JPH11214440A - Mounting method for electronic part - Google Patents
Mounting method for electronic partInfo
- Publication number
- JPH11214440A JPH11214440A JP10011090A JP1109098A JPH11214440A JP H11214440 A JPH11214440 A JP H11214440A JP 10011090 A JP10011090 A JP 10011090A JP 1109098 A JP1109098 A JP 1109098A JP H11214440 A JPH11214440 A JP H11214440A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electrode
- electronic component
- substrate
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を基板に
半田接合により実装する電子部品の実装方法に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component on a substrate by soldering.
【０００２】[0002]
【従来の技術】電子部品を基板に実装する方法として、
電子部品または基板の電極に予め半田バンプやプリコー
ト半田などの半田部を形成する方法が知られている。こ
の方法では、実装時に電子部品を加熱することにより半
田部を溶融させ、電子部品を基板の電極に半田接合す
る。また、実装後の電子部品と基板の隙間は、熱硬化性
樹脂より成るアンダーフィル樹脂で封止される。このア
ンダーフィル樹脂は半田接合部を包み込んで補強すると
ともに異物の侵入を防ぐ機能を有するものである。2. Description of the Related Art As a method for mounting an electronic component on a substrate,
There is known a method in which a solder portion such as a solder bump or pre-coated solder is formed in advance on an electrode of an electronic component or a substrate. In this method, an electronic component is heated at the time of mounting to melt a solder portion, and the electronic component is soldered to an electrode of a substrate. The gap between the electronic component and the board after mounting is sealed with an underfill resin made of a thermosetting resin. The underfill resin has a function of wrapping and reinforcing the solder joint portion and preventing foreign matter from entering.
【０００３】[0003]
【発明が解決しようとする課題】ところで、上記アンダ
ーフィル樹脂は、電子部品の搭載前に基板に塗布される
場合がある。電子部品の小型化によって電子部品と基板
の隙間は狭くなり、実装後のアンダーフィル樹脂の注入
が困難になっていることなどの理由によるものである。
この場合には、半田部を溶融させるための加熱と、アン
ダーフィル樹脂を熱硬化させるための加熱が同一の加熱
工程で行われる。Incidentally, the above-mentioned underfill resin may be applied to a substrate before electronic components are mounted. This is because the gap between the electronic component and the substrate becomes smaller due to the miniaturization of the electronic component, and it becomes difficult to inject the underfill resin after mounting.
In this case, heating for melting the solder portion and heating for thermally curing the underfill resin are performed in the same heating step.
【０００４】半田部が溶融して被接合面に半田接合され
る際には、接合部の形状は半田が被接合面に沿ってでき
るだけ広い範囲に濡れ拡がった形状となるのが望まし
い。しかしながらアンダーフィル樹脂を予め基板上に塗
布する従来の方法では、半田バンプとアンダーフィル樹
脂とが同時に加熱されるため、半田バンプの溶融時には
周囲のアンダーフィル樹脂が既に完全硬化していた。こ
のため硬化したアンダーフィル樹脂は、溶融半田が被接
合面に沿って濡れ拡がるのを阻害し、その結果前述の望
ましい形状の接合部が得られず形状不良を発生する場合
があった。When the solder portion is melted and solder-joined to the surface to be joined, it is desirable that the shape of the joint portion be a shape in which the solder wets and spreads as widely as possible along the surface to be joined. However, in the conventional method of applying the underfill resin on the substrate in advance, since the solder bump and the underfill resin are heated simultaneously, the surrounding underfill resin has already been completely cured when the solder bump is melted. For this reason, the cured underfill resin hinders the molten solder from spreading along the surface to be joined, and as a result, the above-mentioned joint having the desired shape cannot be obtained, and a shape defect may occur.
