JP2834040B2 - Printed wiring board and product name inspection method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a method for inspecting a product name, and more particularly to a method for automatically checking a through-hole pattern product name, a circuit pattern product name, a solder resist pattern product name, and a character pattern product name by an electrical inspection machine. The present invention relates to a printed wiring board and a product name inspection method that can be inspected.

[0002]

2. Description of the Related Art Conventionally, in a manufacturing process of a printed wiring board of this type, characters or marks for identifying a product name of a through-hole pattern , a solder resist pattern product, and a character pattern product name are provided on a portion of the printed wiring board to be a product. Although a visual inspection by drawing collation was performed to check whether the product was manufactured under the specified product name and the product name was as specified, there was a drawback that it took a lot of time to determine the quality, and the accuracy of the determination was low. Also, times
The road pattern Name is a method of inspecting an optical inspection machine provided a circuit pattern Name when the circuit is formed by etching character portion to be a printed circuit board of the product, inspection determination accuracy takes too much time but improves Inspection machines are expensive and are not practically used.

[0003]

In a printed wiring board manufactured by the above-described conventional method for manufacturing a printed wiring board, the inspection of the through hole pattern product name, the circuit pattern product name, the solder resist pattern product name, and the character pattern product name is performed manually. Inspection is performed, but through visual inspection, each pattern of through hole, pattern, solder resist and character
There is a problem in that it takes a lot of time to match with the product name, and it requires a skill of the inspector to perform an accurate inspection, and the burden on the inspector is large.

SUMMARY OF THE INVENTION An object of the present invention is to provide a printed wiring board and a product name inspection method capable of quickly and accurately inspecting a through-hole pattern product name, a circuit pattern product name, a solder resist pattern product name, and a character pattern product name on a printed wiring board. Is to do.

[0005]

A printed wiring board according to the present invention is a printed circuit board in which predetermined through holes are formed in a copper-clad laminate and a circuit is formed, and a solder resist and characters are sequentially formed on the circuit. In the wiring board, the pudding
One land at a predetermined position on the wiring board and connected to it
Circuit pattern and general holes drilled in this circuit pattern
For checking through-hole / circuit pattern product names
A first pad and a first pad provided adjacent to the first pad;
Solder resist for checking solder resist pattern product name
Doo escape La command, character pattern Name switch consisting of characters from the printing material
Escape with text printing materials and solder resist
Common line for electrical inspection common contacts
A check pad for product name inspection composed of a second pad having a pad .

The method for inspecting the product name of a printed wiring board according to the present invention comprises the steps of:
And for the through hole / circuit pattern product name check
1 pad land, solder resist escape land and
Character pattern product name Check for electrical continuity between check lands
Through-hole pattern product of the printed wiring board
Name, solder resist pattern product name and character pattern product
It is characterized by checking the suitability of the name .

[0007]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a printed wiring board according to an embodiment of the present invention. As shown in FIG. 1, a printed wiring board according to an embodiment of the present invention
After forming a through hole on the upper side and performing a copper plating process, a photosensitive resin or a film is coated, and the pad 2a, the through hole 2b and the pattern 2c are formed by etching after exposure, development and development. A check pad 3 for product name inspection is formed simultaneously with this processing. The check pad for product name inspection 3 is provided at a location specified individually for each product name.

FIG. 2 shows a check pad 3 for product name inspection in FIG.
It is the elements on larger scale top view. As shown in FIG. 2, the check pad for product name inspection 3 has a land φ ₁ , a width W ₂ , and a length L.
₂ circuit patterns, the general hole φ ₂ is the circuit pattern
Check the through hole and circuit pattern
A first pad and a pad adjacent to the first pad;
Solder resist for checking solder resist pattern product name
Doo escape land φ _3, character pattern product consisting of characters from the printing material
Name check land φ ₄ and character printing material and solder resist
For electrical contact common contact formed in relief land shape
From a second pad having a width W ₁ having a common land φ ₅
And the overall length of the check pad 3 for product name inspection is
It is L _1. Using this product name inspection check pad 3
Te, the through hole of the printed wiring board, formation of a pattern and the solder resist, common or printing characters are arranged in product name as the specified position lands phi ₅ and before each land
It is configured so that inspection can be performed based on the presence or absence of conduction between (φ ₁ , φ ₃ , φ ₄ ) .

