JPH11251365A5 - - Google Patents
Info
- Publication number
- JPH11251365A5 JPH11251365A5 JP1998047113A JP4711398A JPH11251365A5 JP H11251365 A5 JPH11251365 A5 JP H11251365A5 JP 1998047113 A JP1998047113 A JP 1998047113A JP 4711398 A JP4711398 A JP 4711398A JP H11251365 A5 JPH11251365 A5 JP H11251365A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- protruding
- manufacturing
- protruding electrode
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4711398A JP3780688B2 (ja) | 1998-02-27 | 1998-02-27 | Ｃｓｐ用基板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4711398A JP3780688B2 (ja) | 1998-02-27 | 1998-02-27 | Ｃｓｐ用基板の製造法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006013969A Division JP2006165592A (ja) | 2006-01-23 | 2006-01-23 | エッチングバンプ群を有する部材の製造法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11251365A JPH11251365A (ja) | 1999-09-17 |
| JPH11251365A5 true JPH11251365A5 (enrdf_load_html_response) | 2005-07-14 |
| JP3780688B2 JP3780688B2 (ja) | 2006-05-31 |
Family
ID=12766133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4711398A Expired - Fee Related JP3780688B2 (ja) | 1998-02-27 | 1998-02-27 | Ｃｓｐ用基板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3780688B2 (enrdf_load_html_response) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW512467B (en) * | 1999-10-12 | 2002-12-01 | North Kk | Wiring circuit substrate and manufacturing method therefor |
| KR100973287B1 (ko) | 2003-07-18 | 2010-07-30 | 삼성테크윈 주식회사 | 범프들이 형성되는 반도체 패키지용 기판, 이 반도체패키지용 기판에 의하여 형성된 반도체 패키지, 및 이반도체 패키지의 제조 방법 |
| JP4105202B2 (ja) | 2006-09-26 | 2008-06-25 | 新光電気工業株式会社 | 半導体装置の製造方法 |
| JP5152601B2 (ja) * | 2010-06-01 | 2013-02-27 | 日立化成工業株式会社 | 薄板状物品を用いた接続基板の製造方法と多層配線板の製造方法 |
| US9365947B2 (en) | 2013-10-04 | 2016-06-14 | Invensas Corporation | Method for preparing low cost substrates |
-
1998
- 1998-02-27 JP JP4711398A patent/JP3780688B2/ja not_active Expired - Fee Related
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