JPH11237441A - Semiconductor integrated circuit device, its manufacture, and its inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device for electrically, efficiently, and accurately inspecting the open-circuiting of a power supply terminal or the ground of a grounding terminal in a semiconductor integrated circuit device such as an LSI mainly using a flip-chip system. SOLUTION: An inspection judgment means 7 for electrically detecting each connection state between a plurality of wiring terminal parts 2 that are provided at a semiconductor integrated circuit device 1 and other terminal junction parts 6-1 to 6-3 that are provided opposite to each of the wiring terminal parts 2 and for discriminating whether each connection state of the wiring terminal parts 2 is normal or not is built into the semiconductor integrated circuit device 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device, a method for manufacturing a semiconductor integrated circuit device, and an inspection method for inspecting a connection failure of a wiring terminal portion in the semiconductor integrated circuit device.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor integrated circuit device such as an LSI, after the semiconductor integrated circuit device is manufactured, it is determined whether or not a wiring state in the semiconductor integrated circuit device is correctly connected. After the completion of the semiconductor integrated circuit device such as the LSI, it is necessary to externally observe the connection state between the wiring terminal portion in the internal wiring circuit and other wiring terminals connected thereto. Therefore, it is difficult to easily detect the connection failure.

In the semiconductor integrated circuit device, even if there is a poor connection at a part of the wiring connection of the power supply terminal or the ground terminal (GND), the power supply terminal or the grounding terminal (GND) is connected to another power supply terminal through a power supply wiring path inside the circuit. Since the current is supplied, the circuit operates, but a so-called electromigration that a current larger than a design value flows in a wiring portion designed with a predetermined width is generated, and the semiconductor integrated circuit is operated. This has made it impossible to use the device for a long period of time and has caused noise.

Further, with respect to signal terminals in the semiconductor integrated circuit device, a predetermined signal is input to a predetermined signal input terminal and an output signal at an output terminal is detected, thereby electrically connecting the signal terminal. A connection failure can be detected, but there has been no method for electrically detecting the connection failure of a power supply terminal or a ground terminal. For this reason, conventionally, a method of peeling off the sealing resin of the completed semiconductor integrated circuit device or shaving off the molding resin and optically observing the inside is used.
It was not efficient and was dangerous work, and had the disadvantage of destroying circuit wiring.

That is, in a semiconductor integrated circuit device such as an LSI formed by a flip chip method generally used at present, it is electrically tested whether all the power supply terminals or GND terminals are connected. Even if the power supply terminal or the GND terminal is not connected at all, the chip which is a semiconductor integrated circuit device such as the LSI operates tentatively, and a reliability problem occurs. come.

FIG. 3 shows an example of the structure of a semiconductor integrated circuit device generally used in the prior art. A chip 32 having pads 31 only in the peripheral portion is packaged in a package 3.
3 shows a cross-sectional view when mounted. In FIG. 3, the pad portion 31 of the chip 32 is
2 shows an example in which the terminal is connected to the terminal unit 35 of the package 33 through the terminal.

In a conventional chip in which pads are arranged only in the peripheral portion, when testing the chip in a wafer or assembling the chip into a package, a connection test of signal pins is performed by an electrical test using a tester or the like. The connection test of the terminal pin or the GND terminal pin can be performed by an optical method based on appearance inspection. However, as shown in FIG. 2, in a flip chip 3 in which a large number of solder bumps 2 are arranged via pads in a chip 1, the entire chip surface is covered with a probe card or package from above during a wafer test or package assembly. Therefore, it is impossible to optically test whether all the power supply terminals or the GND terminals are correctly connected.

Further, in the flip chip 3 as shown in FIG. 2, the power supply terminal or the GND terminal is not always located at the periphery of the chip, and may be located at the center of the chip. Because of the large number, the conventional method has a problem that the inspection method becomes more complicated.
In the chip, all power supply terminals or GN
Even when the D terminal is not connected correctly, the chip operates by supplying current from another power supply terminal. However, as described above, current flows from a path different from the current path assumed in the design. Since they are supplied, problems such as a noise problem and a decrease in reliability in long-term use also occur.