In this embodiment, the length L ₁ = 19 mm and the width W ₁ = 5 mm of the check pad 3 for product name inspection. Run through holes and pads for checking circuit pattern product names
De phi ₁ = 3 mm and the circuit pattern length L ₂ = 2 mm and width W
₂ = 0.5 mm and the general hole φ ₂ = 1.0 mm.
Further, the solder resist pattern Name Seo copper layer for checking exposed Rudarejisuto relief land phi ₃ = 3 mm, character
A pattern product name check land φ ₄ = 3 mm and a common land φ ₅ = 3 mm are provided, and an electrical inspection probe is brought into contact with each land. The contact is point contact.

FIG. 3 is a plan view trimmed from the copper-clad laminate to the outer shape of the printed wiring board. As shown in FIG. 3, a general hole having a specified shape, solder resist printing and character printing are performed, and the outer shape is trimmed.

FIG. 4 is a sectional view showing a product name inspection state in which a probe of an electric inspection machine is brought into contact with a product name inspection check pad. As shown in FIG.
And open and short between the probes 5a to 5d. Flowing a current between 5a~5d by contacting a probe 5a~5d the product name test check pads 3 of the printed wiring board 6, first, the common land phi ₅ and the through-holes and circuit paths <br/> turn checks pad lands if during phi ₁ is non-conducting (open), through-holes and the circuit pattern Product names,
It is judged as good as specified. In addition, Sorudareji of common land φ ₅ and the solder resist pattern Name for check
Solder resist pattern Name if stringent escape land phi ₃ during conduction (short) is judged to be good at the specified street. , Common pad φ ₅ character pattern product name checker
If during command phi ₄ is non-conducting (open), a character pattern
The product name is as specified and is determined to be good.

[0013]

As described above, according to the present invention, when forming a through hole and a pattern, a check pad for product name inspection is formed at an individual position for each product name, and solder resist printing and character printing are performed. By that, through hole,
Pattern, solder resist and efficiently each pattern PRODUCT characters electrical inspection machine, also it becomes possible to automatically carry out the product name inspection of the printed wiring board. This efficiency eliminates the need for visual collation with drawings during the inspection process.
There is an effect that the time per product name can be reduced by 12% as compared with the conventional inspection method.

[Brief description of the drawings]

FIG. 1 is a plan view of a printed wiring board according to an example of an embodiment of the present invention.

FIG. 2 is a partially enlarged plan view of a check pad for product name inspection in FIG. 1;

FIG. 3 is a plan view trimmed from a copper-clad laminate to an outer shape of a printed wiring board.

FIG. 4 is a cross-sectional view showing a product name inspection state in which a probe of an electrical inspection machine is brought into contact with a product name inspection check pad.

[Explanation of symbols]

1 copper-clad laminate a pad 2c pattern 3 check pads Name test 4 electric inspection machine 5a~5d probe 6 printed wiring board phi ₁ Land phi ₂ generally well phi ₃ solder resist relief land phi ₄ character pattern Name Check land phi ₅ common land

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H05K 1/11 H05K 3/00

Claims (2)

(57) [Claims] 1. A printed wiring board in which predetermined through holes are formed and a circuit is formed on a copper-clad laminate, and a solder resist and characters are sequentially formed on the circuit.
One land and it at a predetermined position on the printed wiring board
The circuit pattern connected to the
Through-hole with circuit hole and circuit pattern
And a first pad for the check
For checking the solder resist pattern product name
Solder resist escape land, character pattern consisting of character printing material
Turn product name check land, character printing material and solder register
Common contact for electrical inspection formed in relief land shape by strike
And a second pad having a common land for
Printed circuit board, characterized in that a product name test check pads that. 2. The product name inspection of the printed wiring board according to claim 1.
Common land of test pad and through hole / circuit pattern
Land of the first pad for checking product name, solder register
Strike relief land and character pattern product name check land
The printed wiring board has a switch depending on whether there is electrical conduction between
Luhole pattern product name, solder resist pattern product name
And product name inspection method of a printed wiring board, characterized in that to check the suitability of a character pattern Name.