JPH11266095A - Electromagnetic wave shielding plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent moire from occurring for the scanning line of a display body, by providing a conductive pattern with an electromagnetic wave shielding property on a transparent substrate, and further successively laminating a blackening layer, a conductive pattern layer, and a blackening layer for the conductive pattern. SOLUTION: In an electromagnetic shielding plate 1, a line x in a lateral direction and a line y in a vertical direction are crossed on a transparent substrate 2, thus constituting a mesh-shaped conductive pattern P with an electromagnetic wave shielding property. Then, with the conductive pattern P, adjacent lines x in a lateral direction and adjacent lines y in a vertical direction are arranged irregularly with an arbitrary interval for each line width, and a first blackening layer 3a, a conductive pattern 4, and a second blackening layer 3b are successively laminated in this order, thus shielding the emission of strong electromagnetic waves and preventing moire or the like from occurring for the scanning line of a display without sacrificing its see-through property.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding plate, and more particularly, to shielding electromagnetic waves generated from a large amount of electromagnetic wave sources such as an electron tube for a display and preventing generation of moire or the like on a scanning line of the display. And then
The present invention relates to an electromagnetic wave shielding plate capable of preventing reflection of internal light due to light emission of a display body and reflection of external light on a visual side of the display body and displaying an image of extremely high quality.

[0002]

2. Description of the Related Art To remove an electromagnetic wave from an electronic device or the like that generates an electromagnetic wave, the outer periphery of the electronic device is usually covered with a suitable conductive member to absorb the electromagnetic wave and convert the current to a current. Generally, a method of preventing electromagnetic waves from being emitted to the outside by earthing is used. By the way, an electron tube for display and other devices are installed and used in direct proximity to human beings, and the intensity of electromagnetic wave emission must be within a standard in consideration of adverse effects on the human body. Therefore, it is common to provide an electromagnetic wave shielding plate on the display surface. Thus, in order to perform transparent electromagnetic wave shielding that makes it easy to see through a display screen, a commonly practiced method is to form, for example, an indium-tin oxide film (eg, an indium-tin oxide film) on a transparent glass or plastic substrate surface. A transparent conductive film such as an ITO film is formed into a thin film by vapor deposition or sputtering to produce a transparent electromagnetic wave shielding plate, which is provided in front of a display screen to shield electromagnetic waves. Alternatively, for example, a suitable metal screen such as a wire mesh may be adhered to a transparent glass or plastic substrate surface, or a metal thin film may be entirely formed on the transparent glass or plastic substrate surface by electroless plating or vapor deposition. Then, an unnecessary portion of the metal thin film is etched and removed by a photolithography method using a photoresist to form a finer mesh-like metal thin film to produce an electromagnetic wave shielding plate. Electromagnetic shielding is provided in front of the display screen.

[0003]

In the above example, if importance is placed on transparency, an electromagnetic wave shielding plate in which an ITO film is formed on a transparent substrate is excellent in performance. The ratio is around 90%, the brightest, and a uniform film is formed on the entire surface. Therefore, there is no concern about occurrence of moire or the like with respect to the scanning lines of the display, and it is very easy to use. is there. However,
In the electromagnetic wave shielding plate in which the ITO film is formed on the transparent substrate, since a vapor deposition or sputtering technique is used to form the ITO film, a manufacturing apparatus is expensive,
Since the productivity is generally poor, there is a problem that the price of the electromagnetic wave shielding plate itself as a product becomes high. In addition, the electromagnetic wave shielding plate in which the ITO film is formed on the transparent substrate is inferior in electroconductivity by one digit or more as compared with the electromagnetic wave shielding plate in which the mesh metal thin film is formed. It is effective for weak objects, but when it is used for strong objects, its shielding function is insufficient, leaked electromagnetic waves are emitted, and it may not be possible to satisfy its standard value There is a problem. For example, in order to completely shield an electromagnetic wave by using an electromagnetic wave shielding plate in which an ITO film is formed on the above transparent substrate for a plasma display, it is necessary to provide conductivity about 10 times more than that of the current state. . Thus, in the electromagnetic wave shielding plate in which the ITO film is formed on the transparent substrate, if the thickness of the ITO film is increased in order to increase the conductivity, the conductivity is improved to some extent. In addition, there is a problem that the performance is remarkably reduced, and further, there is a problem that the price becomes more expensive as the thickness is increased.

Next, in the above-mentioned example, for example, in an electromagnetic wave shielding plate in which a suitable metal screen such as a wire net is adhered to the surface of a transparent plastic substrate or the like, the structure is the simplest. Yes and inexpensive, but effective mesh of metal screen (100-200 mesh)
It has a serious drawback that the transmittance is 50% or less, resulting in an extremely dark display.

Furthermore, in the above example, a metal thin film is formed on the entire surface of a transparent glass or plastic substrate by electroless plating or vapor deposition, and then the metal thin film is unnecessary by a photolithography method using a photoresist. In the electromagnetic wave shielding plate in which a finer mesh-like metal thin film is formed by removing the portion by etching, since fine processing is possible, it is possible to create a high aperture ratio (high transmittance) mesh of fine wires. It has the advantage that it is a metal wire, and since it is a metal wire, its conductivity is much higher than that of the above-mentioned ITO film and the like, and has the advantage that it can shield strong electromagnetic wave emission. Thus, in the electromagnetic wave shielding plate formed with the above-mentioned fine mesh-like metal thin film, in general, a mesh-like pattern having a constant pitch width that is orthogonal is effective against electromagnetic waves in the vicinity of a specific wavelength band. However, there is a problem that the electromagnetic wave absorption characteristics in other wavelength bands are deteriorated. That is, in the electromagnetic wave shielding plate on which the fine mesh-like metal thin film is formed, it is effective to determine the pitch width of the mesh-like pattern according to the wavelength of the electromagnetic wave. However, it is difficult to effectively absorb a wide range of wavelength bands with a mesh-like pattern having a constant pitch width as in the related art. Further, in the electromagnetic wave shielding plate on which the fine mesh-shaped metal thin film is formed, moire generated when the electromagnetic wave shielding plate is installed on the front surface of a display body for displaying an image in an orthogonal matrix structure generally has a line between the display body scanning line and the scanning line. Whenever the mesh pattern intersects, the occurrence of moiré is minimized, but it still causes discomfort to the person, and although this is the minimum moiré, the mesh pattern is generated at regular intervals. This is due to the regular array display.

