JPS62243388A - Printed wiring board and test of the same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a printed wiring board and a method for inspecting the same.

In particular, the present invention relates to a printed wiring board in which a general hole not connected to a conductive pattern and a component mounting hole connected to a conductive pattern are connected via a conductive pattern for inspection, and a method for inspecting the same.

[Conventional technology]

Conventionally, as a means of testing for leakage, holes 1a provided at the four corners of a wiring board 11 have been used as a means of testing for leakage in printed wiring boards (hereinafter abbreviated as wiring boards) in which there is no conductive pattern connection. The presence or absence of holes was visually checked by comparing all the holes of ~1d with the drawings.

[・Problem that the invention seeks to solve]

The above-mentioned conventional method for inspecting the presence or absence of general holes in wiring boards has the drawback that defective products with no seal film holes at all or some with no general holes are mixed in with normal crystals due to the inspector's omission of visual inspection. there were.

[Means for solving problems]

SUMMARY OF THE INVENTION An object of the present invention is to provide a wiring board and a method for inspecting the same, which solves the conventional drawbacks. According to the present invention, there is obtained a wiring board characterized in that a general hole of the wiring board and a component mounting hole adjacent to the general hole are connected via a conductive pattern for inspection.

Further, a step of forming a dummy pad slightly smaller than the general hole in the center of the general hole forming part, a step of providing a conductive pattern for inspection connecting the dummy pad and the nearby component mounting hole, and a step of providing the dummy pad and the component mounting hole are provided. There is also obtained a method for inspecting a wiring board, which includes the step of inspecting the connection with the mounting hole by electrical means.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

First, a known N/C hole is constructed by means of wiring board 11 in FIG.
After drilling the component mounting holes 12a to 12d, the component mounting holes 12a to 12 are formed by a known through-hole copper plating method.
A through-hole conductor layer (not shown) is formed on d. Next, circular dummy pads 10a to 10d, which are slightly smaller in diameter than the general holes 1a to 1d, are placed in the center of the positions where the general holes 13 to 1d are formed (circular portions indicated by chain lines). Inspection conduction pattern lla connecting component mounting holes 12a to 12d near the dummy pad
~lid is formed in the same manner as other ordinary conductive patterns le, If, etc. by a known photo printing method, and then a known N
/C holes are made by means etc., as shown in the figure, general holes 13 to 1d.
'Ik holes. Therefore, the dummy pads 10a to 10d in Fig. 2 are removed by drilling when the general holes 13 to 1d are normally drilled as shown in Fig. 1, and the N/C drilling of the general holes is done during work. Holes are formed only when leaks occur due to construction errors such as forgetting to set the drill or breaking the drill. Note that the conductive pattern lla~ exposed in the normally drilled general hole 13~ld in Figure 1
The end of the lid is insulated by coating the inside of the general holes 1a to 1d with a glue resist applied to the surface of the wiring board 110.

Next, a method for inspecting a wiring board according to the present invention will be explained. In a known wiring test, the dummy pads 10a to 10d and the dummy pads 10a to 10d in FIG.
An inspection jig (not shown) is prepared in which inspection probes are placed at the positions of the component mounting holes 12a to 12d connected by la to lid.

Note that the inspection probe that contacts the dummy pads 10a to 10d of this inspection jig has a diameter smaller than that of the general holes 1a to 1d in Fig. 1, and if the general holes 13 to 1d have been properly drilled. The test conduction pattern lla~
Avoid touching the lid. Using this test jig, the conductivity of the conductive patterns 1e to 1f, etc. is tested, and at the same time, the dummy pads 10a to 10d and the component mounting hole 12a in FIG.
The general holes 18 to 1d of the final product shown in FIG. 1 are checked for leakage by inspecting the presence or absence of continuity with the holes 18 to 12d. That is, the wiring test data shows that there is no conduction between the dummy pad 10a and the component mounting hole 12a in FIG. 2, and that there is no conduction between the dummy pad 10C and the component mounting hole 12c, respectively.
By registering no continuity with 2d, general hole 1
During the work, the holes 3 to 1d should be replaced with dummy pads 10a to 10 as shown in FIG.
d is formed and conduction exists between the dummy pads 10a to 10d and the component mounting holes 12a to 12d, and a defect is detected. In addition, when the general holes 13 to 1d are normally drilled, no dummy pad is formed as shown in FIG. 1, and there is no conduction between the dummy pad and the component mounting holes 12a to 12d, so that the product is determined to be non-defective.

〔Effect of the invention〕

As described above, the present invention has the following effects.

(1) It is possible to electrically test whether a general hole is formed or not at the same time as testing the presence or absence of continuity of a conduction pattern using a wiring tester.

(2) Therefore, visual inspection for the presence or absence of general holes becomes unnecessary.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of an embodiment of the printed wiring board of the present invention. Second
The figure is a plan view of the printed wiring board of the present invention in which leakage occurs in one film hole. FIG. 3 is a plan view of a conventional printed wiring board. 11...Printed wiring board% la, lb, lc, Id...
General hole, le, 1f=-conducting pattern, 10a, 10b
, 10c, 10d--dummy pad, lla, llb
, llc, Ild... - Continuity pattern for inspection 6, 12a, 12b, 12c, 12d...
・One component mounting hole. 71

Claims (2)

[Claims] (1) A printed wiring board characterized in that a general hole of the printed wiring board and a component mounting hole adjacent to the general hole are connected via a conductive pattern for inspection. (2) A step of forming a dummy pad slightly smaller than the general hole in the center of the general hole forming part, a step of providing a conductive pattern for inspection connecting the dummy pad and a nearby component mounting hole, and a step of forming the dummy pad and the step of inspecting the connection between the component mounting hole and the component mounting hole by electrical means.