In addition, Japanese Patent Application Laid-Open No. 61-161742 describes a method of detecting a wiring connection failure in a semiconductor integrated circuit device. In the case where the dummy bump portion is provided and the wiring connection is defective, the wiring portion is connected to the dummy bump portion so that the potential of the dummy bump portion is constantly measured, so that the wiring can be performed. Although the connection is determined to be good or bad, a description is given of a semiconductor integrated circuit device in which a circuit for detecting the connection state of a wiring terminal portion is embedded in a semiconductor integrated circuit device substrate such as an LSI. can not see.

Japanese Patent Application Laid-Open No. 9-264918 discloses that
This merely shows a method of detecting a wiring connection failure using a conventionally used probe, and a semiconductor in which a circuit for detecting and detecting a connection state of a wiring terminal portion is embedded in a semiconductor device without using a probe. No description is found for the integrated circuit device.

[0011]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to improve the above-mentioned disadvantages of the prior art, and to provide a power supply terminal or a ground terminal in a semiconductor integrated circuit device such as an LSI mainly using a flip chip method. An object of the present invention is to provide a semiconductor integrated circuit device capable of performing an open test of GND electrically and efficiently as well as accurately. Further, in the present invention, a power supply terminal or a power supply terminal is provided inside the semiconductor integrated circuit device. Provided is a semiconductor integrated circuit device formed by embedding a test determination circuit for detecting a connection state at a ground terminal and determining whether the connection state is normal or abnormal inside a semiconductor integrated circuit device, particularly, a substrate. Things.

[0012]

In order to achieve the above-mentioned object, the present invention employs the following basic technical structure. That is, as a first aspect according to the present invention, a plurality of wiring terminal portions provided in a semiconductor integrated circuit device and another terminal joint portion provided opposite to each of the wiring terminal portions are provided. A semiconductor integrated circuit device having a built-in inspection determination means for electrically detecting each connection state in the semiconductor integrated circuit device and determining whether each connection state of the wiring terminal portion is normal or abnormal. In a second aspect of the present invention,
Switch means are individually arranged at portions corresponding to lower portions of the plurality of wiring terminals in the semiconductor circuit, and one end of each switch is connected to the wiring terminal and the other of the switches is connected. Is connected to a predetermined constant current source, a voltage between two adjacent wiring terminals is detected, and a comparing means for comparing the voltage with a predetermined reference voltage value is arbitrarily selected. Are disposed corresponding to each of two adjacent wiring terminal portions.
Judgment for judging the connection state of the wiring terminal to be inspected from the comparison result of the control means for controlling the switching operation of the switch means and the comparison means arranged between the two arbitrarily selected adjacent wiring terminal parts. Means for manufacturing the semiconductor integrated circuit device, wherein the means are arranged inside the semiconductor circuit.

Further, as a third aspect according to the present invention,
Switch means are individually arranged at portions corresponding to lower portions of the plurality of wiring terminals in the semiconductor circuit, and one end of each switch is connected to the wiring terminal and the other of the switches is connected. Is connected to a predetermined constant current source, a voltage between two adjacent wiring terminals is detected, and a comparing means for comparing the voltage with a predetermined reference voltage value is arbitrarily selected. Are disposed corresponding to each of two adjacent wiring terminal portions.
Judgment for judging the connection state of the wiring terminal to be inspected from the comparison result of the control means for controlling the switching operation of the switch means and the comparison means arranged between the two arbitrarily selected adjacent wiring terminal parts. In the semiconductor integrated circuit device configured to dispose the means inside the semiconductor circuit, the switch means corresponding to the selected wiring terminal part to be inspected is turned on, and the switch means selected at the same time is selected. The switch means corresponding to the wiring terminal portion arranged on both sides of the wiring terminal portion to be inspected is turned off, and then the respective wiring terminal portions arranged on both sides of the wiring terminal portion to be inspected and the wiring terminal to be inspected are turned off. The voltage formed between the first and second parts is detected by the detecting means, and the detected voltage value is compared with a predetermined reference voltage value by the comparing means. In accordance with the output level of at the comparison means on at least one side of the inspected terminal part,
Inspection for determining a connection state of a wiring terminal portion to be inspected in a circuit of a semiconductor integrated circuit device configured to determine a connection state between the wiring terminal portion and another terminal joint portion. Is the way.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS That is, the semiconductor integrated circuit device according to the present invention, a method for manufacturing the semiconductor integrated circuit device, and
The inspection method of the semiconductor integrated circuit device employs the above-described technical configuration, and in the semiconductor integrated circuit chip such as the LSI, whether all the power supply terminals or the GND terminals are correctly connected or not. By applying a predetermined power and running a predetermined program, it is possible to inspect very easily and electrically and efficiently, and to use a simple device for the determination result. By using it, it can be easily confirmed at any time.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor integrated circuit device according to the present invention will be described below.
Each of the method of manufacturing the semiconductor integrated circuit device and the method of inspecting the semiconductor integrated circuit device will be described in detail with reference to the drawings. That is, as shown in FIGS. 1 and 2, the semiconductor integrated circuit device 1 according to the present invention is configured such that soldering is performed via a suitable pad 5 on one main surface of a chip portion 1 in which a predetermined circuit portion is built. The chip 1 is mounted on a predetermined wiring board 4.
The final semiconductor device 100 is formed by mounting and bonding by a flip chip method.