Further, an appropriate metal screen such as a wire mesh is adhered to the above-mentioned transparent glass or plastic substrate surface, or a fine mesh metal thin film is formed to form an electromagnetic wave shielding plate. Because the mesh part protrudes higher than the substrate surface, the mesh part is damaged due to friction or scratching, or dirt, dust, dust, etc. adhere to the mesh part, reducing the visibility of the displayed image There is a problem to make it. In order to prevent such defects, it has been proposed to form a protective film that also smoothes the surface and also protects the mesh-like portion. However, in general, a protective film mainly composed of resin has a strong effect. Friction causes not only fine scratches and loss of transparency, but also high electrical resistance and easy generation of static electricity. There is a problem that transparency is lost.

Further, an appropriate metal screen such as a wire mesh is adhered to the transparent glass or plastic substrate surface, or a fine mesh-like metal thin film is formed to form an electromagnetic wave shielding plate. However, there is a problem that external light enters from the viewing side of the display body, hits the metal surface constituting the metal screen or the mesh-like metal thin film, is reflected on the metal surface, and causes a phenomenon of deteriorating the image quality of the display body. Also, from the display body side, internal light reflection caused by light emission of the display body is caused on the metal screen constituting the metal screen or the mesh-like metal thin film. In particular, in the case of color display, etc., red (R) ), Green (G), blue (B)
However, there is a problem that it is difficult to display a high-quality image by internally reflecting each emission color from each cell and mixing it with other emission colors to reduce color purity and saturation. Therefore, the present invention has a high-performance electromagnetic wave shielding property, and prevents the occurrence of moire on the scanning line of the display body. Prevent internal light reflection caused by light emission, and have a high hardness and excellent abrasion resistance, and have a wear-resistant protective film that prevents the generation of static electricity. It is to provide an electromagnetic wave shielding plate which can be used.

[0008]

As a result of various studies to solve the above problems, the present inventor has found that an electromagnetic wave shielding plate provided with a conductive pattern having electromagnetic wave shielding properties on the surface of a transparent substrate. In the above, a blackening layer is provided on both upper and lower surfaces of the conductive pattern to produce an electromagnetic wave shielding plate.
When the electromagnetic wave shielding plate is provided in front of a display screen such as a plasma display to perform electromagnetic wave shielding, strong electromagnetic wave emission can be shielded, and the transparency of the display is not impaired. It also prevents the occurrence of moire and the like on the lines, and further prevents internal light reflection due to light emission of the display body and external light reflection due to external light from the visual side of the display body, making it easier for a viewer to recognize. The present invention has been completed by finding that an electromagnetic wave shielding plate having an effect of expressing an image can be manufactured.

That is, according to the present invention, a conductive pattern having an electromagnetic wave shielding property is provided on a transparent substrate, and the conductive pattern further comprises a blackening layer, a conductive pattern layer, ,
The present invention relates to an electromagnetic wave shielding plate having a structure in which blackening layers are sequentially stacked.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in more detail below. An example of the electromagnetic wave shielding plate according to the present invention will be exemplified and will be described in more detail with reference to the drawings. FIG. 1 is a schematic perspective view showing a conceptual configuration of the electromagnetic wave shielding plate according to the present invention. 2 is FIG.
Y ₁ -Y ₁ for electromagnetic shielding plate according to the present invention shown in
FIG. 3 is a schematic sectional view showing a conceptual configuration of the electromagnetic wave shielding plate according to the present invention, and FIG.
FIGS. 5, 6, and 7 are schematic cross-sectional views showing the configuration of each material in each step of the first manufacturing method of the electromagnetic wave shielding plate according to the present invention, and FIGS. FIGS. 11, 12, and 13 are schematic cross-sectional views showing the configuration of each material in each step of another manufacturing method for the electromagnetic wave shielding plate according to the present invention.

First, the configuration of the electromagnetic wave shielding plate according to the present invention will be described with reference to an example. As shown in FIGS. 1 and 2, the electromagnetic wave shielding plate 1 according to the present invention
On the transparent substrate 2, for example, a horizontal line x and a vertical line y intersect to provide a conductive pattern P having electromagnetic wave shielding properties (FIG. 1). Putter
The first black layer 3a, the conductive pattern layer 4, and the second black layer 3b are sequentially laminated in this order (FIG. 2). In the present invention, the above-mentioned conductive pattern P having an electromagnetic wave shielding property will be described in more detail. Although not shown, in order to prevent the occurrence of moire or the like on the scanning lines of the display body, the conductive pattern P is used. The horizontal line x and the vertical line y constituting the pattern P are crossed at an arbitrary angle to form a mesh-shaped conductive pattern.
In addition, the width of each of the horizontal line x and the vertical line y constituting the mesh-shaped conductive pattern P is made irregular between adjacent lines. Thus, the openings of the mesh forming the mesh-shaped conductive pattern P can be formed in an irregular rectangular shape to prevent occurrence of moire. Although not shown, in the above-mentioned electromagnetic wave shielding plate, for example, a solid conductive layer can be formed on the periphery of the transparent substrate so that static electricity can be removed from an arbitrary position. In particular, in the present invention, as described later, a horizontal line x and a vertical line y constituting the mesh-shaped conductive pattern P are:
As described above, the first blackening layer 3a, the conductive pattern layer 4,
And a structure (FIG. 2) in which the second blackening layer 3b is sequentially superposed and provided, and these are formed by a metal electrodeposition layer or a Since it is formed by forming a metal plating layer etc., a solid conductive layer can be formed around the periphery of the substrate. This has the advantage that static electricity can be eliminated. Further, in the present invention, a specific static elimination terminal may be formed.

Next, an electromagnetic wave shielding plate according to another embodiment of the present invention will be described with reference to an example of an electromagnetic wave shielding plate according to another embodiment. The electromagnetic wave shielding plate 1a according to another embodiment of the present invention is shown in FIG. First, as described above, for example, a horizontal line x is formed on the transparent substrate 2 as described above.
And the vertical line y intersect to form a mesh-shaped conductive pattern P (FIG. 1), and the mesh-shaped conductive pattern P forms the first blackened layer 3a, The conductive pattern layer 4 and the second blackening layer 3b are successively layered in this order (FIG. 2). Further, as shown in FIG. The conductive fine powder is included on the entire surface including the conductive pattern P, and the surface resistance is 10 ⁹ Ω / c.
m ² or less, and has a configuration in which a wear-resistant protective film 5 having a uniform film thickness with a light transmittance of 75% or more is provided.

