JPH0946014A - Printed wiring board and product name check method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To check a through-hole name, a pattern name, a solder resist name and a letter name rapidly and exactly on a printed wiring board. SOLUTION: When a through-hole and a patten are formed on a copper clad lamination board, an item check pad 3 is provided for bringing four probes of electrical check into contact with separate position by item unit, solder resist print and letter print are performed for the item check pad 3 one by one, through-hole, pattern item division lands ϕ1 , ϕ2 , a solder resist item dividing escape land ϕ3 , a letter item division land ϕ4 and a common land ϕ5 are provided and four electrical check probes are borught into contact therewith. Then, a product name is judged in open and short mode among probes 5a to 5b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a product name inspection method, and more particularly, to an automatic inspection machine for automatically inspecting through-hole product names, pattern product names, solder resist product names, and character product names with or without continuity. Printed wiring board and product name inspection method.

[0002]

2. Description of the Related Art Conventionally, in the manufacturing process of a printed wiring board of this type, a character or mark for identifying a through-hole product name, a solder resist product name, and a character product name has not been provided in a portion of the printed wiring board which is a product. Although a visual inspection is performed by collating the drawings to see if the product is manufactured according to the designated product name, it takes a lot of time to determine whether the product is good or bad, and the determination accuracy is low. Also, regarding the pattern product name, there is a method of inspecting with an optical inspector provided in the part of the printed wiring board where the pattern product name is formed by etching characters at the time of circuit formation, but the inspection determination accuracy improves but it still takes a lot of time. However, since the inspection machine is also expensive, it is not a method that is widely used in practice.

[0003]

In the printed wiring board manufactured by the conventional method for manufacturing a printed wiring board described above, the inspection of the through-hole product name, the pattern product name, the solder resist product name, and the character product name is a manual inspection. , It takes a lot of time to check the product name of through-holes, patterns, solder resists and letters by visual inspection, and the inspector's skill is required to make an accurate inspection. There was a big problem.

It is an object of the present invention to provide a printed wiring board and a product name inspection method capable of inspecting through-hole product names, pattern product names, solder resist product names and character product names in a printed wiring board quickly and accurately. .

[0005]

A printed wiring board according to the present invention is a printed wiring board in which a predetermined through hole is drilled and a circuit is formed in a copper-clad laminate, and a solder resist and characters are sequentially laminated on the circuit. The wiring board is characterized in that a product name inspection check pad having a through hole for electrical inspection and a plurality of lands is provided at a predetermined position.

The method of inspecting a product name of a printed wiring board according to the present invention comprises a through hole having a land for electrical inspection at a predetermined position of the copper clad laminate and a plurality of through holes at the same time when the through hole holes are formed in the copper clad laminate and the circuit is formed. The step of forming the land and the solder resist printing and the character printing of the copper-clad laminate at the same time as exposing the land of the through hole and the portion which becomes the common land to the land and printing the land to inspect the product name. Check pad and the probe of the electrical inspection machine is brought into contact with each predetermined land of the product name inspection check pad, and the through hole product name, solder resist product name, and character product name are made conductive or non-conductive at each land. It is characterized by including a step of inspecting the presence or absence of an error depending on the state.

[0007]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a printed wiring board according to an embodiment of the present invention. As shown in FIG. 1, a printed wiring board according to an embodiment of the present invention
After forming a through hole on the top and performing copper plating, a photosensitive resin or film is coated, and after exposure and development, etching is performed to form a pad 2a, a through hole 2b and a pattern 2c. A check pad 3 for product name inspection is formed simultaneously with this processing. The check pad for product name inspection 3 is provided at a location specified individually for each product name.

FIG. 2 is a partially enlarged plan view of the product name inspection check pad of FIG. As shown in FIG. 2, the check pad 3 for inspecting the product name has through holes and patterns product name classification lands φ ₁ and φ ₂ , solder resist product name classification escape land φ ₃ , character product name classification land φ ₄ and common land φ _5.
Is formed, and whether or not the through holes of the printed wiring board, the formation of patterns and the solder resist, and the printing of characters are arranged according to the product name at the designated positions can be inspected by the presence or absence of conduction.