At this time, the connection state between the bumps 2 of the chip section 1 and the corresponding connection terminal sections 6 on the mounting board poses a problem. The semiconductor integrated circuit device 1 according to the present invention, that is, the chip 1 having the configuration illustrated in FIG.
The connection state between the plurality of wiring terminal portions 2 provided in the semiconductor integrated circuit device 1 and the other terminal joining portions 6 provided opposite to each of the wiring terminal portions 2 is electrically determined. The semiconductor integrated circuit device 1 is built in the semiconductor integrated circuit device 1 with the inspection determination means 7 for detecting the connection state of each of the wiring terminal portions normally and for determining whether the connection state is normal or abnormal.

The plurality of wiring terminal portions 8 according to the present invention
(8-1, 8-2, 8-3,...) Represent pad portions 5-1, 5-2, 5-3,... Provided on chip 1, which is the semiconductor integrated circuit device, respectively. .. and bumps 2-1, 2-2, 2-3,... Formed mainly of solder.
・ It is desirable to be composed of In the present invention, each of the wiring terminal portions (8-1, 8-2, 8-3,...) Has a predetermined distance from the wiring 12 in the chip provided on the main surface of the substrate 11. Are connected via

Further, according to the present invention, each wiring terminal portion 8 is located inside the substrate 11 of the semiconductor integrated circuit device 1.
(8-1, 8-2, 8-3,...), A plurality of switch means (SW1,
SW2, SW3,...) Are individually arranged, and the individual switch means (SW1, SW2, SW
3) are connected to the respective wiring terminal portions 8
(8-1, 8-2, 8-3,...) Are connected in the vicinity of the wiring 12 in the chip.

Further, in the present invention, it is desirable that the other ends of the switch means (SW1, SW2, SW3,...) Are connected to a predetermined constant current source 13. On the other hand, in the present invention, the switch means (SW
1, SW2, SW3,...) Include ON / OF of the switch means (SW1, SW2, SW3,...).
F is provided, and the control means 14 selects any three continuous switch means (SW1, SW2, SW3), and among them, the wiring terminal section 8 to be inspected. Switch means SW2 corresponding to -2
Is turned ON, and the inspection wiring terminal portions 8 on both sides except for the switch means SW2 corresponding to the inspection wiring terminal portion 8-2.
Switch means SW1 and SW corresponding to -1 and 8-3
3 has a function of performing selection control so that 3 is turned off.

That is, the control means 14 according to the present invention comprises:
Any three adjacent wiring terminal portions 8-1, 8-2, 8-3 are selected from the plurality of wiring terminal portions 8, and the middle wiring terminal 8-2 is determined as the wiring terminal portion to be inspected. Then, the switch SW2 corresponding to the wiring terminal 8-2 is turned ON, and the switches SW1 and SW3 corresponding to the remaining inspection wiring terminals 8-1 and 8-3 are turned OFF. Execute.

The above operation is performed by simultaneously selecting three adjacent wiring terminal portions so that all the power supply terminals or GND terminals of the semiconductor integrated circuit device 1 are to be inspected wiring terminal portions. The operation for executing the operation is sequentially repeated. Further, in the present invention, the substrate 1
1, each of the wiring terminal portions 8 (8-1, 8-2, 8-8)
-3,...) Are connected to the wiring 1 in the chip.
, The voltages (V1, V2, V3,...) Respectively generated at the three wiring terminals adjacent to each other are measured.
From the result, between two arbitrarily selected wiring terminal parts,
For example, the wiring terminal portions 8-1 and 8-2 or the wiring terminal portion 8
-2 and 8-3, respectively, voltage difference (V2-V1)
Alternatively, a plurality of comparing means 15-1 and 15-2 for measuring (V3-V2) and comparing a predetermined reference voltage value and the measured voltage difference are provided.