In the above electromagnetic wave shielding plate, the transparent substrate 2
Any substrate may be used as long as it is transparent and has a function as a support for holding a conductive pattern P having an electromagnetic wave shielding property. As the transparent substrate, specifically, for example, colorless transparent glass, various similar transparent plastic substrates, various transparent plastic films, or the like can be used. Furthermore, as the above-mentioned transparent plastic substrate or transparent plastic film, specifically, most general-purpose resin materials can be used, and in particular, a film of (meth) acrylic resin or polyester resin or It is preferred to use a sheet. As for the thickness of the transparent substrate, for a small product such as a character-display tube, a thin film having an appropriate flexibility of 0.03 mm to 0.5 mm is attached to the display. It is preferable because it can be used. On the other hand, when applied to a large display of several tens of inches or more, a stiff flexible film or a rigid substrate, that is, one having a thickness of 0.5 to 10 mm is suitably used. For large displays,
This is because it is necessary to mechanically install the display using an auxiliary jig or the like. In any case, the transparency of the substrate is ideally 100%, but it is preferable to select a substrate having a transmittance of 80 to 95%.

Next, in the above-described electromagnetic wave shielding plate, for example, a mesh-shaped conductive pattern P having electromagnetic wave shielding properties formed by crossing a horizontal line x and a vertical line y is used. Since it is necessary to increase the transmittance of light as much as possible, it is preferable to design the opening of the mesh-shaped portion of the mesh-shaped conductive pattern P so as to satisfy the conductivity condition and be large. Things. In the above, in order to increase the aperture ratio, it is necessary to make the horizontal line x and the vertical line y constituting the mesh-shaped conductive pattern P relatively thin. For that purpose, a mesh-shaped conductive pattern
It is desirable to reduce the thickness of the film P. For example, when the film thickness is a thin layer, it is desirable because it is easy to form a fine line by various processing methods. In the present invention, the mesh-shaped conductive pattern
The thickness of the film P is preferably about 0.05 to 30 μm because a uniform electrodeposited film can be obtained, and from the viewpoint of workability, it is more preferably about 0.2 to 10 μm. The line width of the horizontal line x and the vertical line y of the mesh-shaped conductive pattern P is as follows.
The thickness is preferably 5 to 60 μm, but if the thickness is about 10 to 40 μm, stable production can be performed at low cost, which is more preferable. In the present invention, the mesh density, line width, thickness, and the like differ depending on the purpose of use. In the present invention, the opening ratio of the mesh-shaped conductive pattern P is more advantageous as close to 100%, but is preferably 65 to 95%.
% Is technically practical.

Next, in the above-mentioned electromagnetic wave shielding plate,
For example, a first blackening layer 3a, a second blackening layer 3b, etc., which form a mesh-like conductive pattern P formed by crossing a horizontal line x and a vertical line y, are formed. The blackening layer to be formed can be formed by appropriately selecting and utilizing the following concept. In the present invention, a mesh-shaped conductive pattern P, which is a main object, is used.
There are two methods for forming the metal layer, one of which is a metal plating method, and the other is an etching method. In the present invention, the first blackening layer 3a, the second blackening layer 3
The method for forming b and the like, the materials used, and the like are different. That is, in the present invention, in order to form the conductive pattern P on the first blackening layer 3a, the second blackening layer 3b, etc. by the metal plating method or the like, the conductive pattern P which can be plated with metal is used. When a conductive blackening layer is required, and when blackening is performed in a final step by an etching method, an electrodeposition method, or the like, a nonconductive blackening layer can be formed using a nonconductive material or the like. . In general, the conductive blackening layer can be formed using a conductive metal compound, for example, a compound such as nickel (Ni), zinc (Zn), and copper (Cu). The blackening layer is
Paste-like black polymer material, for example, black ink or the like, or black chemical conversion material, for example, a black compound formed by chemical conversion treatment of a metal plating surface, furthermore, an electrodepositable ionic polymer It can be formed using a material such as an electrodeposition coating material. In the present invention, utilizing the above-described blackening layer forming method, selecting an appropriate method according to the manufacturing process in the manufacturing method of the electromagnetic wave shielding plate, and adopting the method to form the blackening layer. Can be.

Further, in the above-mentioned electromagnetic wave shielding plate,
For example, as the conductive pattern 4 forming a mesh-shaped conductive pattern P having an electromagnetic wave shielding property formed by crossing a horizontal line x and a vertical line y, a conductive pattern It is a mesh shape composed of fine lines composed of a good substance, and it is generally preferable to have a form composed of thin lines in order to maintain transparency, and the shape is, for example, square, rectangular , A rectangular shape having an arbitrary shape such as a random strip shape, a diamond shape, or the like is used as a basic structure. In the present invention, since the material constituting the above-mentioned conductive pattern 4 needs to have good conductivity,
Usually, various metals can be used, and furthermore, metal oxides and other compound materials can be used as long as the conditions can be satisfied. Thus, as the above-mentioned good conductive material, generally, metal is a preferable material because it is inexpensive and easy to process, and specifically used metal species include: For example, A
u, Ag, Cu, Ni, Cr, Fe, Al, Zn, T
Various simple metals such as i, Ta, Mo, Co, and others, or various alloys can be used. Also,
In the present invention, the conductive pattern 4 is made of one of the above-mentioned metals or two or more of the above-mentioned metals.
Seeds can also be provided in layers. Thus, in the present invention, the above-mentioned conductive pattern 4 is formed by the above-mentioned first pattern.
The first blackening layer 3a, the conductive pattern 4 and the second blackening layer 3b are located between the blackening layer 3a and the second blackening layer 3b. , A horizontal line x and a vertical line y, and the horizontal line x and the vertical line y intersect to form a mesh-shaped conductive pattern P. It is.

