JPH09508207A - Isfetセンサの静電放電保護 - Google Patents
Isfetセンサの静電放電保護Info
- Publication number
- JPH09508207A JPH09508207A JP7519596A JP51959695A JPH09508207A JP H09508207 A JPH09508207 A JP H09508207A JP 7519596 A JP7519596 A JP 7519596A JP 51959695 A JP51959695 A JP 51959695A JP H09508207 A JPH09508207 A JP H09508207A
- Authority
- JP
- Japan
- Prior art keywords
- isfet
- liquid
- esd
- interface
- protection circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 82
- 239000003990 capacitor Substances 0.000 claims abstract description 41
- 150000002500 ions Chemical class 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 37
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 30
- 239000010703 silicon Substances 0.000 claims abstract description 30
- 230000005669 field effect Effects 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 239000000126 substance Substances 0.000 claims description 14
- 230000002457 bidirectional effect Effects 0.000 claims description 12
- 230000004888 barrier function Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- 238000007743 anodising Methods 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000006194 liquid suspension Substances 0.000 abstract 1
- 239000000523 sample Substances 0.000 description 16
- 238000012360 testing method Methods 0.000 description 12
- 230000006378 damage Effects 0.000 description 8
- 239000012212 insulator Substances 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 239000012085 test solution Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 241000283080 Proboscidea <mammal> Species 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
- G01N27/4148—Integrated circuits therefor, e.g. fabricated by CMOS processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Electrochemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Molecular Biology (AREA)
- Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.液体中のイオンを選択的に測定する装置であって、 (a)シリコン基板上に形成されたイオン感応電界効果トランジスタ(ISF ET)の形態の化学的に感知するイオン・センサを含む測定回路と、 (b)前記基板上に集積された静電放電(ESD)保護回路と、 (c)前記基板上に集積され、前記保護回路と前記液体との間にインタフェー スを形成するインタフェース手段と を備え、前記インタフェース手段がISFETと前記液体との間に直流漏れ電流 の経路を開くことなく前記液体との接点を行うことを特徴とする装置。 2.前記インタフェース手段がキャパシタ構造体をさらに備えることを特徴とす る請求項1に記載の装置。 3.前記キャパシタ構造体が、 (a)前記保護回路と電気的に接触する電極と、 (b)前記電極および被測定液体と接触するキャパシタ誘電体とをさらに備え ることを特徴とする請求項2に記載の装置。 4.前記電極が金属膜であることを特徴とする請求項3に記載の装置。 5.前記キャパシタ誘電体が前記金属膜の酸化物であることを特徴とする請求項 3に記載の装置。 6.前記保護回路が、 (a)前記インタフェース手段と前記ISFETのソースとの間の第1の双方 向ツェナー・ダイオードと、 (b)前記インタフェース手段と前記ISFETのドレインとの間の第2の双 方向ツェナー・ダイオードと、 (c)前記インタフェース手段と前記基板との間の単方向ツェナー・ダイオー ドとをさらに備える請求項1に記載の装置。 7.前記インタフェース手段がキャパシタ構造体をさらに備えることを特徴とす る請求項6に記載の装置。 8.液体中のイオンの活量を測定するために使用するイオン感応電界効果トラン ジスタ(ISFET)ベースの測定装置に静電放電(ESD)保護を与える装置 であって、 (a1)前記ISFETのソースに結合された第1の双方向ツェナー・ダイ オードと、 (a2)前記ISFETのドレインに結合された第2の双方向ツェナー・ダ イオードと、 (a3)前記基板に結合された単方向ツェナー・ダイオードと を有する(a)シリコン基板上に製作されたESD保護回路と、 (b)ISFETと前記液体との間に直流漏れ電流の経路を開くことなく前記保 護回路と前記液体との間にインタフェースを形成する、前記基板上に前記ESD 保護回路と共に集積されたインタフェース手段と を備える装置。 9.前記インタフェース手段が前記第1の双方向ツェナー・ダイオード、前記第 2の双方向ツェナー・ダイオード、および前記単方向ツェナー・ダイオードのそ れぞれと直列に接続されていることを特徴とする請求項8に記載の装置。 10.液体試料中のイオンの活量を測定するために使用するイオン感応電界効果 トランジスタ(ISFET)ベースのセンサ・チップに静電放電(ESD)保護 を形成する装置であって、 (a)ESD現象の結果として前記液体試料中に蓄積された電荷を前記ISF ETのソース、ドレイン、および基板に移動させる手段と、 (b)ISFETと前記液体の間に直流漏れ電流の経路を開くことなく前記保 護回路と前記液体との間にインタフェースを形成する、前記チップ上に前記電荷 移動手段と共に集積されたインタフェース手段と を備える装置。 