On the other hand, in the present invention, the respective comparing means 15-1 or 15-1 are further provided inside the substrate 11.
Output from 5─2 or two adjacent comparison means 1
A determination means 16 for determining the connection state of the wiring terminal portion 8-2 to be inspected from the outputs from 5-1 and 15 # 2 is provided. That is, in the semiconductor integrated circuit device 1 according to the present invention, in a flip-chip LSI in which pads are arranged in an internal region of a chip, one side is connected to a constant current source circuit 13 immediately below all power supply terminals, and A voltage comparison circuit 15 for measuring a potential difference between a switch circuit SW connected to the wiring 12 immediately below the pad and an adjacent power supply pad.
Are arranged, and the operation is as follows.

That is, when testing whether all the power terminals or the ground terminals are correctly connected at the time of a wafer test of an LSI having a flip-chip configuration or after mounting on a substrate, first, the power terminals shown in FIG. 8-
In the test of No. 2, only the switch means SW2 disposed immediately below the power supply terminal 8-2 is turned on to apply a current to the constant current source circuit.

If the power supply terminal 8-2 is correctly connected to the predetermined terminal portion 6-2 of the mounting board 4, the main path of the current flowing from the switch means SW to the constant current source 13 is shown in FIG. As shown in the figure, the current path 1 is provided, and the amount of current flowing from the adjacent wiring terminal sections 8-1 and 8-3 into the current path 1 is very small. And the potential difference (V2-V1) and (V2-V3) between the potential V2 and the potentials V1 and V3 immediately below the wiring terminal portions 8-1 and 8-3, respectively.

However, the inspected wiring terminal portion 8-
2 is open, the switch SW
2 flows into the constant current source 13 from the wiring terminal portions 8-1 and 8-3 adjacent to the wiring terminal portion 8-2 to be inspected.
As shown in FIG. 1, current paths passing through the power supply wiring 12 in the chip from the current paths 2 and / or 3
Or, the current flows through 3, and depending on the wiring resistance of the power supply wiring 12, the wiring terminals 8-2 and 8-3 or the wiring terminals 8-2 and 8-1 adjacent to each other are determined depending on the wiring resistance of the power wiring 12. , V1 and V
2, V3, the potential difference (V2-V1) and (V2-V
3) occurs, the potential difference is set to a predetermined reference value, and the comparing means 15-1 and 15-2 determine
It is determined whether or not the potential difference exceeds the reference value, and further, based on the output data of the comparing means 15, the connection state at the wiring terminal under inspection 8-2 is normal or abnormal. By providing the judging means 16 for judging whether the potential difference exceeds the predetermined reference value,
The wiring terminal section 8-2 to be inspected is determined to be in an open state.

In the present invention, such an operation is executed for all power supply terminals or GND terminals. As a result, it is possible to easily and electrically determine whether or not all power supply terminals or GND terminals in a predetermined semiconductor integrated circuit device are correctly connected.

In the present invention, a control means 17 formed of a computer or the like which comprehensively controls the switch control means 14, the comparison means 15, the judgment means 16 and the like according to a predetermined program is provided. Is desirable. A feature of the present invention is that all the circuits, means, and the like described above are arranged and formed inside the substrate 11 of the semiconductor integrated circuit device 1, and the connection state determination circuit of the wiring terminal portion is provided by the semiconductor integrated circuit device. It is configured to be embedded in the substrate 11 of the circuit device 1 in advance.

For example, as shown in FIG. 4, the switch means S is formed by utilizing a corner of the substrate portion 11 constituting a predetermined circuit of the semiconductor integrated circuit device 1 where no circuit is arranged.
It is desirable to embed the W, the comparison means 15, the determination means 16, the control means 17, and the like. Further, as another specific example of the present invention, for example, a storage unit 18 for storing an individual determination result for each wiring terminal unit determined by the determination unit is provided inside the substrate 11. It is also preferable that