Next, in the above-mentioned electromagnetic wave shielding plate, the wear-resistant protective film 5 will be described.
For example, as a main component, one or more resins having surface protection aptitude can be used.
Seeds or more are added, and if necessary, additives such as plasticizers, stabilizers, antioxidants, ultraviolet absorbers, infrared absorbers, antistatic agents, lubricants, fillers, etc. are optionally added. Then, the coating solution is adjusted by sufficiently kneading with a solvent, a diluent, or the like, and then the coating solution is, for example, roll-coated,
A transparent wear-resistant protective film 5 which is applied or printed by a coating method such as gravure coating, die coating, dip coating, knife coating, reverse roll coating, spray coating, etc. Can be formed. In the above, the thickness of the wear-resistant protective film 5 is about 1 to 100 μm
Is preferable, and more preferably about 3 to 50 μm. As the resin having the above surface protection suitability, light, electron beam,
One or more resins or monomers or prepolymers thereof that can be cured or cross-linked by the action of heat or a curing agent or a cross-linking agent to form a resin film having high hardness can be used. For example, polyester-based resin, polyamide-based resin, polyimide-based resin, polyamide-imide-based resin, silicone-based resin, xylene-based resin, epoxy-based resin, curable (meth) acrylic-based resin,
Polyurethane resins, phenol resins, aminoplast resins, and other hard resins can be used. Further, various commercially available coatings commonly used for protecting the surface of plastic products can be used. Agents can also be recommended. For example, Mitsubishi Chemical Corporation, trade name, Yupima-UVHN-
5A, Iupima-UVH6000, Iupima-UVH700
0, manufactured by Toshiba Silicon Corporation, trade name, UVHC855
3. A resin composition for forming a wear-resistant protective film such as UVHC8558 can be used. Examples of the conductive fine powder include fine powders which are themselves conductive, such as indium-tin oxide (ITO) fine powder, tin oxide fine powder, and zinc oxide fine powder; Silicon, titanium oxide, and other conductive fine powders provided with a coating layer on the surface of white fine powder particles with the above-described ITO or the like to impart conductivity can be used. The individual crystal units of the fine powder as described above are transparent or white, and some aggregates exhibit white. As for the mixing ratio of the resin and the conductive fine powder, the conductive fine powder is mixed in an amount of about 10% by weight to about 10% by weight with respect to the resin component, and is slightly higher in transparency and at least translucent. It is preferred that Therefore, if the light diffusivity is too high, the displayed image is undesirably blurred. For example, the above-mentioned Yupi-
UVH6000 (manufactured by Mitsubishi Chemical Corporation),
Although it has an antistatic property, its deterioration with time is recognized. Therefore, if a conductive fine powder is mixed into the base, there is an advantage that the antistatic deterioration can be prevented and an appropriate light diffusing property can be arbitrarily set. It is preferable that the above-mentioned abrasion-resistant protective film has a surface resistance of 10 ⁹ Ω / cm ² or less, which exhibits an antistatic effect, and has a light transmittance so as not to make the display screen dark. , 75% or more.

Next, in the present invention, the above-mentioned resin is used as the above-mentioned wear-resistant protective film 5, and one or more conductive fine powders are added thereto as described above. If necessary, for example, optionally add additives such as plasticizers, stabilizers, antioxidants, ultraviolet absorbers, infrared absorbers, antistatic agents, lubricants, fillers, etc., and melt-knead them. Then, a resin pellet is prepared, and then, using the resin pellet, a resin film or sheet is produced therefrom, and the film or sheet is formed on the surface of the mesh-shaped conductive pattern, For example, the protective layer 5 can be formed by laminating through an adhesive or the like. The above resin film or sheet preferably has a thickness of about 10 to 100 μm, more preferably 15 to 50 μm.
The m-th position is desirable. In the above, as the adhesive, for example, a resin such as a curable (meth) acrylic resin, a polyester resin, a polyamide resin, an epoxy resin, a polyurethane resin, a phenol resin, or the like is used as a main component of the vehicle. Or an adhesive of an emulsion type or the like.

Next, the method for producing the electromagnetic wave shielding plate according to the present invention will be described. There are various methods for producing the electromagnetic wave shielding plate. The first method is a metal electrodeposition transfer method. In this method, a conductive pattern electrodeposited on another substrate surface is transferred to a target transparent substrate surface. First, FIG.
As shown in FIG. 1, a mesh-shaped resist pattern 12 composed of an insulating film that inhibits electrodeposition is formed on a conductive substrate 11 such as a metal plate, and the surface of the conductive substrate 11 is exposed.
An electrodeposited substrate 14 having an electrodeposited portion 13 capable of metal electrodeposition in a mesh shape is manufactured. In the above description, the insulating film is generally formed by a known optical patterning method using a known inexpensive water-soluble photoresist such as a dichromate-based or diazo-based photoresist. However, it is usually damaged after one or two uses, so in stable work,
It is necessary to form an insulating film every time. In the above optical patterning method, a mesh-shaped conductive pattern is used.
In order to form a pattern, patterning can be performed by performing exposure, development, and the like using a negative or positive resist pattern having a mesh-shaped pattern as a basic structure. On the other hand, when the selected various commercially available photoresists are applied to the above-described first manufacturing method of the present invention, for example, it is possible to use the photoresist several times to about ten and several times. However, since the durability is low, it is preferable to use a stronger resin resist. In the present invention, for example, patterning of the insulating film is preferably performed by using a mechanical cutting method or a burn-out drawing method in a heat mode such as laser processing. Further, in the present invention, although not shown, a groove required by photolithography or cutting is formed on the surface of a metal substrate as a conductive substrate, and then a strong insulating resin is embedded in the groove. By curing, an electrodeposited substrate having an electrodeposited portion capable of metal electrodeposition in a mesh shape can be produced. In this case, since the surface of the electrodeposited substrate is polished, the electrodeposited portion and the insulating portion become flat, so that there is an advantage that the operation for transferring the electrodeposit is easy. Still further, in the present invention, although not shown, as another method for producing a highly durable electrodeposited substrate, for example, a silicon dioxide (SiO ₂ ) layer is formed on the surface of a stainless steel substrate, By forming the insulating layer by photoetching the layer, a fine, precise, and highly durable electrodeposited substrate can be manufactured. Alternatively, a simple metal plate such as tantalum or titanium,
Alternatively, when the surface is a metal surface, a resist is formed only at a portion corresponding to a portion constituting an electrodeposited portion, and then anodized to form an insulating oxide layer such as titanium oxide or tantalum oxide. By forming and then removing the resist, an electrodeposited substrate having extremely high durability and extremely high repetitive use can be manufactured. In this case, the anodic metal oxide layer has features such as high hardness, low scratch resistance, and having an insulating film that can sufficiently withstand electrodeposition and pressure bonding.