【０００５】このように、従来の電子部品の実装方法で
は、半田溶融のタイミングとアンダーフィル樹脂の熱硬
化のタイミングとの関連に起因する接合部の形状不良に
より接合部の強度が確保されず、接合部の信頼性が低下
するという問題点があった。また、上記問題を解決する
電子部品の実装方法として、融点が半田の融点よりも高
い硬化剤のみを含んだアンダーフィル樹脂を使用する方
法が考えられる。この方法ではアンダーフィル樹脂を硬
化剤の融点よりも高い温度に加熱しないと硬化しないの
で半田の濡れ拡がりの問題は解決できるが、アンダーフ
ィル樹脂が完全硬化するまでの時間が長く、したがって
実装のタクトタイムが長くなり、生産性が低いという問
題点もあった。[0005] As described above, in the conventional mounting method of electronic parts, the strength of the joint cannot be ensured due to the poor shape of the joint caused by the relationship between the timing of melting the solder and the timing of thermosetting of the underfill resin. There has been a problem that the reliability of the joint is reduced. Further, as a method of mounting an electronic component to solve the above problem, a method of using an underfill resin containing only a curing agent having a melting point higher than the melting point of solder can be considered. This method can solve the problem of solder wetting and spreading because the underfill resin does not cure unless it is heated to a temperature higher than the melting point of the curing agent.However, the time required for the underfill resin to completely cure is long, so the mounting tact time is reduced. There was also a problem that time was long and productivity was low.
【０００６】そこで本発明は、接合部の信頼性が高く生
産性に優れた電子部品の実装方法を提供することを目的
とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for mounting an electronic component having a high reliability of a joint and excellent productivity.
【０００７】[0007]
【課題を解決するための手段】請求項１記載の電子部品
の実装方法は、基板の電極もしくは電子部品の電極の少
なくともいずれか一方の電極に半田部を形成し、この半
田部によって前記基板の電極に前記電子部品の電極を半
田接合する電子部品の実装方法であって、前記基板上に
半田融点温度よりも低い融点温度の硬化剤を含む熱硬化
性樹脂を塗布して前記基板の電極または電極に形成され
た半田部を覆う工程と、前記半田部を前記電極または電
極に形成された半田部に対して位置合せする工程と、前
記半田部を前記電極または電極に形成された半田部に対
して押圧した状態で電子部品を加熱して前記熱硬化性樹
脂を硬化させる工程とを含み、前記電子部品を加熱する
工程において、前記熱硬化性樹脂が完全硬化する前に前
記半田部を半田の融点温度以上に昇温させるようにし
た。According to a first aspect of the present invention, there is provided a method of mounting an electronic component, comprising: forming a solder portion on at least one of an electrode of a substrate and an electrode of an electronic component; A method of mounting an electronic component by soldering an electrode of the electronic component to an electrode, wherein a thermosetting resin containing a curing agent having a melting point lower than the melting point of solder is applied to the substrate, and the electrode of the substrate or A step of covering the solder portion formed on the electrode; a step of aligning the solder portion with the solder portion formed on the electrode or the electrode; and a step of positioning the solder portion on the solder portion formed on the electrode or the electrode. Heating the electronic component in a state where the thermosetting resin is pressed against the thermosetting resin, and in the step of heating the electronic component, soldering the solder portion before the thermosetting resin is completely cured. of And to raise the temperature above the point temperature.
【０００８】請求項２記載の電子部品の実装方法は、請
求項１記載の電子部品の実装方法であって、前記熱硬化
性樹脂に、少なくとも半田の融点温度よりも低い融点温
度を有する第１の硬化剤と、半田の融点温度よりも高い
融点温度を有する第２の硬化剤とを含む。According to a second aspect of the present invention, there is provided the electronic component mounting method according to the first aspect, wherein the thermosetting resin has at least a melting point lower than a melting point of solder. And a second curing agent having a melting point higher than the melting point of the solder.
【０００９】本発明によれば、電子部品を加熱する工程
において、熱硬化性樹脂が完全硬化する前に半田部を半
田融点温度以上に昇温させることにより、半田部と被接
合面での溶融半田の濡れ拡がりが阻害されず、良好な形
状で信頼性の高い接合部を得ることができ、熱硬化性樹
脂の硬化が促進されることにより実装時間を短縮するこ
とができる。According to the present invention, in the step of heating the electronic component, the temperature of the solder portion is raised to a temperature equal to or higher than the melting point of the solder before the thermosetting resin is completely cured, thereby melting the solder portion and the surface to be joined. Solder spread of the solder is not hindered, and a highly reliable joint having a good shape can be obtained, and the mounting time can be shortened by accelerating the curing of the thermosetting resin.
【００１０】[0010]
【発明の実施の形態】次に本発明の実施の形態を図面を
参照して説明する。図１（ａ），（ｂ），（ｃ），
（ｄ）は本発明の一実施の形態の電子部品の実装方法の
工程説明図、図２は同電子部品の実装方法の加熱温度と
アンダーフィル樹脂の硬化の状態を示すグラフ、図３
（ａ），（ｂ），（ｃ），（ｄ）は同電子部品の実装方
法の半田部と電極の断面図である。なお図１（ａ），
（ｂ），（ｃ），（ｄ）は電子部品の実装方法を工程順
に示すものである。Embodiments of the present invention will now be described with reference to the drawings. 1 (a), (b), (c),
(D) is an explanatory view of a process of a method of mounting an electronic component according to an embodiment of the present invention. FIG. 2 is a graph showing a heating temperature and a state of curing of an underfill resin in the mounting method of the electronic component.
(A), (b), (c), (d) is a sectional view of a solder portion and an electrode in the mounting method of the electronic component. In addition, FIG.
(B), (c), and (d) show the mounting method of the electronic component in the order of steps.
【００１１】図１（ａ）において、基板１上には電極２
が形成されている。この電極２上に、半田部としてのプ
リコート半田３が形成される。プリコート半田３の形成
には、半田メッキや、スクリーンマスクにより電極２上
にクリーム半田を印刷する方法などを用いることができ
る。このプリコート半田３上を覆って、基板１上にディ
スペンサ４によりボンド５が塗布される。ボンド５は半
田融点温度よりも低い融点温度の硬化剤を含む熱硬化性
樹脂である。すなわち、ボンド５は半田融点温度より低
い温度で熱硬化を開始する。In FIG. 1A, an electrode 2 is provided on a substrate 1.
Are formed. On this electrode 2, a precoat solder 3 as a solder portion is formed. For forming the precoat solder 3, a method such as solder plating or printing cream solder on the electrode 2 using a screen mask can be used. The dispenser 4 applies a bond 5 on the substrate 1 so as to cover the pre-coated solder 3. The bond 5 is a thermosetting resin containing a curing agent having a melting point lower than the solder melting point. That is, the bond 5 starts thermosetting at a temperature lower than the solder melting point temperature.
【００１２】次に、このボンド５が塗布された基板１
に、突出した電極である金バンプ８を有する電子部品６
が搭載される。金バンプ８は電子部品６の電極７上に金
めっきにより金膜を形成し、この金膜上に形成されたも
のである。電子部品６は図１（ｂ）に示すように、圧着
ツール９に保持され、圧着ツール９によって電子部品６
を基板１に対して押圧することにより、金バンプ８はプ
リコート半田３に対して押圧される。この状態で、図１
（ｃ）に示すように、圧着ツール９の加熱手段により電
子部品６を加熱する。Next, the substrate 1 to which the bond 5 has been applied
Electronic component 6 having gold bumps 8 as protruding electrodes
Is mounted. The gold bumps 8 are formed by forming a gold film on the electrodes 7 of the electronic component 6 by gold plating, and formed on the gold film. The electronic component 6 is held by a crimping tool 9 as shown in FIG.
Is pressed against the substrate 1 so that the gold bump 8 is pressed against the pre-coated solder 3. In this state, FIG.
As shown in (c), the electronic component 6 is heated by the heating means of the crimping tool 9.
【００１３】このときの加熱温度、ボンド５の粘度の時
間的変化について図２を参照して説明する。図２におい
て、折れ線ａは電子部品６を加熱する加熱温度の時間的
変化を示したものであり、曲線ｂはボンド５の熱硬化に
よる粘度の上昇を示している。なお、ここでは粘度を示
す値として、ボンド５のせん断力を用いている。曲線
ｂ’は後述するボンド５’を用いた場合の粘度の上昇を
示しており、ａ０，ｂ０で示すグラフはそれぞれ従来の
実装方法の加熱温度およびボンドの粘度変化を対比のた
めに示したものである。The change of the heating temperature and the viscosity of the bond 5 with time at this time will be described with reference to FIG. In FIG. 2, a polygonal line a shows a temporal change in a heating temperature at which the electronic component 6 is heated, and a curve b shows an increase in viscosity due to thermosetting of the bond 5. Here, the shear force of the bond 5 is used as a value indicating the viscosity. The curve b 'shows the increase in viscosity when a bond 5' described later is used, and the graphs a0 and b0 show the heating temperature and the change in the bond viscosity of the conventional mounting method for comparison. It is.
【００１４】図２に示すように、加熱温度を示す折れ線
ａは加熱開始時点ｔ０から急速に立上げられ、短時間で
半田融点温度（１８３°Ｃ）を越えて２００°Ｃまで上
昇する。したがって、プリコート半田３が溶融するタイ
ミングｔ１では、ボンド５の熱硬化が開始してからわず
かの時間しか経過しておらず、曲線ｂで示すボンド５の
粘度はまだ低いレベルにある。したがって、プリコート
半田３の周囲のボンド５は、溶融半田３’が金バンプ８
の表面で濡れ拡がるのを阻害しない。このため冷却固化
後には、図１（ｄ）に示すように溶融半田３’は半田濡
れ性の良い金バンプ８の表面に沿って濡れ拡がり、金バ
ンプ８をしっかりと包み込んで強度に優れた信頼性の高
い接合部を得ることができる。As shown in FIG. 2, the polygonal line a indicating the heating temperature rises rapidly from the time t0 when the heating is started, and rises to 200 ° C. in a short time over the solder melting point temperature (183 ° C.). Therefore, at the timing t1 at which the precoat solder 3 melts, only a short time has elapsed since the start of the thermosetting of the bond 5, and the viscosity of the bond 5 indicated by the curve b is still at a low level. Therefore, the bond 5 around the pre-coated solder 3 is formed by melting the solder 3 ′ with the gold bump 8.
It does not prevent the surface from spreading on the surface. Therefore, after cooling and solidification, as shown in FIG. 1 (d), the molten solder 3 'spreads along the surface of the gold bump 8 having good solder wettability, and wraps the gold bump 8 firmly to provide a reliable and excellent strength. It is possible to obtain a highly bonded portion.
【００１５】これに対し、従来の電子部品の実装方法で
は、グラフａ０，ｂ０で示すように加熱温度が上昇して
半田融点温度に到達した時点では、ボンドは既に完全硬
化していた。このため前述のように溶融半田の流動が周
囲のボンドによって妨げられ金バンプの表面で濡れ拡が
ることができず、接合部の形状不良を生じる原因となっ
ていた。On the other hand, in the conventional electronic component mounting method, when the heating temperature rises and reaches the solder melting point temperature as shown in graphs a0 and b0, the bond has already been completely cured. For this reason, as described above, the flow of the molten solder is hindered by the surrounding bonds and cannot spread on the surface of the gold bump, which causes a defective shape of the joint.
【００１６】また、図２に示すＴは完全硬化時間であ
り、加熱開始からボンド５が完全硬化するまでに要する
時間を示している。前述のように、短時間で加熱温度を
上昇させることにより、しかも比較的低い温度で熱硬化
を開始する熱硬化性樹脂を用いることにより、ボンド５
の熱硬化は早期に促進され、完全硬化時間Ｔは図２に示
す従来のボンドの完全硬化時間Ｔ０と比べて大幅に短縮
されている。したがって、実装が完了するまでのタクト
タイムを短縮して生産性を向上させることができる。Further, T shown in FIG. 2 is a complete curing time, which is a time required from the start of heating to the time when the bond 5 is completely cured. As described above, by increasing the heating temperature in a short time, and using a thermosetting resin that starts thermosetting at a relatively low temperature, the bond 5 can be formed.
Is accelerated early, and the complete curing time T is significantly shorter than the complete curing time T0 of the conventional bond shown in FIG. Therefore, the tact time until the mounting is completed can be shortened, and the productivity can be improved.
【００１７】次に、ボンド５の硬化を更に促進させたボ
ンド５’を用いた例について説明する。ボンド５’は少
なくとも半田の融点温度よりも低い融点温度を有する第
１の硬化剤と、半田の融点温度よりも高い融点温度を有
する第２の硬化剤を含んだ熱硬化性樹脂である。図２の
曲線ｂ’に示すように、ボンド５’は加熱工程におい
て、半田融点温度以下で第１の硬化剤が溶融して熱硬化
を促進するとともに、半田融点温度を越えた時点で第２
の硬化剤が溶融することにより硬化が更に促進され、完
全硬化時間Ｔ’は、前述のＴを更に短縮したものとなっ
ている。したがって実装のタクトタイムを更に短縮して
生産性を大幅に向上させることができる。Next, a description will be given of an example using a bond 5 ′ in which the curing of the bond 5 is further promoted. The bond 5 ′ is a thermosetting resin including at least a first curing agent having a melting point lower than the melting point of the solder and a second curing agent having a melting point higher than the melting point of the solder. As shown by the curve b ′ in FIG. 2, in the heating step, the first curing agent is melted at a temperature lower than the solder melting point to promote thermosetting in the heating step, and the bond 5 ′ is heated to the second point when the temperature exceeds the solder melting point.
Is further accelerated by melting of the curing agent, and the complete curing time T ′ is a value obtained by further shortening the aforementioned T. Therefore, the tact time of mounting can be further reduced, and productivity can be greatly improved.
【００１８】なお本発明は、上記実施の形態に限定され
ないのであって、例えば図３（ａ），（ｂ），（ｃ），
（ｄ）に示すような半田部と電極の組み合わせについて
も適用可能である。図３（ａ）は、電子部品６に半田部
としてのプリコート半田１３が設けられ、基板１の電極
２上に金メッキを施した後に金バンプ１８を形成したも
のであり、実施の形態１の電子部品６と基板１を互いに
入れ替えた形となっている。Note that the present invention is not limited to the above-described embodiment. For example, FIG. 3 (a), (b), (c),
A combination of a solder portion and an electrode as shown in FIG. FIG. 3A shows the electronic component 6 in which a precoat solder 13 is provided as a solder portion, and a gold bump 18 is formed after gold plating is performed on the electrode 2 of the substrate 1. The component 6 and the substrate 1 are interchanged.
【００１９】また図３（ｂ）は電子部品６に半田部とし
ての半田バンプ１４を設け、基板１の電極２上に金メッ
キを施して半田濡れ性を向上させたものである。図３
（ｃ）は、図３（ｂ）の半田バンプ１４と電極２の組み
合わせにおいて、電子部品６と基板１を互いに入れ替え
た形、すなわち基板１の電極２上に半田バンプ１４’を
設け、電子部品６の電極７に金めっきを施したものであ
る。更に図３（ｄ）は、電子部品７と基板１の電極双方
にプリコート半田１５を形成したものである。このよう
に、半田部としては、突部を形成した半田バンプや電極
上に半田めっきなどでコーティングするプリコート半田
などいずれの形態でもよく、また、電極としてはフラッ
トな形状のもののほか、金などの半田ぬれ性の良い金属
を用いた突出電極（金属バンプ）を用いることができ
る。FIG. 3B shows an electronic component 6 in which solder bumps 14 are provided as solder portions, and gold plating is performed on the electrodes 2 of the substrate 1 to improve solder wettability. FIG.
FIG. 3C shows a combination of the solder bump 14 and the electrode 2 shown in FIG. 3B in which the electronic component 6 and the substrate 1 are replaced with each other, that is, a solder bump 14 ′ is provided on the electrode 2 of the substrate 1. The electrode 7 of No. 6 is plated with gold. Further, FIG. 3D shows that the pre-coated solder 15 is formed on both the electronic component 7 and the electrode of the substrate 1. As described above, the solder portion may be in any form such as a solder bump having a protruding portion or a pre-coated solder in which an electrode is coated with a solder plating or the like. A protruding electrode (metal bump) using a metal having good solder wettability can be used.
【００２０】上記各例において、電極として図３（ａ）
のように金バンプなどの突出電極を用いる場合には、半
田部の表面の酸化膜を金属の突部によって破壊すること
ができるので、半田接合に際しフラックスの使用を必要
としない。また、金属の突部を有しない場合でも、半田
部と電極を互いに押圧する際に超音波振動の付与を併用
することにより、同様に半田部の表面の酸化膜を破壊す
ることができるので、フラックスの使用を必要としな
い。In each of the above examples, the electrodes shown in FIG.
When a protruding electrode such as a gold bump is used as described above, the oxide film on the surface of the solder portion can be destroyed by the protruding portion of the metal, so that it is not necessary to use a flux for solder bonding. In addition, even when the solder portion and the electrode are not provided with each other, the oxide film on the surface of the solder portion can be similarly destroyed by simultaneously using the application of the ultrasonic vibration when pressing the solder portion and the electrode together, Does not require the use of flux.
【００２１】このように、基板１および電子部品６のい
ずれかまたは双方の電極に半田部を形成して、この半田
部により基板１に電子部品６を実装するに際し、従来よ
りも加熱の速度を大きくし、アンダーフィル樹脂として
の熱硬化樹脂が未硬化の間に半田部を溶融させるように
加熱プロファイルを設定することにより、溶融半田は被
接合面での濡れ拡がりが阻害されず良好な接合部が得ら
れるとともに、アンダーフィル樹脂の完全硬化に至るま
での時間が短縮され、実装のタクトタイムを短縮して生
産性を向上させることができる。As described above, when a solder portion is formed on one or both of the electrodes of the substrate 1 and the electronic component 6 and the electronic component 6 is mounted on the substrate 1 by using the solder portion, the heating speed is increased as compared with the conventional case. By setting the heating profile so that the solder portion is melted while the thermosetting resin as the underfill resin is not yet cured, the molten solder will not hinder the spread of the wet on the surface to be joined, and will provide a good joint. Is obtained, and the time until the underfill resin is completely cured is shortened, so that the tact time of mounting can be shortened and the productivity can be improved.
【００２２】[0022]
【発明の効果】本発明によれば、電子部品を加熱する工
程において、熱硬化性樹脂が完全硬化する前に半田部を
半田融点温度以上に昇温させることにより、溶融半田の
被接合面での濡れ拡がりが阻害されず、良好な形状で強
度に優れ信頼性の高い接合部を得ることができる。また
アンダーフィル樹脂としての熱硬化性樹脂の完全硬化に
至るまでの所要時間が短縮されるので、実装のタクトタ
イムを短縮して生産性を向上させることができる。According to the present invention, in the step of heating the electronic component, the temperature of the solder portion is raised to a temperature equal to or higher than the melting point of the solder before the thermosetting resin is completely cured. , And a highly reliable joint having a good shape, excellent strength and excellent reliability can be obtained. Further, since the time required until the thermosetting resin as the underfill resin is completely cured is shortened, the tact time for mounting can be shortened and the productivity can be improved.
【図１】（ａ）本発明の一実施の形態の電子部品の実装
方法の工程説明図 （ｂ）本発明の一実施の形態の電子部品の実装方法の工
程説明図 （ｃ）本発明の一実施の形態の電子部品の実装方法の工
程説明図 （ｄ）本発明の一実施の形態の電子部品の実装方法の工
程説明図BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is an explanatory view of a process of a method of mounting an electronic component according to an embodiment of the present invention. FIG. 1B is an explanatory view of a process of a mounting method of an electronic component according to an embodiment of the present invention. Process description diagram of electronic component mounting method according to one embodiment (d) Process description diagram of electronic component mounting method according to one embodiment of the present invention
【図２】本発明の一実施の形態の電子部品の実装方法の
加熱温度とアンダーフィル樹脂の硬化の状態を示すグラ
フFIG. 2 is a graph showing a heating temperature and a state of curing of an underfill resin in a method of mounting an electronic component according to an embodiment of the present invention.
