JPH10163578A - 半導体素子搭載用のヒートシンクが突設された半導体装置用アイレットの製造方法 - Google Patents
半導体素子搭載用のヒートシンクが突設された半導体装置用アイレットの製造方法Info
- Publication number
- JPH10163578A JPH10163578A JP8340609A JP34060996A JPH10163578A JP H10163578 A JPH10163578 A JP H10163578A JP 8340609 A JP8340609 A JP 8340609A JP 34060996 A JP34060996 A JP 34060996A JP H10163578 A JPH10163578 A JP H10163578A
- Authority
- JP
- Japan
- Prior art keywords
- eyelet
- main body
- heat sink
- clad
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 53
- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 238000007789 sealing Methods 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims description 36
- 238000003825 pressing Methods 0.000 claims description 17
- 238000003466 welding Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 238000005304 joining Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 38
- 229910052742 iron Inorganic materials 0.000 abstract description 19
- 229910000640 Fe alloy Inorganic materials 0.000 abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 9
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 9
- 229910052802 copper Inorganic materials 0.000 abstract description 9
- 239000010949 copper Substances 0.000 abstract description 9
- 238000003754 machining Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 18
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8340609A JPH10163578A (ja) | 1996-12-04 | 1996-12-04 | 半導体素子搭載用のヒートシンクが突設された半導体装置用アイレットの製造方法 |
| KR1019970058579A KR100259750B1 (ko) | 1996-12-04 | 1997-11-06 | 반도체 소자 탑재용의 히트 싱크가 돌설된 반도체 장치용 아이릿트의 제조방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8340609A JPH10163578A (ja) | 1996-12-04 | 1996-12-04 | 半導体素子搭載用のヒートシンクが突設された半導体装置用アイレットの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10163578A true JPH10163578A (ja) | 1998-06-19 |
Family
ID=18338623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8340609A Pending JPH10163578A (ja) | 1996-12-04 | 1996-12-04 | 半導体素子搭載用のヒートシンクが突設された半導体装置用アイレットの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH10163578A (ko) |
| KR (1) | KR100259750B1 (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002374100A (ja) * | 2001-06-14 | 2002-12-26 | Matsushita Electric Ind Co Ltd | 電子部品装着装置とカセット制御装置 |
| JP2007142112A (ja) * | 2005-11-17 | 2007-06-07 | Shinko Electric Ind Co Ltd | 光半導体素子用ステムの製造方法 |
-
1996
- 1996-12-04 JP JP8340609A patent/JPH10163578A/ja active Pending
-
1997
- 1997-11-06 KR KR1019970058579A patent/KR100259750B1/ko not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002374100A (ja) * | 2001-06-14 | 2002-12-26 | Matsushita Electric Ind Co Ltd | 電子部品装着装置とカセット制御装置 |
| JP4582963B2 (ja) * | 2001-06-14 | 2010-11-17 | パナソニック株式会社 | 電子部品装着装置 |
| JP2007142112A (ja) * | 2005-11-17 | 2007-06-07 | Shinko Electric Ind Co Ltd | 光半導体素子用ステムの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR19980063568A (ko) | 1998-10-07 |
| KR100259750B1 (ko) | 2000-06-15 |
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