Next, as a method of providing a blackening layer in the present invention, as shown in FIG. 5, a blackening layer is formed on a conductive substrate 11 such as a metal plate prepared as described above by an insulating film which inhibits electrodeposition. The electrodeposited substrate 14 having the mesh-shaped resist pattern 12 is first immersed in an electrolytic solution such as blackened copper or blackened nickel, and plated by a known electrochemical plating method. A mesh-like second blackening layer 3b made of a copper oxide layer or a blackening nickel layer is formed. In the present invention, the black plating bath can be a black plating bath containing nickel sulfate as a main component, and a commercially available black plating bath can also be used.
Specifically, for example, a black plating bath (trade name, Noble Broy SNC, Sn-Ni alloy system) manufactured by Shimizu Co., Ltd., a black plating bath (trade name, Nikka Black, Sn- Ni alloy type), black plating bath manufactured by Kinzoku Kagaku Kogyo Co., Ltd.
, Cr-based) can be used. In the present invention, as the black plating bath, a Zn-based plating bath,
Various black plating baths such as u-based and others can be used. Next, in the present invention, similarly, as shown in FIG. 5, the electrodeposition substrate 14 provided with the second blackening layer 3b is provided.
Is immersed in a metal electrolytic solution for shielding electromagnetic waves, and a mesh-shaped conductive pattern 4 is formed to a desired thickness at a position corresponding to the second blackening layer 3b of the electrodeposited substrate 14. Lamination and electrodeposition. In the above, as the material constituting the mesh-shaped conductive pattern 4, the above-mentioned metal as a good conductive substance can be used as the most advantageous material. Thus,
When forming the above-mentioned metal electrodeposition layer, a general-purpose metal electrolyte can be used.Therefore, there are various kinds of inexpensive metal electrolytes, and selection suitable for the purpose can be freely performed. There is an advantage that you can. Generally, Cu is frequently used as an inexpensive good conductive metal, and in the present invention,
The use of Cu is useful in accordance with the purpose, and of course, other metals can be used as well. Next, in the present invention, the mesh-shaped conductive pattern 4 does not need to be composed of only a single metal layer. For example, although not shown, the mesh-shaped conductive pattern made of Cu in the above example is used. Since the negative electrode P is relatively soft and easily scratched, a two-layer metal electrodeposition layer using a general-purpose hard metal such as Ni or Cr can be used as the protective layer. Next, in the present invention, similarly, as shown in FIG.
Is formed, for example, the surface of the mesh-shaped conductive pattern 4 is subjected to chemical conversion treatment. Specifically, for example, if the conductive pattern P is made of copper (Cu), The surface of copper is treated with hydrogen sulfide (H ₂ S) solution to make copper sulfide (CuS)
The surface of the metal electrodeposition layer constituting the mesh-shaped conductive pattern 4 is blackened to form a first blackened layer 3.
a, and the second blackened layer 3b, the conductive pattern layer 4, and the first blackened layer 3a are sequentially stacked in this order to form a mesh-shaped conductive pattern. P is formed. In the present invention, as the above-mentioned copper surface blackening agent, a sulfide-based or sulfide-based compound can be easily produced, and further, there are many types of commercially available products, for example, Product name ・ Copper Black CuO 、 Cu
S, selenium-based Copa Black No. 65 (manufactured by Isolate Chemical Laboratories), trade name, Ebonol C Special (manufactured by Meltex Co., Ltd.), etc. can be used.

Next, in the first manufacturing method of the present invention, as shown in FIG. 6, the transparent substrate 2 is superposed on the mesh-shaped conductive pattern P formed as described above. Is pressed, and a mesh-shaped conductive pattern is formed on the transparent substrate 2 surface.
Then, the transparent substrate 2 having the mesh-shaped conductive pattern P is peeled off from the electrodeposited substrate 14, and the first blackened layer 3a and the conductive pattern are removed. A transparent substrate 2 having a mesh-shaped conductive pattern P having a structure in which a conductive layer 4 and a second blackening layer 3b are sequentially laminated in this order is manufactured, and the electromagnetic wave shielding plate 1 according to the present invention is manufactured. It can be. At the time of the above adhesive transfer, as shown in the drawing, an adhesive is applied in advance on the surface of the transparent substrate 2 to form an adhesive layer 15.
The surface of the mesh-shaped conductive pattern P is superimposed on the surface, and the both are pressed or thermocompression-bonded to adhere the entire surface of the mesh-shaped conductive pattern P to the adhesive layer 15.
The transparent substrate 2 having the adhesive-transferred mesh-shaped conductive pattern P can be peeled off from the electrodeposited substrate 14 and the mesh-shaped conductive pattern P can be adhesive-transferred to the surface of the transparent substrate 2. In the above description, the adhesive constituting the adhesive layer 15 may be an adhesive having an appropriate adhesive strength, an adhesive having a heat seal property, a curable adhesive which is cured by light, an electron beam, heat or the like. And other adhesives. Thus, in the present invention, the use of a curable adhesive after the adhesive transfer is advantageous for producing a stable and reliable product. In addition, in the present invention, a stable and reliable product is manufactured even when hot-pressed using a thermosetting adhesive such as a thermosetting acrylic adhesive in order to uniformly bond and transfer the entire surface. be able to. In the above-described transfer method, the step of the second blackening layer 3b is omitted, and first, the transfer is performed as a two-layer structure of direct copper plating and blackening treatment, and then the surface of the copper plating after transfer is exposed. The copper surface may be blackened to form a second blackened layer. By the way, as the transfer adhesive used in the above-mentioned transfer method, an adhesive having a weak adhesive force with the mesh-shaped resist pattern 12 made of an insulating film is selected in order to repeatedly use the electrodeposited substrate 14. Need to be used. Thus, such an adhesive can be easily selected from various types of commercially available adhesives and used, which affects the durability of the electrodeposited substrate 14. Further, in the present invention, the mesh-shaped conductive pattern P
However, it is preferable to select and use the conductive substrate 11 such as a metal plate constituting the electrodeposited substrate 14 so that the substrate can be easily separated from the electrodeposited substrate 14. In general, the surface of the stainless steel plate has a weak adhesiveness to the metal electrodeposition layer, and after such electrodeposition, the stainless steel plate surface is commonly used for such a task as peeling off the metal electrodeposition layer. It is preferable to use a stainless steel plate as the metal plate constituting the electrodeposited substrate 14. Further, in the present invention, when a metal plate is used as a material for forming the electrodeposited substrate 14 as described above, a layer of, for example, Cr, Ni, or the like is formed on the surface thereof, so that Can be easily peeled off. This is because the metal surface is oxidized to form an oxide, and the surface portion of the Cr and Ni components, which also incorporates the releasability of stainless steel, is oxidized.

