JP2701607B2 - Manufacturing method of mounting board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting pattern for mounting a plurality of electronic components such as LSIs on a ceramic multilayer wiring board formed by laminating green sheets and firing together.
The present invention relates to a method for manufacturing a mounting board for forming a component.

[0002]

2. Description of the Related Art A laminated ceramic multi-layer wiring board formed by stacking green sheets and then firing them in a lump is L
It is used as a substrate for mounting electronic components such as SI. In addition, the density of the mounted LSI has been increased, the number of terminals has been increased, and the size of the LSI has been reduced, and some LSIs use a thin film technique for forming a component mounting pattern.

[0003] However, the laminated ceramic multi-layer wiring board has a variation in dimensions due to shrinkage during firing of the board. This variation varies depending on the substrate firing atmosphere and the manufacturing conditions of the ceramic multilayer wiring substrate such as the green sheet, but usually, about ± 0.5% occurs (Reference: Ceramic multilayer wiring substrate Otsuka). (Kanji Uchida Rokaku Farm).

[0004] Therefore, when a fine pattern is formed on a ceramic multilayer wiring board by a thin film technique, a pattern that absorbs this dimensional variation is required. This absorption pattern is ス ル ー 0.7 mm or more (100 × 0.005 + 0.05 mm) in a substrate having a through-hole diameter of 0.2 mm and a region where a through-hole is formed is 100 mm □.
2 = 0.7) is required. That is, when an electronic component mounting pattern is to be formed on the above-described conventional ceramic multilayer wiring board, an absorption pattern of ¢ 0.7 mm or more must be interposed.

[0005]

However, in the conventional mounting board described above, when an electronic component mounting pattern is formed on a ceramic multilayer wiring board by a thin film technique, a pattern that absorbs dimensional variations of the ceramic multilayer wiring board is required. Therefore, there is a problem in that the pitch of the through-holes and the pitch of the thin film patterns of the ceramic multilayer wiring board cannot be miniaturized due to the size of the absorption pattern as a bottleneck.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to reduce an absorption pad for dimensional variation due to shrinkage of a ceramic multilayer wiring board and to reduce a through-hole pitch of the ceramic multilayer wiring board. It is another object of the present invention to provide a method of manufacturing a mounting substrate which enables a fine pattern pitch of a thin film.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a method of mounting a plurality of electronic components on a ceramic multilayer wiring board formed by stacking green sheets and firing them all at once. In a method of manufacturing a mounting substrate for forming a mounting pattern to be formed ,
A first step of measuring a through-hole pitch,
From the measurement results of the through-hole pitch in the process
Determine the mounting pattern position to be formed on the multilayer wiring board
And, and have a second step of forming a mounting pattern on the determined position.

[0008]

According to the present invention, a ceramic multilayer arrangement after firing is provided.
The pitch of the through-hole of the printed circuit board is measured and this through-hole
The pitch on the ceramic multilayer wiring board
The mounting pattern position to be formed is determined.
A mounting pattern is formed at the position.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a plan view of an LSI mounting board for explaining one embodiment of a method of manufacturing a mounting board according to the present invention, and FIG. 2 is an enlarged plan view of an electronic component mounting pattern in FIG. FIG. 3 is a plan view of the ceramic multilayer wiring board 11 before the formation of the electronic component mounting pattern. FIG. 4 is a plan view of the ceramic multilayer wiring board 11, the electronic component mounting pattern 2, and LS.
It is sectional drawing which shows the connection state with I9.

First, in FIG. 3, on the surface of a ceramic multilayer wiring board 11, through-hole blocks 6 constituted by a plurality of through-holes 5 connected to an LSI to be mounted are arranged in six rows in the X direction and in the Y direction. A total of 42 blocks of 7 rows are formed, and each through-hole block 6 corresponds to the electronic component mounting pattern block 7.

