JPS59225598A - Method of mounting electronic part - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION □ Industrial Application Field The present invention relates to a method of skipping defective boards when mounting electronic components onto a large number of electronic circuit boards.

Conventional Structure and Problems In the conventional electronic component mounting method, electronic components are taken out from a component supply device and sequentially mounted onto an electronic circuit board by numerical control.

However, in the above method, when printing resistors etc. using a printing device on a board 1 that is printed in large numbers as shown in FIG. If parts cannot be mounted, not only the defective board in the board 1 but also the electronic components mounted on this defective board become unusable, which has the drawback of making it difficult to achieve low cost and high productivity. .

Purpose of the Invention The present invention eliminates the above-mentioned conventional drawbacks, detects defective boards in multi-chip boards before mounting them, skips the mounting process, and eliminates the mounting of electronic components, thereby reducing costs. In response to cost reduction and high productivity), we are trying to provide mounting manufacturing values for electronic components.

Structure of the Invention The present invention includes a printing and firing process for incorporating electronic circuits into a board that can be printed in large numbers, an inspection process for inspecting the printed state of the board in module units, and a process for inspecting defective boards in module units through this inspection process. a defective mark printing process in which a defective mark is printed; a detection process in which the defective mark is detected; and upon detection of the defective mark, the mounting of electronic components is stopped in units of modules on the board capable of producing a large number of sheets, and the process is moved to the next module board. It consists of a skippable mounting process, and since electronic components are not mounted on defective boards, it has the effect of lowering costs and increasing productivity.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

2 and 3 show an electronic component mounting apparatus according to an embodiment of the present invention. On the main body 2, there is an mounting device 4,
The operation of an electronic component mounting apparatus provided with a supply device 6 for supplying components and a determination device 6 for determining the quality of a board will be described below.

As shown in FIGS. 4 and 6, in an electronic circuit board 1 printed and fired with multiple resistors 7 up to Awn, for example, F of this board 1 generates grooves 8 when printing resistors 7, and In the inspection process, if the resistance value is so high that it cannot be used, the board 1 is printed with a defective mark 11 on the electronic circuit pattern copper strip 1o of the first mounted component 9 when the component is mounted. To explain this, the board 1 is moved by the XY table 3, and the mounting device 4 positions it downstairs for the first mounting, and as shown in Figs. A switch 12 is provided, and if the board 1 is normal, the copper foil 10 is detected by the reflected light 14 of the light 13 emitted from the optical switch 12, and the component 9 is mounted by the mounting device 4. However, if the board 1 is in state F, the light 13 emitted from the optical switch 12 is absorbed by the mark 11 and cannot be detected, and the mounting device 4 does not operate.
Skip to board 10G on XY table 3 and F of board 1
removes the mounting process.

As described above, according to the present invention, by providing one discriminating device, it is possible to reduce costs in a mounting device for multi-chip boards.
This enables high productivity and the mounting of highly reliable electronic components.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an electronic circuit board, Fig. 2 is a perspective view of a mounting device in an embodiment of the present invention, Fig. 3 is a perspective view of a discriminator mounting section, and Fig. 4 is a printed and fired electronic circuit board. FIG. 5 is a detailed view of an electronic circuit board where a printing defect has occurred. FIG. 6 is a perspective view of a discriminating unit for detecting non-defective products. FIG. FIG. 8 is a flowchart for skipping the determination. 1...Electronic circuit board, 6...Discrimination device, 7...Printed resistor, 8...Groove, 11...
...Mark-12...Reflective light switch I. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 3 Figure 5 Figure 6 Figure 2 Figure 8

Claims (1)

[Claims] There is a printing and firing process in which electronic circuits are incorporated into a board that can be printed in large numbers, an inspection process in which the printed state of the board is inspected in module units, and a defect mark is printed in each module on defective boards in this inspection process. An electronic device comprising a mark printing process, a detection process for detecting a defective mark, and a mounting process in which mounting of electronic components is stopped in module units on the board capable of producing a large number of boards upon detection of the defective mark, and skipping to the next module board. How to install parts.