base film unit for an electromagnetic wave filter that can increase not only does not cause environmental pollution and also reduces the manufacturing cost.

Further, another object of the present invention is not only to block electromagnetic waves, but also to improve light transmittance in realizing an image of a flat panel display device, thereby increasing the resolution and contrast of the flat panel display device and not causing environmental pollution. It is to provide a base film unit for an electromagnetic wave filter to reduce the manufacturing cost.

In order to achieve the above object, the manufacturing method of the base film unit for electromagnetic wave filter according to the present invention, in the manufacturing method of the base film unit for electromagnetic wave filter, the base film made of a transparent synthetic resin, the adhesive force to the base film A seed metal layer forming step of depositing a seed metal made of a strong and metallic material to form a seed metal layer on the front surface of the base film; Depositing a first metal layer formed of a metallic material on the seed metal layer to form a first metal layer on the seed metal layer; A pattern forming step of forming the pattern on the seed metal layer and the first metal layer by cutting the seed metal layer and the first metal layer into a predetermined pattern to expose a part of the front surface of the base film; And plating a second metal made of a metallic material on the first metal layer on which the pattern is formed to form a second metal layer having the same pattern as the pattern on the first metal layer. do.

According to the present invention, the seed metal layer is preferably made of nickel.

In addition, according to the present invention, the base film is made of a plate-like polyethyleneterephtalate (PET), both the first metal layer and the second metal layer is made of copper, the seed metal layer is 200 ~ 500Å in the thickness direction of the base film Phosphorus thickness is formed, and the first metal layer is preferably formed to a thickness of 800 kPa to 1000 kPa in the thickness direction of the base film.

Further, according to the present invention, in the pattern forming step, the pattern is preferably formed by laser processing.

In order to achieve the above another object, the base film for an electromagnetic wave filter according to the present invention is formed by depositing a base film made of a transparent synthetic resin and a seed metal made of a metallic material with strong adhesion to the base film on the base film. And a seed metal layer and a first metal layer formed by depositing a first metal made of a metallic material on the seed metal layer, wherein the seed metal layer and the first metal layer are cut in a predetermined pattern to expose a part of the front surface of the base film. And a pattern having the same shape as that of the pattern, and having a second metal layer formed by plating a second metal made of a metallic material on the first metal layer on which the pattern is formed and having the same pattern as the pattern. .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a schematic cross-sectional view of a base film unit for an electromagnetic wave filter according to an embodiment of the present invention, Figures 4 and 5 are for explaining the process of manufacturing the base film unit for an electromagnetic wave filter shown in FIG. 6 is a schematic cross-sectional view of an electromagnetic wave filter including the base film unit shown in FIG. 3.

3 to 5, the method of manufacturing a base film unit for an electromagnetic wave filter according to the present embodiment includes a seed metal layer forming step, a first metal layer forming step, a pattern forming step, and a second metal layer plating step.

In the seed metal layer forming step, the seed metal layer 40 is formed on the base film. The base film 30 is made of a transparent synthetic resin such as polyethylene, polypropylene, polyester, polyvinyl chloride, polystyrene, polyethylene terephthalate (PET, polyethyleneterephtalate). The base film 30 is formed in a plate shape, in the present embodiment is made of polyethylene terephthalate (PET, polyethyleneterephtalate). The seed metal layer 40 has a strong adhesive force to the base film 30, it is made of a seed (seed) made of a metallic material. As the seed metal, a metal such as nickel (Ni) or an alloy of nickel and chromium (Ni / Cr) may be used. In this embodiment, nickel having the best adhesion to the base film is used. The nickel is deposited on the base film 30 by chemical vapor deposition or physical vapor deposition (PVD).

The seed metal layer 40 made of nickel is preferably formed to have a thickness of 200 kPa to 500 kPa in the thickness direction of the base film 30. If the seed metal layer 40 is formed to a thickness of less than 200 microns, the seed metal layer 40 may not sufficiently serve as a seed for crystal growth for forming the first metal layer 50 to be described later. In addition, since the entire surface of the seed metal layer 40 is not blackened, a separate blackening process is required to improve contrast of a flat panel display device such as a plasma display panel (PDP) and a liquid crystal display (LCD). Because. In addition, since the seed metal layer 40 is difficult to be deposited, it is not economically preferable to form the seed metal layer 40 thicker than necessary. Therefore, it is not economical to form the seed metal layer 40 with a thickness larger than 500 kPa.

In the forming of the first metal layer, a first metal made of a metallic material is deposited on the seed metal layer 40 to form the first metal layer 50 on the seed metal layer 40. The first metal layer 50 is made of a metallic material of any one of copper (Cu), nickel (Ni), gold (Au), silver (Ag), and a metal alloy thereof. Since the first metal layer 50 is used as an electrode for plating the second metal, which will be described later, the first metal layer 50 is made of copper (Cu) having excellent electrical conductivity.

The first metal layer 50 made of copper may be formed by any one of well-known chemical vapor deposition (PVD), physical vapor deposition (PVD), and magnetron sputtering. In particular, the magnetron sputtering method is preferable. This is because when the magnetron sputtering method is used as compared with the chemical vapor deposition method or the physical vapor deposition method, the first metal layer 50 may be formed to have a uniform thickness on the entire surface of the seed metal layer 40. The magnetron stuttering method is well known, and is well disclosed, for example, in Korean Unexamined Patent Publication Nos. 2001-76022, 2000-68592, and the like.

The first metal layer 50 made of copper is preferably formed to a thickness of 800 kPa to 1000 kPa in the thickness direction of the base film 30. This is because, when the thickness of the first metal layer 50 is smaller than 800 mm, the first metal layer 50 may be electrolyzed without performing a role as an electrode when plating the second metal, which will be described later. In addition, since the first metal layer 50 is difficult to deposit, it is not economically preferable to form the first metal layer 50 thicker than necessary. Therefore, it is not preferable to form the first metal layer 50 in a thickness larger than 1000 kPa from an economical point of view.

In the pattern forming step, the seed metal layer 40 and the first metal layer 50 are cut into a predetermined pattern so that a part of the front surface of the base film 30 is exposed to the seed metal layer 40 and the first metal layer 50. ) To form the pattern. That is, the seed metal layer 40 and the first metal layer 50 illustrated in FIG. 4 are processed by an oil mask method or a laser cutting method, which is widely known, and illustrated in FIG. 5. As described above, the seed metal layer 40a and the first metal layer 50a having the lattice mesh pattern are formed. In this embodiment, the pattern is formed by a laser processing method excellent in precision processing. While irradiating the laser beam along the pattern to the first metal layer 50 shown in FIG. 4 to form the pattern on the first metal layer 50, the seed metal layer 40 may be applied to the seed metal layer 40 in the same manner. A pattern may be formed, and in some cases, the pattern may be simultaneously formed on the first metal layer 50 and the seed metal layer 40 by increasing the intensity of the laser beam.

In the second metal layer plating step, a second metal made of a metallic material is plated on the first metal layer 50 to form a second metal layer 60 having the same pattern as the pattern on the first metal layer 50a. .

The second metal layer 60 is made of a metallic material of any one of copper (Cu), nickel (Ni), gold (Au), silver (Ag), and a metal alloy thereof. The second metal layer 60 is preferably made of a metal having excellent electrical conductivity in order to prevent electromagnetic waves from radiating to the outside. In the present embodiment, the second metal layer 60 is made of copper (Cu).

As is widely known, the second metal layer 60 may be formed by a method such as an electroless plating method or an electroplating method, among which the electroless plating method is as follows.

In the plating solution containing ① copper salt, ② reducing agent, ③ complexing agent, ④ pH adjusting agent, ⑤ pH buffer, and ⑥ improving agent, the base film 30 shown in Fig. 5, the seed metal layer 40a, and the first After dipping the sub-base film unit made of the metal layer 50a, copper may be plated on the first metal layer 50a by applying a current to the first metal layer 50a. At this time, since the pattern is formed on the first metal layer 50a, the second metal is plated on the first metal layer 50a, so that the same pattern as the pattern is shown in FIG. The second metal layer 60 is formed.

The ① copper salt serves to supply copper ions to the first metal layer 50 of the sub-base film unit, and includes chloride, nitrate, sulfate, and the like. The ② reducing agent serves to reduce the copper ions on the first metal layer 50 of the sub-base film unit, and includes a polysaccharide compound such as NaBH ₄ , KBH ₄ , NaH ₂ PO ₂ , hydrazine, formalin or glucose, etc. do. The ③ complexing agent prevents hydroxide precipitation in the alkaline solution and controls the concentration of free metal ions, thereby preventing decomposition of metal salts and controlling the plating rate, and chelate such as ammonia solution, acetic acid, guanic acid and EDTA. Include the first. The ④ pH adjuster serves to adjust the pH of the plating solution, it is an acid or a base compound. The ⑤ pH buffering agent suppresses the pH variation of the plating solution, and contains various organic acids and weakly acidic inorganic compounds. The? Improver refers to a compound capable of improving coating properties and planarization properties, and generally includes a surfactant and an adsorbent material capable of adsorbing a component that interferes with crystal growth.