In FIG. 1, the electronic component mounting pattern block 7 has six columns in the X direction and seven rows in the Y direction.
Two electronic component mounting patterns 2 are formed in common. The pitch P ₁ of the electronic component mounting pattern is formed by exposure machine stepper method in the electronic component mounting pattern units in accordance with the through hole block pitch P ₂ during the firing up of the ceramic multi-layer wiring substrate 11.

Each electronic component mounting pattern 2 is shown in FIG.
As shown in FIG. 1, the through hole pad 3 and the LSI pad 4 connected to the through hole pad 3 are provided. The through-hole pads 3 are connected to the through-holes 5 of the ceramic multilayer wiring board 11, and the pitch thereof is 0.3 mm. The LSI pad 4 is connected to an LSI 9 to be mounted. Therefore, the LSI 9 and the ceramic multilayer wiring board 11
The through holes 5 are connected through the through hole pads 3 and the LSI pads 4 as shown in FIG. The through-hole pad 3 has a thickness of 0.2 to absorb the dimensional variation of the ceramic multilayer wiring board 11.
It has a size of 7 mm × 0.30 mm.

Next, the mounting substrate 1 described above will be described along the manufacturing process. First, to measure the pitch P ₂ of the respective through-hole block 6 of the ceramic multilayer wiring board 11 shown in FIG. Then, 42 patterns of the electronic component mounting pattern 2 shown in FIG. 2 are exposed by a stepper type exposure machine in accordance with the pitch P ₂ of the through-hole blocks 6 of the ceramic multilayer wiring board 11. Thereafter, the LSI component mounting substrate 1 can be obtained by forming the electronic component mounting pattern 2 by a normal thin film process.

According to the prior art, since the through-hole area of the ceramic multilayer wiring board 11 is 94.5 mm □, the absorption pattern of the dimensional variation due to shrinkage is ¢ 0.6.
7 mm (94.5 × 0.005 + 0.2 = 0.67) is required, and the electronic component mounting pattern 2 having the through-hole pads 3 with a 0.3 mm pitch as shown in FIG. 1 cannot be formed. However, according to this embodiment, the dimensional variation between each mounting block can be absorbed at the time of exposure, so that only the dimensional variation within one mounting block needs to be absorbed. The connection can be made possible by the through-hole pad 3.

[0015]

As described above, according to the present invention, the firing
The through hole pitch of the formed ceramic multilayer wiring board
Measured.
The position of the mounting pattern to be formed on the
The mounting pattern is formed at this determined position.
Dimension due to shrinkage of the ceramic multilayer wiring board
An extremely excellent effect is obtained in that it is possible to reduce the size of the absorption pad due to variation in method and to increase the density.

[Brief description of the drawings]

FIG. 1 is a view showing an electronic component mounting pattern of an LSI mounting board for explaining one embodiment of a method of manufacturing a mounting board according to the present invention.

FIG. 2 is an enlarged plan view showing an electronic component mounting pattern in FIG.

FIG. 3 is a plan view showing a ceramic multilayer wiring board before an electronic component mounting pattern is formed.

FIG. 4 is a cross-sectional view showing a connection state between a ceramic multilayer wiring board, an electronic component mounting pattern, and an LSI.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mounting board 2 electronic component mounting pattern 3 through hole pad 4 LSI pad 5 through hole 6 through hole block 7 electronic component mounting pattern block 9 LSI 10 internal wiring of ceramic multilayer wiring substrate 11 ceramic multilayer wiring substrate

Claims (1)

(57) [Claims] 1. Manufacturing of a mounting board in which green sheets are stacked and a mounting pattern for mounting a plurality of electronic components is formed on a ceramic multilayer wiring board formed by batch firing.
A first step of measuring a through-hole pitch of the ceramic multilayer wiring board after firing , and a measurement result of the through-hole pitch in the first step.
Mounting pattern formed on the ceramic multilayer wiring board
Position determines the method of manufacturing a mounting substrate, characterized by chromatic and a second step of forming a mounting pattern on the determined position.