In this embodiment, the length L ₁ = 19 mm and the width W ₁ = 5 mm of the check pad 3 for product name inspection. Through hole and pattern product name classification is land size φ ₁
= 3 mm, length L ₂ = 2 mm, width W ₂ = 0.5 mm, and general hole φ ₂ = 1.0 mm. Solder resist product name classification is φ ₃ = escape land for solder resist product name classification with copper layer of 3 mm exposed, character product name classification is φ ₄ =
A land of 3 mm and a common land φ ₅ = 3 mm of each product name are provided, and an electric inspection probe is brought into contact with each land.
The contact is point contact.

FIG. 3 is a plan view trimmed from the copper-clad laminate to the outer shape of the printed wiring board. As shown in FIG. 3, a general hole having a specified shape, solder resist printing and character printing are performed, and the outer shape is trimmed.

FIG. 4 is a sectional view showing a product name inspection state in which a probe of an electric inspection machine is brought into contact with a product name inspection check pad. As shown in FIG.
And open and short between the probes 5a to 5d. The probes 5a to 5d are brought into contact with the product name inspection check pad 3 of the printed wiring board 6, and a current is passed between 5a to 5d. First, the common land φ ₅ and the through hole pattern product name classification land φ ₁ are not electrically connected (open). ), The rule / pattern product name is determined to be a non-defective product as specified. Further, if the common land φ ₅ and the solder resist product name classification escape land φ ₃ are conductive (short), the solder resist product name is as specified and judged to be a good product. On the other hand, if there is no conduction (open) between the common pad φ ₅ and the character product name classification land φ ₄ , the character product name is as specified and it is determined as a non-defective product.

[0013]

As described above, according to the present invention, when forming a through hole and a pattern, a check pad for product name inspection is formed at an individual position for each product name, and solder resist printing and character printing are performed. By that, through hole,
The pattern, solder resist and character product name can be efficiently and automatically inspected by the electric inspection machine and the product name of the printed wiring board can be inspected. With this efficiency improvement, there is no need to visually check the drawing in the inspection process, and the time per product name can be shortened by 12% as compared with the conventional inspection method.

[Brief description of drawings]

FIG. 1 is a plan view of a printed wiring board according to an example of an embodiment of the present invention.

FIG. 2 is a partially enlarged plan view of a check pad for product name inspection in FIG. 1;

FIG. 3 is a plan view trimmed from a copper-clad laminate to an outer shape of a printed wiring board.

FIG. 4 is a cross-sectional view showing a product name inspection state in which a probe of an electrical inspection machine is brought into contact with a product name inspection check pad.

[Explanation of symbols]

1 Copper-clad laminated board 2a Pad 2b Through hole 2c Pattern 3 Product name check pad 4 Electrical inspection machine 5a to 5d Probe 6 Printed wiring board φ ₁ , φ ₂ Through hole pattern Product name Classification land φ ₃ Solder resist product name Classification escape land φ ₄ character product name classification φ ₅ common land

Claims (3)

[Claims] 1. A printed wiring board in which predetermined through holes are formed and a circuit is formed on a copper-clad laminate, and a solder resist and characters are sequentially formed on the circuit.
A printed wiring board having a through hole for electrical inspection and a check pad for product name inspection having a plurality of lands at a predetermined position. 2. A step of forming a through hole having a land for electrical inspection and a plurality of lands at a predetermined position of the copper clad laminate at the same time as forming a through hole and forming a circuit in the copper clad laminate, and the copper. Simultaneously with solder resist printing and character printing on the laminated laminate, exposing the land of the through hole and a part which is common to the land at a predetermined position, printing the land and providing a check pad for product name inspection, and an electrical inspection The process of inspecting the through-hole product name, the solder resist product name, and the character product name for the presence or absence of an error in the conduction or non-conduction state of each land by bringing the probe of the machine into contact with each predetermined land of the product name inspection check pad. A method for inspecting a product name of a printed wiring board, which includes: 3. The probe of the electrical inspection machine is based on the respective lands of the through hole portion showing the product name of the through hole of the product name inspection check pad and the connection land portion showing the pattern product name, the solder resist product name, and the character product name. The product name inspection method for a printed wiring board according to claim 2, wherein the product name inspection is performed.