JPH11204460A5 - - Google Patents

Info

Publication number
JPH11204460A5
JPH11204460A5 JP1998018151A JP1815198A JPH11204460A5 JP H11204460 A5 JPH11204460 A5 JP H11204460A5 JP 1998018151 A JP1998018151 A JP 1998018151A JP 1815198 A JP1815198 A JP 1815198A JP H11204460 A5 JPH11204460 A5 JP H11204460A5
Authority
JP
Japan
Prior art keywords
wafer
plating
jig
conductive
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998018151A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11204460A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10018151A priority Critical patent/JPH11204460A/ja
Priority claimed from JP10018151A external-priority patent/JPH11204460A/ja
Priority to US09/600,028 priority patent/US6365020B1/en
Priority to PCT/JP1999/000059 priority patent/WO1999035309A1/ja
Priority to KR1020007007645A priority patent/KR100586473B1/ko
Priority to DE69939827T priority patent/DE69939827D1/de
Priority to EP99900165A priority patent/EP1087039B9/en
Publication of JPH11204460A publication Critical patent/JPH11204460A/ja
Publication of JPH11204460A5 publication Critical patent/JPH11204460A5/ja
Pending legal-status Critical Current

Links

JP10018151A 1998-01-12 1998-01-12 ウエハのメッキ治具 Pending JPH11204460A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP10018151A JPH11204460A (ja) 1998-01-12 1998-01-12 ウエハのメッキ治具
US09/600,028 US6365020B1 (en) 1998-01-12 1999-01-12 Wafer plating jig
PCT/JP1999/000059 WO1999035309A1 (fr) 1998-01-12 1999-01-12 Support pour metallisation de tranches
KR1020007007645A KR100586473B1 (ko) 1998-01-12 1999-01-12 웨이퍼의 도금지그
DE69939827T DE69939827D1 (de) 1998-01-12 1999-01-12 Beschichtungshaltevorrichtung für wafer
EP99900165A EP1087039B9 (en) 1998-01-12 1999-01-12 Wafer plating jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10018151A JPH11204460A (ja) 1998-01-12 1998-01-12 ウエハのメッキ治具

Publications (2)

Publication Number Publication Date
JPH11204460A JPH11204460A (ja) 1999-07-30
JPH11204460A5 true JPH11204460A5 (https=) 2007-04-19

Family

ID=11963625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10018151A Pending JPH11204460A (ja) 1998-01-12 1998-01-12 ウエハのメッキ治具

Country Status (6)

Country Link
US (1) US6365020B1 (https=)
EP (1) EP1087039B9 (https=)
JP (1) JPH11204460A (https=)
KR (1) KR100586473B1 (https=)
DE (1) DE69939827D1 (https=)
WO (1) WO1999035309A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
TWI228548B (en) * 2000-05-26 2005-03-01 Ebara Corp Apparatus for processing substrate and apparatus for processing treatment surface of substrate
US20040007460A1 (en) * 2002-07-15 2004-01-15 Karl Sagedahl Clamping device having barbed pin
US20050145486A1 (en) * 2004-01-07 2005-07-07 Chung-Ho Chen Clipping device of an electroplating base plate
US20050274604A1 (en) * 2004-02-06 2005-12-15 Koji Saito Plating apparatus
USD583779S1 (en) 2006-07-13 2008-12-30 Ebara Corporation Electrolytic plating anode
USD572673S1 (en) 2006-07-13 2008-07-08 Ebara Corporation Anode shaft
US7507319B2 (en) * 2006-07-21 2009-03-24 Ebara Corporation Anode holder
US9464362B2 (en) 2012-07-18 2016-10-11 Deca Technologies Inc. Magnetically sealed wafer plating jig system and method
US8932443B2 (en) 2011-06-07 2015-01-13 Deca Technologies Inc. Adjustable wafer plating shield and method
JP6247557B2 (ja) * 2014-02-14 2017-12-13 株式会社Ｊｃｕ 基板めっき治具
KR101647074B1 (ko) 2016-06-07 2016-08-09 정진호 사면 연동 로테이션에 기반을 둔 도금 지그 거치용 틸팅 승강 유도체
JP6713863B2 (ja) * 2016-07-13 2020-06-24 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置
CN112251796A (zh) * 2020-10-15 2021-01-22 中山市汇佳精密科技有限公司 应用于太阳能电池片电镀挂具上的可翻转框架
CN119943672B (zh) * 2025-01-03 2025-10-31 华天科技（西安）有限公司 一种单颗qfn框架类产品锡化的方法、治具

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2739117A (en) * 1952-06-18 1956-03-20 Gen Motors Corp Electroplating fixture
US3461059A (en) * 1966-10-10 1969-08-12 Hammond Machinery Builders Inc Power operated electro-chemical fixture
DE3028635A1 (de) * 1980-07-29 1982-03-04 Degussa Ag, 6000 Frankfurt Vorrichtung zum partiellen galvanischen beschichten
JPS61187379A (ja) 1985-02-15 1986-08-21 Sanyo Electric Co Ltd 光起電力装置の製造方法
JPS61187379U (https=) * 1985-05-13 1986-11-21
JPH0686676B2 (ja) 1985-10-18 1994-11-02 旭化成工業株式会社 メツキ用電極部
JPS62188798A (ja) 1986-02-14 1987-08-18 Fujitsu Ltd メツキ用コンタクトピン
FR2633452B1 (fr) * 1988-06-28 1990-11-02 Doue Julien Dispositif de support pour un substrat mince, notamment en un materiau semiconducteur
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
JPH05222587A (ja) 1992-02-06 1993-08-31 Ibiden Co Ltd 電着塗装用クランプ
JPH0813198A (ja) 1994-07-04 1996-01-16 Hitachi Ltd 接触導通用電極及びそれを用いた半導体製造装置
US6228231B1 (en) * 1997-05-29 2001-05-08 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
CH693133A5 (de) * 1997-08-21 2003-03-14 Mecatool Ag Kupplungsanordnung für eine Bearbeitungseinrichtung.

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