【図３】（ａ）本発明の一実施の形態の電子部品の実装
方法の半田部と電極の断面図 （ｂ）本発明の一実施の形態の電子部品の実装方法の半
田部と電極の断面図 （ｃ）本発明の一実施の形態の電子部品の実装方法の半
田部と電極の断面図 （ｄ）本発明の一実施の形態の電子部品の実装方法の半
田部と電極の断面図3A is a cross-sectional view of a solder portion and an electrode in a method of mounting an electronic component according to an embodiment of the present invention; FIG. 3B is a sectional view of a solder portion and an electrode in a method of mounting an electronic component according to an embodiment of the present invention; Cross-sectional view (c) Cross-sectional view of solder part and electrode in mounting method of electronic component according to one embodiment of the present invention (d) Cross-sectional view of solder part and electrode in mounting method of electronic component according to one embodiment of the present invention
１ 基板 ２ 電極 ３ プリコート半田 ５、５’ ボンド ６ 電子部品 ７ 電極 ８ 金バンプ ９ 圧着ツール DESCRIPTION OF SYMBOLS 1 Substrate 2 Electrode 3 Precoat solder 5, 5 'bond 6 Electronic component 7 Electrode 8 Gold bump 9 Crimping tool
Claims (2)
くともいずれか一方の電極に半田部を形成し、この半田
部によって前記基板の電極に前記電子部品の電極を半田
接合する電子部品の実装方法であって、前記基板上に半
田融点温度よりも低い融点温度の硬化剤を含む熱硬化性
樹脂を塗布して前記基板の電極または電極に形成された
半田部を覆う工程と、前記半田部を前記電極または電極
に形成された半田部に対して位置合せする工程と、前記
半田部を前記電極または電極に形成された半田部に対し
て押圧した状態で電子部品を加熱して前記熱硬化性樹脂
を硬化させる工程とを含み、前記電子部品を加熱する工
程において、前記熱硬化性樹脂が完全硬化する前に前記
半田部を半田の融点温度以上に昇温させることを特徴と
する電子部品の実装方法。1. A method of mounting an electronic component, comprising: forming a solder portion on at least one of an electrode of a substrate and an electrode of an electronic component; and soldering the electrode of the electronic component to an electrode of the substrate by the solder portion. A step of applying a thermosetting resin containing a curing agent having a melting point lower than the melting point temperature of the solder on the substrate to cover an electrode of the substrate or a solder portion formed on the electrode; and A step of aligning with the electrode or a solder portion formed on the electrode, and heating the electronic component while pressing the solder portion against the electrode or the solder portion formed on the electrode to form the thermosetting resin. Curing the resin, and in the step of heating the electronic component, wherein the temperature of the solder portion is raised to a temperature equal to or higher than the melting point of solder before the thermosetting resin is completely cured. Real Method.
点温度よりも低い融点温度を有する第１の硬化剤と、半
田の融点温度よりも高い融点温度を有する第２の硬化剤
とを含むことを特徴とする請求項１記載の電子部品の実
装方法。2. The thermosetting resin contains at least a first curing agent having a melting point lower than the melting point of solder and a second curing agent having a melting point higher than the melting point of solder. The method for mounting an electronic component according to claim 1, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01109098A JP3539177B2 (en) | 1998-01-23 | 1998-01-23 | Electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01109098A JP3539177B2 (en) | 1998-01-23 | 1998-01-23 | Electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11214440A true JPH11214440A (en) | 1999-08-06 |
| JP3539177B2 JP3539177B2 (en) | 2004-07-07 |
Family
ID=11768300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01109098A Expired - Lifetime JP3539177B2 (en) | 1998-01-23 | 1998-01-23 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3539177B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8659168B2 (en) | 2007-03-16 | 2014-02-25 | Fujitsu Semiconductor Limited | Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board |
| JPWO2012165321A1 (en) * | 2011-05-27 | 2015-02-23 | コニカミノルタ株式会社 | INK JET HEAD MANUFACTURING METHOD, INK JET HEAD, MANUFACTURING METHOD FOR INTERMEDIATE ELECTRIC STRUCTURE |
-
1998
- 1998-01-23 JP JP01109098A patent/JP3539177B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8659168B2 (en) | 2007-03-16 | 2014-02-25 | Fujitsu Semiconductor Limited | Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board |
| JPWO2012165321A1 (en) * | 2011-05-27 | 2015-02-23 | コニカミノルタ株式会社 | INK JET HEAD MANUFACTURING METHOD, INK JET HEAD, MANUFACTURING METHOD FOR INTERMEDIATE ELECTRIC STRUCTURE |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3539177B2 (en) | 2004-07-07 |
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