JPS61128590A - Printed wiring board and inspection thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a printed wiring board and an inspection method thereof, and in particular, Komei relates to a printed wiring board and an inspection method thereof for inspecting leakage and hole diameter difference.

(Prior art #) Conventionally, as a means for inspecting leakage and hole diameter differences in printed wiring boards (hereinafter abbreviated as wiring boards), component mounting holes 1a of wiring boards 110 as shown in FIG. 2 have been used.

Compare all holes 1b, 1c, 1a, etc. with the drawing to check the presence or absence of holes. KtflS product mounting holes 13 to 1d
The pore diameter was measured by selecting arbitrary pores according to the pore diameter.

For this reason, there is a drawback that defective products, such as those with some holes missing or those with different pore diameters, are mixed in with the normal crystals due to the inspector's omission of visual inspection.

(Object of the Invention) An object of the present invention is to provide a wiring board and a calibration method thereof that solve the conventional drawbacks.

(Structure of the Invention) According to the present invention, in a blank area of a wiring board having a plurality of component mounting holes having different hole diameters and a mounting hole, a gauge hole having the same diameter as the component mounting hole and the mounting hole is provided. A wiring board is obtained, which is characterized by providing a plurality of component mounting holes with different hole diameters in the blank area of the wiring board, and a step of providing gauge holes with the same diameter as the mounting holes, and mechanically forming the gauge holes. There is also obtained a method for inspecting a wiring board, which is characterized by comprising a step of inspecting by means or optical means.

(Example) Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2.

First, as shown in FIG. 1, component mounting holes 1a, 1b, 1c, and 1d with different hole diameters are formed inside the wiring board 11, and for mounting the components, hole 1e is drilled using a reverse printing drill using hole Vc1 in the margin of the wiring board. The well-known N/C holes are gauge holes 10a, 10b, IOC by machine, etc.

10d and 106 are installed by raising and lowering them in a straight line. Note that the gauge holes 103 to 10e provided in the blank space are drilled after the component mounting holes 1a to 1d in the wiring board and the mounting hole 1e are drilled.

That is, to explain in detail by taking the drilling of the component mounting hole 1a as an example,
N/C drilling information such as paper tape is prepared so that the gauge hole 10a is drilled after all the component mounting holes 1a have been drilled.

Next, a conductive layer is formed in the component mounting holes 13 to 1d and the gauge holes Oa to 10d to form through holes by a known through-ball copper plating method, and then a circuit is formed by a known photo method or other means. Thus, a wiring board 11 of the present invention is obtained.

Next, a method for inspecting wiring board 11 according to the present invention will be explained.

Component mounting holes 1a to 1d are provided in the blank area of the wiring board 11, and gauge holes 108 are arranged one by one on the diameter side of the hole 1e for mounting.
For each of the holes 10e to 10e, it is visually counted whether there are as many holes as the hole diameter specified in the drawing, and Komei judges whether there is a leak or not.

Next, it is determined whether the hole diameter specified in the drawing matches the hole diameter of the gauge holes 10a to 10e provided in the blank area by measuring with a pin gauge or a projector.

(effect) As described above, the present invention has the following effects.

1) Gauge holes made in the margins of the wiring board can be checked by inspecting only the number of gauge holes, since holes such as component mounting holes on the wiring board are drilled last on each hole diameter side in the process. Leakage can be easily detected due to forgetting to set the drill during the process or breakage of the drill.

I) By inspecting only the hole diameter of the gauge hole in the blank area, it is possible to easily detect a difference in hole diameter when different drill diameters are set in the drilling process.

[Brief explanation of drawings]

FIG. 1 is a plan view of an embodiment of the printed wiring board of the present invention. Second
The figure is a plan view of a conventional printed wiring board. 11...Printed wiring board, 1a, 1b, 1c,
1d...Component mounting hole (with different hole diameter), 1e
...Mounting holes, 10a, 10b, IOC, 10
d, 10e--Gauge hole. Agent: Susumu Uchihara, patent attorney 1. It's so hot. )1no ;

Claims (2)

[Claims] (1) A gauge hole having the same hole diameter as the component mounting hole and the mounting hole is provided in a blank area of a printed wiring board having a plurality of component mounting holes and mounting holes with different hole diameters. Printed wiring board. (2) Providing gauge holes having the same hole diameter as the plurality of component mounting holes and mounting holes of the printed wiring board in the margins of the printed wiring board, and inspecting the gauge holes by mechanical means or optical means. A printed wiring board inspection method comprising the steps of: