JPH09501197A - ポリマー樹脂含有接着剤ペースト - Google Patents
ポリマー樹脂含有接着剤ペーストInfo
- Publication number
- JPH09501197A JPH09501197A JP7506474A JP50647495A JPH09501197A JP H09501197 A JPH09501197 A JP H09501197A JP 7506474 A JP7506474 A JP 7506474A JP 50647495 A JP50647495 A JP 50647495A JP H09501197 A JPH09501197 A JP H09501197A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive paste
- resin
- paste
- liquid
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01038—Strontium [Sr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01056—Barium [Ba]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01076—Osmium [Os]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. (A)約7−35体積パーセントの有機ポリマー樹脂、 (B)約20−40体積パーセントの無機充填材、および (C)約37−67体積パーセントの易除去性液体、 から本質的に成る接着剤ペーストであって、該樹脂および該充填材の各々が32 5号メッシュスクリーンを通過するに充分なほど小さいサイズの粒子形態で存在 しており、そして該液体および該樹脂の各々がもう一方の中で示す溶解度が約2 0%以下である接着剤ペースト。 2. 該有機ポリマー樹脂が熱可塑材である請求の範囲第1項の接着剤ペース ト。 3. 該熱可塑材がポリスルホン類、ポリ(フェニレンスルフィド)類、ポリ (エーテルスルホン)類およびポリエステル類から成る群から選択される請求の 範囲第2項の接着剤ペースト。 4. 該易除去性液体が約150℃から275℃の沸点を有する脂肪族および 芳香族炭化水素およびグリコールエーテル類から選択される請求の範囲第1項の 接着剤ペースト。 5. 該無機充填材が少なくとも約15ワット/m・°Kの熱伝導率を有する 請求の範囲第1項の接着剤ペースト。 6. 該充填材が約1x10-5オーム・cm未満の電気抵抗を有する請求の範 囲第5項の接着剤ペースト。 7. 該無機充填材が貴金属である請求の範囲第1項の接着剤ペースト。 8. 該無機充填材が銀から本質的に成る請求の範囲第7項の接着剤ペースト 。 9. 該液体および熱可塑性ポリマー樹脂の両方が実質的にもう一方に不溶で ある請求の範囲第1項の接着剤ペースト。 10. 該無機充填材が約0.2から3.0m2/gの表面積を有する請求の 範囲第8項の接着剤ペースト。 11. 該無機充填材が約2−5g/ccのタップ密度を有する請求の範囲第 8項の接着剤ペースト。 12. 基質上に電子構成要素を組み立てる方法であって、 i)(A)約7−35体積パーセントの有機ポリマー樹脂、 (B)約20−40体積パーセントの無機充填材、および (C)約37−67体積パーセントの易除去性液体、 から本質的に成る接着剤ペーストであって該樹脂および該充填材の各々が325 号メッシュスクリーンを通過するに充分なほど小さいサイズの粒子形態で存在し ておりそして該液体および該樹脂の各々がもう一方の中で示す溶解度が約20% 以下である接着剤ペーストを基質の上に付着させ、 ii)該接着剤ペーストに接触させて該基質の上に電子構成要素を位 置させ、 iii)その結果として生じるアセンブリを、該ポリマー樹脂が軟化 して流体になる温度より高くそして該熱可塑性ポリマー樹脂が分解し始める温度 より低い温度に加熱し、そして iv)このアセンブリを冷却し、それによって、該熱可塑性ポリマー 樹脂を固化させて該電子構成要素を該基質に接着させる、 段階を含む方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/100,052 US5391604A (en) | 1993-07-30 | 1993-07-30 | Adhesive paste containing polymeric resin |
US08/100,052 | 1993-07-30 | ||
US100,052 | 1993-07-30 | ||
PCT/US1994/008680 WO1995004786A2 (en) | 1993-07-30 | 1994-07-28 | Adhesive paste containing polymeric resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09501197A true JPH09501197A (ja) | 1997-02-04 |
JP2972342B2 JP2972342B2 (ja) | 1999-11-08 |
Family
ID=22277885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7506474A Expired - Lifetime JP2972342B2 (ja) | 1993-07-30 | 1994-07-28 | ポリマー樹脂含有接着剤ペースト |
Country Status (7)
Country | Link |
---|---|
US (2) | US5391604A (ja) |
EP (1) | EP0719299B1 (ja) |
JP (1) | JP2972342B2 (ja) |
KR (1) | KR100242281B1 (ja) |
CA (1) | CA2168427A1 (ja) |
DE (1) | DE69429099D1 (ja) |
WO (1) | WO1995004786A2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011026602A (ja) * | 1998-01-23 | 2011-02-10 | National Starch & Chemical Investment Holding Corp | マイクロ電子デバイスのための小さい粒度の接着剤 |
