CN113795131B - Electromagnetic shielding member and display - Google Patents
Electromagnetic shielding member and display Download PDFInfo
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- CN113795131B CN113795131B CN202110935172.8A CN202110935172A CN113795131B CN 113795131 B CN113795131 B CN 113795131B CN 202110935172 A CN202110935172 A CN 202110935172A CN 113795131 B CN113795131 B CN 113795131B
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- 239000000758 substrate Substances 0.000 claims abstract description 52
- 230000031700 light absorption Effects 0.000 claims abstract description 16
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 156
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 239000012790 adhesive layer Substances 0.000 claims description 29
- 239000011521 glass Substances 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 20
- 238000002834 transmittance Methods 0.000 claims description 16
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 239000011135 tin Substances 0.000 description 7
- 229910052718 tin Inorganic materials 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000012744 reinforcing agent Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 239000005328 architectural glass Substances 0.000 description 3
- 150000004696 coordination complex Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical group C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- MMCOUVMKNAHQOY-UHFFFAOYSA-L oxido carbonate Chemical compound [O-]OC([O-])=O MMCOUVMKNAHQOY-UHFFFAOYSA-L 0.000 description 2
- 230000036561 sun exposure Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical compound N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- OSBFYPMBKGWPHH-UHFFFAOYSA-N C(=O)(OCCCCCCCCCCCCCCCC)OC(=O)OCCCCCCCCCCCCCCCC Chemical compound C(=O)(OCCCCCCCCCCCCCCCC)OC(=O)OCCCCCCCCCCCCCCCC OSBFYPMBKGWPHH-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- DEPUMLCRMAUJIS-UHFFFAOYSA-N dicalcium;disodium;dioxido(oxo)silane Chemical compound [Na+].[Na+].[Ca+2].[Ca+2].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O DEPUMLCRMAUJIS-UHFFFAOYSA-N 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
Abstract
The invention discloses an electromagnetic shielding member and a display, wherein the electromagnetic shielding member comprises: a substrate that is transparent to light; and the first shielding module comprises a first bonding layer, a first conductive layer and a first light absorption layer which are sequentially laminated on the substrate. The first shielding module is in a grid shape and is provided with a first mesh penetrating through the first bonding layer, the first conductive layer and the first light absorption layer. The technical scheme of the invention aims to be applied to a screen of a display, on one hand, electromagnetic waves can be shielded, on the other hand, the light-penetrable characteristic can not influence a user to watch a picture displayed on the screen, and in addition, the first light absorption layer can inhibit mole patterns of the screen and reflect light of the first conductive layer so as to provide good appearance.
Description
Technical Field
The invention relates to the technical field of electromagnetic shielding, in particular to an electromagnetic shielding component and a display.
Background
Electromagnetic waves can influence the normal operation of electric appliances and easily cause property loss, and a large number of structures for shielding electromagnetic waves are researched, but the existing electromagnetic wave shielding structures are not transparent, and are difficult to apply to the screen of a display.
Disclosure of Invention
The invention mainly aims to provide an electromagnetic shielding component, which is used for shielding electromagnetic waves on one hand and preventing a user from watching a picture displayed on a screen due to the light-penetrable characteristic on the other hand when being applied to the screen of a display.
To achieve the above object, an electromagnetic shielding member according to the present invention includes:
a substrate that is transparent to light; and
the first shielding module comprises a first bonding layer, a first conductive layer and a first light absorption layer which are sequentially laminated on the substrate, the first shielding module is in a grid shape, and the first shielding module is provided with a first mesh penetrating through the first bonding layer, the first conductive layer and the first light absorption layer.
Optionally, the substrate is made of glass or a light-transmitting polymer material.
Optionally, the first adhesion layer is a pure metal coating, a mixed pure metal and metal oxynitride coating, a metal alloy coating, or a mixed metal alloy and metal oxynitride coating.
Optionally, the first conductive layer is a pure metal plating layer or a metal alloy plating layer.
Optionally, the first light absorbing layer is a pure metal coating, a mixed pure metal and metal oxynitride coating, a metal alloy coating, or a mixed metal alloy and metal oxynitride coating.
