KR100586473B1 - 웨이퍼의 도금지그 - Google Patents

웨이퍼의 도금지그 Download PDF

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Publication number
KR100586473B1
KR100586473B1 KR1020007007645A KR20007007645A KR100586473B1 KR 100586473 B1 KR100586473 B1 KR 100586473B1 KR 1020007007645 A KR1020007007645 A KR 1020007007645A KR 20007007645 A KR20007007645 A KR 20007007645A KR 100586473 B1 KR100586473 B1 KR 100586473B1
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KR
South Korea
Prior art keywords
wafer
jig
tip
plating
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020007007645A
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English (en)
Korean (ko)
Other versions
KR20010034038A (ko
Inventor
요시오카준이치로
도미오카겐야
센다이사토시
조노아츠시
오자와나오미츠
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20010034038A publication Critical patent/KR20010034038A/ko
Application granted granted Critical
Publication of KR100586473B1 publication Critical patent/KR100586473B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020007007645A 1998-01-12 1999-01-12 웨이퍼의 도금지그 Expired - Lifetime KR100586473B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10018151A JPH11204460A (ja) 1998-01-12 1998-01-12 ウエハのメッキ治具
JP10-18151 1998-01-12
PCT/JP1999/000059 WO1999035309A1 (fr) 1998-01-12 1999-01-12 Support pour metallisation de tranches

Publications (2)

Publication Number Publication Date
KR20010034038A KR20010034038A (ko) 2001-04-25
KR100586473B1 true KR100586473B1 (ko) 2006-06-07

Family

ID=11963625

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007007645A Expired - Lifetime KR100586473B1 (ko) 1998-01-12 1999-01-12 웨이퍼의 도금지그

Country Status (6)

Country Link
US (1) US6365020B1 (https=)
EP (1) EP1087039B9 (https=)
JP (1) JPH11204460A (https=)
KR (1) KR100586473B1 (https=)
DE (1) DE69939827D1 (https=)
WO (1) WO1999035309A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101647074B1 (ko) 2016-06-07 2016-08-09 정진호 사면 연동 로테이션에 기반을 둔 도금 지그 거치용 틸팅 승강 유도체

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
TWI228548B (en) * 2000-05-26 2005-03-01 Ebara Corp Apparatus for processing substrate and apparatus for processing treatment surface of substrate
US20040007460A1 (en) * 2002-07-15 2004-01-15 Karl Sagedahl Clamping device having barbed pin
US20050145486A1 (en) * 2004-01-07 2005-07-07 Chung-Ho Chen Clipping device of an electroplating base plate
US20050274604A1 (en) * 2004-02-06 2005-12-15 Koji Saito Plating apparatus
USD583779S1 (en) 2006-07-13 2008-12-30 Ebara Corporation Electrolytic plating anode
USD572673S1 (en) 2006-07-13 2008-07-08 Ebara Corporation Anode shaft
US7507319B2 (en) * 2006-07-21 2009-03-24 Ebara Corporation Anode holder
US9464362B2 (en) 2012-07-18 2016-10-11 Deca Technologies Inc. Magnetically sealed wafer plating jig system and method
US8932443B2 (en) 2011-06-07 2015-01-13 Deca Technologies Inc. Adjustable wafer plating shield and method
JP6247557B2 (ja) * 2014-02-14 2017-12-13 株式会社Ｊｃｕ 基板めっき治具
JP6713863B2 (ja) * 2016-07-13 2020-06-24 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置
CN112251796A (zh) * 2020-10-15 2021-01-22 中山市汇佳精密科技有限公司 应用于太阳能电池片电镀挂具上的可翻转框架
CN119943672B (zh) * 2025-01-03 2025-10-31 华天科技（西安）有限公司 一种单颗qfn框架类产品锡化的方法、治具

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2739117A (en) * 1952-06-18 1956-03-20 Gen Motors Corp Electroplating fixture
US3461059A (en) * 1966-10-10 1969-08-12 Hammond Machinery Builders Inc Power operated electro-chemical fixture
DE3028635A1 (de) * 1980-07-29 1982-03-04 Degussa Ag, 6000 Frankfurt Vorrichtung zum partiellen galvanischen beschichten
JPS61187379A (ja) 1985-02-15 1986-08-21 Sanyo Electric Co Ltd 光起電力装置の製造方法
JPS61187379U (https=) * 1985-05-13 1986-11-21
JPH0686676B2 (ja) 1985-10-18 1994-11-02 旭化成工業株式会社 メツキ用電極部
JPS62188798A (ja) 1986-02-14 1987-08-18 Fujitsu Ltd メツキ用コンタクトピン
FR2633452B1 (fr) * 1988-06-28 1990-11-02 Doue Julien Dispositif de support pour un substrat mince, notamment en un materiau semiconducteur
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
JPH05222587A (ja) 1992-02-06 1993-08-31 Ibiden Co Ltd 電着塗装用クランプ
JPH0813198A (ja) 1994-07-04 1996-01-16 Hitachi Ltd 接触導通用電極及びそれを用いた半導体製造装置
US6228231B1 (en) * 1997-05-29 2001-05-08 International Business Machines Corporation Electroplating workpiece fixture having liquid gap spacer
CH693133A5 (de) * 1997-08-21 2003-03-14 Mecatool Ag Kupplungsanordnung für eine Bearbeitungseinrichtung.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101647074B1 (ko) 2016-06-07 2016-08-09 정진호 사면 연동 로테이션에 기반을 둔 도금 지그 거치용 틸팅 승강 유도체

Also Published As

Publication number Publication date
WO1999035309A1 (fr) 1999-07-15
JPH11204460A (ja) 1999-07-30
EP1087039A4 (en) 2006-05-31
DE69939827D1 (de) 2008-12-11
EP1087039B1 (en) 2008-10-29
EP1087039B9 (en) 2009-08-19
US6365020B1 (en) 2002-04-02
KR20010034038A (ko) 2001-04-25
EP1087039A1 (en) 2001-03-28

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