11.前記インタフェース手段がキャパシタ構造体をさらに備えることを特徴と する請求項10に記載の装置。 12.イオン感応電界効果トランジスタ(ISFET)ベースのイオン選択電極 に静電放電(ESD)保護を与える方法であって、 (a)シリコン・チップ上にISFET回路を形成するステップと、 (b)前記ISFETが形成されている前記チップ上に保護回路を集積するス テップと、 (c)ISFETと前記液体との間に直流漏れ電流の経路を開くことなく前記 液体との接点を行う、前記保護回路と前記液体との間のインタフェースを前記チ ップ上に集積するステップとを含む方法。 13.前記チップ上に集積されたインタフェースがキャパシタ構造体であること を特徴とする請求項12に記載の方法。 14.シリコン基板と、フィールド酸化膜層と、少なくとも1つの化学障壁層と 、キャパシタを保護回路に接続する拡散P+領域とを有するイオン感応電界効果 トランジスタ(ISFET)チップが液体中のイオンを測定するために使用され る際に、被測定液体と前記ISFETチップに組み込まれた前記保護回路との間 のインタフェースとして機能するキャパシタを製作する方法であって、 (a)前記フィールド酸化膜と前記少なくとも1つの化学障壁層の中にビアを 開けるステップと、 (b)前記チップ上に金属膜をスパッタ付着させて前記キャパシタの下部電極 を作成するステップと、 (c)前記ビアを通して前記膜を前記拡散P+領域に接続するステップと、 (d)前記キャパシタの誘電体として機能するように前記金属膜の酸化膜を形 成するステップと を含む方法。 15.酸化膜を形成する前記ステップが前記金属膜を化学酸化させることによっ て行われることを特徴とする請求項14に記載の方法。 16.酸化膜を形成する前記ステップが前記金属膜を陽極酸化させることによっ て行われることをさらに特徴とする請求項14に記載の方法。 17.液体試料中のイオンの活量を測定するために使用するイオン感応電界効果 トランジスタ(ISFET)ベースのセンサ・チップに静電放電(ESD)保護 を与える方法であって、 (a)ESD現象中に前記試料中に電荷を蓄積するステップと、 (b)前記ESD現象の結果として前記液体試料中に蓄積された電荷を同時に ISFETのソース、ドレイン、および基板に移動させるステップと を含む方法。 18.液体試料中のイオンの活量を測定するために使用するイオン感応電界効果 トランジスタ(ISFET)ベースのセンサ・チップに静電放電(ESD)保護 を与える装置であって、 (a)ESD現象中に前記試料中に電荷を蓄積する手段と、 (b)前記ESD現象の結果として、前記液体試料中に蓄積された電荷をIS FETのソース、ドレイン、および基板に移動させる手段と を備える装置。 19.電荷を蓄積する前記手段と電荷を移動させる前記手段が前記チップ上に集 積されていることを特徴とする請求項18に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/183,733 US5414284A (en) | 1994-01-19 | 1994-01-19 | ESD Protection of ISFET sensors |
US183,733 | 1994-01-19 | ||
PCT/US1995/000426 WO1995020243A1 (en) | 1994-01-19 | 1995-01-12 | Electrostatic discharge protection of isfet sensors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09508207A true JPH09508207A (ja) | 1997-08-19 |
JP3701308B2 JP3701308B2 (ja) | 2005-09-28 |
Family
ID=22674080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51959695A Expired - Lifetime JP3701308B2 (ja) | 1994-01-19 | 1995-01-12 | Isfetセンサの静電放電保護 |
Country Status (10)
Country | Link |
---|---|
US (2) | US5414284A (ja) |
EP (1) | EP0749632B1 (ja) |
JP (1) | JP3701308B2 (ja) |
KR (1) | KR100358534B1 (ja) |
CN (1) | CN1120985C (ja) |
AU (1) | AU1602195A (ja) |
CA (1) | CA2181591C (ja) |
DE (1) | DE69535202T2 (ja) |
RU (1) | RU2134877C1 (ja) |
WO (1) | WO1995020243A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008542733A (ja) * | 2005-05-30 | 2008-11-27 | メトラー−トレド アクチェンゲゼルシャフト | 電気化学センサ |
JP2012242253A (ja) * | 2011-05-20 | 2012-12-10 | Horiba Ltd | Isfetセンサ |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5869869A (en) * | 1996-01-31 | 1999-02-09 | Lsi Logic Corporation | Microelectronic device with thin film electrostatic discharge protection structure |
US5747839A (en) * | 1996-09-30 | 1998-05-05 | Motorola, Inc. | Chemical sensing trench field effect transistor |
US5833824A (en) * | 1996-11-15 | 1998-11-10 | Rosemount Analytical Inc. | Dorsal substrate guarded ISFET sensor |
US5811868A (en) * | 1996-12-20 | 1998-09-22 | International Business Machines Corp. | Integrated high-performance decoupling capacitor |
US5944970A (en) * | 1997-04-29 | 1999-08-31 | Honeywell Inc. | Solid state electrochemical sensors |
US5892252A (en) * | 1998-02-05 | 1999-04-06 | Motorola, Inc. | Chemical sensing trench field effect transistor and method for same |
WO1999063596A1 (de) * | 1998-06-04 | 1999-12-09 | GFD-Gesellschaft für Diamantprodukte mbH | Diamantbauelement mit rückseitenkontaktierung und verfahren zu seiner herstellung |
US6300148B1 (en) * | 1998-10-05 | 2001-10-09 | Advanced Micro Devices | Semiconductor structure with a backside protective layer and backside probes and a method for constructing the structure |
US6387724B1 (en) | 1999-02-26 | 2002-05-14 | Dynamics Research Corporation | Method of fabricating silicon-on-insulator sensor having silicon oxide sensing surface |
TW434704B (en) * | 1999-06-11 | 2001-05-16 | Univ Nat Yunlin Sci & Tech | Device of amorphous WO3 ion sensitive field effect transistor (ISFET) and method for making the same |
JP2000356619A (ja) * | 1999-06-14 | 2000-12-26 | Sumitomo Metal Ind Ltd | pHセンサおよびそれを使用したpH測定方法 |
US6218208B1 (en) | 1999-07-02 | 2001-04-17 | National Science Council | Fabrication of a multi-structure ion sensitive field effect transistor with a pH sensing layer of a tin oxide thin film |
US7151036B1 (en) * | 2002-07-29 | 2006-12-19 | Vishay-Siliconix | Precision high-frequency capacitor formed on semiconductor substrate |
US6538300B1 (en) * | 2000-09-14 | 2003-03-25 | Vishay Intertechnology, Inc. | Precision high-frequency capacitor formed on semiconductor substrate |
TW468233B (en) | 2000-09-16 | 2001-12-11 | Univ Nat Yunlin Sci & Tech | Apparatus and measurement method of hysteresis and time shift for ISFET containing amorphous silicon hydride sensing membrane |
KR20030075437A (ko) * | 2002-03-19 | 2003-09-26 | (주)티오스 | 감이온 전계효과 트랜지스터-미터의 정전기로 인한 손상방지를 위한 감이온 전계효과 트랜지스터-프로브 제작 및측정기 본체의 회로 설계 기술 |
TW544752B (en) | 2002-05-20 | 2003-08-01 | Univ Nat Yunlin Sci & Tech | Method for producing SnO2 gate ion sensitive field effect transistor (ISFET), and method and device for measuring the temperature parameters, drift and hysteresis values thereof |
US20040104454A1 (en) * | 2002-10-10 | 2004-06-03 | Rohm Co., Ltd. | Semiconductor device and method of producing the same |
DE10260961A1 (de) * | 2002-12-20 | 2004-07-01 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Halbleitersensor mit frontseitiger Kontaktierung |
US7337898B2 (en) * | 2003-09-30 | 2008-03-04 | Fred Lewter | Golf bag |
JP4065855B2 (ja) * | 2004-01-21 | 2008-03-26 | 株式会社日立製作所 | 生体および化学試料検査装置 |
CA2538232A1 (en) * | 2004-01-21 | 2005-08-11 | Rosemount Analytical Inc. | Ion sensitive field effect transistor (isfet) sensor with improved gate configuration |
TWI241020B (en) * | 2004-03-31 | 2005-10-01 | Univ Nat Yunlin Sci & Tech | Method of manufacturing TiO2 sensing film, ISFET having TiO2 sensing film, and methods and apparatus for measuring the temperature parameter, drift, and hysteresis thereof |
US20050225916A1 (en) * | 2004-04-02 | 2005-10-13 | Siemens Medical Solutions Usa, Inc. | Ultrasound membrane transducer collapse protection system and method |
ITTO20040386A1 (it) * | 2004-06-09 | 2004-09-09 | Infm Istituto Naz Per La Fisi | Dispositivo ad effetto di campo per la rilevazione di piccole quantita' di carica elettrica, come quelle generate in processi biomolecolari, immobilizzate nelle vicinanze della superficie. |
GB2416210B (en) * | 2004-07-13 | 2008-02-20 | Christofer Toumazou | Ion sensitive field effect transistors |