Optionally, the light transmittance of the substrate is greater than 90%.
Optionally, the adhesion of the first adhesive layer to the substrate and the adhesion to the first conductive layer are both greater than 0.5kg/cm 2 。
Optionally, the light absorption rate of the first light absorption layer is greater than 70%.
Optionally, the thickness of the first adhesion layer ranges from 20nm to 250nm.
Optionally, the thickness of the first conductive layer ranges from 0.1 μm to 300 μm.
Optionally, the thickness of the first light absorbing layer ranges from 20nm to 250nm.
Optionally, the line width of the first shielding module ranges from 5 μm to 1mm.
Optionally, the line distance of the first shielding module ranges from 5 μm to 10mm.
Optionally, the substrate has a first surface and a second surface that are oppositely disposed, two first shielding modules are disposed, one first shielding module is disposed on the first surface, and the other second shielding module is disposed on the second surface.
Optionally, the grid lines of one of the first shielding modules block the grid lines of the other shielding module when seen from one of the first surface and the second surface towards the other.
Optionally, the electromagnetic shielding member is further provided with a first protective layer covering at least the first shielding module.
Optionally, the electromagnetic shielding member is provided with a shielding area, a GND (Ground) area surrounding the shielding area, and an external connection portion connected to the GND area, and the electromagnetic shielding member further includes a second shielding module disposed on the substrate and connected to the first shielding module, and a third shielding module disposed on the substrate and connected to the second shielding module, where the third shielding module is provided with a first current guiding layer, the shielding area includes the first shielding module, the GND area includes the second shielding module, the external connection portion includes the third shielding module, and the external connection portion is used for connecting a PCB (Printed Circuit Board) board.
The invention also proposes a display comprising:
a display screen;
a touch screen; and
the electromagnetic shielding component is clamped between the display screen and the touch screen.
In the technical scheme of the invention, it can be understood that the electromagnetic shielding component can be applied to the building glass and the screen of the display, and as the first mesh penetrates through the first adhesive layer, the first conductive layer and the first light absorption layer and the substrate is transparent, part of light rays on one side of the substrate, which is away from the first mesh, can be emitted through the first mesh without damage, when the electromagnetic shielding component is applied to the screen, the light emitted by the picture can fall into human eyes, and when the electromagnetic shielding component is applied to the building glass, the lighting of the building glass is not affected;
the first conductive layer is attached to the substrate through the first adhesive layer, so that the first conductive layer is not easy to separate from the substrate when the electromagnetic shielding member is tested at high temperature and high humidity, namely the electromagnetic shielding member has higher structural stability in a harsh environment;
because of the arrangement mode of the first mesh, the first conductive layer is also in a grid shape, and it can be understood that the electromagnetic wave is converted into current after reaching the first conductive layer and is led out by the first conductive layer, thereby realizing the purpose of shielding the electromagnetic wave;
in addition, the first light-absorbing layer absorbs light reaching the first light-absorbing layer, in particular, light emitted from the first light-absorbing layer toward the second light-absorbing layer, reducing the visibility of the electromagnetic shielding member, which is shown to suppress the generation of moire when the electromagnetic shielding member is applied to a display screen, and which is shown to be less dazzling when the electromagnetic shielding member is applied to a architectural glass when the architectural glass is viewed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of a part of the structure of an electromagnetic shielding member in an embodiment of the present invention;
fig. 2 is a schematic structural view of an electromagnetic shielding member according to an embodiment of the present invention;
FIG. 3 is a schematic view of a part of the electromagnetic shielding member according to an embodiment of the present invention;
FIG. 4 is a schematic view of the first mesh in FIG. 3;
FIG. 5 is a schematic view of a portion of the shielding region of FIG. 2;
fig. 6 is a schematic view of a part of the GND area in fig. 2;
fig. 7 is a schematic structural view of a portion of the outer joint part in fig. 2.
