JPH0314285A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE:To enable screening for the same standard to be made properly and defective articles to be detected accurately by forming a marking and/or resist ink layer on the surface of a tentative land and then inspecting conduction/non- conduction between tentative lands when performing conduction test. CONSTITUTION:A tentative pattern 3, etc., should by formed on a disposed printed board 1a for avoiding electrical failure and a plurality of pairs of tentative lands 2 which are conducted by one tentative connection pattern are provided when performing both printing of a marking 4 and a resist ink. Shape of the tentative pattern, etc., namely the thickness and length of the tentative connection pattern an the size/shape of the tentative land may be of any size if there is sufficient space. A tentative land which is attached to both tips of the tentative connection pattern 3 may be the through-hole or non-through- hole. The marking 4 and/or resist ink should by provided on the surface of the tentative land may be slightly smaller than the diameter of the tentative land. When a printed board 1 is produced the above means, there are not marking and/or resist ink layer at a tentative pattern, etc., when the tentative lands conduct each other by conduction test.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a method for manufacturing a printed wiring board.

(Prior art) To give an overview of the manufacturing process of printed wiring boards, first, copper plating is applied to the board on which copper foil is pasted, and unnecessary copper plating is removed by etching, etc. Through holes, lands, wiring patterns, etc. (hereinafter collectively referred to as patterns, etc.) are formed, and then, as necessary, resist ink (solder mask) is printed or applied (hereinafter referred to as solder mask) to areas of the patterns that should not be electrically conductive. Printing or applying so-called markings such as the position of parts, names of parts, etc. on the board (in this case, both are collectively referred to as printing). It is given by

The above-mentioned patterns are generally used to pass current, to remove parts, or to be left as marks for machining the outer shape of the plate.

All printed wiring boards manufactured as described above are subjected to a continuity test to check whether the printed wiring is short-circuited or disconnected.

After a series of these manufacturing processes, a printed wiring board is completed, but as a general rule, patterns that are not directly necessary for the printed wiring board, such as "1" marks, etc., are not added to avoid electrical problems for the user. .

(Problems to be Solved by the Invention) The above-mentioned marking (hereinafter referred to as marking) and resist ink printing are provided as needed, and are not necessarily applied to all the substrates.

However, in the process of manufacturing printed wiring boards, items that require marking and items that do not require marking flow through the same process, so regardless of whether or not marking is required, the items flow to the next process without marking. Even if a continuity test is performed in the final manufacturing process, the H-marking has nothing to do with electrical continuity, so it is overlooked, and the product passes the test and is delivered to the user. there were.

Additionally, there is a problem in that the marking or resist ink may be undone from the proper position and applied to the pattern, etc., which may be overlooked and shipped.

(Means for Solving the Problems) The present invention was made as a result of studying various methods to solve the above-mentioned problems, and its gist is that after forming a pattern on a substrate, marking After each board that requires printing and/or printing with resist ink is marked and/or printed with resist ink, a continuity test is performed on each board. While forming a temporary connection pattern that connects a plurality of temporary lands and lands of the end plate, which are not originally necessary, when printing marking and/or resist ink, marking and/or resist ink is applied to the surface of the temporary land. The method of manufacturing a printed wiring board is characterized in that a layer is formed, and conduction/non-continuity between the temporary lands is inspected during a continuity test.

In the present invention, the substrate can be a single-sided board, a double-sided board, or a multilayer board.

A temporary land and a temporary connection pattern (hereinafter referred to as a temporary pattern, etc.) in the present invention, and a marking and/or a resist ink layer formed on the surface of the temporary land will be described below.

The position where the temporary pattern is formed is not particularly limited as long as there is space on the board, but in order to avoid electrical disturbances, it is preferable to form it on a waste board and remove it after the continuity test is completed.

In addition, for temporary patterns, etc., it is sufficient to provide a pair of temporary lands that are electrically connected by one temporary connection pattern, or if both marking and resist ink are printed, each temporary land should be provided with one temporary land. A plurality of pairs of temporary lands are provided which are electrically connected with the connection pattern. When a plurality of pairs of temporary lands are used, it is also possible to improve the accuracy of detecting defective products.

The shape of the temporary pattern, etc., i.e. the thickness of the temporary connection pattern,
The length and the size and shape of the temporary land are not particularly important as long as there is space, but the thickness of the temporary connection pattern, that is, the width is between 0.5 m + n and 3 mm, preferably between 1 mm and 2 mm.
mm, and the length is from 0.5 mm to 5 cm, preferably 1.5 mm. It is 2 cm from am. The temporary lands attached to both ends of the temporary connection pattern may be through holes or non-through holes, but the latter is preferable. Also, the shape of the temporary land may be round or square, but its size, that is, the diameter as long as it is round, is not particularly important.1. mmΦ
to 3mmΦ, preferably 1. , 5 mm (1)
It is 2.5mmΦ.