CN100446417C (zh) * | 2004-12-23 | 2008-12-24 | 中国科学院电子学研究所 | 基于双模式的集成isfet传感器信号差分读出电路 |
US20060174683A1 (en) * | 2005-02-07 | 2006-08-10 | Ulrich Bonne | Functionalized field effect transistor sensor with self checking |
TWI244702B (en) * | 2005-04-04 | 2005-12-01 | Univ Nat Yunlin Sci & Tech | Titanium oxide thin film for extended gate field effect transistor using reactive sputtering |
CN101101272B (zh) * | 2006-07-07 | 2010-10-13 | 中国科学院电子学研究所 | 一种生化微传感集成芯片、制作及模具制备方法 |
DE102006052863B4 (de) | 2006-11-09 | 2018-03-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Schutzstruktur für Halbleitersensoren und deren Verwendung |
US8349167B2 (en) | 2006-12-14 | 2013-01-08 | Life Technologies Corporation | Methods and apparatus for detecting molecular interactions using FET arrays |
EP2653861B1 (en) | 2006-12-14 | 2014-08-13 | Life Technologies Corporation | Method for sequencing a nucleic acid using large-scale FET arrays |
US8262900B2 (en) | 2006-12-14 | 2012-09-11 | Life Technologies Corporation | Methods and apparatus for measuring analytes using large scale FET arrays |
US11339430B2 (en) | 2007-07-10 | 2022-05-24 | Life Technologies Corporation | Methods and apparatus for measuring analytes using large scale FET arrays |
US8017982B2 (en) * | 2007-06-12 | 2011-09-13 | Micron Technology, Inc. | Imagers with contact plugs extending through the substrates thereof and imager fabrication methods |
CN102203282B (zh) | 2008-06-25 | 2014-04-30 | 生命技术公司 | 使用大规模fet阵列测量分析物的方法和装置 |
US8207894B2 (en) * | 2008-09-11 | 2012-06-26 | Google Inc. | Multilayer compact antenna |
US20100137143A1 (en) | 2008-10-22 | 2010-06-03 | Ion Torrent Systems Incorporated | Methods and apparatus for measuring analytes |
US20100301398A1 (en) | 2009-05-29 | 2010-12-02 | Ion Torrent Systems Incorporated | Methods and apparatus for measuring analytes |
US8776573B2 (en) | 2009-05-29 | 2014-07-15 | Life Technologies Corporation | Methods and apparatus for measuring analytes |
US20120261274A1 (en) | 2009-05-29 | 2012-10-18 | Life Technologies Corporation | Methods and apparatus for measuring analytes |
EP2320222A1 (en) * | 2009-11-04 | 2011-05-11 | Nxp B.V. | Electrostatic discharge (ESD) protection for biosensors |
TWI400009B (zh) * | 2010-04-12 | 2013-06-21 | Ili Technology Corp | Electrostatic discharge protection module |
US8487790B2 (en) | 2010-06-30 | 2013-07-16 | Life Technologies Corporation | Chemical detection circuit including a serializer circuit |
AU2011226767B1 (en) | 2010-06-30 | 2011-11-10 | Life Technologies Corporation | Ion-sensing charge-accumulation circuits and methods |
TWI569025B (zh) | 2010-06-30 | 2017-02-01 | 生命技術公司 | 用於測試離子感測場效電晶體(isfet)陣列之裝置及方法 |
US11307166B2 (en) | 2010-07-01 | 2022-04-19 | Life Technologies Corporation | Column ADC |
EP2589065B1 (en) | 2010-07-03 | 2015-08-19 | Life Technologies Corporation | Chemically sensitive sensor with lightly doped drains |
WO2012036679A1 (en) | 2010-09-15 | 2012-03-22 | Life Technologies Corporation | Methods and apparatus for measuring analytes |
AU2011226766A1 (en) | 2010-09-24 | 2012-04-12 | Life Technologies Corporation | Matched pair transistor circuits |
GB2484339B (en) | 2010-10-08 | 2016-12-21 | Dnae Group Holdings Ltd | Electrostatic discharge protection |