Reference numerals illustrate:
reference numerals | Name of the name | Reference numerals | Name of the name |
100 | Substrate board | 200 | First shielding module |
210 | First adhesive layer | 220 | A first conductive layer |
230 | First light absorption layer | 200a | First mesh openings |
300 | Second shielding module | 310 | A second adhesive layer |
320 | Second conductive layer | 330 | Second light absorption layer |
400 | Third shielding module | 410 | Third adhesive layer |
420 | Third conductive layer | 430 | First current leading-out layer |
500 | First protective layer | 600a | Shielded region |
600b | GND area | 600c | External connection part |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The invention provides an electromagnetic shielding member.
Referring to fig. 1, 3 and 4, in an embodiment of the present invention, the electromagnetic shielding member includes:
a substrate 100 transparent to light; and
the first shielding module 200 includes a first adhesive layer 210, a first conductive layer 220, and a first light absorbing layer 230 sequentially stacked on the substrate 100, the first shielding module 200 is in a grid shape, and the first shielding module 200 has a first mesh 200a penetrating the first adhesive layer 210, the first conductive layer 220, and the first light absorbing layer 230.
In the technical solution of the present invention, it can be understood that the electromagnetic shielding member may be, but not limited to, applied to a screen of a building glass and a display, and since the first mesh 200a penetrates the first adhesive layer 210, the first conductive layer 220 and the first light absorbing layer 230, and the substrate 100 is transparent, a part of light on one side of the substrate 100 facing away from the first mesh 200a may be emitted through the first mesh 200a without damage, when the electromagnetic shielding member is applied to the screen, light emitted from a picture may fall into human eyes, and when the electromagnetic shielding member is applied to the building glass, lighting of the building glass is not affected;
the first conductive layer 220 is attached to the substrate 100 through the first adhesive layer 210, so that the electromagnetic shielding member is not easy to separate from the substrate 100 during high temperature and high humidity testing, that is, the electromagnetic shielding member has higher structural stability in a severe environment, when the electromagnetic shielding member is applied to a screen, it can be understood that the screen is widely applied, the environment where the screen is positioned is different, the electromagnetic shielding member can enable the screen to still maintain a good electromagnetic shielding function in the high temperature and high humidity environment, when the electromagnetic shielding member is applied to the building glass, the building glass is subjected to wind and sun exposure, and the structural stability of the electromagnetic shielding member ensures that the building glass can still maintain a good electromagnetic shielding function after being subjected to wind and sun exposure;
because of the arrangement mode of the first mesh 200a, the first conductive layer 220 is also in a grid shape, it can be understood that the electromagnetic wave is converted into current after reaching the first conductive layer 220 and is led out by the first conductive layer 220, thereby achieving the purpose of shielding the electromagnetic wave;
in addition, the first light absorbing layer 230 absorbs light reaching the first light absorbing layer 230, and in particular, absorbs light emitted from the first light absorbing layer 230 toward the first conductive layer 220, reducing the visibility of the electromagnetic shielding member, which is shown to suppress the generation of moire when applied to a display screen, and is shown to be not dazzling when applied to a architectural glass.
It should be noted that the above screen at least includes a display screen and a touch screen, and the electromagnetic shielding member may be sandwiched between the display screen and the touch screen, or may be disposed on a side of the display screen facing away from the touch screen.
Optionally, in the present embodiment, the material of the substrate 100 is configured as glass or transparent polymer material, and it can be understood that the glass or transparent polymer material has excellent light transmission property, and specifically, the glass may be sodium silicate glass, sodium calcium silicate glass, potassium silicate glass, aluminum silicate glass, or the like, but is not limited thereto; the polymer material may be polyethylene terephthalate (Polyethylene terephthalate, PET), polymethyl methacrylate (Polymethyl methacrylate, PMMA), transparent Polyamide (Polyimide, PI), transparent Polyamide (PA) or Polycarbonate (PC) film material, but is not limited thereto. Further, the substrate 100 is transparent so as to allow light of various colors to pass therethrough, thereby ensuring that the display can display a picture including various colors when the geomagnetic shielding member is used for the display.
Alternatively, the light transmittance of the substrate 100 is greater than 90%, and it is understood that the substrate 100 has high light transmittance, and light can easily pass through the non-shielded portion of the substrate 100 almost without damage, so that the electromagnetic shielding member can be applied to a screen or a structure such as a building glass, for example, in the screen, so that an image displayed on the screen can be viewed, and can be applied to the building glass, so that the building glass has good lighting performance.