Further, according to the present invention, as shown in FIG. 7, after the mesh-shaped conductive pattern P is entirely adhered to the surface of the transparent substrate 2 via the adhesive layer 15 or the like as described above. The above-mentioned conductive fine powder is included on the entire surface including the mesh-shaped conductive pattern P to which the adhesive transfer has been performed, the surface resistance is 10 ⁹ Ω / cm ² or less, and the light transmittance is
Abrasion-resistant protective film 16 having a uniform film thickness of 75% or more
By providing (5), it is possible to manufacture the electromagnetic wave shielding plate 1a having the electromagnetic wave shielding property and the see-through property according to the present invention.

Next, as another method of manufacturing the electromagnetic wave shielding plate according to the present invention, a method in which a mesh-shaped conductive pattern is formed by photoetching and then transferred to a transparent substrate can be mentioned. . The transfer method according to the above-described photo-etching method will be described. As shown in FIG. 8, a conductive substrate 31 capable of electrodepositing a metal is used, and a second blackening layer 32 is formed on the conductive substrate 31. Conductive metal layer 3
3, and a member having a configuration in which the first blackening layer 34 is sequentially laminated is prepared. Next, as shown in FIGS. 9 and 10, after an etching resist pattern 35 is formed, the first blackened layer 34 and the conductive metal layer 3 which are exposed are exposed.
3, and the overlapping portion of the second blackening layer 32 is, for example,
When each layer such as the second blackening layer 32, the conductive metal layer 33, and the first blackening layer 34 is formed of a metal such as copper or nickel, a ferric chloride solution or the like is used. By performing chemical etching using the etching solution of the above, by removing the exposed portions of the first blackened layer 34, the conductive metal layer 33, and the second blackened layer 32, The remaining layers, such as the second blackening layer 32, the conductive metal layer 33, and the first blackening layer 34, are respectively formed by the second blackening layer 3b and the conductive pattern layer 4. And the first blackening layer 3a
And a mesh-shaped conductive pattern P having a configuration in which the layers are sequentially laminated in this order is formed.

Next, as shown in FIGS. 11 and 12, the etching resist pattern 35, the remaining second blackening layer 32 (3b), and the conductive metal layer 3 are formed as described above.
3 (4) and an adhesive having poor adhesion to the conductive substrate 31 is selected over the entire surface including the mesh-shaped conductive pattern P composed of the first blackened layer 34 (3a). An adhesive layer 36 is formed, and a transparent substrate 37 is formed through the adhesive layer 36.
Adhesive transfer to (2). Alternatively, in the present invention, when an adhesive having an adhesive property is used, the entire surface of the substrate (for example, a stainless steel plate) is plated with a thin film of nickel Ni or the like in advance, and this is used as a starting substrate. What should I do? That is, in the present invention, when copper Cu is etched, if ammonium persulfate is used as an etchant, only copper Cu can be selectively etched, and the nickel Ni layer is not etched. After the etching, an adhesive layer 36 of a strong adhesive is formed. Next, in the present invention, when the nickel layer is transferred by adhesive transfer to the transparent substrate 37 (2) via the adhesive layer 36, the nickel Ni thin film layer after transfer is dissolved and removed with a dilute etchant. In the above, although the copper Cu layer may be slightly etched, the purpose is not affected since the nickel Ni layer is thin. According to this method, the first blackening layer 34 (3
a), a transparent substrate 37 (2) having a mesh-shaped conductive pattern P having a configuration in which a conductive metal layer 33 (4) and a second blackening layer 32 (3b) are sequentially laminated. ) Can be manufactured (FIG. 1).
2). Further, in the present invention, as shown in FIG.
As described above, the etching resist pattern 35,
A first blackening layer 34 (3a), a conductive metal layer 33 (4),
Further, the above-described conductive fine powder is included on the entire surface including the mesh-shaped conductive pattern P having a configuration in which the second blackening layer 32 (3b) is sequentially laminated, and the surface resistance is reduced. 10
^The protective layer 38 (5) having a uniform thickness of ⁹ Ω / cm ² or less and a light transmittance of 75% or more is provided to improve the electromagnetic wave shielding property and the transparency according to the present invention. Can be manufactured.

In the above-described electromagnetic wave shielding plate according to the present invention, the etching resist pattern 35 may be removed or may be left, and when the etching resist pattern 35 is removed, After the etching resist pattern 35 is removed, the surface of the remaining conductive metal layer 33 can be blackened. The above blackening treatment is performed by using a known blackening treatment method such as a plating method of black copper (Cu) or black nickel (Ni) or a chemical blackening method. be able to. In the above description, as the conductive substrate 31, a stainless steel plate having good removability of electrodeposited metal can be generally used. In the above, when etching is performed using the etching resist pattern 35 as a mask, the etching can be performed in the same manner as described above. However, when a ferric chloride solution or the like is used, the surface of the stainless steel plate is also etched. Care must be taken when a stainless steel plate is repeatedly used as the conductive substrate 31. In the above description, the etching resist pattern 35 can be formed by a method using a photoresist, a method using a precision printing method, or the like, as described above. Thus, in the present invention, in the method using the above photoresist,
As described above, in order to form a mesh-shaped conductive pattern, a negative or positive resist pattern or the like having a mesh-shaped pattern as a basic structure is used to form a pattern such as an exposure and development process. By performing the etching, an etching resist pattern 35 can be formed. Further, in the present invention, the three-layer structure is constituted by a two-layer structure, and then the surface of the conductive metal layer 33 made of a Cu surface, such as a bare surface, which appears on the surface after being closely transferred to the transparent substrate 37, is subjected to blackening treatment. The desired blackening layer / conductive pattern layer /
A three-layer structure of a blackening layer may be used.

[0026]

