JPH10500633A - 高度な耐摩耗性コーティングの蒸着のためのイオンビーム法 - Google Patents
高度な耐摩耗性コーティングの蒸着のためのイオンビーム法Info
- Publication number
- JPH10500633A JPH10500633A JP7523076A JP52307695A JPH10500633A JP H10500633 A JPH10500633 A JP H10500633A JP 7523076 A JP7523076 A JP 7523076A JP 52307695 A JP52307695 A JP 52307695A JP H10500633 A JPH10500633 A JP H10500633A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- ion beam
- ion source
- precursor gas
- ion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 191
- 238000000034 method Methods 0.000 title claims abstract description 182
- 238000010884 ion-beam technique Methods 0.000 title claims abstract description 112
- 230000008021 deposition Effects 0.000 title claims description 61
- 239000000758 substrate Substances 0.000 claims abstract description 198
- 150000002500 ions Chemical class 0.000 claims abstract description 144
- 239000011248 coating agent Substances 0.000 claims abstract description 139
- 238000005299 abrasion Methods 0.000 claims abstract description 70
- 229920003023 plastic Polymers 0.000 claims abstract description 41
- 239000004033 plastic Substances 0.000 claims abstract description 39
- 238000000992 sputter etching Methods 0.000 claims abstract description 34
- 239000000356 contaminant Substances 0.000 claims abstract description 25
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 20
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 20
- 238000001704 evaporation Methods 0.000 claims abstract description 9
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- 229910052710 silicon Inorganic materials 0.000 claims description 111
- 239000007789 gas Substances 0.000 claims description 101
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 100
- 229910052760 oxygen Inorganic materials 0.000 claims description 82
- 238000000151 deposition Methods 0.000 claims description 80
- 239000000463 material Substances 0.000 claims description 75
- 229910052739 hydrogen Inorganic materials 0.000 claims description 61
- 229910052799 carbon Inorganic materials 0.000 claims description 59
- 239000002243 precursor Substances 0.000 claims description 52
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 51
- 229910052786 argon Inorganic materials 0.000 claims description 50
- 229910052757 nitrogen Inorganic materials 0.000 claims description 50
- 239000010703 silicon Substances 0.000 claims description 49
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 42
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 37
- 239000001301 oxygen Substances 0.000 claims description 37
- 238000004519 manufacturing process Methods 0.000 claims description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 28