Optionally, in the present embodiment, the first adhesion layer 210 is a pure metal plating layer, a mixed metal and metal oxynitride plating layer, a metal alloy plating layer, or a mixed metal alloy and metal oxynitride plating layer, which is favorable for forming the first adhesion layer 210 on the substrate 100 through electroplating, chemical plating, vacuum sputtering or vacuum evaporation, and the thickness of the first adhesion layer 210 is controllable through the above process, so that the yield of the electromagnetic shielding member is greatly improved, and specifically, the metal element may be nickel, titanium, chromium, copper or iron, but is not limited thereto.
Optionally, aIn the present embodiment, the adhesion of the first adhesion layer 210 to the substrate 100 and the adhesion to the first conductive layer 220 are both greater than 0.5kg/cm 2 Thus, the electromagnetic shielding member can pass the high-temperature and high-humidity test to ensure that the electromagnetic shielding member has higher structural stability in a severe environment, if the adhesive force is less than 0.5kg/cm 2 The first conductive layer 220, the first adhesive layer 210, and the substrate 100 may be peeled off from each other in a high-temperature and high-humidity environment.
Optionally, in this embodiment, the first conductive layer 220 is a pure metal plating layer or a metal alloy plating layer, and the metal has excellent electromagnetic shielding capability and conductivity, and in addition, the metal material is favorable for forming the first conductive layer 220 on the first adhesion layer 210 through electroplating, electroless plating, vacuum sputtering or vacuum evaporation, and the thickness of the first conductive layer 220 is controllable through the above process, so that the yield of the electromagnetic shielding member is greatly improved.
The first conductive layer 220 is invisible, and in this embodiment, it is shown that light emitted by the metal under the action of light is suppressed by the first light absorbing layer 230 so that the first conductive layer 220 is invisible.
Optionally, in this embodiment, the first light absorbing layer 230 is a pure metal plating layer, a mixed plating layer of pure metal and metal oxynitride, a metal alloy plating layer, or a mixed plating layer of metal alloy and metal oxynitride, which is favorable for forming the first light absorbing layer 230 on the first conductive layer 220 through electroplating, chemical plating, vacuum sputtering, and vacuum evaporation, by which the thickness of the first light absorbing layer 230 is controllable, and the yield of the electromagnetic shielding member is greatly improved. Specifically, the metal element may be nickel, titanium, chromium, tin, copper or iron, but is not limited thereto.
It should be noted that, the first adhesive layer 210, the first conductive layer 220 and the first light absorbing layer 230 are all metal layers, and in practical application, the first adhesive layer 210, the first conductive layer 220 and the first light absorbing layer 230 all have the capability of shielding electromagnetic waves, and the effect of shielding electromagnetic waves is remarkable.
The first light absorbing layer 230 has a light absorptivity of more than 70% and absorbs a large amount of light, thereby suppressing the generation of moire.
Alternatively, in the present embodiment, the thickness of the first adhesive layer 210 ranges from 1nm to 3000nm, when the thickness of the first adhesive layer 210 is too small, it can be understood that the smaller the size, the higher the process requirement, that is, the manufacturing cost is increased linearly, which is unfavorable for practical production, and the adhesion of the first adhesive layer 210 to the substrate 100 and the first conductive layer 220 is also significantly reduced, so that it is difficult to satisfy that the electromagnetic shielding member maintains good structural stability under the high-temperature and high-humidity environment, and when the thickness of the first adhesive layer 210 is too large, the adhesion is significantly increased, but resource waste is caused, and the adhesion is only satisfied to be greater than 0.5kg/cm 2 The use requirement of the electromagnetic shielding member can be satisfied, and therefore, when the thickness of the first adhesive layer 210 is in the range of 1nm to 3000nm, the adhesive force of more than 0.5kg/cm can be ensured to be manufactured at low cost 2 The first adhesive layer 210 of (2) can avoid wasting resources.
Further, in this embodiment, the thickness of the first adhesive layer 210 ranges from 20nm to 250nm, which can consume the lowest cost for manufacturing the first adhesive layer 210 and ensure the adhesive force to be greater than 0.5kg/cm 2 So that the electromagnetic shielding member has good structural stability.