US9970984B2 (en) | 2011-12-01 | 2018-05-15 | Life Technologies Corporation | Method and apparatus for identifying defects in a chemical sensor array |
US8821798B2 (en) | 2012-01-19 | 2014-09-02 | Life Technologies Corporation | Titanium nitride as sensing layer for microwell structure |
US8786331B2 (en) | 2012-05-29 | 2014-07-22 | Life Technologies Corporation | System for reducing noise in a chemical sensor array |
US9080968B2 (en) | 2013-01-04 | 2015-07-14 | Life Technologies Corporation | Methods and systems for point of use removal of sacrificial material |
US9841398B2 (en) | 2013-01-08 | 2017-12-12 | Life Technologies Corporation | Methods for manufacturing well structures for low-noise chemical sensors |
US8962366B2 (en) | 2013-01-28 | 2015-02-24 | Life Technologies Corporation | Self-aligned well structures for low-noise chemical sensors |
US8871549B2 (en) * | 2013-02-14 | 2014-10-28 | International Business Machines Corporation | Biological and chemical sensors |
US8841217B1 (en) | 2013-03-13 | 2014-09-23 | Life Technologies Corporation | Chemical sensor with protruded sensor surface |
US8963216B2 (en) | 2013-03-13 | 2015-02-24 | Life Technologies Corporation | Chemical sensor with sidewall spacer sensor surface |
US9116117B2 (en) | 2013-03-15 | 2015-08-25 | Life Technologies Corporation | Chemical sensor with sidewall sensor surface |
JP6671274B2 (ja) | 2013-03-15 | 2020-03-25 | ライフ テクノロジーズ コーポレーション | 薄伝導性素子を有する化学装置 |
US9128044B2 (en) | 2013-03-15 | 2015-09-08 | Life Technologies Corporation | Chemical sensors with consistent sensor surface areas |
US9835585B2 (en) | 2013-03-15 | 2017-12-05 | Life Technologies Corporation | Chemical sensor with protruded sensor surface |
US20140264472A1 (en) * | 2013-03-15 | 2014-09-18 | Life Technologies Corporation | Chemical sensor with consistent sensor surface areas |
US20140336063A1 (en) | 2013-05-09 | 2014-11-13 | Life Technologies Corporation | Windowed Sequencing |
US10458942B2 (en) | 2013-06-10 | 2019-10-29 | Life Technologies Corporation | Chemical sensor array having multiple sensors per well |
US9978689B2 (en) | 2013-12-18 | 2018-05-22 | Nxp Usa, Inc. | Ion sensitive field effect transistors with protection diodes and methods of their fabrication |
US9442090B2 (en) | 2014-03-27 | 2016-09-13 | Honeywell International Inc. | Magnetic stimulus of ISFET-based sensor to enable trimming and self-compensation of sensor measurement errors |
US10077472B2 (en) | 2014-12-18 | 2018-09-18 | Life Technologies Corporation | High data rate integrated circuit with power management |
CN107250784B (zh) | 2014-12-18 | 2020-10-23 | 生命科技公司 | 具有发送器配置的高数据率集成电路 |
WO2016100521A1 (en) | 2014-12-18 | 2016-06-23 | Life Technologies Corporation | Methods and apparatus for measuring analytes using large scale fet arrays |
EP3206027B1 (en) * | 2016-02-11 | 2019-09-11 | Sensirion AG | Sensor chip comprising electrostatic discharge protection element |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4020830A (en) * | 1975-03-12 | 1977-05-03 | The University Of Utah | Selective chemical sensitive FET transducers |
US4397714A (en) * | 1980-06-16 | 1983-08-09 | University Of Utah | System for measuring the concentration of chemical substances |
JPS57159055A (en) * | 1981-03-25 | 1982-10-01 | Toshiba Corp | Manufacture of semiconductor device |
NL8302963A (nl) * | 1983-08-24 | 1985-03-18 | Cordis Europ | Inrichting voor het selectief meten van ionen in een vloeistof. |
US4505799A (en) * | 1983-12-08 | 1985-03-19 | General Signal Corporation | ISFET sensor and method of manufacture |
GB8428138D0 (en) * | 1984-11-07 | 1984-12-12 | Sibbald A | Semiconductor devices |
US4851104A (en) * | 1987-02-27 | 1989-07-25 | General Signal Corporation | Instrument for potentiometric electrochemical measurements |
JP2610294B2 (ja) * | 1988-03-31 | 1997-05-14 | 株式会社東芝 | 化学センサ |
DD275958A1 (de) * | 1988-10-03 | 1990-02-07 | Akad Wissenschaften Ddr | Chemischer sensor mit elektrostatischem schutz |
US4898839A (en) * | 1988-11-15 | 1990-02-06 | Sanyo Electric Co., Ltd. | Semiconductor integrated circuit and manufacturing method therefor |
US5025298A (en) * | 1989-08-22 | 1991-06-18 | Motorola, Inc. | Semiconductor structure with closely coupled substrate temperature sense element |
US5130760A (en) * | 1991-06-11 | 1992-07-14 | Honeywell Inc. | Bidirectional surge suppressor Zener diode circuit with guard rings |
FR2683947B1 (fr) * | 1991-11-18 | 1994-02-18 | Sgs Thomson Microelectronics Sa | Diode de protection monolithique basse tension a faible capacite. |
DE4232532A1 (de) * | 1992-09-29 | 1994-04-28 | Ct Fuer Intelligente Sensorik | Anordnung und Verfahren zur Erhöhung der Zuverlässigkeit von ionensensitiven Feldeffekttransistoren |
-
1994
- 1994-01-19 US US08/183,733 patent/US5414284A/en not_active Expired - Lifetime
- 1994-10-13 US US08/322,226 patent/US5407854A/en not_active Expired - Lifetime
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- 1995-01-12 DE DE69535202T patent/DE69535202T2/de not_active Expired - Lifetime
- 1995-01-12 WO PCT/US1995/000426 patent/WO1995020243A1/en active IP Right Grant
- 1995-01-12 JP JP51959695A patent/JP3701308B2/ja not_active Expired - Lifetime
- 1995-01-12 KR KR1019960703873A patent/KR100358534B1/ko not_active IP Right Cessation
- 1995-01-12 CA CA002181591A patent/CA2181591C/en not_active Expired - Fee Related
- 1995-01-12 RU RU96115918A patent/RU2134877C1/ru not_active IP Right Cessation
- 1995-01-12 CN CN95191279A patent/CN1120985C/zh not_active Expired - Lifetime
- 1995-01-12 EP EP95908032A patent/EP0749632B1/en not_active Expired - Lifetime
- 1995-01-12 AU AU16021/95A patent/AU1602195A/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008542733A (ja) * | 2005-05-30 | 2008-11-27 | メトラー−トレド アクチェンゲゼルシャフト | 電気化学センサ |
JP2012242253A (ja) * | 2011-05-20 | 2012-12-10 | Horiba Ltd | Isfetセンサ |
Also Published As
Publication number | Publication date |
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DE69535202D1 (de) | 2006-10-12 |
CA2181591C (en) | 2008-04-29 |
US5407854A (en) | 1995-04-18 |
CN1143428A (zh) | 1997-02-19 |
CA2181591A1 (en) | 1995-07-27 |
JP3701308B2 (ja) | 2005-09-28 |
EP0749632A1 (en) | 1996-12-27 |
WO1995020243A1 (en) | 1995-07-27 |
US5414284A (en) | 1995-05-09 |
DE69535202T2 (de) | 2007-07-19 |
EP0749632B1 (en) | 2006-08-30 |
KR100358534B1 (ko) | 2003-01-25 |
CN1120985C (zh) | 2003-09-10 |
EP0749632A4 (en) | 1999-11-24 |
RU2134877C1 (ru) | 1999-08-20 |
AU1602195A (en) | 1995-08-08 |
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