JP2882157B2 - Manufacturing method of ceramic multilayer electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic multilayer electronic component having a via hole connecting portion and a wiring pattern connected to the via hole connecting portion. Ceramic multilayer electronic components to which the present invention is directed include a ceramic multilayer circuit board, a hybrid IC having a ceramic multilayer structure, an LC composite component also having a ceramic multilayer structure, a multilayer capacitor, and the like.

[0002]

2. Description of the Related Art FIG. 3 shows several steps involved in a method for manufacturing a ceramic multilayer circuit board as an example of a ceramic multilayer electronic component.

First, as shown in FIG. 3A, a ceramic green sheet 2 is formed on a carrier film 1 and then dried. The formation of the ceramic green sheet 2 is performed by applying ceramic slurry to one surface of the carrier film 1 with a doctor blade or the like.

[0004] Next, as shown in FIG. 3 (2), the carrier film 1 is peeled from the ceramic green sheet 2.

Next, as shown in FIG. 3C, the ceramic green sheet 2 is punched into a predetermined size.

[0006] Next, as shown in FIG.
A hole 3 to be a via hole is provided in the ceramic green sheet 2 by a drill or the like.

Next, as shown in FIG. 3 (5), the conductive paste 4 is filled in the holes 3. One specific example of the step of applying the conductor paste 4 is shown in FIG. That is, application of the conductor paste 4 is performed by screen printing using the screen 5. The ceramic green sheet 2 provided with the holes 3 is placed on a suction stage 7 via a breathable sheet 6. Arrow 8 on the suction stage 7
As shown by a vacuum suction, a negative pressure is applied to each of the holes 3 through the breathable sheet 6 by the vacuum suction. The screen 5 has a conductive paste 4 corresponding to the holes 3 provided in the ceramic green sheet 2.
Is formed. The conductive paste 4 is filled in the holes 3 by being handled by the squeegee 10 on the screen 5. At this time, since the pattern 9 has a diameter slightly larger than the diameter of the hole 3, as shown in FIG. 3 (5), an overhang 11 of the conductive paste 4 is formed around the hole 3. You. The conductive paste 4 filled in this way is then dried.

Next, as shown in FIG. 3 (6), a wiring pattern 12 is formed by, for example, screen printing. The wiring pattern 12 is then dried.

Next, the ceramic green sheets 2 shown in FIG. 3 (6) are stacked in a predetermined order.
In this stacking, the ceramic green sheets 2 must be aligned with each other. This alignment is performed with reference to the end face of the ceramic green sheet 2 or a hole is provided in the ceramic green sheet 2 for alignment. This is performed by inserting a pin into the hole.

[0010]

The wiring pattern formed on such a ceramic multilayer circuit board may include a fine line pattern. Printing such fine line wiring patterns requires high precision. However, in the case of manufacturing a ceramic multilayer circuit board having a fine line wiring pattern, the following problems are encountered according to the above-described conventional manufacturing method.

(A) Before the step of printing the wiring pattern 12 shown in FIG. 3 (6), the step of providing the holes 3 shown in FIG. 3 (4) and the filling of the conductive paste 4 shown in FIG. A process is performed. Therefore, the holes 3 and the projecting portions 11 of the conductive paste 4 are already formed in the ceramic green sheet 2 brought into the printing process of the wiring pattern 12. It is easy to understand that it is difficult to print such a work with poor flatness with high accuracy. For example, as shown in FIG. 5, when the squeegee 10a moves in the direction of the arrow 13 along the screen 5a, at the start end 14 and the end end 15 of the overhanging portion 11 where the conductive paste 4 has risen, Recess 16 formed due to insufficient filling of paste 4
In this case, the wiring pattern 12 often spreads, the applied thickness varies, and the line width varies. This may cause failure of various characteristics such as capacitance and inductance.

(B) In the step of providing the holes 3 shown in FIG. 3D, as shown in an exaggerated manner in FIG.
May occur. The presence of the hanging surface 17 and the burr 18 causes the same defect as in the case of FIG.

(C) Further, when the conductive paste 4 filled in the holes 3 is dried, the ceramic green sheet 2 may be wavy, undulated, warped, or shrinkage-variable, which also lowers the printing accuracy of the wiring pattern 12. Invite.

An object of the present invention is to provide a method for manufacturing a ceramic multilayer electronic component which can solve the above-mentioned problems (A) to (C).

[0015]

The invention according to claim 1 is directed to a method of manufacturing a ceramic multilayer electronic component including a via hole connection portion and a wiring pattern connected to the via hole connection portion. To solve technical issues, prepare ceramic green sheets,
After printing and drying a wiring pattern on the ceramic green sheet, a hole to be a via hole is provided in a region where the wiring pattern is formed, and the hole is filled with a conductive paste and dried. It is set to.

[0016]

According to the first aspect of the present invention, since the wiring pattern is printed on the flat ceramic green sheet before the hole to be the via hole is provided, the printing accuracy can be improved. In the invention according to claim 1,
In, a hole to be a via hole is formed on a wiring pattern.

[0017]

Therefore, according to the first aspect of the present invention, the capacitance in the obtained ceramic multilayer electronic component,
The non-defective rate with respect to electrical characteristics such as inductance is improved.

In general, stricter accuracy is required in printing a wiring pattern than in filling a conductive paste for forming a via-hole connection portion. According to the present invention, at the stage where the printing of the wiring pattern has been completed, the quality of the product is determined, and for the product determined to be defective, a subsequent hole is provided, and the hole is filled with a conductive paste. Since it is not necessary, the production efficiency of the ceramic multilayer electronic component can be increased as a whole.

