JPH10102247A - スパッタリング装置及び方法 - Google Patents

スパッタリング装置及び方法

Info

Publication number
JPH10102247A
JPH10102247A JP8261643A JP26164396A JPH10102247A JP H10102247 A JPH10102247 A JP H10102247A JP 8261643 A JP8261643 A JP 8261643A JP 26164396 A JP26164396 A JP 26164396A JP H10102247 A JPH10102247 A JP H10102247A
Authority
JP
Japan
Prior art keywords
target
magnet
sputtering
sputtering apparatus
magnets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8261643A
Other languages
English (en)
Japanese (ja)
Inventor
Isamu Aokura
勇 青倉
Hitoshi Yamanishi
斉 山西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8261643A priority Critical patent/JPH10102247A/ja
Priority to KR1019970050935A priority patent/KR100274433B1/ko
Publication of JPH10102247A publication Critical patent/JPH10102247A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP8261643A 1996-10-02 1996-10-02 スパッタリング装置及び方法 Pending JPH10102247A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP8261643A JPH10102247A (ja) 1996-10-02 1996-10-02 スパッタリング装置及び方法
KR1019970050935A KR100274433B1 (ko) 1996-10-02 1997-10-02 스퍼트링장치 및 스퍼트링방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8261643A JPH10102247A (ja) 1996-10-02 1996-10-02 スパッタリング装置及び方法

Publications (1)

Publication Number Publication Date
JPH10102247A true JPH10102247A (ja) 1998-04-21

Family

ID=17364756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8261643A Pending JPH10102247A (ja) 1996-10-02 1996-10-02 スパッタリング装置及び方法

Country Status (2)

Country Link
JP (1) JPH10102247A (ko)
KR (1) KR100274433B1 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040002346A (ko) * 2002-06-18 2004-01-07 한스타 디스플레이 코포레이션 자기 제어식 요동 주사형 스퍼터 장치
WO2007046243A1 (ja) * 2005-10-18 2007-04-26 Ulvac, Inc. スパッタリング装置及び成膜方法
US7682495B2 (en) * 2005-04-14 2010-03-23 Tango Systems, Inc. Oscillating magnet in sputtering system
US7744730B2 (en) * 2005-04-14 2010-06-29 Tango Systems, Inc. Rotating pallet in sputtering system
KR20110065353A (ko) * 2009-12-09 2011-06-15 가부시키가이샤 알박 마그네트론 스퍼터 전극용의 자석 유닛 및 스퍼터링 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100640993B1 (ko) * 2001-02-15 2006-11-06 엘지.필립스 엘시디 주식회사 스퍼터링 장치
TW574385B (en) * 2002-06-25 2004-02-01 Hannstar Display Corp Method of pre-sputtering with an increased rate of use of sputtering target

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04371575A (ja) * 1991-06-19 1992-12-24 Fujitsu Ltd スパッタ装置
JPH05302166A (ja) * 1992-04-24 1993-11-16 Nec Corp スパッタ装置
JPH07233473A (ja) * 1994-02-22 1995-09-05 Hitachi Ltd マグネトロンスパッタ装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040002346A (ko) * 2002-06-18 2004-01-07 한스타 디스플레이 코포레이션 자기 제어식 요동 주사형 스퍼터 장치
JP2004019006A (ja) * 2002-06-18 2004-01-22 Hannstar Display Corp マグネトロンスパッタリング装置
US7682495B2 (en) * 2005-04-14 2010-03-23 Tango Systems, Inc. Oscillating magnet in sputtering system
US7744730B2 (en) * 2005-04-14 2010-06-29 Tango Systems, Inc. Rotating pallet in sputtering system
WO2007046243A1 (ja) * 2005-10-18 2007-04-26 Ulvac, Inc. スパッタリング装置及び成膜方法
JPWO2007046243A1 (ja) * 2005-10-18 2009-04-23 株式会社アルバック スパッタリング装置及び成膜方法
KR100984965B1 (ko) 2005-10-18 2010-10-04 울박, 인크 스퍼터링 장치 및 성막 방법
JP4763711B2 (ja) * 2005-10-18 2011-08-31 株式会社アルバック スパッタリング装置及び成膜方法
US8585872B2 (en) 2005-10-18 2013-11-19 Ulvac, Inc. Sputtering apparatus and film-forming processes
KR20110065353A (ko) * 2009-12-09 2011-06-15 가부시키가이샤 알박 마그네트론 스퍼터 전극용의 자석 유닛 및 스퍼터링 장치

Also Published As

Publication number Publication date
KR19980032508A (ko) 1998-07-25
KR100274433B1 (ko) 2000-12-15

Similar Documents

Publication Publication Date Title
JP4246547B2 (ja) スパッタリング装置、及びスパッタリング方法
JP3403550B2 (ja) スパッタリング装置とスパッタリング方法
US5865961A (en) Magnetron sputtering apparatus and method
US5626727A (en) Sputtering apparatus and method
JPH11302839A (ja) スパッタリング装置
JP5461264B2 (ja) マグネトロンスパッタリング装置、及び、スパッタリング方法
JPS6272121A (ja) 半導体処理装置
JPH10102247A (ja) スパッタリング装置及び方法
WO2022018840A1 (ja) イオンガン及び真空処理装置
JPH11158625A (ja) マグネトロンスパッタ成膜装置
JPH0881769A (ja) スパッタ装置
US9607813B2 (en) Magnetic field generation apparatus and sputtering apparatus
JP3411312B2 (ja) マグネトロン・スパッタカソードおよび膜厚分布の調整方法
JP6985570B1 (ja) イオンガン及び真空処理装置
JP2004346387A (ja) スパッタ源、スパッタリング装置、及びスパッタリング方法
JPS6176673A (ja) スパツタリング方法
JPH0660393B2 (ja) プラズマ集中型高速スパツタ装置
KR20140080154A (ko) 마그네트론 및 이를 포함하는 마그네트론 스퍼터링 장치
JP2902822B2 (ja) プレーナ形マグネトロンスパッタ電極
JPS6217175A (ja) スパツタリング装置
JPH07233473A (ja) マグネトロンスパッタ装置
GB2393321A (en) Plasma generation
JPH03257159A (ja) ダイポールリング型磁気回路を用いたスパッタ装置
JPH11140639A (ja) マグネトロン装置及びスパッタリング装置
JPS63103066A (ja) プレ−ナマグネトロン方式のスパツタリング装置

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20040224