JPH11121978A - Electromagnetic wave shielding plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent formation of a moire for scanning lines of an indicator by providing a mesh-like conductive pattern on a transparent electromagnetic wave shielding plate surface, and the line pitches of mesh-like conductive lines of this pattern is made different sequentially. SOLUTION: The plate 1 comprises a mesh-like conductive pattern 3 composed of mesh-like vertical conductive lines 4a, 4b, 4c, 4d, 4e with pitches 5a, 5b, 5c, 5d, 5e changed sequentially, and lateral conductive lines 6a, 6b, 6c, 6d, 6e with pitches 7a, 7b, 7c, 7d, 7e made different sequentially on a transparent electromagnetic wave shielding plate 2. This plate shields a powerful electromagnetic wave radiation, and prevents formation of a moire, etc., on scanning lines of a display without losing its transparency.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding plate, and more particularly, to shielding electromagnetic waves generated from a large amount of electromagnetic wave sources such as an electron tube for a display, and generating moire or the like to a scanning line of the display. The present invention relates to an electromagnetic wave shielding plate that prevents the above.

[0002]

2. Description of the Related Art To remove an electromagnetic wave from an electronic device or the like that generates an electromagnetic wave, the outer periphery of the electronic device is usually covered with a suitable conductive member to absorb the electromagnetic wave and convert it into a current. Generally, a method of preventing electromagnetic waves from being emitted to the outside by earthing is used. By the way, an electron tube for display and other devices are installed and used in direct proximity to human beings, and the intensity of electromagnetic wave emission must be within a standard in consideration of adverse effects on the human body. Therefore, it is common to provide an electromagnetic wave shielding plate on the display surface. Thus, in order to perform transparent electromagnetic wave shielding that makes it easy to see through a display screen, a commonly practiced method is to form, for example, an indium-tin oxide film (eg, an indium-tin oxide film) on a transparent glass or plastic substrate surface. A transparent conductive film such as an ITO film is formed into a thin film by vapor deposition or sputtering to produce a transparent electromagnetic wave shielding plate, which is provided in front of a display screen to shield electromagnetic waves. Alternatively, for example, a suitable metal screen such as a wire mesh may be adhered to a transparent glass or plastic substrate surface, or a metal thin film may be entirely formed on the transparent glass or plastic substrate surface by electroless plating or vapor deposition. Then, unnecessary portions of the metal thin film are etched and removed by a photolithography method using a photoresist to form a finer mesh-shaped metal thin film, thereby producing an electromagnetic wave shielding plate. Electromagnetic shielding is provided in front of the display screen.

[0003]

As described above, the basic structure of the electromagnetic wave shielding plate is relatively simple. In the above example, if importance is placed on transparency, the I
Electromagnetic wave shielding plate with TO film is excellent in performance,
In general, the light transmittance is about 90%, which is the brightest, and a uniform film is formed on the entire surface. It has the characteristic of being easy.
However, in the electromagnetic wave shielding plate in which the ITO film is formed on the transparent substrate, since the deposition or the sputtering technique is used to form the ITO film, the manufacturing apparatus is expensive, and the productivity is generally low. Due to the inferiority, there is a problem that the price of the electromagnetic wave shielding plate itself as a product becomes high. In addition, the electromagnetic wave shielding plate in which the ITO film is formed on the transparent substrate is inferior in electroconductivity by one digit or more as compared with the electromagnetic wave shielding plate in which the mesh metal thin film is formed. It is effective for weak objects, but when it is used for strong objects, its shielding function is insufficient, leaked electromagnetic waves are emitted, and it may not be possible to satisfy its standard value There is a problem. For example, using an electromagnetic wave shielding plate in which an ITO film is formed on the above transparent substrate for a plasma display,
In order to completely shield electromagnetic waves, it is necessary to provide conductivity about 10 times that of the current state. Thus, in the electromagnetic wave shielding plate in which the ITO film is formed on the transparent substrate, if the thickness of the ITO film is increased in order to increase the conductivity, the conductivity is improved to some extent. In addition, there is a problem that the performance is remarkably reduced, and further, there is a problem that the price becomes more expensive as the thickness is increased.

Next, in the above-described example, the method of directly attaching a suitable metal screen such as a wire mesh to the display surface is the simplest and cheapest, but is effective. The transmittance of a metal screen of a mesh (100 to 200 mesh) is 50% or less, which has a serious disadvantage that an extremely dark display is obtained. Further, in the above example, a metal thin film is formed on the entire surface of a transparent glass or plastic substrate by electroless plating or vapor deposition, and then unnecessary portions of the metal thin film are etched by a photolithography method using a photoresist. In an electromagnetic wave shielding plate formed by removing and forming a finer mesh-like metal thin film, since it is possible to perform fine processing, it is possible to create a mesh with a high aperture ratio (high transmittance) of fine wires. In addition, since it is a metal wire, it has an advantage that the conductivity is very high as compared with the above-mentioned ITO film and the like, and strong electromagnetic wave emission can be shielded. Thus, in the electromagnetic wave shielding plate formed with the above-mentioned fine mesh-like metal thin film, in general, a mesh-like pattern having a constant pitch width that is orthogonal is effective against electromagnetic waves in the vicinity of a specific wavelength band. However, there is a problem that the electromagnetic wave absorption characteristics in other wavelength bands are deteriorated. That is, in the electromagnetic wave shielding plate on which the fine mesh-like metal thin film is formed,
It is effective to determine the pitch width of the mesh pattern according to the wavelength of the electromagnetic wave. However, in the case of having a wide wavelength band, a mesh pattern having a constant pitch width as in the related art is used. It is difficult to effectively absorb a wide wavelength band. Further, in the electromagnetic wave shielding plate on which the fine mesh-like metal thin film is formed, moire generated when the electromagnetic wave shielding plate is installed on the front surface of a display body for displaying an image in an orthogonal matrix structure is generally about the same as a display body scanning line. When the mesh patterns intersect at 30 degrees, the occurrence of moiré is minimized, but it still causes discomfort to the person, and although it is the minimum moiré, the mesh pattern has a constant spacing. This is due to the fact that they are displayed in a regular array. Therefore, the present invention has a high-performance electromagnetic wave shielding property, further prevents the occurrence of moiré on a scanning line of a display body, for example, an electromagnetic wave shielding plate that can be effectively used for a plasma display or the like, and an inexpensive. Another object of the present invention is to provide a method of manufacturing an electromagnetic wave shielding plate that can be efficiently manufactured at low cost.