Optionally, in this embodiment, the thickness of the first conductive layer 220 is in the range of 0.1 μm to 300 μm, when the thickness of the first conductive layer 220 is too small, it can be understood that the smaller the size, the higher the process requirement, that is, the manufacturing cost is increased linearly, which is unfavorable for practical production, in addition, the electromagnetic shielding capability is positively related to the thickness of the first conductive layer 220, the too small thickness of the first conductive layer 220 is unfavorable for shielding electromagnetic waves, when the thickness of the first adhesive layer 210 is too large, although the electromagnetic shielding capability is significantly increased, the first conductive layer 220 is difficult to be thinned, that is, the transmittance of the electromagnetic shielding member is significantly reduced, particularly when the material of the first conductive layer 220 is copper, the problem of difficult etching and trapezoid structure is easily generated, and huge difficulty is brought to the thinning of the first conductive layer 220, and even the reduction of the transmittance of the electromagnetic shielding member is caused, therefore, when the thickness of the first conductive layer 220 is in the range of 0.1 μm to 300 μm, the first conductive layer 220 with good shielding capability can be manufactured at low cost, that is also good in the first conductive layer 220, that the first conductive layer 220 has good transmittance.
Optionally, in this embodiment, the thickness of the first conductive layer 220 is in the range of 0.5 μm to 50 μm, so that the first conductive layer 220 with good electromagnetic wave shielding capability is manufactured at low cost, and the thinning degree of the first conductive layer 220 is the highest. It should be noted that, the shielding capability of the electromagnetic shielding member herein may exceed 30dB in the 18GHz-40GHz band.
Optionally, in this embodiment, the thickness of the first light absorbing layer 230 ranges from 1nm to 3000nm, when the thickness of the first light absorbing layer 230 is too small, it can be understood that the smaller the size, the higher the process requirement, that is, the manufacturing cost is increased, which is unfavorable for practical production, and the light absorptivity of the light absorbing layer is also brought about to be significantly reduced, and it is difficult to satisfy the requirement of light absorption, that is, the generation of moire is difficult to be inhibited, when the thickness of the first light absorbing layer 230 is too large, the light absorptivity is obviously increased, but resource waste is caused, and when the light absorptivity is satisfied to be greater than 70%, the generation of moire is well inhibited, so when the thickness of the first light absorbing layer 230 ranges from 1nm to 3000nm, the first light absorbing layer 230 with the light absorptivity of greater than 70% can be manufactured at low cost, and resource waste can be avoided.
Optionally, in this embodiment, the thickness of the first light absorbing layer 230 ranges from 20nm to 250nm, which can consume the lowest cost for manufacturing the first light absorbing layer 230 and ensure the light absorptivity to be greater than 70%, so that the electromagnetic shielding member can inhibit the generation of moire.
Alternatively, in this embodiment, the cross section of the first mesh 200a is polygonal, specifically, the polygonal shape is configured as a diamond, wherein an included angle of the diamond ranges from 30 degrees to 60 degrees, so that when the electromagnetic shielding member is used in the display, a moire of LCM (LCD Module) of the display is effectively suppressed.
Of course, in other embodiments, the cross section of the first mesh may be, but not limited to, a closed pattern, or even, the first mesh may be configured as a groove, where the extending directions of the plurality of grooves are the same, and the plurality of grooves are disposed parallel to each other in the extending direction of the groove, and the plurality of grooves penetrate the first shielding module in the extending direction.
It should be noted that, in the present embodiment, the ratio of the projection area of the first shielding module 200 projected toward the substrate 100 along the normal line of the substrate 100 to the area of the substrate 100 is less than 30%, that is, the light transmittance of the electromagnetic shielding member is greater than 70%, so that the electromagnetic shielding member can be applied to, but not limited to, a display screen, and of course, the ratio can be less than other values to meet other application requirements, such as application to building glass.
Alternatively, in the present embodiment, the plurality of meshes of the first mesh 200a are uniformly dispersed in the first shielding module 200, thus solving the problem of non-uniformity of shielding electromagnetic waves.