- 239000011521 glass Substances 0.000 claims description 24
- 239000001257 hydrogen Substances 0.000 claims description 22
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 230000001965 increasing effect Effects 0.000 claims description 14
- 238000007737 ion beam deposition Methods 0.000 claims description 12
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 11
- 229910001882 dioxygen Inorganic materials 0.000 claims description 11
- 125000004429 atom Chemical group 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 claims description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 9
- 239000011261 inert gas Substances 0.000 claims description 9
- 238000007740 vapor deposition Methods 0.000 claims description 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 8
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 7
- -1 oxygen ions Chemical class 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 238000001771 vacuum deposition Methods 0.000 claims description 6
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 5
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 229910021529 ammonia Inorganic materials 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229910052743 krypton Inorganic materials 0.000 claims description 4
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- 229910052724 xenon Inorganic materials 0.000 claims description 4
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 4
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 claims description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 3
- 238000007872 degassing Methods 0.000 claims 4
- 239000012780 transparent material Substances 0.000 claims 4
- WSPOQKCOERDWJQ-UHFFFAOYSA-N 2-methyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C[SiH]1O[SiH2]O[SiH2]O[SiH2]O1 WSPOQKCOERDWJQ-UHFFFAOYSA-N 0.000 claims 2
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 claims 1
- ACXIAEKDVUJRSK-UHFFFAOYSA-N methyl(silyloxy)silane Chemical compound C[SiH2]O[SiH3] ACXIAEKDVUJRSK-UHFFFAOYSA-N 0.000 claims 1
- 238000007738 vacuum evaporation Methods 0.000 claims 1
- 238000005137 deposition process Methods 0.000 abstract description 11
- 239000010410 layer Substances 0.000 description 49
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 30
- 230000008569 process Effects 0.000 description 26
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 18
- 238000009792 diffusion process Methods 0.000 description 12
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 12
- 239000010935 stainless steel Substances 0.000 description 12
- 229910001220 stainless steel Inorganic materials 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 11
- 229920000515 polycarbonate Polymers 0.000 description 10
- 239000004417 polycarbonate Substances 0.000 description 10
- 229910001873 dinitrogen Inorganic materials 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 229910002804 graphite Inorganic materials 0.000 description 8
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- 239000004215 Carbon black (E152) Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 238000010849 ion bombardment Methods 0.000 description 4
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- 239000011253 protective coating Substances 0.000 description 4
- 238000013341 scale-up Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
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- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000615 nonconductor Substances 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
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- 239000002356 single layer Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- UCXUKTLCVSGCNR-UHFFFAOYSA-N diethylsilane Chemical compound CC[SiH2]CC UCXUKTLCVSGCNR-UHFFFAOYSA-N 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
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- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- RVLCUCVJZVRNDC-IMJSIDKUSA-N 2-[(2s,5s)-5-methyl-3,6-dioxopiperazin-2-yl]acetic acid Chemical compound C[C@@H]1NC(=O)[C@H](CC(O)=O)NC1=O RVLCUCVJZVRNDC-IMJSIDKUSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
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- 239000006117 anti-reflective coating Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000005229 chemical vapour deposition Methods 0.000 description 1
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- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- BAQNULZQXCKSQW-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Ti+4] BAQNULZQXCKSQW-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
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- 239000002594 sorbent Substances 0.000 description 1
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- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
- C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/308—Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
- C23C16/345—Silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
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Abstract
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Claims (1)
