JPH10247679A - 半導体処理装置 - Google Patents
半導体処理装置Info
- Publication number
- JPH10247679A JPH10247679A JP6382497A JP6382497A JPH10247679A JP H10247679 A JPH10247679 A JP H10247679A JP 6382497 A JP6382497 A JP 6382497A JP 6382497 A JP6382497 A JP 6382497A JP H10247679 A JPH10247679 A JP H10247679A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- processing
- substrate
- substrates
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 133
- 230000008569 process Effects 0.000 claims abstract description 115
- 239000000758 substrate Substances 0.000 claims abstract description 97
- 238000003860 storage Methods 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 194
- 238000004519 manufacturing process Methods 0.000 description 28
- 230000032258 transport Effects 0.000 description 21
- 239000011521 glass Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6382497A JPH10247679A (ja) | 1997-03-03 | 1997-03-03 | 半導体処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6382497A JPH10247679A (ja) | 1997-03-03 | 1997-03-03 | 半導体処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10247679A true JPH10247679A (ja) | 1998-09-14 |
| JPH10247679A5 JPH10247679A5 (enExample) | 2005-01-20 |
Family
ID=13240509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6382497A Pending JPH10247679A (ja) | 1997-03-03 | 1997-03-03 | 半導体処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10247679A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011009290A (ja) * | 2009-06-23 | 2011-01-13 | Shin Etsu Handotai Co Ltd | ウェーハの処理方法、ウェーハの処理システム、エピタキシャルウェーハの製造方法およびエピタキシャルウェーハの製造システム |
| JP2020017604A (ja) * | 2018-07-25 | 2020-01-30 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| KR20220040379A (ko) * | 2020-09-23 | 2022-03-30 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
-
1997
- 1997-03-03 JP JP6382497A patent/JPH10247679A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011009290A (ja) * | 2009-06-23 | 2011-01-13 | Shin Etsu Handotai Co Ltd | ウェーハの処理方法、ウェーハの処理システム、エピタキシャルウェーハの製造方法およびエピタキシャルウェーハの製造システム |
| JP2020017604A (ja) * | 2018-07-25 | 2020-01-30 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置および基板処理方法 |
| KR20220040379A (ko) * | 2020-09-23 | 2022-03-30 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040223 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040223 |
|
| A977 | Report on retrieval |
Effective date: 20070403 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
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| A131 | Notification of reasons for refusal |
Effective date: 20070807 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A02 | Decision of refusal |
Effective date: 20071204 Free format text: JAPANESE INTERMEDIATE CODE: A02 |