JPH098221A - Manufacture of semiconducting ceramic package - Google Patents

Abstract

PURPOSE: To provide a semiconducting ceramic package manufacturing method by which fine block patterns can be printed or formed on a substrate with high accuracy. CONSTITUTION: In a semiconducting ceramic package manufacturing method in which a plurality of semiconductor chip mounting blocks 2 is formed on a ceramic substrate 1 and block patterns 3 composed of conductor patterns are formed on the blocks 2 by post-metallization, recognition marks 5 are provided near each block 2 on the substrate 1. Then conductor paste for forming the patterns 3 is successively applied or printed to or on the blocks on the basis of the marks 5 and, after applying or printing the conductor paste, the patterns 3 on all blocks 2 are baked.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a semiconductor ceramic package, and more particularly to a block having a plurality of blocks for mounting semiconductor chips on a ceramic substrate, the block having a conductor pattern. The present invention relates to a method for manufacturing a semiconductor ceramic package in which a pattern is metallized afterwards.

[0002]

2. Description of the Related Art Semiconductor ceramic packages include packages such as a multi-chip module (MCM) having a plurality of blocks for mounting semiconductor chips on a ceramic substrate. In such a package, ceramic raw sheets having vertical and horizontal conductor patterns are stacked and fired to obtain a ceramic substrate, and then a plurality of semiconductor chips are mounted on the exposed surface of the vertical conductor of the ceramic substrate. A plurality of blocks are subjected to screen printing or coating with a block pattern made of a conductor pattern, and then baked to produce the block pattern. That is, in such a package, a block pattern is added to each block by a metallizing method.

By the way, in such a package, it is required that various semiconductor chips having different functions, sizes and forms can be accommodated and mounted within a minimum area.
Therefore, the vertical conductors, the horizontal conductor patterns formed on the package base (ceramic substrate), and the wiring patterns (block patterns) formed on the surface of the substrate are required to have a high density.

[0004]

However, when a package such as a multi-chip module (MCM) is manufactured by the above-mentioned method, there are the following problems. Ceramic substrate itself forming a plurality of blocks, due to the shrinkage of the substrate due to firing during its production, because there is a variation in the dimensional accuracy of the substrate, if the block pattern is simultaneously printed and formed by screen printing, A displacement occurs between the block pattern and the vertical conductor. For example, as shown in FIG. 3, in a semiconductor ceramic package 32 having four blocks 32 on a substrate 31, for example, the area b of each block 32 is 20 mm.
Assuming that the corners and the space c between the adjacent blocks 32 are 10 mm, when the block patterns are simultaneously screen-printed on the four blocks 32, the maximum area a of the patterns is 50 mm square. Hole diameter of conductor (through hole filled with conductor) φ
When the design value of is 0.1 mm, 0.1 / 50 = 0.2
%, A high dimensional accuracy of the substrate is required. The dimensional accuracy of a normal ceramic substrate is about 0.4%. For this reason, it is necessary to more accurately perform the alignment accuracy of the print pattern when screen-printing the block pattern on the block, and higher dimensional accuracy is required when manufacturing the substrate.

In order to solve the above-mentioned problems, the dimensional accuracy of the substrate itself should be improved. However, as the size of the substrate becomes larger, the problem of shrinkage due to firing increases, so that the dimensional accuracy of the substrate is improved. There is a limit to what you can do. Therefore,
Based on such a viewpoint, the present inventor divides a plurality of blocks formed on the ceramic substrate into each block, and prints and forms a predetermined block pattern for each block on the substrate. , It was clarified that a fine block pattern can be printed and formed with high accuracy.

The present invention has been made in response to the above problems, and the purpose of the invention is
It is an object of the present invention to provide a method for manufacturing a semiconductor ceramic package that can print and form a fine block pattern with high accuracy.