In general, the wiring pattern is printed by screen printing. In this case, printing distortion always occurs. Therefore, when the alignment between the via hole connection portion and the wiring pattern is strictly required, after forming the via hole connection portion as in the related art, the wiring pattern is aligned with the via hole connection portion with high accuracy and printed. That is pretty difficult. However, according to the present invention, by printing the wiring pattern first, it is possible to provide an accurate hole while positioning the wiring pattern by image processing or the like. It is possible to cope with a high-density product requiring strict alignment, such as a case where a small and fine line wiring pattern is formed.

Further, conventionally, it was difficult when it checks whether or not the hole to the via hole is provided to ensure that the white ceramic green sheets, the invention described in claim 1 According to the method, since holes can be provided in the wiring pattern, the holes can be easily identified by using an easily identifiable color wiring pattern. For example, if a black conductive paste is used as the wiring pattern, the holes can be easily identified. Such an effect is particularly prominent when the number of via holes is small and large.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing a ceramic multilayer circuit board will be described as one embodiment of the present invention.

FIG. 1 sequentially shows several steps included in the manufacturing method according to this embodiment.

First, as shown in FIG. 1A, a ceramic green sheet 22 is formed on a carrier film 21 and then dried. The formation of the ceramic green sheet 22 is performed, for example, by applying a ceramic slurry to one surface of the carrier film 21 with a doctor blade or the like.

Next, as shown in FIG. 1 (2), the carrier film 21 is peeled from the ceramic green sheet 22.

Next, as shown in FIG. 1C, the ceramic green sheet 22 is punched into a predetermined size.

Next, as shown in FIG. 1D, the ceramic green sheet 22 is screen-printed or the like.
The wiring pattern 23 is printed and then dried.

Next, as shown in FIG.
A hole 24 to be a via hole is provided in the ceramic green sheet 22 by a drill or the like. In the drawing, hole 2
4 is formed in a region where the wiring pattern 23 is formed, but the hole 24 may be provided in a region where the wiring pattern 23 is not formed according to a circuit provided by the ceramic multilayer circuit board. .

Next, as shown in FIG. 1 (6), the conductive paste 25 is filled in the holes 24. This conductor paste 2
5 is provided, for example, as shown in FIG.

Next, although not shown, the ceramic green sheets 22 shown in FIG. 1 (6) are stacked in a predetermined order. In this stacking step, the mutual alignment of the ceramic green sheets 22 is performed, for example, by:
It is performed using the end face of the ceramic green sheet 22 as a reference, by performing a positioning hole in the ceramic green sheet 22 and inserting a reference pin therethrough, or by using a frame for providing a reference for positioning. Or by performing image processing on a positioning mark (or a hole). After stacking
The desired ceramic multilayer circuit board is obtained by thermocompression bonding, cutting if necessary, and firing. In the above-described embodiment, the long ceramic green sheet 22 is punched in FIG. 1 (3).
Even if the steps shown in FIGS. 1 (4) to (6) are performed while the sheet is long, for example, the ceramic green sheet 22 is punched between the steps (4) and (5). You may.

In order to facilitate the handling and positioning of the ceramic green sheet 22 and to prevent the ceramic green sheet 22 from waving, undulating, warping, and shrinking, the ceramic green sheet 22 shown in FIGS. During the steps 2) to (6), the ceramic green sheet 22 may be kept lined with the carrier film 21. For example, the ceramic green sheet 2 backed by the carrier film 21
When the step of FIG. 1 (4) is carried out in FIG. 2, gravure printing can be applied in addition to screen printing.

In FIG. 1 (5), when the holes 24 are provided, the holes may be formed from the side where the wiring pattern 23 is formed or from the opposite side. Which of the hanging surface 17 and the burr 18 shown in FIG.
3 may be determined depending on whether or not it has any adverse effect.

Also, in the step of FIG.
When 5 is filled, the filling may be performed from the side where the wiring pattern 23 is formed or from the opposite side. For example, if the filling of the conductive paste 25 is performed by screen printing as shown in FIG. 4 from the side opposite to the wiring pattern 23, as shown in FIG. Overhang 26
Is formed. Thus, when the overhang portion 26 is formed, the conduction reliability is further improved.

While the present invention has been described with reference to a method for manufacturing a ceramic multilayer circuit board, the manufacturing method according to the present invention has a ceramic multilayer structure and includes a via-hole connection portion and a wiring pattern connected thereto. Then, the present invention can be widely applied to ceramic multilayer electronic components such as hybrid ICs, LC composite components, and multilayer capacitors.

[Brief description of the drawings]

FIG. 1 is a sectional view sequentially showing several steps included in a method for manufacturing a ceramic multilayer circuit board according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a modification of the step shown in FIG. 1 (6).

FIG. 3 is a sectional view sequentially showing several steps included in a conventional method for manufacturing a ceramic multilayer circuit board.

FIG. 4 is a sectional view showing a specific example of an apparatus for performing the steps shown in FIG. 3 (5).

FIG. 5 is a cross-sectional view for explaining a problem encountered in a printing process of the wiring pattern 12 shown in FIG. 3 (6).

FIG. 6 is a cross-sectional view for explaining a problem encountered in the step shown in FIG.

[Explanation of symbols]

 21 Carrier film 22 Ceramic green sheet 23 Wiring pattern 24 Hole 25 Conductor paste

Claims (1)

(57) [Claims] 1. A method for manufacturing a ceramic multilayer electronic component having a via hole connection portion and a wiring pattern connected to the via hole connection portion, comprising: preparing a ceramic green sheet; printing the wiring pattern on the ceramic green sheet; And forming a hole to be a via hole in a region where the wiring pattern is formed , filling the hole with a conductive paste, and drying the hole.