DE69429099D1 - Klebstoffpaste welche ein polymeres harz enthält - Google Patents

Klebstoffpaste welche ein polymeres harz enthält

Info

Publication number
DE69429099D1
DE69429099D1 DE69429099T DE69429099T DE69429099D1 DE 69429099 D1 DE69429099 D1 DE 69429099D1 DE 69429099 T DE69429099 T DE 69429099T DE 69429099 T DE69429099 T DE 69429099T DE 69429099 D1 DE69429099 D1 DE 69429099D1
Authority
DE
Germany
Prior art keywords
polymer resin
adhesive paste
paste
adhesive
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69429099T
Other languages
English (en)
Inventor
Louis Dietz
David Martin Peck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diemat Inc
Original Assignee
Diemat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diemat Inc filed Critical Diemat Inc
Application granted granted Critical
Publication of DE69429099D1 publication Critical patent/DE69429099D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69429099T 1993-07-30 1994-07-28 Klebstoffpaste welche ein polymeres harz enthält Expired - Lifetime DE69429099D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/100,052 US5391604A (en) 1993-07-30 1993-07-30 Adhesive paste containing polymeric resin
PCT/US1994/008680 WO1995004786A2 (en) 1993-07-30 1994-07-28 Adhesive paste containing polymeric resin

Publications (1)

Publication Number Publication Date
DE69429099D1 true DE69429099D1 (de) 2001-12-20

Family

ID=22277885

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69429099T Expired - Lifetime DE69429099D1 (de) 1993-07-30 1994-07-28 Klebstoffpaste welche ein polymeres harz enthält

Country Status (7)

Country Link
US (2) US5391604A (de)
EP (1) EP0719299B1 (de)
JP (1) JP2972342B2 (de)
KR (1) KR100242281B1 (de)
CA (1) CA2168427A1 (de)
DE (1) DE69429099D1 (de)
WO (1) WO1995004786A2 (de)

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US6140402A (en) * 1993-07-30 2000-10-31 Diemat, Inc. Polymeric adhesive paste
US5391604A (en) * 1993-07-30 1995-02-21 Diemat, Inc. Adhesive paste containing polymeric resin
US6111005A (en) * 1993-07-30 2000-08-29 Diemat, Inc. Polymeric adhesive paste
TW301843B (en) 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
US5959340A (en) * 1995-09-05 1999-09-28 Drs Technologies, Inc. Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion
EP0805616A1 (de) * 1996-05-03 1997-11-05 International Business Machines Corporation Elektrisch leitfähige Zusammensetzungen
US6127203A (en) * 1996-08-30 2000-10-03 Drs Technologies, Inc. Thermoplastic mounting of a semiconductor die to a substrate having a mismatched coefficient of thermal expansion
US5847038A (en) * 1996-09-03 1998-12-08 Xerox Corporation Polymer processes
WO1998030647A1 (en) * 1997-01-06 1998-07-16 Quantum Materials, Inc. Reducing void formation in curable adhesive formulations
US6265471B1 (en) 1997-03-03 2001-07-24 Diemat, Inc. High thermally conductive polymeric adhesive
JPH1145965A (ja) 1997-07-28 1999-02-16 Kyocera Corp 伝熱性化合物およびこれを用いた半導体装置
US6022616A (en) * 1998-01-23 2000-02-08 National Starch And Chemical Investment Holding Corporation Adhesive composition with small particle size for microelectronic devices
US6165613A (en) * 1999-03-09 2000-12-26 National Starch And Chemical Investment Holding Corporation Adhesive paste for semiconductors
US6426552B1 (en) * 2000-05-19 2002-07-30 Micron Technology, Inc. Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
JP2001351929A (ja) * 2000-06-09 2001-12-21 Hitachi Ltd 半導体装置およびその製造方法
US6784555B2 (en) * 2001-09-17 2004-08-31 Dow Corning Corporation Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
US7074481B2 (en) * 2001-09-17 2006-07-11 Dow Corning Corporation Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
TWI251018B (en) * 2002-04-10 2006-03-11 Fujikura Ltd Electroconductive composition, electroconductive coating and method of producing the electroconductive coating
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
JP3988735B2 (ja) * 2004-03-15 2007-10-10 日立金属株式会社 半導体装置及びその製造方法
TWI329323B (en) * 2006-04-21 2010-08-21 Kwo Kung Ming Method of fabricating conductive paste for conductive substrate or conductive film
US8344523B2 (en) 2006-05-08 2013-01-01 Diemat, Inc. Conductive composition
US20070256783A1 (en) * 2006-05-08 2007-11-08 Dietz Raymond L Thermally enhanced adhesive paste
US8159825B1 (en) 2006-08-25 2012-04-17 Hypres Inc. Method for fabrication of electrical contacts to superconducting circuits
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
WO2009025787A2 (en) * 2007-08-20 2009-02-26 Diemat, Inc. Adhesives with thermal conductivity enhanced by mixed silver fillers
KR101510665B1 (ko) * 2008-02-25 2015-04-10 헨켈 아게 운트 코. 카게아아 자기-필렛화 다이 부착 페이스트
US7906373B1 (en) * 2008-03-26 2011-03-15 Pawel Czubarow Thermally enhanced electrically insulative adhesive paste
DE102008036837A1 (de) * 2008-08-07 2010-02-18 Epcos Ag Sensorvorrichtung und Verfahren zur Herstellung
JP6706100B2 (ja) * 2016-03-10 2020-06-03 ナミックス株式会社 熱伝導性接着剤、ディスペンス用接着剤、スクリーン印刷用接着剤、および半導体装置
WO2018181625A1 (ja) 2017-03-31 2018-10-04 田中貴金属工業株式会社 導電性接着剤組成物

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US5155066A (en) * 1990-10-24 1992-10-13 Johnson Matthey Inc. Rapid-curing adhesive formulation for semiconductor devices
US5391604A (en) * 1993-07-30 1995-02-21 Diemat, Inc. Adhesive paste containing polymeric resin

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CA2168427A1 (en) 1995-02-16
KR100242281B1 (ko) 2000-02-01
EP0719299B1 (de) 2001-11-14
KR960704000A (ko) 1996-08-31
WO1995004786A3 (en) 1995-03-16
US5488082A (en) 1996-01-30
JP2972342B2 (ja) 1999-11-08
WO1995004786A2 (en) 1995-02-16
US5391604A (en) 1995-02-21
EP0719299A1 (de) 1996-07-03
EP0719299A4 (de) 1998-07-01
JPH09501197A (ja) 1997-02-04

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