The marking and/or resist ink is applied to the surface of the temporary land, and the method is to cover the temporary land itself, and it is sufficient to make it slightly smaller than the diameter of the temporary land. For example, the land diameter is 2mm.
If Φ, the marking printed on it is 1-,
It should be 5 mm cD.

(Function) When a printed circuit board is manufactured by the means described above,
During the continuity test, if there is continuity between temporary lands, mark the temporary pattern etc. and/or register I.
This shows that there is no ink layer.

This may mean that the original markings and/or resist ink on the substrate that should have been printed at the same time are not printed, or that the markings and/or the resist ink are printed but the device is This means that there is a misalignment, so you can immediately discover defective products. On the other hand, if there is no conduction, it can be seen that the marking and/or resist ink has been printed, and that the marking and/or resist ink has been printed in approximately the correct position.

(Example) Example] Twenty 254 mm x 254 mm printed circuit boards 1 shown in FIG. 1 were prepared. 20 of them are discarded board part]a
, a temporary land 2.2 with a diameter of 2 mmΦ and a width of 0.2 mm to connect the temporary land 2.2. 5mm.

A temporary connection pattern 3 having a length of 5 cm was formed at the same time as the original pattern.

Ten of the substrates 1 obtained above are temporary lands 2.
Diameter], 5mmΦ at the center on the surface of 2 as shown in Figure 2
Marking 4 was printed to obtain a substrate (A).

Temporary land 2 formed in the sacrificial board part la of the board (A)
．． When we tested the continuity between the two using a commonly used contact needle for continuity testing, we found that there was no continuity between any of the temporary lands.

That is, it was shown that marking 4 was printed correctly.

On the remaining 10 sheets used in the Comparative Examples, markings 4a were formed at a distance of 0.5 mm from the center of the temporary land 2, as shown in FIG. 3, to obtain substrates (B).

A continuity test between temporary lands 2 and 2 on the board (B) was conducted in the same manner as above, and continuity was found. In other words, it has been found that even if markings are printed, misalignment can be detected.

Example 2 Twenty printed circuit boards 1 similar to Example 2 were prepared.

Ten of them have a diameter of 1.2 with their centers aligned with the surface of the temporary land 2.2. ．． When we printed resist ink with a diameter of 5 mm and tested continuity between temporary lands 2 and 2, no continuity was found.

That is, it was shown that resist ink was printed.

On the remaining 10 printed wiring boards of Comparative Example, resist ink was printed on the remaining 10 printed wiring boards in the same manner as in Example] with a 0.5 mm offset from the center of the temporary land 2. A continuity test was conducted between temporary lands 2 and 2, and all were found to be electrically conductive.

It was found that resist ink can detect misalignment even when printed.

In each of the following two embodiments, if neither marking nor resist ink is printed on the surface of the temporary land 2.2, it goes without saying that all the lands are conductive in the continuity test. Therefore, it can be detected that there is no printing or that the printing is misaligned.

A pair of temporary lands 2 connected to each other through a temporary connection pattern 3.
If a plurality of pairs (for example, two pairs) of 2 are provided and one is used for marking and the other is used for resist ink, it is possible to perform both marking inspection and resist ink inspection.

(Effects of the Invention) According to the method for manufacturing a printed wiring board of the present invention, it is possible to detect printing leakage and printing misalignment of marking and/or resist ink, so multiple types of prints can be produced in the same process. - Even when manufacturing wiring boards, it is possible to correctly sort them according to the same standard, and it is also effective in accurately detecting defective products due to masking and/or printing leakage of resist ink and printing misalignment.

[Brief explanation of the drawing]

Fig. 1 is a plan view of a printed wiring board according to an embodiment of the present invention, Fig. 2 is a diagram showing the same (when markings are correctly printed on the temporary land of the printed wiring board of the embodiment), and Fig. 3 is a diagram showing the same markings. FIG. 1...Printed wiring board 1a...Discarded board 2...
Temporary land 3...Temporary connection pattern 4...Marking

Claims (1)

[Claims] 1. After forming a pattern on a substrate, markings and/or resist ink are printed on the substrates that require printing of markings and/or resist ink, and then electrical conductivity is established for each substrate. In a method for manufacturing a printed wiring board to be tested, a plurality of temporary lands, which are not originally required when forming the pattern, and a temporary connection pattern connecting between the temporary lands, are formed, while marking and/or resist ink is applied. When printing,
A method for manufacturing a printed wiring board, comprising forming a marking and/or a resist ink layer on the surface of the temporary lands, and inspecting conductivity or non-conduction between the temporary lands during a continuity test. 2. The method of manufacturing a printed wiring board according to claim 1, wherein the temporary land is provided with one or more pairs that are electrically connected by the temporary connection pattern. 3. The method of manufacturing a printed wiring board according to claim 1 or 2, wherein the temporary lands and the temporary connection patterns are formed within a waste substrate.