[0007]

A method for manufacturing a semiconductor ceramic package according to claim 1 of the present invention as a means for solving the above problems comprises a plurality of blocks for mounting semiconductor chips on a ceramic substrate. In the method for manufacturing a semiconductor ceramic package having a block pattern made of a conductor pattern afterwards and metallized to the block, a pair of more than one pair corresponding to each block is provided on the ceramic substrate in the vicinity of each block. Alignment recognition marks are provided, and on the ceramic substrate, with reference to each of the alignment recognition marks, for each of the blocks corresponding to each of the alignment recognition marks, a block pattern consisting of the conductor pattern is sequentially formed. Apply or print the conductor paste to form all the blocks. Te, after coating or printing a conductor paste, has a configuration obtained by firing the block pattern.

According to a second aspect of the present invention, there is provided a method for producing a semiconductor ceramic package according to the first aspect, wherein
The alignment recognition mark is provided at a symmetrical position with respect to the center of each block.

[0009]

According to the method of manufacturing a semiconductor ceramic package of claim 1 of the present invention, a plurality of blocks formed on a ceramic substrate are coated with or printed with a block pattern made of a conductor pattern. Each block is divided and a block pattern is applied or printed for each block. By the way, the dimensional accuracy of each block in the ceramic substrate is smaller in absolute value than the dimensional accuracy of the entire ceramic substrate. Therefore, a fine block pattern can be formed with high accuracy on the block on the ceramic substrate.

Further, when printing or applying a block pattern for each block, each block corresponding to each alignment recognition mark is set with reference to the alignment recognition mark provided corresponding to each block. Since the block pattern is applied or printed on the substrate, the block pattern and the substrate can be aligned well, so that a finer block pattern can be formed on the block on the ceramic substrate with high accuracy.

In the method of manufacturing a semiconductor ceramic package according to a second aspect of the present invention, since the alignment recognition mark is provided at a position symmetrical with respect to the center of each block, it is possible to form the block pattern to be formed in each block. Good alignment with the substrate.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. Here, FIG. 1 is a plan view of a package for explaining a method for manufacturing a semiconductor ceramic package of the present invention, and FIG. 2 is an explanatory view of a positional relationship between a block pattern and a vertical conductor.

The method of manufacturing a semiconductor ceramic package of this embodiment is a method of manufacturing a multi-chip module (MCM). In brief, a ceramic substrate having a plurality of blocks for mounting a plurality of semiconductor chips is provided. After manufacturing, a block pattern is screen-printed on each block for each block, and after block-patterning is metallized by printing on all blocks, the block pattern is baked to obtain a package of a multi-chip module.

As shown in FIG. 1, the ceramic substrate 1 is
Four blocks 2 for mounting semiconductor chips are provided on the surface of the substrate, and each block 2 has a vertical conductor 4 electrically connected to a block pattern 3 formed of a conductor pattern printed / formed on the block 2. Are formed.
The ceramic substrate 1 is usually manufactured by firing a ceramic green sheet on which a vertical conductor is formed. A ceramic green sheet having vertical conductors and internal horizontal conductors laminated and fired may be used.

Here, the ceramic green sheet located on the uppermost layer forming the substrate surface is provided with a pair of alignment marks 5 corresponding to each block 2 in the vicinity of the block 2. . And the ceramic substrate 1
Has a structure in which an alignment mark 5 is provided in advance, and since the alignment mark 5 and the vertical conductor 4 of the block 2 corresponding to this mark 5 are in close proximity to each other, substrate manufacturing is performed. There is little influence of shrinkage due to firing at the time of.

By the way, in the present embodiment, the positioning marks 5 are provided outside the peripheral portion of each block 2 and one at each intermediate portion of the four sides of the block 2, for a total of 4 marks.
Are provided. It is preferable that two alignment marks 5 are provided at symmetrical positions such as a facing position and a diagonal line in each block 2. As a result, it is possible to accurately perform alignment when printing the block pattern 3.

Then, a predetermined block pattern 3 is screen-printed on each block 2 of the ceramic substrate 1 with the alignment mark 5 as a reference. Figure 1
As shown in (a), with respect to one block 2a of the four blocks 2, corresponding to the block 2a, the alignment mark 5a provided in the vicinity of the block 2a is used as a reference. , A mark formed on the screen on which the print pattern is formed (not shown) using the print pattern forming the block pattern 3a
Align with and block pattern 3 with a squeegee
Screen print a. Next, after printing the block pattern 3a on this block 2a, the block pattern 3b is printed on the block 2b with reference to the alignment mark 5b, and the block pattern 3c is sequentially printed on the block 2c and the block pattern 3d is printed on the block 2d. To print. In addition, it is necessary to dry each of the block patterns after the screen printing.