Alternatively, the line width of the first shielding module 200 ranges from 5 μm to 1mm, and in the case of a certain number of meshes, the smaller line width means the larger the mesh, that is, the better the light transmittance of the electromagnetic shielding member, and it is understood that the line width is also the specific expression of the fine line as described herein. The stability of the first shielding module 200 is worse and is more easily broken by external influence as the value of the line width is smaller, and the light transmittance of the electromagnetic shielding member is worse as the value of the line width of the first shielding module 200 is larger, and thus, when the line width of the first shielding module 200 is in the range of 5 μm to 1mm, the first shielding module 200 has good stability and excellent light transmittance.
Alternatively, the first shielding module 200 has a line spacing ranging from 5 μm to 10mm, a smaller line spacing means that the mesh is smaller, that is, the light transmittance of the electromagnetic shielding member is worse and the electromagnetic shielding ability is stronger, and a larger line spacing means that the mesh is larger, that is, the electromagnetic shielding ability of the electromagnetic shielding member is worse and the light transmittance of the electromagnetic shielding member is better, and therefore, when the line spacing of the first shielding module ranges from 5 μm to 10mm, the electromagnetic shielding member has both good light transmittance and excellent electromagnetic shielding ability.
Alternatively, in the present embodiment, the substrate 100 has a first surface and a second surface that are disposed opposite to each other, two first shielding modules 200 are disposed, one first shielding module 200 is disposed on the first surface, and the other second shielding module 300 is disposed on the second surface.
The total thickness of the two first conductive layers 220 is greater than the thickness of one first conductive layer 220, that is, the electromagnetic shielding capability of the electromagnetic shielding member is enhanced, in addition, since the two first conductive layers 220 are respectively formed on different surfaces, the two first conductive layers 220 can be thinned under the condition of ensuring good electromagnetic wave shielding capability, that is, if the two first conductive layers are combined into one layer, the problems of etching difficulty and a trapezoid structure can be generated, and the technical scheme can be used for distributing the total thickness to the two first conductive layers to avoid the problems of etching difficulty and the trapezoid structure. It should be noted that the two first shielding modules 200 are disposed on opposite sides of the substrate 100, which is beneficial to realizing bidirectional shielding of electromagnetic waves and bidirectional inhibition of moire generation. In addition, it will be appreciated that the electromagnetic shielding member of this embodiment has the first light absorbing layer on substantially opposite sides, i.e., light rays emitted from the first surface toward the second surface and light rays emitted from the sub-second surface toward the first surface are both absorbed by the electromagnetic shielding member, so that neither of the opposite sides of the electromagnetic shielding member is visible.
Optionally, when seen from one of the first surface and the second surface toward the other, the grid lines of one of the first shielding modules block the grid lines of the other shielding module, so as to maintain the transmittance of the electromagnetic shielding member unchanged, or increase or maintain the transmittance of the electromagnetic shielding member by increasing the mesh size of at least one of the first meshes 200a of the different first shielding modules, it is understood that in the present embodiment, the cross section of the mesh is diamond-shaped, and the size of the mesh hole can be enlarged by enlarging the interval between the opposite sides of the diamond.
It should be noted that, in other embodiments, when the first mesh is configured as a groove, the grooves of the first mesh of the first shielding module located on the first surface extend along the first direction, the grooves of the first mesh of the second shielding module located on the second surface extend along the second direction, that is, the two first shielding modules are separated by the first mesh by a plurality of parallel partial first shielding modules, the projections of the partial first shielding modules located on the first surface and the partial second shielding modules located on the second surface are projected towards the substrate along the normal line of the substrate, and the projections of the partial first shielding modules located on the first surface and the projections of the partial second shielding modules located on the second surface are staggered to limit the grid.
Optionally, in this embodiment, the electromagnetic shielding member is further provided with a first protection layer 500 that at least covers the first shielding module 200, and the first protection layer 500 may prevent the first shielding module 200 from being corroded by water or gas, so as to prolong the service life of the electromagnetic shielding member. Specifically, in the present embodiment, the first protection layer 500 is further coated on the exposed surface of the substrate 100 and the second shielding module 300 to protect them from the external environment, thereby improving the weather resistance and reliability.