- 【特許請求の範囲】 1.基体表面上に、保護、耐摩耗性コーティングを製造する方法であって、 汚染物質を除去するために上記基体表面を化学洗浄し、 残りの汚染物質を更に除去し上記表面を活性化するために、真空蒸着チャンバ ー内で強力イオンのビームで、上記基体表面をスパッターエッチングし、 以下の、Si及びC;Si、C及びH;Si及びN;Si、N及びH;Si及 びO;Si、O及びH;Si、O及びN;Si、O、N及びH;Si、C及びN ;Si、C、H及びN;Si、C及びO;Si、C、H及びO;Si、C、O及 びN;Si、C、H、O及びNからなる群から選択される原子の組み合わせの少 なくとも1つを含有する耐摩耗性コーティング材料の層を前駆体ガスを用いてイ オンビーム蒸着し、 真空チャンバーの圧力を実質的に大気圧に上昇させ、 耐摩耗性が向上した被覆基体製品を回収する、 工程からなる方法。 2.上記前駆体ガスが、Si及びC;Si、C及びH;Si及びN;Si、N及 びH;Si及びO;Si、O及びH;Si、O及びN;Si、O、N及びH;S i、C及びN;Si、C、H及びN;Si、C及びO;Si、C、H及びO;S i、C、O及びN;Si、C、H、O及びNの原子の組み合わせを1つ含む、請 求項1記載の方法。 3.上記汚染物質が、残留炭化水素、表面酸化物及び他の好ましくない材料から なる群から選択される、請求項1記載の方法。 4.上記前駆体ガスが、酸素及びヘキサメチルジシロキサンを含有する、請求項 1記載の方法。 5.上記前駆体ガスが、酸素及びテトラメチルシクロテトラシロキサンを含有す る、請求項1記載の方法。 6.上記前駆体ガスが、酸素及びオクタメチルシクロテトラシロキサンを含有す る、請求項1記載の方法。 7.上記前駆体ガスが、酸素及びテトラエトキシシランを含有する、請求項1記 載の方法。 8.上記前駆体ガスが、酸素、シラン及びアンモニアを含有する、請求項1記載 の方法。 9.上記スパッターエッチング工程が、不活性ガスのイオンを含有するイオンビ ームで行われる、請求項1記載の方法。 10.上記不活性ガスが、アルゴン、クリプトン、キセノン及びそれらの混合物か らなる群から選択される、請求項9記載の方法。 11.上記スパッターエッチング工程が、酸素イオンを含有するイオンビームで行 われる、請求項1記載の方法。 12.上記真空チャンバーが、上記真空チャンバーから空気が脱気されたチャンバ ーである、請求項1記載の方法。 13.上記耐摩耗性コーティング材料が、非晶質炭化ケイ素、窒化ケイ素、酸化ケ イ素、オキシ窒化ケイ素、オキシ炭化ケイ素、炭化窒化ケイ素、オキシ炭化窒素 ケイ素、それらの混合物及びそれらの化合物からなる群から選択される、請求項 1記載の方法。 14.上記基体が、光学的に透明な材料である、請求項1記載の方法。 15.上記基体材料が、プラスチックである、請求項14記載の方法。 16.上記基体がレンズである、請求項15記載の方法。 17.上記基体が光学的に透明なレンズである、請求項1記載の方法。 18.上記基体がバーコードスキャナーウィンドウである、請求項14記載の方法 。 19.上記耐摩耗性コーティングが、所定の波長で反射を減少する、少なくとも2 種類の異なる屈折率の多層を含有する、請求項14記載の方法。 20.上記耐摩耗性コーティングが、所定の波長で反射を減少する、少なくとも2 種類の異なる屈折率の多層を含有する、請求項15記載の方法。 21.上記耐摩耗性コーティングが、所定の波長で反射を減少する、少なくとも2 種類の異なる屈折率の多層を含有する、請求項16記載の方法。 22.上記耐摩耗性コーティングが、所定の波長で反射を減少する、少なくとも2 種類の異なる屈折率の多層を含有する、請求項17記載の方法。 23.上記基体が、光学的に透明な材料である、請求項13記載の方法。 24.上記基体材料がプラスチックである、請求項23記載の方法。 25.上記基体がレンズである、請求項24記載の方法。 26.上記基体が、光学的に透明なレンズである、請求項23記載の方法。 27.上記基体がバーコードスキャナーウインドウである、請求項23記載の方法 。 28.上記耐摩耗性コーティングが、所定の波長で反射を減少する、少なくとも2 種類の異なる屈折率の多層を含有する、請求項23記載の方法。 29.上記耐摩耗性コーティングが、所定の波長で反射を減少する、少なくとも2 種類の異なる屈折率の多層を含有する、請求項24記載の方法。 30.上記耐摩耗性コーティングが、所定の波長で反射を減少する、少なくとも2 種類の異なる屈折率の多層を含有する、請求項25記載の方法。 31.上記耐摩耗性コーティングが、所定の波長で反射を減少する、少なくとも2 種類の異なる屈折率の多層を含有する、請求項26記載の方法。 32.上記基体が、金属、セラミック、ガラス及びプラスチックからなる群から選 択される材料を含有する、請求項1記載の方法。 33.上記基体が、金属、セラミック、ガラス及びプラスチックからなる群から選 択される材料を含有する、請求項13記載の方法。 34.上記耐摩耗性コーティング材料が、グリッドKaufman 型イオン源を用いてイ オンビーム蒸着されている、請求項1記載の方法。 35.上記耐摩耗性コーティング材料が、高周波プラズマで作動するグリッドイオ ン源を用いてイオンビーム蒸着されている、請求項1記載の方法。 36.上記耐摩耗性コーティング材料が、マイクロ波周波プラズマ作動するグリッ ドイオン源を用いてイオンビーム蒸着されている、請求項1記載の方法。 37.上記耐摩耗性コーティング材料が、電子サイクロトロン共鳴条件でのマイク ロ波周波プラズマ作動するグリッドイオン源を用いてイオンビーム蒸着されてい る、請求項1記載の方法。 38.上記耐摩耗性コーティング材料が、End Hallイオン源を用いてイオンビーム 蒸着されている、請求項1記載の方法。 39.上記耐摩耗性コーティング材料が、Hall型加速器イオン源を用いてイオンビ ーム蒸着されている、請求項1記載の方法。 40.上記前駆体ガスが、イオン源のプラズマチャンバーに直接導入される、請求 項1記載の方法。 41.少なくとも1つのガスがイオン源のプラズマチャンバー内に導入され、上記 前駆体ガスがイオン源真空チャンバーの外部からイオンビームに導入される、請 求項1記載の方法。 42.少なくとも1つのガスがイオン源のプラズマチャンバー内に導入され、上記 前駆体ガスがイオン源プラズマチャンバーの外部から上記基体に接近して導入さ れる、請求項1記載の方法。 43.上記前駆体ガスが酸素及びヘキサメチルジシロキサンを含有し、End Hallイ オン源のプラズマチャンバー内に直接導入される、請求項1記載の方法。 