Next, the present invention will be described in more detail with reference to specific examples. Example 1 After cleaning the surface of a stainless steel plate having a thickness of 0.15 mm, a commercially available negative photoresist (manufactured by Tokyo Ohka Co., Ltd.,
(Product name, KOR) is applied and dried, and then a master of a photographic plate having a mesh-shaped pattern prepared in advance.
The plate was brought into close contact using a vacuum baking frame and exposed to ultraviolet light. The mesh pattern was 100 mesh, the line width of the electrodeposited portion was 25 microns. Next, development and drying were performed as specified to produce an electrodeposited substrate having an electrodeposited portion of 23 microns. First, using the above electrodeposited substrate, a blackening layer was electrodeposited to a thickness of 2 to 3 microns in the following nickel Ni plating bath. Subsequently, copper Cu plating was performed to form a conductive layer having a thickness of 8 to 10 microns, and the copper electrodeposited surface was treated with a copper blackening treatment solution to blacken the copper surface to form a three-layer structure. The blackening solution used was
In an aqueous solution containing 20% of solution A and 10% of solution B of commercially available Copper Black (manufactured by Isolate Chemical Laboratory Co., Ltd.),
It was immersed at 40-60 ° C for 5-10 minutes to obtain a black copper oxide film. Plating bath conditions (black nickel Ni plating) Nickel ammonium sulfate 60 g / l Zinc sulfate 7.5 g / l Sodium thiocyanate 15 g / l Temperature 30 ° C. Current density (energization time 3 minutes) Initial 0.1 A / dm, current gradually increased and finished 1 A / dm. (Conductive layer of copper Cu Plating: Biro acid copper _{baths) Cu 2 P 2 0 7 ·} 3H 2 0 49g / l K 2 P 2 0 7 340g / l NH 4 OH (28%) 3m / l pH 8.8 P ratio (P ₂ O ₇ ⁴⁻ / Cu ²⁺ ) 7.0 Liquid temperature 55 ° C. Electrodeposited film thickness 8 to 10 μm Next, in order to transfer the above electrodeposit onto a transparent substrate, a transparent acrylic substrate having a thickness of 5 mm is used. A photocurable acrylic adhesive was applied to the surface in advance to a uniform thickness of 20 microns. The above-mentioned photocurable adhesive mainly contains an acrylate monomer and a photopolymerization initiator. Here, as the acrylate monomer, 2-ethylhexyl acrylate, 1.4-butanediol acrylate, or the like is used. And benzoyl peroxide was used as a photopolymerization initiator. Next, the electrodeposited substrate and the acrylic substrate coated with a photo-curable adhesive were uniformly pressed, and then irradiated with ultraviolet rays from the acrylic substrate side for curing and bonding. In this case, the adhesiveness with the electrodeposit is good, but the adhesive strength with the resist is weak, so when the stainless steel electrodeposited substrate is slowly peeled off, the electrodeposit is completely transferred to the transparent substrate side, and the resist is It remained on the stainless steel plate side without peeling. As a result, a metal mesh having a line width of 30 to 35 microns was formed on the transfer surface of the transparent acrylic plate to which the electrodeposit was transferred, using a 100-mesh conductive metal. Furthermore, in order to increase the practical characteristics, a curable acrylic resin (Epicoat UVH6000) 10
Parts, a resin composition containing 1 part of indium-tin oxide (ITO) fine powder is coated uniformly to a thickness of 15 μm,
A transparent acrylic resin protective film having high transparency, high surface hardness and antistatic properties was formed. In forming the protective film, a mask is provided so that the protective film is not formed on a part of the transparent substrate so that the protective film can be easily connected to the earth portion of the frame jig for attaching the electromagnetic wave shielding plate. The part
Contact processing part. The electromagnetic wave shielding plate produced by this method exhibited a good electromagnetic wave shielding effect. The stainless steel substrate that had been peeled off with the resist remaining could be used again as an electrodeposited substrate. However, since a part of the resist image was easily broken, the number of repeated use was limited to several times.

Embodiment 2 In the above-mentioned Embodiment 1, a method of forming a blackened layer by black copper conversion treatment after copper Cu electrodeposition is exemplified. In this example, two blackened layers are formed by black nickel Ni plating. In this case, the same black plating bath can be used for forming both blackening layers, which is convenient in operation. First, black nickel Ni plating and copper Cu
The plating step was performed in exactly the same manner as in Example 1 above. Next, the third blackening layer is formed of the above black nickel N
When the current is passed for 2 to 3 minutes at a current density of 0.1 A / dm using the i-plating bath as it is, the black nickel Ni layer
Formed to a thickness of microns, the surface of the copper Cu plating layer,
Blackened. Next, chromate treatment was performed on the blackened surface. This chromate treatment was performed by dipping in a 5 to 10% solution of ammonium bichromate for 2 to 3 minutes, followed by washing with water and drying. Next, when the same photocurable acrylic adhesive of Example 1 described above was directly applied to the black nickel Ni surface, the adhesion to the electrodeposit was weak, but the above chromate treatment was performed. By doing so, the adhesiveness was strengthened, and the electrodeposit was reliably transferred to the transparent substrate side at the time of transfer peeling. The treatment on the transparent substrate side after the electrodeposit transfer
In the same manner as in Example 1 described above, an electromagnetic wave shielding plate having good electromagnetic wave shielding hardening was produced in the same manner as in Example 1 above.

Example 3 In Example 2 described above, in order to increase the abrasion resistance (scratch resistance) of the surface of the metal mesh having a three-layer structure, a nickel Ni layer having a high hardness was formed near the mesh surface after the transfer. It was formed into a four-layer structure. That is, the mesh-plated stainless steel substrate used in Example 1 was first plated with black nickel Ni according to the previous example, and then a normal nickel nickel plating layer was formed using the nickel nickel bath described below.
An attempt was made to maintain the surface hardness by forming a micron in thickness. Next, in the same manner as in the previous example, copper Cu plating and black nickel Ni plating were further performed on the nickel Ni layer, followed by washing with water, chromate treatment, and after washing and drying, a transparent photocurable adhesive was applied. It was cured and adhered to an acrylic substrate having a thickness of 5 mm. The transfer mesh basically had a four-layer structure of a blackened nickel Ni layer / a nickel Ni layer / a copper Cu layer / a blackened nickel Ni layer from the surface. The presence of the nickel Ni layer near the surface layer resulted in the prevention of scratches and the like during work and the like. The protection film on the acrylic substrate surface after the mesh transfer was formed in the same manner as in Example 1 above, and an electromagnetic wave shielding plate having a good electromagnetic wave shielding effect was manufactured. (Nickel Ni plating bath) Nickel sulfate Ni 240-340 g / l Nickel chloride Ni 45 g / l Sulfuric acid 30-38 g / l pH 2.2-5.5 Temperature 46-70 ° C Current density 2.5-10 A / dm