Optionally, in this embodiment, the components of the first protective layer 500 include a resin, a metal-complexing precursor, a reinforcing agent, an antifoaming agent, and a solvent. Wherein the metal complex precursor is an azole substance.
Further, in this embodiment, the protective layer comprises the following components in percentage by mass: 1 to 50 percent of resin, 0.01 to 5 percent of metal complex precursor, 0.01 to 3 percent of reinforcing agent, 0.01 to 2.5 percent of defoaming agent and the balance of solvent.
Further, in this embodiment, the protective layer comprises the following components in percentage by mass: 5 to 30 percent of resin, 0.3 to 2.5 percent of metal complex precursor, 0.06 to 1 percent of reinforcing agent, 0.03 to 1 percent of defoaming agent and the balance of solvent.
Further, in this embodiment, the protective layer component further includes 0.02 to 3% by mass of an initiator and 1 to 20% by mass of an acryl monomer oligomer.
Further, in this embodiment, the initiator is one or a combination of azo, peroxide or peroxycarbonate.
Further, in the present embodiment, the initiator is one of azobisisobutyronitrile, azobisisoheptonitrile, dibenzoyl peroxide, di (hexadecyl) dicarbonate, or bipyridine peroxycarbonate, or a combination thereof.
Further, in this embodiment, the metal-complexing precursor is one or a combination of benzotriazole and 2-mercaptobenzimidazole.
Further, in the present embodiment, the resin is one of polyurethane resin or polyacrylic resin or a combination thereof.
Further, in this embodiment, the reinforcing agent is a nano-sized silica sol gel.
Further, in this embodiment, the solvent is one or a combination of propylene glycol methyl ether acetate or ethylene glycol monobutyl ether.
Alternatively, referring to fig. 2, 5, 6 and 7 together, in the present embodiment, the electromagnetic shielding member is provided with a shielding region 600a, a GND region 600b surrounding the shielding region, and an external connection portion 600c connecting the GND region 600b, and further comprises a second shielding module 300 provided on the substrate 100 and connected to the first shielding module 200, and a third shielding module 400 provided on the substrate 100 and connected to the second shielding module 300, and the third shielding module 400 is provided with a first current guiding layer 430; the shielding region 600a includes the first shielding module 200; the GND region 600b includes the second shielding module 300; the external connection portion 600c includes the third shielding module 400, and the external connection portion 600c is used for connecting to a PCB board.
The second shielding module 300 includes a second adhesive layer 310, a second conductive layer 320, and a second light absorbing layer 330 sequentially laminated on the substrate 100, and the second shielding module 300 may have a second mesh penetrating the second adhesive layer 310, the second conductive layer 320, and the second light absorbing layer 330, or may not have a second mesh. The third shielding module 400 includes a third adhesive layer 410, a third conductive layer 420, and a first current guiding layer 430 sequentially stacked on the substrate 100. Specifically, in the present embodiment, the first adhesive layer 210, the second adhesive layer 310, and the third adhesive layer 410 are integrally formed, however, in other embodiments, they may be formed separately; in the present embodiment, the first conductive layer 220, the second conductive layer 320, and the third conductive layer 420 are integrally formed, however, in other embodiments, they may be formed separately; in the present embodiment, the first light absorbing layer 230 and the second light absorbing layer 330 are integrally formed, but of course, in other embodiments, may be formed separately.
Note that, the shielding region 600a, the GND region 600b, and the external connection portion 600c each include a part of the substrate 100.
When the electromagnetic shielding member is applied to the display, if the second shielding module 300 of the GND area 600b has the second grid, the GND area 600b and the shielding area 600a serve as display areas, and when the second shielding module 300 of the GND area 600b does not have the second grid, the GND area 600b serves as a frame area, and the shielding area 600a serves as a display area. In addition, the first current guiding layer 430 of the external connection portion 600c is convenient for guiding the current transmitted from the shielding region 600a to the GND region 600b onto the PCB board, and it can be understood that the faster the current guiding, the better the electromagnetic wave shielding effect, specifically, in this embodiment, the first current guiding layer 430 may be configured as a tin layer or made of anisotropic conductive adhesive, and both the tin layer and the anisotropic conductive adhesive have good conductive ability, and even the tin layer is also convenient for welding and fixing the third shielding module 400 of the external connection portion 600c and the PCB board, where the welding is reflow welding. In addition, in other embodiments, the first shielding module and the second shielding module may be provided with a tin layer or use anisotropic conductive adhesive. The tin layer surface may be oxidized to gray tin oxide as the light absorbing layer, and the tin layer thickness is in the range of 0.5 μm to 1.5 μm.