On the other hand, if the process as described above, it is possible to manufacture the base film unit 100 as shown in Figure 3, the base film unit 100 thus manufactured is finally passed through the following steps The electromagnetic wave blocking filter 1000 is manufactured. That is, as described in the related art, after the base film unit 100 is blackened, a thermoplastic resin such as an acrylic resin, an epoxy resin, a urethane resin, a thermosetting resin, and ultraviolet (UV) light may be formed on a portion where a mesh pattern is formed. After filling and drying the transparent synthetic resin 71 such as a curable resin, the near-infrared (near infrared) blocking layer 72, the color correction dye layer 73 and the anti-reflection (anti a layer of layers (reflection) 74 are sequentially stacked, and a pressure sensitive adhesive 81, a glass 82, and an anti-reflection layer 83 are formed on the rear surface of the base film unit 100. ) Is sequentially stacked to finally manufacture the electromagnetic wave filter 1000 shown in FIG. 6. In some cases, the electromagnetic wave blocking filter 1000 may be configured such that the glass 82 is not provided.

As described above, in the base film unit 100 for electromagnetic wave filter of the present embodiment, the base film 30, the seed metal layer 40a, the first metal layer 50a, and the second metal layer 60 are included. The base film unit 100 is formed with a pattern in the form of a mesh. In this structure, unlike the conventional art, the light generated from the flat panel display device does not pass through the adhesive layer in the process of passing through the portion where the mesh pattern is formed. Therefore, in the flat panel display device including the electromagnetic wave blocking filter including the base film unit according to the present embodiment, the light transmittance is improved as compared with the prior art, and thus the image realized is bright. In addition, the sharpness, contrast and the like are improved. In addition, since the seed metal is deposited on the base film 30, it is possible to prevent a phenomenon in which foreign matters are contaminated between the base film 30 and the seed metal layer 40, unlike the conventional art.

And, unlike the conventional method of forming a pattern using a photoresist or printable resist material and a material causing environmental pollution such as a metal etching solution, in this embodiment, the pattern is applied to the seed metal layer and the first metal layer using a laser beam. Since it is configured to form, there is an advantage that the environmental pollutant as in the prior art does not occur. In addition, unlike the conventional method, since the second metal layer having the same pattern as the pattern is formed on the first metal layer on which the pattern is formed, there is no need to form a pattern by laser processing on the second metal layer, thereby reducing manufacturing time. do. In addition, since there is no need to laser process the second metal layer, material waste of the second metal layer can be reduced, thereby reducing the manufacturing cost of the base film unit.

As mentioned above, the present invention has been described in detail with reference to preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art within the technical idea of the present invention. It is obvious.

According to the present invention having the above-described configuration, it is possible to block the electromagnetic wave and to improve the light transmittance when the image of the flat panel display is implemented, thereby increasing the resolution and contrast of the flat panel display.

In addition, since the pattern is formed by an oil mask method or a laser processing method, environmental pollutants are not generated. In addition, it is not necessary to form a pattern on the second metal layer by a separate process, thereby reducing the waste of the material of the second metal layer.

Claims (5)

In the manufacturing method of the base film unit for electromagnetic wave filter, On a base film made of transparent synthetic resin, a seed metal made of a metallic material with strong adhesion to the base film is deposited by chemical vapor deposition or physical vapor deposition (PVD). A seed metal layer forming step of forming a seed metal layer on the entire surface of the film; Depositing a first metal layer formed of a metallic material on the seed metal layer to form a first metal layer on the seed metal layer; A pattern forming step of forming the pattern on the seed metal layer and the first metal layer by cutting the seed metal layer and the first metal layer into a predetermined pattern to expose a part of the front surface of the base film; And A second metal layer plating step of plating a second metal made of a metallic material on the first metal layer on which the pattern is formed to form a second metal layer having the same pattern as the pattern on the first metal layer; The seed metal layer is made of nickel, The base film is made of a plate-shaped polyethylene (polyethyleneterephtalate), The first metal layer and the second metal layer are all made of copper, In the pattern forming step, the pattern is a method of manufacturing a base film unit for electromagnetic wave filter, characterized in that formed by laser processing. delete delete delete Base film unit for electromagnetic wave filter produced by claim 1.

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