44.酸素ガスがEnd Hallイオン源のプラズマチャンバーに直接導入され、ヘキサ メチルジシロキサン蒸気がイオン源プラズマチャンバーの外部からイオンビーム に導入される、請求項1記載の方法。 45.上記前駆体ガスが酸素及びテトラメチルシクロテトラシロキサンを含有し、 End Hallイオン源のプラズマチャンバーに直接導入される、請求項1記載の方法 。 46.酸素ガスがEnd Hallイオン源のプラズマチャンバーに直接導入され、テトラ メチルシクロテトラシロキサン蒸気がイオン源プラズマチャンバーの外部からイ オンビームに導入される、請求項1記載の方法。 47.上記前駆体ガスが酸素及びオクタメチルシクロテトラシロキサンを含有し、 End Hallイオン源のプラズマチャンバーに直接導入される、請求項1記載の方法 。 48.酸素ガスがEnd Hallイオン源のプラズマチャンバーに直接導入され、オクタ メチルシクロテトラシロキサン蒸気がイオン源プラズマチャンバーの外部からイ オンビームに導入される、請求項1記載の方法。 49.上記前駆体ガスが酸素及びテトラエトキシシランを含有し、End Hallイオン 源のプラズマチャンバーに直接導入される、請求項1記載の方法。 50.酸素ガスがEnd Hallイオン源のプラズマチャンバーに直接導入され、テトラ エトキシシラン蒸気がイオン源プラズマチャンバーの外部からイオンビームに 導入される、請求項1記載の方法。 51.請求項1記載の方法の方法。 52.下記工程(a)〜(g)からなる、基体表面に、保護、耐摩耗性コーティングを製 造する方法。 (a) 残留炭化水素及び他の汚染物質を除去するために、上記基体の表面を化学 洗浄し、 (b) 上記基体を蒸着真空チャンバー内に配置し、上記チャンバー内を脱気して 、 (c) 残留炭化水素及び他の表面汚染物質を更に除去し、表面を活性化するため に、強力なガスイオンビームで上記基体表面をスパッターエッチングし、 (d) 非晶質炭化ケイ素、窒化ケイ素、酸化ケイ素、オキシ窒化ケイ素、オキシ 炭化ケイ素、炭化窒化ケイ素、オキシ炭化窒素ケイ素、それらの混合物及びそれ らの化合物からなる群から選択される材料の中間層を前駆体ガスを用いてイオン ビーム蒸着し、 (e) 上記中間層の上にDLCコーティング材料の層を蒸着し、 (f) 真空チャンバー内の圧力を大気圧まで上昇させ、 (g) 耐摩耗性が向上した被覆基体製品を回収する。 53.上記DLCコーティングが、End Hallイオン源によって生成されるイオンビ ームから蒸着される、請求項52記載の方法。 54.上記基体が、プラスチック、金属、ガラス及びセラミックからなる群から選 択される材料からなる、請求項52記載の方法。 55.上記基体が、プラスチック、金属、ガラス及びセラミックからなる群から選 択される材料からなる、請求項53記載の方法。 56.上記基体が、光学的に透明な材料である、請求項52記載の方法。 57.上記基体が、光学的に透明な材料である、請求項53記載の方法。 58.上記基体が、光学的に透明なレンズである、請求項52記載の方法。 59.上記基体が、光学的に透明なレンズである、請求項53記載の方法。 60.上記基体が、バーコードスキャナーウインドウである、請求項56記載の方 法。 61.上記基体が、バーコードスキャナーウインドウである、請求項57記載の方 法。 62.上記DLCコーティングのための前駆体ガスがメタンである、請求項53記 載の方法。 63.上記DLCコーティングのための前駆体ガスがシクロヘキサンである、請求 項53記載の方法。 64.請求項52記載の方法の製品。 65.下記工程(a)〜(f)からなる、基体表面に、保護、耐摩耗性コーティングを製 造する方法。 (a) 残留炭化水素及び他の汚染物質を除去するために、上記基体表面を化学洗 浄し、 (b) 上記基体を蒸着真空チャンバー内に配置し、上記チャンバー内を脱気して 、 (c) 残留炭化水素及び他の表面汚染物質を更に除去し、表面を活性化するため に、強力なガスイオンビームで上記基体表面をスパッターエッチングし、 (d) End Hallイオン源で生成されるイオンビームを用いた、耐摩耗性DLCコ ーティング材料の層を前駆体ガスを用いてイオンビーム蒸着し、 (e) 真空チャンバー内の圧力を大気圧まで上昇させ、 (f) 耐摩耗性が向上した被覆基体製品を回収する。 66.上記基体がプラスチック材料である、請求項65記載の方法。 67.上記基体材料がケイ素又はゲルマニウムである、請求項65記載の方法。 68.上記DLCコーティング材料のための前駆体ガスがメタンである、請求項6 5記載の方法。 69.上記DLCコーティング材料のための前駆体ガスがシクロヘキサンである、 請求項65記載の方法。 70.請求項65記載の方法の製品。 71.下記工程(a)〜(f)からなる、原基体上に、C、H、Si及びOからなる、耐 摩耗性コーティング材料を蒸着する方法。 (a) 残留炭化水素及び他の汚染物質を除去するために、上記基体表面を化学洗 浄し、 (b) 上記基体を蒸着真空チャンバー内に配置し、上記チャンバー内を脱気して 、 (c) 残りの炭化水素及び他の表面汚染物質を更に除去し、表面を活性化するた めに、強力なガスイオンビームで上記基体表面をスパッターエッチングし、 (d) 上記基体を、炭素、水素、ケイ素及び酸素を含有する前駆体ガスにさらす ことにより、上記耐摩耗性材料の層を上記基体表面上にイオンビーム蒸着し、上 記前駆体ガスが上記イオンビームによって活性化され、上記基体が蒸着に際し強 力イオン照射され、 (e) 真空チャンバー内の圧力を大気圧まで上昇させ、 (f) ナノインデンテーション硬度が約2〜約5GPaの範囲で引張ひずみ対微 小割れが約1%未満である耐摩耗性が向上した被覆基体製品を回収する。 72.上記前駆体ガスが窒素をも含有し、上記耐摩耗性コーティング材料が窒素を も含有する、請求項71記載の方法。 73.上記耐摩耗性コーティング材料がグリッドイオン源を用いてイオンビーム蒸 着されている、請求項71記載の方法。 74.上記耐摩耗性コーティング材料が、グリッドレスイオン源を用いてイオンビ ーム蒸着されている、請求項71記載の方法。 75.上記前駆体ガスがイオン源のプラズマチャンバー内に直接導入される、請求 項71記載の方法。 76.上記前駆体ガスがイオン源のプラズマチャンバー内に導入され、上記前駆体 ガスの残りの部分がイオンプラズマチャンバーの外部からイオンビームに導入さ れる、請求項71記載の方法。 77.上記前駆体ガスが酸素を含有する、請求項71記載の方法。 78.上記前駆体ガスが、シロキサン、シラン、シラザン及びそれらの混合物から なる群から選択される材料である、請求項71記載の方法。 79.上記前駆体ガスが、ヘキサメチルジシロキサン、テトラメチルシクロテトラ シロキサン、オクタメチルシクロテトラシロキサン及びそれらの混合物からなる 群から選択される材料である、請求項71記載の方法。 80.下記工程(a)〜(g)からなる、原基体上に、C、H、Si及びOからなる、耐 摩耗性コーティング材料を蒸着する方法。 (a) 残留炭化水素及び他の汚染物質を除去するために、上記基体表面を化学洗 浄し、 (b) 上記基体を蒸着真空チャンバー内に配置し、上記チャンバー内を脱気して 、 (c) 残りの炭化水素及び他の表面汚染物質を更に除去し、表面を活性化するた めに、強力なガスイオンビームで上記基体表面をスパッターエッチングし、 (d) 上記基体を、炭素、水素、ケイ素及び酸素を含有する前駆体ガスにさらす ことにより上記基体表面上に、ナノインデンテーション硬度が約2〜約5GPa の範囲で引張ひずみ対微小割れが約1%未満の特性を有する耐摩耗性材料の中間 層をイオンビーム蒸着し、上記前駆体ガスが上記イオンビームによって活性化さ れ、上記基体が蒸着に際し強力イオン照射され、 (e) 上記中間層上に耐摩耗性DLC材料の層を蒸着し、 (f) 真空チャンバー内の圧力を大気圧まで上昇させ、 (g) 耐摩耗性が向上した被覆基体製品を回収する。 81.上記前駆体ガスが窒素をも含有し、上記耐摩耗性コーティング材料が窒素を も含有する、請求項80記載の方法。 82.上記耐摩耗性コーティング材料が、グリッドイオン源を用いてイオンビーム 蒸着されている、請求項80記載の方法。 83.上記耐摩耗性コーティング材料が、グリッドレスイオン源を用いてイオンビ ーム蒸着されている、請求項80記載の方法。 84.記前駆体ガスがイオン源のプラズマチャンバー内に直接導入される、請求項 80記載の方法。 85.上記前駆体ガスがイオン源のプラズマチャンバー内に導入され、上記前駆体 ガスの残りの部分がイオンプラズマチャンバーの外部からイオンビームに導入さ れる、請求項80記載の方法。 86.上記基体が、プラスチック、金属、ガラス及びセラミックからなる群から選 択される材料からなる、請求項80記載の方法。 87.上記中間層を形成する上記前駆体ガスが、シロキサン、シラン、シラザン及 びそれらの混合物からなる群から選択される材料である、請求項80記載の方法 。 88.上記中間層を形成する上記前駆体ガスが、ヘキサメチルジシロキサン、テト ラメチルシクロテトラシロキサン、オクタメチルシクロテトラシロキサン及びそ れらの混合物からなる群から選択される材料である、請求項80記載の方法。 89.下記工程(a)〜(f)からなる、基体表面に保護、耐摩耗性コーティングを製造 する方法。 (a) 残留炭化水素及び他の汚染物質を除去するために、上記基体表面を化学洗 浄し、 (b) 上記基体を蒸着真空チャンバー内に配置し、上記チャンバーから空気を排 出し、 (c) 残りの炭化水素及び他の表面汚染物質を更に除去し、表面を活性化するた めに、強力なガスイオンビームで上記基体表面をスパッターエッチングし、 (d) 中空陰極電子源を有するEnd Hallイオン源によって生成される、耐摩耗性 コーティング材料の層を、前駆体ガスを用いてイオンビーム蒸着し、酸素を上記 イオン源のプラズマチャンバーに導入し、オクタメチルシクロテトラシロキサン をイオンビーム内に直接導入し、 (e) 真空チャンバー内の圧力を大気圧まで上昇させ、 (f) 耐摩耗性が向上した被覆基体製品を回収する。
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JP52307695A Expired - Fee Related JP3837159B2 (ja) | 1994-03-03 | 1995-03-01 | 高度な耐摩耗性コーティングの蒸着のためのイオンビーム法 |
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US (2) | US5508368A (ja) |
EP (1) | EP0748260B2 (ja) |
JP (1) | JP3837159B2 (ja) |
AT (1) | ATE240162T1 (ja) |
DE (1) | DE69530758T3 (ja) |
WO (1) | WO1995023652A1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
US5508368A (en) | 1996-04-16 |
DE69530758D1 (de) | 2003-06-18 |
EP0748260A1 (en) | 1996-12-18 |
USRE37294E1 (en) | 2001-07-24 |
WO1995023652A1 (en) | 1995-09-08 |
JP3837159B2 (ja) | 2006-10-25 |
DE69530758T2 (de) | 2003-11-27 |
EP0748260A4 (en) | 1998-07-15 |
EP0748260B1 (en) | 2003-05-14 |
DE69530758T3 (de) | 2009-12-31 |
EP0748260B2 (en) | 2009-10-28 |
ATE240162T1 (de) | 2003-05-15 |
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