JPH11121933A - 多層プリント配線板および電子部品を実装したプリント配線板 - Google Patents

多層プリント配線板および電子部品を実装したプリント配線板

Info

Publication number
JPH11121933A
JPH11121933A JP9285175A JP28517597A JPH11121933A JP H11121933 A JPH11121933 A JP H11121933A JP 9285175 A JP9285175 A JP 9285175A JP 28517597 A JP28517597 A JP 28517597A JP H11121933 A JPH11121933 A JP H11121933A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
pattern
layer
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9285175A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11121933A5 (enExample
Inventor
Shiyouji Ichimasa
昭司 一政
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP9285175A priority Critical patent/JPH11121933A/ja
Publication of JPH11121933A publication Critical patent/JPH11121933A/ja
Publication of JPH11121933A5 publication Critical patent/JPH11121933A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9285175A 1997-10-17 1997-10-17 多層プリント配線板および電子部品を実装したプリント配線板 Pending JPH11121933A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9285175A JPH11121933A (ja) 1997-10-17 1997-10-17 多層プリント配線板および電子部品を実装したプリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9285175A JPH11121933A (ja) 1997-10-17 1997-10-17 多層プリント配線板および電子部品を実装したプリント配線板

Publications (2)

Publication Number Publication Date
JPH11121933A true JPH11121933A (ja) 1999-04-30
JPH11121933A5 JPH11121933A5 (enExample) 2007-01-25

Family

ID=17688080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9285175A Pending JPH11121933A (ja) 1997-10-17 1997-10-17 多層プリント配線板および電子部品を実装したプリント配線板

Country Status (1)

Country Link
JP (1) JPH11121933A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7514779B2 (en) 1998-09-17 2009-04-07 Ibiden Co., Ltd. Multilayer build-up wiring board
CN101675519B (zh) 2007-05-22 2012-04-18 国际商业机器公司 集成电路封装和制造集成电路的方法
CN103608915A (zh) * 2011-06-21 2014-02-26 株式会社村田制作所 电路模块

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7514779B2 (en) 1998-09-17 2009-04-07 Ibiden Co., Ltd. Multilayer build-up wiring board
US7847318B2 (en) 1998-09-17 2010-12-07 Ibiden Co., Ltd. Multilayer build-up wiring board including a chip mount region
CN101675519B (zh) 2007-05-22 2012-04-18 国际商业机器公司 集成电路封装和制造集成电路的方法
CN103608915A (zh) * 2011-06-21 2014-02-26 株式会社村田制作所 电路模块
US9961764B2 (en) 2011-06-21 2018-05-01 Murata Manufacturing Co., Ltd. Circuit module

Similar Documents

Publication Publication Date Title
US6888240B2 (en) High performance, low cost microelectronic circuit package with interposer
US7271348B1 (en) Providing decoupling capacitors in a circuit board
US6528734B2 (en) Semiconductor device and process for fabricating the same
KR100600202B1 (ko) 저인덕턴스집적회로패키지
JP3287673B2 (ja) 半導体装置
JP2002261402A (ja) 電子回路ユニットの回路基板
US6657133B1 (en) Ball grid array chip capacitor structure
US8633398B2 (en) Circuit board contact pads
JP3082579B2 (ja) シールドケース
JP3166490B2 (ja) Ｂｇａ型半導体装置
JP2001144205A (ja) 多端子素子及びプリント配線板
US6953893B1 (en) Circuit board for connecting an integrated circuit to a support and IC BGA package using same
JPH01256161A (ja) 印刷配線板装置
JPH11121933A (ja) 多層プリント配線板および電子部品を実装したプリント配線板
JP3330468B2 (ja) 配線基板及び半導体装置
JP4113969B2 (ja) プリント配線板
JP2933729B2 (ja) プリント配線基板装置
US6509646B1 (en) Apparatus for reducing an electrical noise inside a ball grid array package
JPH07183627A (ja) 部品実装プリント基板
JPH0215699A (ja) 多層印刷配線板
JP2006013029A (ja) 半導体パッケージ
JP2001257445A (ja) プリント配線板
JPH0553269U (ja) 高周波シールド構造を有する多層配線基板
JP2000091463A (ja) Ｂｇａパッケージ
JPH0555719A (ja) 回路基板装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041015

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041015

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20061106

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20061219

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070508