JPH11168045A5 - - Google Patents

Info

Publication number
JPH11168045A5
JPH11168045A5 JP1997332584A JP33258497A JPH11168045A5 JP H11168045 A5 JPH11168045 A5 JP H11168045A5 JP 1997332584 A JP1997332584 A JP 1997332584A JP 33258497 A JP33258497 A JP 33258497A JP H11168045 A5 JPH11168045 A5 JP H11168045A5
Authority
JP
Japan
Prior art keywords
wafer
cover
semiconductor manufacturing
chamber
manufacturing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997332584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11168045A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9332584A priority Critical patent/JPH11168045A/ja
Priority claimed from JP9332584A external-priority patent/JPH11168045A/ja
Priority to US09/088,702 priority patent/US6217319B1/en
Publication of JPH11168045A publication Critical patent/JPH11168045A/ja
Publication of JPH11168045A5 publication Critical patent/JPH11168045A5/ja
Pending legal-status Critical Current

Links

JP9332584A 1997-12-03 1997-12-03 半導体製造装置およびウェハの処理方法 Pending JPH11168045A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9332584A JPH11168045A (ja) 1997-12-03 1997-12-03 半導体製造装置およびウェハの処理方法
US09/088,702 US6217319B1 (en) 1997-12-03 1998-06-02 Semiconductor manufacturing device and method of processing wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9332584A JPH11168045A (ja) 1997-12-03 1997-12-03 半導体製造装置およびウェハの処理方法

Publications (2)

Publication Number Publication Date
JPH11168045A JPH11168045A (ja) 1999-06-22
JPH11168045A5 true JPH11168045A5 (forum.php) 2005-04-07

Family

ID=18256575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9332584A Pending JPH11168045A (ja) 1997-12-03 1997-12-03 半導体製造装置およびウェハの処理方法

Country Status (2)

Country Link
US (1) US6217319B1 (forum.php)
JP (1) JPH11168045A (forum.php)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW464931B (en) * 1999-10-19 2001-11-21 Tokyo Electron Ltd Heating processing device
KR100479942B1 (ko) * 2002-06-28 2005-03-30 참이앤티 주식회사 웨이퍼 가열장치
JP4833005B2 (ja) * 2006-09-11 2011-12-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US20080008837A1 (en) * 2006-07-10 2008-01-10 Yasuhiro Shiba Substrate processing apparatus and substrate processing method for heat-treating substrate
KR101696196B1 (ko) * 2015-05-29 2017-01-17 세메스 주식회사 기판 처리 장치
CN119105239A (zh) * 2023-06-09 2024-12-10 沈阳芯源微电子设备股份有限公司 盘盖单元及烘烤装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841614A (en) * 1971-12-06 1974-10-15 Kawasaki Heavy Ind Ltd Apparatus for preheating steel ingot or blooms by the use of high-speed jet streams as well as heating furnace using the same
US4556785A (en) * 1983-05-23 1985-12-03 Gca Corporation Apparatus for vapor sheathed baking of semiconductor wafers
JPS63107116A (ja) 1986-10-24 1988-05-12 Fujitsu Ltd レジストベ−キング方法
JPH03163819A (ja) 1989-11-22 1991-07-15 Mitsubishi Electric Corp 半導体装置の製造方法
JPH0684781A (ja) 1992-09-03 1994-03-25 Fujitsu Ltd 半導体製造装置
JP3983831B2 (ja) * 1995-05-30 2007-09-26 シグマメルテック株式会社 基板ベーキング装置及び基板ベーキング方法
TW464944B (en) * 1997-01-16 2001-11-21 Tokyo Electron Ltd Baking apparatus and baking method

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