In this way, a plurality of (in this embodiment, four) blocks 2a formed on the ceramic substrate 1,
After printing block patterns 3a, 3b, 3c and 3d on all of 2b, 2c and 2d in order, firing and baking and post-finishing metallization provided, fine block patterns were provided on the ceramic substrate 1. Ceramic packages can be manufactured.

In the manufacturing method of this embodiment, a fine block pattern can be formed for the following reason. That is, in the present embodiment, in FIG. 3 used in the description of the conventional example described above, since the block pattern is printed with the alignment mark for each block as a reference, the maximum area b of each block pattern is Unlike the case of the conventional example, when the design value of the hole diameter φ of the vertical conductor (through hole filled with conductor) formed on the substrate is 20 mm square, the design value is 0.1 mm, 0.1 / 20 = 0. This is because the board dimensional accuracy of 0.5% improves. Then, this eliminates the possibility of misalignment between the vertical conductor and the block pattern, and a fine block pattern can be printed and formed on the ceramic substrate with high accuracy.

The present invention is not limited to the above-described embodiments, but includes configurations that can be modified and implemented within the scope of the present invention. Incidentally, in the above-mentioned embodiment, the block pattern is screen-printed, but it goes without saying that the block pattern may be arranged by coating. By the way, the semiconductor chip includes capacitors and other electronic components.

[0021]

As is apparent from the above description, according to the semiconductor ceramic package of claim 1 of the present invention, when a block pattern is formed in a plurality of blocks formed on a ceramic substrate, the plurality of blocks are formed. The blocks can be divided into blocks, and a block pattern can be applied or printed for each block within the range of dimensional accuracy in each block of the ceramic substrate, and the blocks are provided corresponding to the blocks. Since the block pattern is applied or printed for each block corresponding to the alignment recognition mark with reference to the alignment recognition mark, the block pattern can be favorably aligned with the substrate, and the block on the ceramic substrate It has an effect that a fine block pattern can be formed with high accuracy.

According to the method of manufacturing a semiconductor ceramic package of claim 2, since the alignment recognition mark is provided at a position symmetrical with respect to the center of each block,
This has the effect of favorably aligning the block pattern to be formed in each block with the substrate.

Therefore, according to the present invention, it is possible to provide a method of manufacturing a semiconductor ceramic package which can form a fine block pattern with high accuracy.

[Brief description of drawings]

FIG. 1 is a plan view of a package for explaining a method for manufacturing a semiconductor ceramic package of the present invention.

FIG. 2 is an explanatory diagram of a positional relationship between a block pattern and a vertical conductor.

FIG. 3 is a plan view of a package for explaining a conventional method for manufacturing a semiconductor ceramic package.

[Explanation of symbols]

1 ... Ceramic substrate, 2 ... Block, 3 ...
Block pattern, 4 ... Vertical conductor, 5 ... Positioning mark

Claims (2)

[Claims] 1. A method of manufacturing a semiconductor ceramic package, comprising a plurality of blocks for mounting a semiconductor chip on a ceramic substrate, wherein a block pattern made of a conductor pattern is post-metallized on the blocks to form a semiconductor ceramic package. Is provided with a pair of alignment recognition marks corresponding to each block in the vicinity of each block, and each alignment recognition mark is provided on the ceramic substrate with reference to each alignment recognition mark. For each of the blocks corresponding to the marks, a conductor paste that forms a block pattern composed of the conductor pattern is sequentially applied or printed, and after applying or printing the conductor paste for all of the plurality of blocks, the A semiconductor ceramic package characterized by firing a block pattern Manufacturing method. 2. The method for manufacturing a semiconductor ceramic package according to claim 1, wherein the alignment recognition mark is provided at a position symmetrical with respect to the center of each block.