[0005]

As a result of various studies to solve the above-mentioned problems, the present inventor has provided a mesh-shaped conductive pattern on a transparent electromagnetic wave shielding substrate surface, An electromagnetic wave shielding plate is formed by sequentially varying the line pitch width of each of the mesh-shaped conductive lines constituting the conductive pattern. Thus, the electromagnetic wave shielding plate is used for a display screen such as a plasma display. The electromagnetic wave shielding provided before was able to shield strong electromagnetic wave emission, without impairing its transparency, and minimized the occurrence of moire etc. on the scanning lines of the display, and observed The inventors have found that an electromagnetic wave shielding plate having an effect of exhibiting a phenomenon that can be more easily recognized by a person can be manufactured, and the present invention has been completed.

That is, according to the present invention, a mesh-shaped conductive pattern is provided on a transparent electromagnetic wave shielding substrate surface.
The present invention relates to an electromagnetic wave shielding plate characterized in that each line pitch width of mesh-shaped conductive lines constituting the conductive pattern is sequentially changed.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in more detail below. An example of the electromagnetic wave shielding plate according to the present invention will be described by way of example with reference to the drawings. FIG. 1 is a schematic plan view showing a conceptual configuration of the electromagnetic wave shielding plate according to the present invention. , FIGS. 3, 4 and 5
And FIG. 6 is a schematic cross-sectional view showing the configuration of each material in each step of the first manufacturing method of the electromagnetic wave shielding plate according to the present invention, and FIG. 7, FIG.
1, FIG. 12, FIG. 13, FIG. 14, FIG. 15 and FIG.
It is a schematic sectional view showing composition of each material in each process of another 2nd manufacturing method about an electromagnetic wave shielding board concerning the present invention.

First, the configuration of the electromagnetic wave shielding plate according to the present invention will be described with reference to an example. As shown in FIG. 1, the electromagnetic wave shielding plate 1 according to the present invention is provided on a transparent electromagnetic wave shielding substrate 2. And a mesh-shaped conductive pattern 3
And the vertical conductive lines 4a, 4b, 4c, 4d, 4e constituting the mesh-shaped conductive pattern 3.
... Each line pitch width 5a, 5b, 5c, 5
d, 5e,... and the horizontal conductive lines 6a, 6
The basic configuration is that the line pitch widths 7a, 7b, 7c, 7d, 7e,... of b, 6c, 6d, 6e,. Although not shown, in the above-described electromagnetic wave shielding plate, for example, a solid conductive layer is formed around the transparent electromagnetic wave shielding substrate so that static electricity can be removed from an arbitrary position. . In particular, in the present invention, as will be described later, since an electrodeposition portion, a metal layer, and the like constituting a mesh-shaped conductive pattern are formed by electrodeposition, plating, or the like, a solid portion is formed around the substrate. An advantage is that the conductive layer can be formed and used as a static elimination terminal portion, to which an earth or the like can be connected to easily eliminate static electricity. Further, in the present invention, a specific static elimination terminal may be formed.

In the above-mentioned electromagnetic wave shielding plate, the transparent electromagnetic wave shielding substrate is a transparent substrate having transparency and functioning as a support for holding a mesh-shaped conductive pattern. Any one can be used. As the transparent substrate, specifically, for example, colorless transparent glass, various similar transparent plastic substrates, various transparent plastic films, or the like can be used. Furthermore, as the above-mentioned transparent plastic substrate or transparent plastic film, specifically, most general-purpose resin materials can be used, and in particular, a film of (meth) acrylic resin or polyester resin or It is preferred to use a sheet. As the thickness of the above transparent substrate,
For a small product such as a character-display tube, it is a thin film of 0.03 mm to 0.5 m with appropriate flexibility.
m is preferable because it can be used by attaching it to a display. On the other hand, when applied to a large display of several tens of inches or more, a stiff flexible film or a rigid substrate, that is, 0.5 to 10 m
m are preferably used. This is because, in the case of a large display, it is necessary to mechanically install the display using an accessory jig or the like. In each case,
Ideally, the transparency of the substrate is 100%,
It is preferable to select one having a transmittance of 80 to 98%.

Next, in the above-mentioned electromagnetic wave shielding plate,
The mesh-shaped conductive pattern is a fine-line mesh made of a material having good conductivity, and is generally a fine-line mesh formed to maintain transparency. It is preferable that the shape is designed in any shape such as a square, a rectangle, and a random strip. In the present invention, since the material constituting the above-mentioned mesh-shaped conductive pattern needs to have good conductivity, various metals can be usually used, and furthermore, the conditions are satisfied. If possible, a compound material such as a metal oxide and others can be used. Thus, as the above-mentioned good conductive material, generally, metal is a preferable material because it is inexpensive and easy to process, and specifically used metal species include: For example, A
u, Ag, Cu, Ni, Cr, Fe, Al, Zn, T
Various simple metals such as i, Ta, Mo, Co, and others, or various alloys can be used.

In the present invention, since the light transmittance of the mesh-shaped conductive pattern needs to be as large as possible, the opening of the mesh-shaped conductive pattern is formed. It is preferable that the portion satisfies the conductive condition and is designed to be large. In the above, in order to increase the aperture ratio, it is necessary to make the mesh-shaped portion of the mesh-shaped conductive pattern relatively thin. It is desirable to reduce the thickness of the characteristic pattern. For example, when the film thickness is a thin layer, it is desirable because it is easy to form a fine line by various processing methods. In the present invention, the film thickness of the mesh-shaped conductive pattern is 0.05 to 4
When the thickness is about 0 μm, a uniform electrodeposited film can be obtained, and from the viewpoint of workability, it is more preferably about 0.5 to 20 μm. The line width of the mesh-shaped conductive pattern is preferably 5 to 60 μm,
When the thickness is about 40 μm, stable production can be performed at low cost, which is more preferable. In the present invention, the aperture ratio of the mesh-like metal electrodeposition layer 3 is more advantageous when it is closer to 100%, but about 65 to 95% is technically practical. Further, in the electromagnetic wave shielding plate according to the present invention, when the electromagnetic wave shielding plate is installed on the front surface of a display for displaying an image in an orthogonal matrix structure, for example, the mesh-shaped conductive pattern causes a scan line of the display to be displayed. In order to prevent the occurrence of moire or the like, each line pitch width of the vertical conductive lines constituting the mesh-shaped conductive pattern and each line pitch width of the horizontal conductive lines are
The conductive patterns are irregular and mesh-shaped, each of which is sequentially different.

Next, a method for manufacturing the electromagnetic wave shielding plate according to the present invention will be described. There are various methods for manufacturing the electromagnetic wave shielding plate. The first method for manufacturing the electromagnetic wave shielding plate is as shown in FIG. A mesh-shaped pattern 12 made of an insulating film that inhibits electrodeposition on a conductive substrate 11 such as a metal plate.
To form an electrodeposited substrate 14 having an electrodeposited portion 13 in which the surface of the conductive substrate 11 is exposed and metal electrodeposition is possible in a mesh shape. In the above, as the insulating film, for example,
It is generally formed by using a known inexpensive water-soluble photoresist such as a dichromate-based or diazo-based photoresist and by an ordinary optical patterning method. Therefore, it is necessary to form an insulating film every time in a stable operation. In the above-mentioned optical patterning method, in order to form the above-mentioned irregular mesh-shaped conductive pattern, the vertical conductive lines constituting the mesh-shaped conductive pattern are formed. Exposure and development using a negative or positive pattern or the like having an irregular pattern based on the basic configuration in which each line pitch width and each line pitch width of the horizontal conductive line are sequentially changed. By performing processing and the like, patterning can be performed. On the other hand, in the case where the selected various commercially available photoresists are applied to the first production method of the present invention, for example,
It can be used several times to about a dozen times. However, since the durability is low, it is preferable to use a stronger resin resist. In the present invention, for example, patterning of the insulating film is preferably performed by using a mechanical cutting method or a burn-out drawing method in a heat mode such as laser processing. Further, in the present invention, although not shown, a groove required by photolithography or cutting is formed on the surface of a metal substrate as a conductive substrate, and then a strong insulating resin is embedded in the groove. By curing, an electrodeposited substrate having an electrodeposited portion capable of metal electrodeposition in a mesh shape can be produced. In this case, since the surface of the electrodeposited substrate is polished, the electrodeposited portion and the insulating portion become flat, so that there is an advantage that the operation for transferring the electrodeposit is easy. Further, in the present invention, although not shown, as another method for producing a highly durable electrodeposited substrate, for example, silicon dioxide (SiO 2)
₂ ) A layer is formed, and then the silicon dioxide layer is photoetched to form an insulating layer, whereby a fine, precise, and highly durable electrodeposited substrate can be manufactured. Alternatively, a single metal plate such as tantalum or titanium, or when the surface is such a metal surface, a resist is formed only at a portion corresponding to a portion constituting an electrodeposited portion, and then anodized to titanium oxide. By forming an insulating oxide layer such as tantalum oxide and then removing the resist, an electrodeposited substrate having extremely high durability and extremely high repetitive use can be manufactured. In this case, the anodic metal oxide layer
It has features such as high hardness, low scratch resistance, and having an insulating film that can sufficiently withstand electrodeposition and pressure bonding.

Next, in the present invention, as shown in FIG. 3, an irregular mesh-like structure composed of an insulating film that inhibits electrodeposition is formed on a conductive substrate 11 such as a metal plate manufactured as described above. An electrodeposited substrate 14 having a pattern 12 is immersed in an electrolytic solution of a metal for shielding electromagnetic waves to form an electrodeposited portion 1 of the electrodeposited substrate 14.
Then, a mesh-shaped conductive pattern 3 having a desired thickness is electrodeposited at a position corresponding to 3. In the above, as the material constituting the mesh-shaped conductive pattern 3, the above-mentioned metal as a good conductive substance can be used as the most advantageous material, and accordingly, the mesh-shaped conductive pattern 3 is used. 3 is
Generally, it can be regarded as a metal electrodeposition layer. In the case of forming the above-mentioned metal electrodeposition layer, a general-purpose metal electrolyte can be used. Therefore, there are various kinds of inexpensive metal electrolytes, and a selection suitable for the purpose can be freely selected. There is an advantage that can be performed. In general, Cu is frequently used as an inexpensive good conductive metal, and in the present invention, it is useful to use Cu in conformity with the purpose thereof. It can be used for. Next, in the present invention, the mesh-shaped conductive pattern 3 does not need to be composed of only a single metal layer.
The mesh-shaped conductive pattern 3 is relatively soft and easily scratched.
A two-layer metal electrodeposition layer can be formed by using a general-purpose hard metal such as r. In this case, assuming a transfer step to be described later, first, a hard metal is electrodeposited to form a protective layer, and then Cu is electrodeposited to form a mesh-shaped conductive pattern.
It is preferable to form a protective layer made of a hard metal on the surface when the electromagnetic wave shielding plate is completed by this electrodeposition order, which has an advantage of increasing safety against external force. Have. Furthermore, when applied to the display surface, if the viewing side surface has metallic luster, the contrast of the displayed image is reduced. If a blackening layer is further provided to prevent this, a display with good contrast can be obtained. For example, a blackened copper layer, a blackened nickel layer or the like can be easily added by a chemical or electrochemically known method. In the present invention, in order to further add or add other characteristics, it is necessary to form a metal electrodeposition layer composed of two or more layers by combining various metals to manufacture an electromagnetic wave shielding plate having various functions. Is possible.

Next, in the first manufacturing method of the present invention, as shown in FIG. 4, a transparent electromagnetic wave shielding substrate 2 is superposed on the mesh-shaped conductive pattern 3 formed above. The two are pressed together and a mesh-shaped conductive pattern 3 is adhesively transferred to the surface of the transparent electromagnetic wave shielding substrate 2. Thereafter, the adhesive-transferred mesh-shaped conductive pattern 3 is provided. By peeling off the transparent electromagnetic wave shielding substrate 2 from the electrodeposited substrate 14, the electromagnetic wave shielding plate 1 having the electromagnetic wave shielding property and the see-through property according to the present invention can be manufactured. At the time of the above adhesive transfer, as shown in the drawing, an adhesive is applied in advance on the surface of the transparent electromagnetic wave shielding substrate 2 to form an adhesive layer 15, and a mesh is formed on the adhesive layer 15 surface. The surfaces of the conductive patterns 3 are overlapped with each other, and the two are press-bonded or thermo-compressed to bond the entire surface of the mesh-shaped conductive pattern 3 to the adhesive layer 15 and then the adhesive-transferred mesh. The transparent electromagnetic wave shielding substrate 2 having the conductive pattern 3 is peeled off from the electrodeposited substrate 14, and the mesh-shaped conductive pattern 3 is adhesively transferred to the surface of the transparent electromagnetic wave shielding substrate 2. The electromagnetic wave shielding plate 1 having the electromagnetic wave shielding property and the see-through property according to the present invention can be manufactured. In the above description, the adhesive constituting the adhesive layer 15 may be an adhesive having an appropriate adhesive strength, an adhesive having a heat seal property, a curable adhesive which is cured by light, an electron beam, heat or the like. And other adhesives. Thus, in the present invention, the use of a curable adhesive after the adhesive transfer is advantageous for producing a stable and reliable product. Further, in the present invention, in order to uniformly bond and transfer the entire surface, a stable and reliable product can be manufactured even when hot-press bonding is performed using a heat-sealing curable heat adhesive. it can. By the way, in the present invention, in order to repeatedly use the electrodeposited substrate 14,
It is necessary to select and use an adhesive having a low adhesive strength to the mesh-shaped pattern 12 made of an insulating film.
Thus, such an adhesive can be easily selected from a variety of commercially available adhesives and used.
This determines the durability of the electrodeposited substrate 14. In the present invention, the conductive substrate 11 such as a metal plate constituting the electrodeposited substrate 14 is selected and used so that the mesh-shaped conductive pattern 3 can be easily separated from the electrodeposited substrate 14. Is preferred. In general, the surface of the stainless steel plate has a weak adhesiveness to the metal electrodeposition layer, and after such electrodeposition, the stainless steel plate surface is commonly used for such a task as peeling off the metal electrodeposition layer. It is preferable to use a stainless steel plate as the metal plate constituting the electrodeposited substrate 14. Further, in the present invention, when a metal plate is used as a material for forming the electrodeposited substrate 14 as described above, a layer of, for example, Cr, Ni, or the like is formed on the surface thereof, so that Can be easily peeled off. This is because the metal surface is oxidized to form an oxide, and the surface portion of the Cr and Ni components, which also incorporates the releasability of stainless steel, is oxidized. In the present invention, after the mesh-shaped conductive pattern 3 is entirely adhered to the adhesive layer 15 as described above, the transparent electromagnetic wave shielding substrate having the mesh-shaped conductive pattern 3 transferred and bonded thereto. 2 is peeled off from the electrodeposited substrate 14, and the mesh-shaped conductive pattern 3 as shown in FIG. 1 is adhesively transferred to the surface of the transparent electromagnetic wave shielding substrate 2 according to the present invention. The electromagnetic wave shielding plate 1 having the property can be manufactured.

Next, in the first manufacturing method according to the present invention, an example of another electrodeposited substrate different from the above-described electrodeposited substrate 14 will be described. As shown in FIG. 5, the electrodeposited substrate 14 'can be formed by forming a mesh-shaped conductive layer 22 on the surface of a support 21 made of an insulating material. Thus,
As shown in FIG. 6, in the electrodeposited substrate 14 'as described above, as described above, the electrodeposited substrate 14' is immersed in a metal electrolytic solution to form a mesh-shaped electrode on the electrodeposited substrate 14 '. A mesh-shaped conductive pattern 3 is electrodeposited to a desired thickness on the conductive layer 22. Thereafter, although not shown, a transparent electromagnetic wave shielding is provided on the surface of the mesh-shaped conductive pattern 3. The mesh-shaped conductive pattern 3 is adhesively transferred to the surface of the transparent electromagnetic wave shielding substrate 2 by pressing the substrates 2 on each other and pressing them together.
According to the present invention, it is possible to produce an electromagnetic wave shielding plate having electromagnetic wave shielding properties and transparency. In the above, as a method for forming the mesh-shaped conductive layer 22, for example, a metal layer is formed on the entire surface of the support 21 made of an insulating material by vapor deposition, sputtering, or electroless plating. Next, the mesh-shaped conductive layer 22 can be formed by etching and removing the metal layer using a normal photolithography method or the like. The material constituting the mesh-shaped conductive layer 22 formed as described above is usually Ni, since the adhesiveness to the mesh-shaped conductive pattern 3 must be weak as described above. It is preferable to use a material having good releasability from the metal electrodeposition layer, such as Cr, Cr, or the like. Furthermore, in the present invention, the support made of an insulating material such as glass or ceramic is made of Ni, C formed on its surface.
r and other metal layers have strong adhesiveness, but in the case of a plastic substrate or the like, the adhesiveness is weak. Therefore, in the case of a plastic substrate or the like, a metal layer of Ni, Cr, or the like is formed on the surface of the plastic substrate after a metal layer having high adhesiveness is formed on the surface of the electrodeposited substrate 14 '. It is possible to produce an electrodeposited substrate having repeatability, durability and the like. In such a case, a mesh-shaped conductive layer composed of multiple metal layers is formed on a support made of an insulating material. Furthermore, in the above description, generally, the metal electrodeposition layer grows in the thickness direction and also grows in the lateral direction, so that the line width of the metal electrodeposition layer becomes slightly thicker. Therefore, it is preferable that the design line width of the mesh-shaped conductive layer 22 is formed in advance to a value that allows for the thickness.

As is clear from the above description, the basic concept of the first manufacturing method of the present invention is a method utilizing an electrochemical plating (electrodeposition) method, and the basic steps can be roughly divided into two. it can. The first is the production of an electrodeposited substrate, in which a mesh-shaped irregular pattern is formed on the substrate based on the use of the product, and the same substrate can be used repeatedly for the electrodeposition operation. is there. Part 2 is to selectively electrodeposit any material in accordance with the mesh pattern of the electrodeposited substrate,
Next, the electrodeposit is transferred to a transparent substrate surface, and the transferred substrate is commercialized as an electromagnetic wave shielding plate. Thus, in the above, the electrodeposited substrate, like a printing plate in printing, is one that can be used many times, and its production cost is sufficiently high in productivity even if it is relatively expensive.
It can be used, and can be accurately manufactured, generally by a photolithography method or the like, so as to give a fine and high aperture ratio. Electrodeposition is performed by forming a mesh-shaped conductive pattern on the surface of the electrodeposited substrate. In this case, a single layer or a multilayer of different materials can be used. In addition, it is also possible to form a fine line. Thus, the metal electrodeposition layer is transferred to a transparent substrate surface, and the transfer substrate is used as an electromagnetic wave shielding plate.

Next, a second method of manufacturing the electromagnetic wave shielding plate according to the present invention will be described.
Can be exemplified by a photo-etching method. Thus, the above photo-etching method includes:
Basically, there are two production methods, direct method and transfer method,
First, the direct method will be described. As shown in FIG.
A member having a metal layer 32 formed on a transparent substrate 31 is prepared. In the above, the transparent substrate 31 is generally
An electrically insulating material such as glass, plastic plate or film can be used. In the above description, as the metal layer 32, usually, a metal thin film layer is formed on the entire surface by an evaporation method, an electroless plating method, or the like, and then the metal layer is conveniently formed by performing an electrolytic plating or the like to a predetermined thickness. It can be formed easily and inexpensively. next,
In the present invention, as shown in FIG. 8, an etching resist pattern 33 is formed on the metal layer 32 formed above. In the above, the etching resist pattern 33 can be formed by a method using a photoresist, a method using a precision printing method, or the like. Thus, in the present invention, in the method using the photoresist, as described above, in order to form an irregular mesh-shaped conductive pattern, the mesh-shaped conductive pattern is formed. Negative or positive patterns having an irregular pattern whose basic structure is that the line pitch width of each vertical conductive line and the line pitch width of each horizontal conductive line are sequentially different. By performing exposure, development processing, and the like, and performing patterning, an irregular etching resist pattern 33 can be formed. Next, in the present invention, using the irregular etching resist pattern 33 formed above, the bare metal layer 3 is exposed.
In the case where the metal layer 32 is formed of, for example, copper, nickel, or the like, the portion 2 is subjected to chemical etching using an etching solution such as a ferric chloride solution, and the above-mentioned bare portion is exposed. By removing the portion of the metal layer 32, an irregular mesh-shaped conductive pattern composed of the remaining metal layer 32 'is formed, and the electromagnetic shielding plate according to the present invention can be manufactured. Things. Thus, in the present invention, as shown in FIG.
A protective film 34 for protecting the surface is formed by applying a resin composition containing, for example, a transparent hard acrylic resin to the entire surface including the irregular mesh-shaped conductive pattern of 2 '. Thus, the electromagnetic shielding plate according to the present invention can be provided. In the above-described electromagnetic shielding plate according to the present invention, the etching resist pattern 33 includes:
It may be removed, but generally it is not necessary to remove it,
Rather, it has the advantage that the metallic luster on the surface can be eliminated by mixing a black material such as carbon black in advance into the film and forming a black protective layer. Have In the present invention, if the etching resist pattern 33 must be removed, the surface of the metal layer remaining after removing the etching resist pattern 33 is removed for the same purpose as described above. It is desirable that the surface of the film be blackened. The above blackening treatment is performed by using a known blackening treatment method such as a plating method of black copper (Cu) or black nickel (Ni) or a chemical blackening method. be able to.

Next, in the present invention, a transfer method according to the above-described photo-etching method will be described. As shown in FIG. 11, a conductive substrate 41 capable of electrodepositing a metal is used.
A metal film 4 is uniformly formed on the conductive substrate 41 by an electrodeposition method.
2 is formed to a required thickness, and then, as shown in FIGS.
After the formation of the metal layer 43, the exposed metal layer 42 is chemically etched to form
Is removed, the remaining metal layer 4 is removed.
An irregular mesh-shaped conductive pattern of 2 'is formed. Next, an adhesive having poor adhesiveness to the conductive substrate 41 is used on the entire surface including the irregular mesh-shaped conductive pattern composed of the metal layer 42 'formed above.
Alternatively, when an adhesive having no such characteristics is used, the above-mentioned etched portion is plated again with thin copper or the like, and then the adhesive is applied to form an adhesive layer 44. Thereafter, FIG.
As shown in FIG. 3, the transparent substrate 4
5 on the transparent substrate 45 so that the adhesive layer 41
An electromagnetic shielding plate according to the present invention can be manufactured by closely transferring an irregular mesh-shaped conductive pattern formed of a metal layer 42 'through the contact. Further, in the present invention, as shown in FIG. 16, the entire surface including the irregular mesh-shaped conductive pattern composed of the metal layer 32 'formed as described above, for example, a transparent hard By applying a resin composition containing an acrylic resin, a protective film 46 for protecting the surface thereof can be formed, and the electromagnetic shielding plate according to the present invention can be formed. In the above-described electromagnetic shielding plate according to the present invention, the etching resist pattern 43 may be removed or may be left in the same manner as described above, and the etching resist pattern 43 may be removed. It is desirable that after removing the etching resist pattern 43, the surface of the remaining metal layer be blackened. The above blackening treatment is performed by using a known blackening treatment method such as a plating method of black copper (Cu) or black nickel (Ni) or a chemical blackening method. be able to. In the above, as the conductive substrate 41, generally, a stainless steel plate having good releasability of electrodeposited metal can be used. Also,
In the above, the metal layer 42 is etched with an etching resist pattern.
The etching can be performed in the same manner as described above when using the stainless steel plate 43 as a mask. However, when a ferric chloride solution or the like is used, the surface of the stainless steel plate is also etched. If you use
You need to be careful. No effect is observed on the peeling transfer of the metal layer 42 '. In the present invention,
When the metal layer 42 is made of copper (Cu) or the like, if a cupric sulfate solution or the like is used, the stainless steel plate is not affected and copper (C) is used.
Only u) can be etched. That is, in the present invention, since only the metal layer 42 can be etched, if an etching solution is selected, it is convenient for the subsequent operation. In the above description, the etching resist pattern 43 can be formed by a method using a photoresist, a method using a precision printing method, or the like, as described above. Thus, in the present invention, in the method using the photoresist, as described above, in order to form an irregular mesh-shaped conductive pattern, the mesh-shaped conductive pattern is formed. Negative or positive patterns having an irregular pattern whose basic structure is that the line pitch width of each vertical conductive line and the line pitch width of each horizontal conductive line are sequentially different. By performing exposure, development processing, and the like using the above-described method and patterning, an irregular etching resist pattern 43 can be formed. Further, in the present invention, a transfer type electromagnetic wave shielding plate can be manufactured by subjecting the surface of the metal layer 42 ′ to blackening treatment after being closely transferred to the transparent substrate 45 and further forming a protective film 46.

Next, in the present invention, in the electromagnetic wave shielding plate according to the present invention manufactured by the above-described manufacturing method,
A transparent protective film can be formed on the surface of the mesh-shaped conductive pattern to protect it. For example, one or more resins having surface protection suitability as a main component, and if necessary, for example, a plasticizer, a stabilizer, an antioxidant, an ultraviolet absorber, an infrared absorber of a specific wavelength, charging Additives such as an inhibitor, a lubricant, a filler, and the like are optionally added, and the mixture is sufficiently kneaded with a solvent or a diluent to prepare a coating solution. Then, the coating solution is, for example, roll-coated.
Coating, gravure coating, die coating, dip coating, knife coating, reverse roll coating, spray coating,
The transparent protective film can be formed by coating or printing by other coating methods. In the above, the thickness of the transparent protective film is preferably about 1 to 50 μm,
More preferably, it is about 3 to 20 μm. Examples of the resin having the surface protection suitability include, for example, a polyester resin, a polyamide resin, a polyimide resin, an epoxy resin, a (meth) acrylic resin, a polyurethane resin,
Phenol resins, aminoplast resins, and others can be used.

[0020]

Next, the present invention will be described in more detail with reference to specific examples. Example 1 After cleaning the surface of a stainless steel plate having a thickness of 0.15 mm, a commercially available negative photoresist (manufactured by Tokyo Ohka Co., Ltd.,
A product name, KOR) is applied and dried, and then, an irregular mesh-like mesh pattern (100 mesh, electrodeposition line width, 28 μm) prepared in advance is contact-exposed, and then developed and dried as specified. Thus, an electrodeposited substrate was produced (see FIG. 4). Next, the electrodeposited substrate was placed in a copper plating bath, and copper was electrodeposited on a resist-free portion of the electrodeposited substrate under the following conditions using the electrodeposited substrate as a cathode and a copper plate as an anode. (Electrodeposition conditions) bath composition: copper pyrophosphate bath _{Cu 2 P 2 O 7 · 3H} 2 O 49g / l K 4 P 2 O 7 340g / l MH 4 OH (28%) 3ml / l pH 8.8 P ratio (P ₂ O ₇ ⁴⁻ / Cu ²⁺ ) 7.0 Liquid temperature 55 ° C. Electrodeposition rate (5 A / dm) 1.0 μm / min Electrodeposited film thickness 3.0 μm / min Finished line width 30.0 μm (some Next, in order to transfer the above electrodeposit to a transparent substrate, a photocurable adhesive was uniformly applied to a surface of a transparent acrylic substrate having a thickness of 5 mm to a thickness of about 1 μm in advance. . The above-mentioned photocurable adhesive contains acrylate monomer and a photopolymerization initiator as main components.
Ethylhexyl acrylate or 1.4-butanediol acrylate was used, and benzoyl peroxide was used as a photopolymerization initiator. Next, after the electrodeposited substrate and the acrylic substrate coated with the photocurable adhesive were uniformly pressed, ultraviolet rays were irradiated from the acrylic substrate side. In this case, the adhesion with the electrodeposited copper is good, but the adhesion with the insulating resist is weak, so if the stainless steel electrodeposited substrate is slowly peeled off, all the electrodeposited copper is transferred to the transparent substrate side. The resist did not peel off but remained on the stainless steel plate side. On the transfer surface of the transparent acrylic plate to which the electrodeposited copper has been transferred, a transparent acrylic resin protective film is removed from the surrounding frame-shaped copper part.
An electromagnetic wave shielding substrate was formed on the entire surface except for the lead-out portion to obtain a good electromagnetic wave shielding effect. The electrodeposited substrate peeled as described above could be used again for copper electrodeposition. The number of times of repeated use was several times because the end of the resist image was easily broken.

Example 2 A thin film of silicon dioxide was formed to a thickness of 0.2 μm on the entire surface of one side of a stainless steel plate having a thickness of 0.15 mm as in Example 1 by a sputtering method to form an insulating film. Then
In the same manner as in the first embodiment, after forming a photoresist film, exposure and development are performed to form an irregular mesh-shaped pattern, and then silicon dioxide is etched by a conventional method (hydrofluoric acid-based etching). After that, the resist was removed to form an irregular mesh pattern using silicon dioxide as an insulating film. The line width of the obtained mesh pattern was 27 μm. Next, Ni was thinly (1 μm) electrodeposited under the following electrodeposition conditions, washed with water, and then continuously subjected to copper electrodeposition in the same manner as in Example 1 described above.
Two-layer electrodeposition was performed to a thickness of 3 μm. The line width of the obtained electrodeposited film was 31 μm. (Ni electrodeposition conditions) Ni electrodeposition bath composition: nickel sulfate 240-340 g / l nickel chloride 45 g / l sulfuric acid 30-38 g / l pH 2.2-5.5 temperature 46-70 ° C current density 2.5-10 A Using a 0.2 mm-thick polyester film as a transparent substrate for / cm ² transfer, the two-layer electrodeposit was transferred by compression in the same manner as in Example 1 above. The transferred electrodeposit was practical, with Ni being on the outside and protecting the vulnerable Cu. Further, a transparent protective film was formed in the same manner as in Example 1 to improve the safety. The electromagnetic shielding wave was exactly the same as that of Example 1 above. Further, the electrodeposited substrate having the silicon dioxide pattern has a high repetition performance and a durability of several tens to 100 times or more.

Example 3 A glass plate having a thickness of 3 mm was cleaned, and a Cr thin film having a thickness of 0.2 μm was formed on one surface of the glass plate by vapor deposition, and mesh processing was performed in the same manner as in Example 2 above. This was performed using a photoetching method to prepare an electrodeposited substrate. Next, the electrodeposited substrate was placed in the Ni electrodeposition bath of Example 2 described above, the Cr mesh pattern region was used as a cathode, and the Ni plate was used as an anode.
Ni electrodeposition was performed to a thickness of μm, followed by washing with water, followed by Cu electrodeposition of 2 μm in the Cu electrodeposition bath of Example 1 described above.
Further, subsequently, an electrodepositable organic adhesive having the following composition was electrodeposited to complete the structure of Cr / Cu / Cr / electrodepositable organic adhesive. (Electrodepositable organic adhesive) N-dimethylaminoethyl acrylate 115 parts 2-hydroxyethyl mechacrylate 150 parts n-butyl acrylate 400 parts Methyl methacrylate 150 parts n-butyl methacrylate 185 parts Azobisisobutyro Nitrile 50 parts The above components were reacted to obtain a stock solution. The above undiluted solution 100
From 0 parts, 120 parts of block isocyanate, 20 parts of dibutyltin diurarate, and 12,000 parts of water, a cationic adhesive electrodeposition solution having a solid content of 5% was prepared. Next, after a transparent polyester film having a thickness of 0.2 mm is overlaid and carefully pressed, when the polyester film is thinned from the glass substrate, it is peeled off from the Cr / Ni interface, and the glass substrate surface has
The mesh pattern remained as it was, and the layer of Ni / Cu / electrodepositable organic adhesive was completely transferred to the polyester film side. The line width of the obtained electrodeposited metal mesh pattern is
At 31 to 32 μm, it was almost the same as in Example 2 above. A protective film made of an acrylic resin was applied to a thickness of 20 μm on the entire surface of the obtained metal mesh forming film except for the electrode connection portions to obtain an electromagnetic wave shielding plate. The electromagnetic wave shielding effect of the above electromagnetic wave shielding plate was as good as in Example 1 described above. Further, it was found that the Cr mesh glass substrate was strong, and the number of repeated use as the electrodeposited substrate was 100 times or more.

Embodiment 4 Although the above-described embodiment 3 shows a method for producing a planar electromagnetic wave shielding plate, this example shows an example of a continuous production method. A roll cylinder made of Al metal having a diameter of 250 mm was prepared as an electrodeposited substrate, the surface of which was anodized to form a non-porous alumite (aluminum oxide) layer having a thickness of 20 μm. A 2 μm Cr thin film layer was formed by a sputtering method. Next, a conventional photoresist is applied, and a mesh base plate having an irregular pattern made of a flexible polyester film is wrapped with good adhesion, exposed to ultraviolet rays, developed and dried in a usual manner, and then subjected to a second drying process.
The Cr layer was carefully etched with an iron solution. The alumite layer was also slightly etched but in a negligible range. After washing and drying, the resist was removed to obtain an electrodeposited cylinder.
Next, the electrodeposited cylinder was subjected to electrodeposition to a desired thickness by sequentially using the Ni bath and the Cr bath of the above embodiment. Needless to say, an electrodeposition line was provided between each of the electrodeposition baths and after the Cu bath, provided with a water washing layer for cleaning, and further provided with a drying unit continuously. After the electrodeposition cylinder is dried, the electrodeposition cylinder is rolled while being thermocompression-bonded to the surface of a polyester film applied with a heat-sensitive adhesive to a thickness of about 20 μm which is unwound from a long roll of film. / Cu electrodeposited layer was transferred. By this method, many units of metal mesh are formed on the long winding film surface. Finally, a protective film made of acrylic resin is applied to the continuous metal mesh film surface, and an electromagnetic wave shielding plate (film) is continuously produced. did. When used, each unit mesh was cut into one electromagnetic wave shielding plate (film).

Example 5 A stainless steel conductive substrate having a thickness of 0.15 mm of the previous example was used, and the copper film was electrodeposited to a thickness of 10 μm in the same manner as in the previous example using the copper pyrophosphate bath of the previous example. did. Then
The electrodeposited copper film surface is exposed and developed with an irregular pattern using the photoresist of the previous example to form an etching resist, and then carefully using a ferric chloride solution so as not to etch the stainless steel surface carefully. The film was etched.
It should be noted that a fine car
Bonblack powder was previously mixed so that the reflection density at the time of application was 2.0. Therefore, although the photoresist sensitivity was lowered, pattern exposure and development were possible by applying an exposure several times that when no photoresist was mixed.
Next, using the same copper electrodeposition bath as above, after performing copper electrodeposition on the stainless steel portion exposed by etching to a thickness of 1 to 2 μm, the photocurable adhesive of the preceding example was applied to a thickness of 20 μm. Apply, then press the transparent acrylic plate surface of 5 mm thickness to the adhesive layer surface, cure and bond while irradiating ultraviolet rays, and then slowly peel off both to transfer the copper film to the acrylic plate surface did. Next, the entire surface of the above-mentioned transcript is covered with a copper film, but when the entire surface is uniformly and thinly etched using a dilute ferric chloride solution, the copper film deposited secondarily is removed. Irregular mesh eyes appeared beautifully. In the above, since the copper film formed by the primary electrodeposition is also etched at the same time, its thickness is reduced.
Was observed to decrease in film thickness. Next, after sufficient drying, the photocurable resin composition was applied again to a thickness of 20 μm and cured to form a surface protective film, thereby producing an electromagnetic wave shielding plate according to the present invention.