Further, in the present invention, the determining means 1
It is also desirable that the result of 6 is displayed on a display means 20 provided separately from the semiconductor integrated circuit device 1 via an appropriate communication means 19. As a method of manufacturing the semiconductor integrated circuit device 11 according to the present invention, for example, the switch means SW is individually arranged at a portion corresponding to a lower portion of each of the plurality of wiring terminal portions 8 in the semiconductor circuit, One end of the switch means SW is connected to the wiring terminal section 8 and the other end of the switch means SW is connected to a predetermined constant current source 13.
The comparing means 15 for detecting the voltage between the two wiring terminal portions 8-2 and 8 端子 3 and comparing the voltage with a predetermined reference voltage value is replaced by two arbitrarily selected two adjacent wiring terminals. The control means 14 for controlling the switching operation of the switch means SW and the arbitrarily selected mutually adjacent ones are arranged corresponding to each of the sections 8 # 1 and 8-2 or 8 # 2 and 8-3. The determination means 16 for determining the connection state of the wiring terminal part to be inspected from the comparison result of the comparison means 15 disposed between the two wiring terminal parts is arranged and formed inside the substrate 11 of the semiconductor circuit 1. This is a method for manufacturing the semiconductor integrated circuit device thus configured.

The method of inspecting the connection state of the wiring terminal portions 8 of the semiconductor integrated circuit device 1 according to the present invention includes, for example, a method of inspecting a lower portion of each of the plurality of wiring terminal portions 8 in the semiconductor integrated circuit device. The switch means SW is individually arranged in a portion corresponding to the switch section, one end of each switch means SW is connected to the wiring terminal section 8 and the other end of the switch means SW is connected to a predetermined constant current source 13. And a comparing means 15 for detecting the voltage V between two adjacent wiring terminal portions and comparing the voltage V with a predetermined reference voltage value. Are arranged corresponding to each of the wiring terminal portions of
From the comparison result of the control means 14 for controlling the switching operation of the switch means SW and the comparison means 15 disposed between the two arbitrarily selected adjacent wiring terminal parts, the wiring terminal part 8-2 to be inspected is determined. In a semiconductor integrated circuit device in which the determination means 16 for determining the connection state is arranged inside the semiconductor circuit, the switch means SW2 corresponding to the selected wiring terminal section 8-2 to be inspected is connected. When turned on, the wiring terminal portions 8-1 and 8-
The switch means SW1 and SW3 corresponding to 3 are turned off, and then the respective wiring terminal sections 8-1 and 8-3 arranged on both sides of the wiring terminal section 8-2 and the wiring terminal section under test. 8-2 is detected by a suitable detecting means (not shown), and the detected voltage value is compared with a predetermined reference voltage value by the comparing means 15. Then, the inspected wiring terminal portion 8-2
The connection state between the wiring terminal portion and another terminal junction is determined in accordance with the output level of the comparison means 15-2 on at least one side of the wiring terminal. This is an inspection method for determining a connection state of a wiring terminal portion to be inspected in a circuit of a semiconductor integrated circuit device.

[0031]

Since the semiconductor integrated circuit device according to the present invention employs the above-described technical configuration, it is mainly based on the flip-chip method as compared with the conventional semiconductor integrated circuit device inspection system. In a semiconductor integrated circuit device such as an LSI, an open test of a power supply terminal or a ground terminal GND can be inspected electrically and efficiently as accurately as possible. A semiconductor formed by embedding an inspection determination circuit for detecting a connection state at a power supply terminal or a ground terminal and determining whether the connection state is normal or abnormal inside the semiconductor integrated circuit device, particularly, the substrate inside the device. Since it is an integrated circuit device, the judgment or confirmation of the connection state can be executed easily and at any time at any time.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a specific example of a semiconductor integrated circuit device according to the present invention.

FIG. 2 is a diagram showing a specific example of an appearance of a semiconductor integrated circuit device according to the present invention.

FIG. 3 is a diagram showing a configuration of a specific example of a conventional semiconductor integrated circuit device.

FIG. 4 is a block diagram showing a specific example of a configuration of a semiconductor integrated circuit device according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Chip 2 ... Solder bump 4 ... Mounting board 5, 5-1, 5-2, 5-3 ... Pad part 6, 6-1, 6-2, 6-3 ... Terminal joint part 7 ... Connection inspection judgment means 8, 8-1, 8-2, 8-3 Wiring terminal portion 11 Chip substrate 12 Wiring in chip 13 Constant current source 14 Switch control means 15 Comparison means 16 Judgment means 17 Control means 18 Storage means 19 Communication means 20 Display means 31 Pad part 32 Chip 33 Package 34 Wire bonding 35 Package terminal part 100 Semiconductor integrated circuit device

Claims (11)

[Claims] 1. A connection state between a plurality of wiring terminal portions provided in a semiconductor integrated circuit device and other terminal joint portions provided opposite to each of the wiring terminal portions. A semiconductor integrated circuit device, wherein inspection determination means for electrically detecting and determining whether each connection state of the wiring terminal portion is normal or abnormal is built in the semiconductor integrated circuit device. 2. The device according to claim 1, wherein the plurality of wiring terminals are at least a power supply terminal or a ground terminal.
13. The semiconductor integrated circuit device according to claim 1. 3. The semiconductor integrated circuit device according to claim 1, wherein the switch means is individually arranged at a portion inside the substrate corresponding to a lower portion of each of the wiring terminal portions. 4. A plurality of comparators for measuring a voltage between two adjacent wiring terminals in each of the wiring terminals and comparing the measured voltage with a predetermined reference voltage value inside the substrate. 4. The semiconductor integrated circuit device according to claim 1, further comprising means. 5. A judgment means for judging a connection state of a wiring terminal portion to be inspected from an output from each of said comparison means or an output from two adjacent comparison means inside said substrate. 5. The semiconductor integrated circuit device according to claim 1, wherein: 6. The switch device according to claim 3, wherein the other end is connected to a predetermined constant current source.
13. The semiconductor integrated circuit device according to claim 1. 7. Controlling ON / OFF of the switch means, selecting any three consecutive switch means, setting the switch means corresponding to the wiring terminal to be inspected to ON, Turn off the switches on both sides except the switch means corresponding to the wiring terminal part to be inspected
7. The semiconductor integrated circuit device according to claim 1, wherein control means for performing selection control is provided inside said semiconductor integrated circuit device. 8. The storage device according to claim 1, wherein storage means for storing an individual determination result for each of said wiring terminal portions determined by said determination means is provided inside said substrate. A semiconductor integrated circuit device according to any one of the above. 9. The apparatus according to claim 1, wherein a result of said judging means is displayed on a display means provided separately from said semiconductor integrated circuit device via an appropriate communication means. 9. The semiconductor integrated circuit device according to any one of 1 to 8. 10. Switching means are individually arranged at positions corresponding to lower portions of a plurality of wiring terminals in a semiconductor circuit, and one end of each switch is connected to the wiring terminals. Comparing means for connecting the other end of the switch means to a predetermined constant current source, detecting a voltage between two adjacent wiring terminals, and comparing the voltage with a predetermined reference voltage value; A control means for controlling the switching operation of the switch means, and a control means for controlling the switching operation of the arbitrarily selected two adjacent wiring terminal parts. And a determining means for determining a connection state of the wiring terminal part to be inspected from a comparison result of the comparing means disposed between the wiring terminal parts of the semiconductor circuit. A method for manufacturing a body integrated circuit device. 11. Switch means are individually arranged at portions corresponding to lower portions of a plurality of wiring terminals in a semiconductor circuit, and one end of each switch is connected to the wiring terminals. Comparing means for connecting the other end of the switch means to a predetermined constant current source, detecting a voltage between two adjacent wiring terminals, and comparing the voltage with a predetermined reference voltage value; A control means for controlling the switching operation of the switch means, and a control means for controlling the switching operation of the arbitrarily selected two adjacent wiring terminal parts. And a determining means for determining a connection state of the wiring terminal part to be inspected from a comparison result of the comparing means disposed between the wiring terminal parts of the semiconductor integrated circuit device. In the above, while the switch means corresponding to the selected wiring terminal to be inspected is turned ON,
At the same time, the switch means corresponding to the wiring terminal portion arranged on both sides of the wiring terminal portion to be inspected is turned off.
Then, a voltage formed between each of the wiring terminal portions disposed on both sides of the wiring terminal portion to be inspected and the wiring terminal portion to be inspected is detected by the detecting means, and the detected voltage is detected. The value is compared with a predetermined reference voltage value determined in advance by the comparing means, and according to the output level of the comparing means on at least one side of the wiring terminal part to be inspected, the other of the wiring terminal part is checked. An inspection method for judging a connection state of a wiring terminal portion to be inspected in a circuit of a semiconductor integrated circuit device, wherein the inspection method is configured to judge the respective connection states between the semiconductor device and a terminal joint of the semiconductor integrated circuit device. .