JP2011515559A (ja) * | 2008-03-26 | 2011-05-19 | ダイマット,インク. | 熱強化された電気絶縁性接着ペースト |
JP2017160348A (ja) * | 2016-03-10 | 2017-09-14 | ナミックス株式会社 | 熱伝導性接着剤、ディスペンス用接着剤、スクリーン印刷用接着剤、および半導体装置 |
WO2018181625A1 (ja) | 2017-03-31 | 2018-10-04 | 田中貴金属工業株式会社 | 導電性接着剤組成物 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6111005A (en) * | 1993-07-30 | 2000-08-29 | Diemat, Inc. | Polymeric adhesive paste |
US6140402A (en) * | 1993-07-30 | 2000-10-31 | Diemat, Inc. | Polymeric adhesive paste |
US5391604A (en) * | 1993-07-30 | 1995-02-21 | Diemat, Inc. | Adhesive paste containing polymeric resin |
TW301843B (en) | 1994-11-15 | 1997-04-01 | Ibm | Electrically conductive paste and composite and their use as an electrically conductive connector |
US5959340A (en) * | 1995-09-05 | 1999-09-28 | Drs Technologies, Inc. | Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion |
EP0805616A1 (en) * | 1996-05-03 | 1997-11-05 | International Business Machines Corporation | Electrically conductive compositions |
US6127203A (en) * | 1996-08-30 | 2000-10-03 | Drs Technologies, Inc. | Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion |
US5847038A (en) * | 1996-09-03 | 1998-12-08 | Xerox Corporation | Polymer processes |
AU5623798A (en) * | 1997-01-06 | 1998-08-03 | Quantum Materials, Inc. | Reducing void formation in curable adhesive formulations |
US6265471B1 (en) | 1997-03-03 | 2001-07-24 | Diemat, Inc. | High thermally conductive polymeric adhesive |
JPH1145965A (ja) | 1997-07-28 | 1999-02-16 | Kyocera Corp | 伝熱性化合物およびこれを用いた半導体装置 |
US6165613A (en) * | 1999-03-09 | 2000-12-26 | National Starch And Chemical Investment Holding Corporation | Adhesive paste for semiconductors |
US6426552B1 (en) | 2000-05-19 | 2002-07-30 | Micron Technology, Inc. | Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials |
JP2001351929A (ja) * | 2000-06-09 | 2001-12-21 | Hitachi Ltd | 半導体装置およびその製造方法 |
US6784555B2 (en) * | 2001-09-17 | 2004-08-31 | Dow Corning Corporation | Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes |
US7074481B2 (en) * | 2001-09-17 | 2006-07-11 | Dow Corning Corporation | Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes |
TWI251018B (en) * | 2002-04-10 | 2006-03-11 | Fujikura Ltd | Electroconductive composition, electroconductive coating and method of producing the electroconductive coating |
US20050049350A1 (en) * | 2003-08-25 | 2005-03-03 | Sandeep Tonapi | Thin bond-line silicone adhesive composition and method for preparing the same |
JP3988735B2 (ja) * | 2004-03-15 | 2007-10-10 | 日立金属株式会社 | 半導体装置及びその製造方法 |
TWI329323B (en) * | 2006-04-21 | 2010-08-21 | Kwo Kung Ming | Method of fabricating conductive paste for conductive substrate or conductive film |
US8344523B2 (en) | 2006-05-08 | 2013-01-01 | Diemat, Inc. | Conductive composition |
US20070256783A1 (en) * | 2006-05-08 | 2007-11-08 | Dietz Raymond L | Thermally enhanced adhesive paste |
US8159825B1 (en) | 2006-08-25 | 2012-04-17 | Hypres Inc. | Method for fabrication of electrical contacts to superconducting circuits |
US7422707B2 (en) * | 2007-01-10 | 2008-09-09 | National Starch And Chemical Investment Holding Corporation | Highly conductive composition for wafer coating |
EP2181169A2 (en) * | 2007-08-20 | 2010-05-05 | Diemat, Inc. | Adhesives with thermal conductivity enhanced by mixed silver fillers |
CN102124068A (zh) * | 2008-02-25 | 2011-07-13 | 汉高股份两合公司 | 自圆倒角化芯片粘接膏 |
DE102008036837A1 (de) * | 2008-08-07 | 2010-02-18 | Epcos Ag | Sensorvorrichtung und Verfahren zur Herstellung |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5349267A (en) * | 1976-10-15 | 1978-05-04 | Nippon Kokuen Kogyo Kk | Method of mounting electric parts such as resistor to printed circuit substrate |
AU534530B2 (en) * | 1979-02-02 | 1984-02-02 | Takeda Chemical Industries Ltd. | 5-aza-(3.2.0)-heptane derivatives |
US4518524A (en) * | 1983-06-27 | 1985-05-21 | Acheson Industries, Inc. | Silver coating composition for use in electronic applications and the like |
US4533685A (en) * | 1983-07-26 | 1985-08-06 | Hudgin Donald E | Polymer-metal blend |
GB8730196D0 (en) * | 1987-12-24 | 1988-02-03 | Johnson Matthey Plc | Silver-filled glass |
JPH025304A (ja) * | 1988-06-21 | 1990-01-10 | Nitto Denko Corp | 導電性ペースト組成物 |
US5043214A (en) * | 1988-08-15 | 1991-08-27 | Allied-Signal Inc. | Flame resistant article made of phenolic triazine and related method |
US4933030A (en) * | 1989-06-21 | 1990-06-12 | Dietz Raymond L | Low temperature glass composition, paste and method of use |
US5043102A (en) * | 1989-11-29 | 1991-08-27 | Advanced Products, Inc. | Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
US5061549A (en) * | 1990-03-20 | 1991-10-29 | Shores A Andrew | Substrate attach adhesive film, application method and devices incorporating the same |
US5155066A (en) * | 1990-10-24 | 1992-10-13 | Johnson Matthey Inc. | Rapid-curing adhesive formulation for semiconductor devices |
US5391604A (en) * | 1993-07-30 | 1995-02-21 | Diemat, Inc. | Adhesive paste containing polymeric resin |
-
1993
- 1993-07-30 US US08/100,052 patent/US5391604A/en not_active Expired - Fee Related
-
1994
- 1994-07-28 KR KR1019960700482A patent/KR100242281B1/ko active IP Right Grant
- 1994-07-28 CA CA002168427A patent/CA2168427A1/en not_active Abandoned
- 1994-07-28 JP JP7506474A patent/JP2972342B2/ja not_active Expired - Lifetime
- 1994-07-28 EP EP94924102A patent/EP0719299B1/en not_active Expired - Lifetime
- 1994-07-28 DE DE69429099T patent/DE69429099D1/de not_active Expired - Lifetime
- 1994-07-28 WO PCT/US1994/008680 patent/WO1995004786A2/en active IP Right Grant
-
1995
- 1995-02-17 US US08/390,257 patent/US5488082A/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011026602A (ja) * | 1998-01-23 | 2011-02-10 | National Starch & Chemical Investment Holding Corp | マイクロ電子デバイスのための小さい粒度の接着剤 |
JP2011515559A (ja) * | 2008-03-26 | 2011-05-19 | ダイマット,インク. | 熱強化された電気絶縁性接着ペースト |
JP2017160348A (ja) * | 2016-03-10 | 2017-09-14 | ナミックス株式会社 | 熱伝導性接着剤、ディスペンス用接着剤、スクリーン印刷用接着剤、および半導体装置 |
WO2018181625A1 (ja) | 2017-03-31 | 2018-10-04 | 田中貴金属工業株式会社 | 導電性接着剤組成物 |
CN109072041A (zh) * | 2017-03-31 | 2018-12-21 | 田中贵金属工业株式会社 | 导电性粘接剂组合物 |
JPWO2018181625A1 (ja) * | 2017-03-31 | 2020-02-06 | 田中貴金属工業株式会社 | 導電性接着剤組成物 |
Also Published As
Publication number | Publication date |
---|---|
JP2972342B2 (ja) | 1999-11-08 |
WO1995004786A3 (en) | 1995-03-16 |
US5391604A (en) | 1995-02-21 |
CA2168427A1 (en) | 1995-02-16 |
KR100242281B1 (ko) | 2000-02-01 |
DE69429099D1 (de) | 2001-12-20 |
EP0719299A4 (en) | 1998-07-01 |
US5488082A (en) | 1996-01-30 |
EP0719299A1 (en) | 1996-07-03 |
WO1995004786A2 (en) | 1995-02-16 |
KR960704000A (ko) | 1996-08-31 |
EP0719299B1 (en) | 2001-11-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH09501197A (ja) | ポリマー樹脂含有接着剤ペースト | |
CN110023444B (zh) | 膜状粘接剂、使用了膜状粘接剂的半导体封装体的制造方法 | |
US6874573B2 (en) | Thermal interface material | |
JP6749653B2 (ja) | 高性能熱伝導性表面実装(ダイアタッチ)接着剤 | |
JP5774472B2 (ja) | 熱強化された電気絶縁性接着ペースト | |
US6140402A (en) | Polymeric adhesive paste | |
WO2004022663A1 (ja) | 導電性接着剤およびそれを用いた回路 | |
KR20130094243A (ko) | 고열전도성 수지 경화물, 고열전도성 반경화 수지 필름 및 고열전도성 수지 조성물 | |
US8344523B2 (en) | Conductive composition | |
KR940004204B1 (ko) | 다이 부착용 접착제 조성물 | |
JP2005206665A (ja) | シート状半導体封止用樹脂組成物 | |
US7025852B2 (en) | Connecting material and mounting method which uses same | |
JP2011026602A (ja) | マイクロ電子デバイスのための小さい粒度の接着剤 | |
JP2589892B2 (ja) | ダイ接着用接着剤組成物 | |
JPH09263683A (ja) | 導電性エポキシ樹脂組成物 | |
US6111005A (en) | Polymeric adhesive paste | |
JP4064025B2 (ja) | 樹脂組成物およびこれを使用して作製した半導体装置。 | |
JP2010536992A (ja) | 銀フィラーの混合によって強化された熱伝導率を有する接着剤 | |
JP2004288560A (ja) | 導電性接着フィルム及びこれを用いた半導体装置 | |
JP2002020625A (ja) | 高熱伝導性組成物とその用途 | |
JP3759383B2 (ja) | 導電性樹脂ペースト及び半導体装置 | |
CN116970360A (zh) | 环氧树脂电子封装材料及用其包封的电子元器件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070827 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080827 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090827 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100827 Year of fee payment: 11 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120827 Year of fee payment: 13 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120827 Year of fee payment: 13 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130827 Year of fee payment: 14 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |