JPH10340920A5 - - Google Patents

Info

Publication number
JPH10340920A5
JPH10340920A5 JP1997151749A JP15174997A JPH10340920A5 JP H10340920 A5 JPH10340920 A5 JP H10340920A5 JP 1997151749 A JP1997151749 A JP 1997151749A JP 15174997 A JP15174997 A JP 15174997A JP H10340920 A5 JPH10340920 A5 JP H10340920A5
Authority
JP
Japan
Prior art keywords
pad portion
opening
conductive
wiring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997151749A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10340920A (ja
JP3906522B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP15174997A priority Critical patent/JP3906522B2/ja
Priority claimed from JP15174997A external-priority patent/JP3906522B2/ja
Publication of JPH10340920A publication Critical patent/JPH10340920A/ja
Publication of JPH10340920A5 publication Critical patent/JPH10340920A5/ja
Application granted granted Critical
Publication of JP3906522B2 publication Critical patent/JP3906522B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP15174997A 1997-06-10 1997-06-10 半導体装置の製造方法 Expired - Fee Related JP3906522B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15174997A JP3906522B2 (ja) 1997-06-10 1997-06-10 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15174997A JP3906522B2 (ja) 1997-06-10 1997-06-10 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPH10340920A JPH10340920A (ja) 1998-12-22
JPH10340920A5 true JPH10340920A5 (OSRAM) 2005-03-17
JP3906522B2 JP3906522B2 (ja) 2007-04-18

Family

ID=15525454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15174997A Expired - Fee Related JP3906522B2 (ja) 1997-06-10 1997-06-10 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP3906522B2 (OSRAM)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW426980B (en) * 1999-01-23 2001-03-21 Lucent Technologies Inc Wire bonding to copper
JP2003031575A (ja) 2001-07-17 2003-01-31 Nec Corp 半導体装置及びその製造方法
JP2003303848A (ja) * 2002-04-12 2003-10-24 Nec Compound Semiconductor Devices Ltd 半導体装置
KR20040045109A (ko) * 2002-11-22 2004-06-01 주식회사 하이닉스반도체 반도체 소자의 제조 방법
JP2004221098A (ja) 2003-01-09 2004-08-05 Renesas Technology Corp 半導体装置およびその製造方法
JP2008091454A (ja) * 2006-09-29 2008-04-17 Rohm Co Ltd 半導体装置及び半導体装置の製造方法
US7485564B2 (en) * 2007-02-12 2009-02-03 International Business Machines Corporation Undercut-free BLM process for Pb-free and Pb-reduced C4
JP4701264B2 (ja) * 2008-04-18 2011-06-15 ルネサスエレクトロニクス株式会社 半導体装置、および半導体装置の製造方法
JP5582879B2 (ja) * 2010-06-09 2014-09-03 株式会社東芝 半導体装置及びその製造方法
JP5621712B2 (ja) * 2011-06-06 2014-11-12 株式会社デンソー 半導体チップ
JP2014222742A (ja) * 2013-05-14 2014-11-27 トヨタ自動車株式会社 半導体装置
DE102016101801B4 (de) * 2016-02-02 2021-01-14 Infineon Technologies Ag Lastanschluss eines leistungshalbleiterbauelements, leistungshalbleitermodul damit und herstellungsverfahren dafür
JP7379845B2 (ja) * 2019-03-28 2023-11-15 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法、電子デバイス、電子機器および移動体

Similar Documents

Publication Publication Date Title
TW442932B (en) Semiconductor package and method of fabricating the same
US7476959B2 (en) Encapsulated electronic device
KR100304681B1 (ko) 몰드bga형반도체장치및그제조방법
US7109065B2 (en) Bumped chip carrier package using lead frame and method for manufacturing the same
US6162664A (en) Method for fabricating a surface mounting type semiconductor chip package
US20030080439A1 (en) Delamination-preventing substrate and semiconductor package with the same
JPH10340920A5 (OSRAM)
US20070222044A1 (en) Electronic Component and Methods to Produce an Electronic Component
JP2006507686A5 (OSRAM)
GB2337636A (en) Semiconductor wafer fabrication of inside-wrapped contacts for electronic devices
CN101465301A (zh) 晶片水平的芯片级封装
US20040061206A1 (en) Discrete package having insulated ceramic heat sink
CN101290930A (zh) 包含半导体芯片叠层的半导体器件及其制造方法
JP4408475B2 (ja) ボンディングワイヤを採用しない半導体装置
US5446959A (en) Method of packaging a power semiconductor device
JP3072735B2 (ja) ２重金属被覆パッド面へのワイヤ・ボンディング方法及びそのワイヤ・ボンディングを含む電気カード構造
JP2001144213A5 (OSRAM)
JP4334047B2 (ja) 半導体装置とその製造方法
FR2659494A1 (fr) Composant semiconducteur de puissance, dont la puce est montee a l'envers.
JP2905609B2 (ja) 樹脂封止型半導体装置
JP2003124388A (ja) ウェハレベルチップスケールパッケージおよびそれを製造する方法
WO2009117006A1 (en) Apparatus and method for series connection of two die or chips in single electronics package
TW201108372A (en) Wirebond structures
US20020185743A1 (en) Wafer level chip-scale package and a method for manufacturing
JPH0645504A (ja) 半導体装置