JPH11121933A5 - - Google Patents

Info

Publication number
JPH11121933A5
JPH11121933A5 JP1997285175A JP28517597A JPH11121933A5 JP H11121933 A5 JPH11121933 A5 JP H11121933A5 JP 1997285175 A JP1997285175 A JP 1997285175A JP 28517597 A JP28517597 A JP 28517597A JP H11121933 A5 JPH11121933 A5 JP H11121933A5
Authority
JP
Japan
Prior art keywords
layer
wiring board
multilayer printed
printed wiring
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997285175A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11121933A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9285175A priority Critical patent/JPH11121933A/ja
Priority claimed from JP9285175A external-priority patent/JPH11121933A/ja
Publication of JPH11121933A publication Critical patent/JPH11121933A/ja
Publication of JPH11121933A5 publication Critical patent/JPH11121933A5/ja
Pending legal-status Critical Current

Links

JP9285175A 1997-10-17 1997-10-17 多層プリント配線板および電子部品を実装したプリント配線板 Pending JPH11121933A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9285175A JPH11121933A (ja) 1997-10-17 1997-10-17 多層プリント配線板および電子部品を実装したプリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9285175A JPH11121933A (ja) 1997-10-17 1997-10-17 多層プリント配線板および電子部品を実装したプリント配線板

Publications (2)

Publication Number Publication Date
JPH11121933A JPH11121933A (ja) 1999-04-30
JPH11121933A5 true JPH11121933A5 (enExample) 2007-01-25

Family

ID=17688080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9285175A Pending JPH11121933A (ja) 1997-10-17 1997-10-17 多層プリント配線板および電子部品を実装したプリント配線板

Country Status (1)

Country Link
JP (1) JPH11121933A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080023369A (ko) 1998-09-17 2008-03-13 이비덴 가부시키가이샤 다층빌드업배선판
US7646082B2 (en) 2007-05-22 2010-01-12 International Business Machines Corporation Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density
JP5754507B2 (ja) * 2011-06-21 2015-07-29 株式会社村田製作所 回路モジュール

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