Example 4 A thin film of silicon dioxide was formed by sputtering to a thickness of 0.2 μm on one entire surface of a stainless steel plate having a thickness of 0.15 mm. Next, a mesh pattern is formed by photolithography in the same manner as in the previous example, and after etching the silicon dioxide (etching using a hydrofluoric acid-based etchant), the resist is removed to remove the silicon dioxide into an insulating film. An electrodeposited substrate having the following mesh pattern was manufactured. The line width of the electrodeposited portion was 25 microns. Then
A black nickel Ni layer / copper Cu layer / black nickel Ni layer is formed on the electrodeposited substrate in the same manner as in the first embodiment to form a three-layered mesh pattern. The adhesive layer was coated with the following electrodepositable organic adhesive at a voltage of 20-5.
By continuous electrodeposition at 0 V, an adhesive layer having a thickness of 10 to 15 microns was formed only on the mesh pattern. (Electrodepositable organic adhesive) N-dimethylaminoethyl acrylate 115 parts 2-hydroxyethyl methacrylate 150 parts n-butyl acrylate 400 parts Methyl methacrylate 150 parts n-butyl methacrylate 185 parts Azobisisobutyro Nitrile 50 parts The above components were reacted to obtain a stock solution. The above undiluted solution 100
From 0 parts, 120 parts of block isocyanate, 20 parts of dibutyltin diurarate, and 12,000 parts of water, a cationic adhesive electrodeposition solution having a solid content of 5% was prepared. Next, a transparent polyester film having a thickness of 0.2 mm is stacked on the surface of the four-layered mesh-formed electrodeposited substrate including the adhesive layer obtained by the above-described electrodeposition step, carefully pressed, and then peeled off. Then
From the electrodeposited substrate to the mesh part, that is, black nickel Ni
The multilayer electrodeposited portion of the layer / copper Cu layer / black nickel Ni layer / electrodepositable organic adhesive layer was well transferred to the polyester film side. Next, a flexible electromagnetic wave shielding plate (film) is formed by coating and forming a protective film layer on the surface of the transfer electrodeposited portion in the same manner as in Example 1 to effectively perform electromagnetic wave shielding. It was confirmed. Further, the electrodeposited substrate from which the electrodeposited portion has been peeled off is made of a strong silicon dioxide insulating film, and no electrodepositable organic adhesive is electrodeposited on this silicon oxide insulating film. It has a large number of repetitions, and can be used repeatedly for several tens to 100 times.

Example 5 An electromagnetic wave shielding plate made of a multilayer mesh was formed by an etching method of the photolithographic method. A black nickel Ni layer / copper Cu layer / black nickel Ni layer is electrodeposited on the entire surface of the stainless steel plate on which no pattern is formed according to the preceding example, and then subjected to a chromate treatment, followed by a transparent adhesive. Was transferred to the entire surface of a transparent acrylic substrate having a thickness of 5 mm to which was applied. Next, using the photoresist of the preceding example, a mesh plate was formed on the surface of the multilayer electrodeposit according to a standard method, and then etched with a ferric chloride solution (using a 38 ° bore solution) to form a conductive mesh pattern. . Next, a protective film was formed on the pattern surface in the same manner as in Example 1 to manufacture an electromagnetic wave shielding plate. In the present embodiment, unlike the mesh electrodeposition method of the previous example, since the image is narrowed by sand etching in order to form a mesh by etching at the end, it is possible to form a finer wire mesh than the electrodeposition method, and Due to the smooth finish of the edge, a product with higher transmittance and higher uniformity could be obtained.

[0031]

As is apparent from the above description, the present invention relates to an electromagnetic wave shielding plate provided with a conductive pattern having an electromagnetic wave shielding property on the surface of a transparent substrate. On both surfaces, a blackening layer is provided in an overlapping manner to produce an electromagnetic wave shielding plate, and the electromagnetic wave shielding plate is provided in front of a display screen such as a plasma display to perform electromagnetic wave shielding, thereby emitting a strong electromagnetic wave. Can be shielded, and
It does not impair the transparency and prevents the occurrence of moire etc. on the scanning lines of the display. Furthermore, the internal light reflection caused by the light emission of the display body, and the external light due to the external light from the viewing side of the display body An electromagnetic wave shielding plate having an effect of preventing light reflection and exhibiting an image that is more easily recognized by an observer can be manufactured.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a conceptual configuration of an electromagnetic wave shielding plate according to the present invention.

FIG. 2 shows Y _{1 of the} electromagnetic wave shielding plate according to the present invention shown in FIG.
It is a schematic cut sectional view of -Y _1.

FIG. 3 is a schematic plan view showing a conceptual configuration of an electromagnetic wave shielding plate according to another embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view showing a configuration of each material in each step of a first method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 5 is a schematic cross-sectional view showing a configuration of each material in each step of a first method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 6 is a schematic cross-sectional view showing a configuration of each material in each step of a first method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 7 is a schematic cross-sectional view showing a configuration of each material in each step of the first method of manufacturing the electromagnetic wave shielding plate according to the present invention.

FIG. 8 is a schematic cross-sectional view showing a configuration of each material in each step of another method for manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 9 is a schematic cross-sectional view showing the configuration of each material in each step of another method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 10 is a schematic cross-sectional view showing a configuration of each material in each step of another method for manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 11 is a schematic cross-sectional view showing a configuration of each material in each step of another method for manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 12 is a schematic cross-sectional view showing a configuration of each material in each step of another method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 13 is a schematic cross-sectional view showing a configuration of each material in each step of another method of manufacturing an electromagnetic wave shielding plate according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electromagnetic wave shielding plate 1a Electromagnetic wave shielding plate 2 Transparent substrate 3a 1st blackening layer 3b 2nd blackening layer 4 Conductive pattern layer 5 Anti-wear protective film x Horizontal conductive line y Vertical conductive Line P Mesh conductive pattern 11 Conductive substrate 12 Resist pattern 13 Electrodeposited part 14 Electrodeposited substrate 15 Adhesive layer 16 (5) Wear-resistant protective film 31 Conductive substrate 32 (3b) Second black Layer 33 (4) conductive metal layer 34 (3a) first blackening layer 35 etching resist pattern 36 adhesive layer 37 (2) transparent substrate 38 (5) wear-resistant protective film

Claims (5)

[Claims] An electroconductive pattern having an electromagnetic wave shielding property is provided on a transparent substrate, and the electroconductive pattern includes a blackening layer, a conductive pattern layer, and a blackening layer. Characterized in that the electromagnetic wave shielding plate has a configuration in which the layers are sequentially laminated. 2. The electromagnetic wave shielding plate according to claim 1, wherein the conductive pattern layer comprises two or more layers of conductive pattern layers. 3. The electromagnetic wave shielding plate according to claim 1, wherein the conductive pattern layer is made of a metal material. 4. The electromagnetic wave shielding plate according to claim 1, wherein a wear-resistant protective film is provided on the blackening layer. 5. The electromagnetic wave shielding plate according to claim 1, wherein a conductive layer is provided on an outer peripheral end portion on the transparent substrate to form a static elimination terminal portion. .