Example 6 After degreasing and cleaning the surface of a transparent acrylic substrate having a thickness of 5 mm, electroless copper plating was performed to a thickness of about 0.5 μm to form a conductive thin film. Copper electrodeposition was performed using a copper bath so that the total thickness of the copper film was 6 μm. Next, using the blackened photoresist of the previous example, the irregular mesh pattern was exposed and developed, and then the exposed copper film portion was etched with a ferric chloride solution. A photocurable adhesive was applied to a thickness of about 20 μm, and a 10 μm polyester film was uniformly adhered thereon to produce an electromagnetic wave shielding plate according to the present invention as a surface protective film. As a result of applying the polyester film side of the electromagnetic wave shielding plate manufactured above to the screen surface of the plasma display with the visual side as the visual side, it was confirmed that the electromagnetic wave shielding plate functions as an electromagnetic wave shielding plate with no metallic luster and in which moiré is inconspicuous. . The above electroless copper plating formulation was as follows. [Formation of electroless copper plating] Copper sulfate 3.5 g / l Rochelle salt 34.0 g / l sodium carbonate 3.0 g / l sodium hydroxide 7.0 g / l formalin (37%) 13.0 ml / l temperature room temperature

[0026]

As is apparent from the above description, the present invention provides a mesh-shaped conductive pattern on a transparent electromagnetic wave shielding substrate surface, and further comprises a mesh forming the conductive pattern. An electromagnetic wave shielding plate is formed by sequentially varying the line pitch width of the conductive lines in a shape, and the electromagnetic wave shielding plate is provided in front of a display screen such as a plasma display to perform electromagnetic wave shielding. , Which can shield strong electromagnetic wave emission, and does not impair the transparency of the display, and also prevents the occurrence of moire etc. on the scanning lines of the display, manifesting a phenomenon that is more easily recognized by the observer. This makes it possible to manufacture an electromagnetic wave shielding plate having an advantageous effect. Further, since the electromagnetic wave shielding plate according to the present invention is a transparent rigid support or a product of a flexible film support, it can be arbitrarily adapted according to the shape of a display serving as an electromagnetic wave generation source. .

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a conceptual configuration of an electromagnetic wave shielding plate according to the present invention.

FIG. 2 is a schematic cross-sectional view showing a configuration of each material in each step of a first method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 3 is a schematic cross-sectional view showing a configuration of each material in each step of a first method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 4 is a schematic cross-sectional view showing a configuration of each material in each step of a first method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 5 is a schematic cross-sectional view showing a configuration of each material in each step of a first method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 6 is a schematic cross-sectional view showing a configuration of each material in each step of a first method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 7 is a schematic cross-sectional view showing a configuration of each material in each step of a second method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 8 is a schematic cross-sectional view showing a configuration of each material in each step of a second method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 9 is a schematic cross-sectional view showing a configuration of each material in each step of a second method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 10 is a schematic cross-sectional view showing a configuration of each material in each step of a second method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 11 is a schematic cross-sectional view showing a configuration of each material in each step of a second method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 12 is a schematic cross-sectional view showing a configuration of each material in each step of a second method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 13 is a schematic cross-sectional view showing a configuration of each material in each step of a second method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 14 is a schematic cross-sectional view showing a configuration of each material in each step of a second method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 15 is a schematic cross-sectional view showing a configuration of each material in each step of a second method of manufacturing an electromagnetic wave shielding plate according to the present invention.

FIG. 16 is a schematic cross-sectional view showing the configuration of each material in each step of the second method of manufacturing the electromagnetic wave shielding plate according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electromagnetic wave shielding plate 2 transparent electromagnetic wave shielding substrate 3 mesh-shaped conductive pattern 4a conductive line 5a line pitch width 6a conductive line 7a line pitch width 11 conductive substrate 12 mesh-shaped pattern 13 electrodeposition Part 14 Electroplated substrate 14 'Electroplated substrate 15 Adhesive layer 21 Support made of insulating material 22 Mesh-shaped conductive layer 31 Transparent substrate 32 Metal layer 32' Metal layer 33 Etching resist pattern 34 Protective film 41 Conductive Functional substrate 42 Metal film 42 'Metal layer 43 Etching resist pattern 44 Adhesive layer 45 Transparent substrate 46 Protective film

Claims (6)

[Claims] 1. A mesh-shaped conductive pattern is provided on a transparent electromagnetic wave shielding substrate surface, and each line pitch width of the mesh-shaped conductive lines constituting the conductive pattern is sequentially reduced. An electromagnetic wave shielding plate characterized by being different. 2. A mesh-shaped conductive pattern is electrodeposited on a metal-deposited substrate capable of metal electrodeposition using a metal electrolyte, and further bonded via an adhesive. 2. The electromagnetic wave shielding plate according to claim 1, comprising a mesh-like metal electrodeposited layer having a transferred electromagnetic wave shielding property and a see-through property. 3. An electromagnetic wave shield obtained by electrodepositing a mesh-shaped conductive pattern on an electrodeposited substrate on which metal can be electrodeposited, using a metal electrolyte, and further etching the mesh. 2. The electromagnetic wave shielding plate according to claim 1, wherein the electromagnetic wave shielding plate is made of a mesh-like metal electrodeposition layer having transparency and transparency. 4. The electromagnetic wave shielding plate according to claim 1, wherein a transparent protective film is further provided on the mesh-shaped conductive pattern. 5. The mesh-shaped conductive pattern comprises a mesh-like metal electrodeposition layer electrodeposited in two or more layers which are sequentially electrodeposited by using two or more kinds of metal electrolytes. The electromagnetic wave shielding plate according to claim 1, 2, 3, or 4, wherein: 6. The electromagnetic wave shielding plate according to claim 1, wherein a conductive layer is provided on an outer peripheral end of the transparent substrate to form a static elimination terminal. .