The invention also provides a display, which comprises a display screen, a touch screen and the electromagnetic shielding component, wherein the specific structure of the electromagnetic shielding component refers to the embodiment, and the display at least has all the beneficial effects brought by the technical proposal of the embodiment because the screen adopts all the technical proposal of the embodiment, and the detailed description is omitted.
The foregoing description is only of the optional embodiments of the present invention, and is not intended to limit the scope of the invention, and all the equivalent structural changes made by the description of the present invention and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (7)
1. An electromagnetic shielding member, characterized by comprising:
a substrate that is transparent to light; and
the first shielding module comprises a first bonding layer, a first conductive layer and a first light absorption layer which are sequentially laminated on the substrate, the first shielding module is in a grid shape, and the first shielding module is provided with a first mesh penetrating through the first bonding layer, the first conductive layer and the first light absorption layer;
the substrate is provided with a first surface and a second surface which are oppositely arranged, two first shielding modules are arranged, one first shielding module is arranged on the first surface, and the other first shielding module is arranged on the second surface;
the first mesh is configured as a groove, the plurality of grooves of the first mesh of the first shielding module located on the first surface extend along a first direction, the plurality of grooves of the first mesh of the first shielding module located on the second surface extend along a second direction, and projections of the plurality of grooves of the first mesh of the first shielding module located on the first surface and projections of the plurality of grooves of the first mesh of the first shielding module located on the second surface are staggered in a normal direction of the substrate so as to limit a plurality of closed mesh projections;
the electromagnetic shielding component is provided with a shielding area, a GND area surrounding the shielding area and an external connection part connected with the GND area, the electromagnetic shielding component further comprises a second shielding module arranged on the substrate and connected with the first shielding module and a third shielding module arranged on the substrate and connected with the second shielding module, the third shielding module is provided with a first current guiding layer, the shielding area comprises the first shielding module, the GND area comprises the second shielding module, the external connection part comprises the third shielding module, and the external connection part is used for connecting a PCB (printed circuit board).
2. The electromagnetic shielding member according to claim 1, wherein the substrate is made of glass or a light-transmitting polymer material;
and/or the first bonding layer is a pure metal plating layer, a mixed plating layer of pure metal and metal oxynitride, a metal alloy plating layer or a mixed plating layer of metal alloy and metal oxynitride;
and/or the first conductive layer is a pure metal plating layer or a metal alloy plating layer;
and/or the first light absorption layer is a pure metal coating, a pure metal and metal oxynitride mixed coating, a metal alloy coating or a metal alloy and metal oxynitride mixed coating.
3. The electromagnetic shielding member of claim 1 wherein the substrate has a light transmittance of greater than 90%;
and/or the adhesive force of the first adhesive layer and the substrate is greater than 0.5kg/cm 2 ;
And/or, the light absorptivity of the first light absorption layer is greater than 70%.
4. The electromagnetic shielding member of claim 1, wherein the thickness of said first adhesion layer ranges from 20nm to 250nm;
and/or the thickness of the first conductive layer ranges from 0.1 μm to 300 μm;
and/or the thickness of the first light absorption layer ranges from 20nm to 250nm.
5. The electromagnetic shielding member of claim 1, wherein the line width of the first shielding module ranges from 5 μm to 1mm;
and/or the line distance of the first shielding module is in the range of 5 mu m-10mm.
6. The electromagnetic shielding member of claim 1, further provided with a first protective layer that covers at least the first shielding module.
7. A display, comprising:
a display screen;
a touch screen; and
the electromagnetic shielding member according to any one of claims 1 to 6, being interposed between the display screen and the touch screen.
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