JPH04109699A - Components mounting device - Google Patents

Abstract

PURPOSE:To contrive to shorten a time required for operations for detecting presence or absence of interior marks by a method wherein detecting means is so controlled as not to perform operations for detecting presence or absence of the inferior marks of each substrate part when absence of the substrate inferior marks is detected. CONSTITUTION:On the outside of substrate parts 36A to 36F of a multiple pattern substrate 5 marking parts 37A to 37F corresponding to the respective substrate parts are provided parallel, and when any substrate part is inferior, the making part corresponding to the substrate part is marked a bad mark. A CPU marks X-axis and Y-axis motors 2, 3 rotate based upon mark positioning data to move a substrate inferior marking part 38 of the substrate 5 to a location of a photographing area of a substrate cognitive camera 20. After photographing, a photographing image plane is cognition-processed to detect presence or absence of the substrate inferior mark. At this time, if the CPU judges that the inferior mark is present, operations for detecting presence or absence of the bad mark in the respective marking part start, and if it judges that the substrate inferior mark is absent, the detecting operations do not start. Thus, a time required for the bad mark detecting operations can be shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention provides a method for detecting when a detection means detects that there is a defective mark on a multi-sided board corresponding to a defective board part. The present invention relates to a component mounting device that mounts chip components onto other substrate parts without mounting the components.

(B) Prior Art A component mounting device of this kind that detects a defective mark corresponding to a board portion of a multi-sided board and does not mount components on the board is disclosed in Japanese Patent Laid-Open No. 59-225598. .

(c) Problems to be Solved by the Invention However, the prior art described above has a drawback in that it takes time to complete the detection operation for all substrate sections because the presence or absence of defective marks is detected for each substrate section.

Therefore, an object of the present invention is to shorten the time required to detect the presence or absence of a defective mark.

(d) Means for Solving the Problems Therefore, in the present invention, when a detection means detects that a multi-sided board has a defective board mark corresponding to a defective board part, chip components are not placed on the board part. In a component mounting device that mounts chip components to other board parts without mounting them,
If any board part of the board is defective, a board defect mark is displayed, and if the detection means detects that there is no board part defective mark, the presence or absence of each board part defective mark is displayed. A control means is provided for controlling the detection means so as not to perform a detection operation.

(If the first effect detection means detects that there is no board defective mark, the control means controls the detection means so as not to perform the operation of detecting the presence or absence of each board part defective mark.

(f) Example An embodiment of the present invention will be described below based on the drawings.

In Fig. 2, (1) is an XY child table that moves in the XY force direction by the rotation of the X-axis motor (2) and Y-axis motor (3), and the Benont board on which the chip component (4) is mounted. 5) is placed.

Reference numeral 6 is a supply stand, on which a large number of component supply devices (7) for supplying chip components (4) are arranged. (8) is a supply table drive motor, which allows rotation of the ball screw (9) so that it fits into the ball screw (9) and drives the supply table (6).
The supply table (6) is connected via a nut (not shown) fixed to the
is guided by the linear guide (10) and moves.

(11) is a turntable that rotates intermittently, and mounting heads (13) that omit four suction nozzles (12) are arranged at equal intervals on the outer edge of the table (11). Each mounting head (13) stops at the same position every time the turntable (11) rotates intermittently.

The suction station is the stop position of the mounting head (13) where the suction nozzle (12) suctions and takes out the component (4) from the supply device (7), and the suction station is located at the outermost side of the turntable (11). The suction nozzle (12) suctions the component (4). The mounting head (13) is rotated by a head rotation roller (14) at the nozzle exchange station, which is a stop position before the suction station, and the nozzle (12) to be used next is placed on the turntable (11).
).

The position where the mounting head (13) stops after the suction station is the recognition station, and at this station, the component recognition camera (16) recognizes the positional deviation of the component (4) to be suctioned by the suction nozzle (12). be done.

The position next to the recognition station where the mounting head (13) stops is the angle correction station, and the suction nozzle (12>) is rotated by the nozzle rotating roller rough 17 based on the recognition result of the camera (16) to place the part (4). The positional deviation of the rotation angle is corrected.

The next stop position of the angle correction station is a mounting station, and the component (4) to be attracted by the suction nozzle (12) of the station is mounted onto the substrate (5). (
20) is a board recognition camera that recognizes the printed circuit board (5) placed on the XY child table 1).

In FIG. 3, (22) is a CPU, which performs various operations related to component mounting based on NC data and mark position data stored in RAM (23), and programs stored in ROM (24). control according to

The CPU (22) includes an X-axis motor drive circuit (27) that drives the X-axis motor (2) via an interface (25).
), Y-axis motor drive circuit (
28), a supply table drive circuit that drives the supply table drive motor (8) <29), a turntable motor drive circuit that drives the servo motor (31) that rotates the turntable (11);
32), the recognition circuit (33) of the component recognition camera (16) and the recognition circuit (34) of the board recognition camera (20) are connected.

By the way, as shown in FIG. 1, the printed circuit board (5) is a multi-sided board having a large number of board parts (36) on which components (4) can be mounted in the same mounting pattern.

In FIG. 1, the board (5) is a multi-sided board;
Board parts (36A>(36B) (36C) (36D
) (36E) (36F). On the outside of the board parts (36A) to (36F) of the board (5), there are marking parts (37A) (37B) <37C) surrounded by a frame for marking bad marks corresponding to each board part.
(37D), (37E), and (37F) are arranged in parallel, and if any of the board parts is defective, a bad mark is marked on the marking part corresponding to that board part. 1st
In the illustrated substrate (5), the substrate portion (36B) is defective and a bad mark is marked on the marking portion (37B).

(38> is a board defective mark display part for marking a board defective mark, and when a bad mark is marked on any marking part, a board defective mark is marked on the display part, and there is a bad mark. This means that one of the board parts is defective.Since the board (5) in FIG. 1 has a bad mark, the display part (38>) is marked with a board defective mark.

The NC shown in FIG. 4 stored in the RAM (23)
The data is used for mounting components onto the board (5) in FIG.

The NC data shown in FIG. 4 will be explained.

The data section from steps M1 to M3 is a mounting data section, and in each board section, a component of the type in the component column is placed at the X coordinate and Y coordinate position from the origin of each board section to steps M1 to M3. 4> is installed. Then, the position of the origin of each substrate portion is represented by the X and Y coordinates of steps M4 to M9. The control command Up indicates the end of the mounting data section. Control command r E
.

indicates the end of NC data.

The mark position data stored in the RAM (23) corresponding to the board (5) in FIG. 1 is shown in FIG.
The X and Y coordinates of “T” are the board defect mark display area (38)
The X and Y coordinates of "AJ to 1F" respectively indicate the positions of the marking parts (37A) to (37F) in this order.

The operation of the above configuration will be described below.

As shown in Figure 1, the bad mark is on the marking part (37B)
When the printed circuit board (5) with the marking completed and the printed circuit board (5) with the board defect mark marked on the board defect mark display section (38) is placed on the XY child table 1) by a transfer means (not shown). , the CPU (22) uses the RAM (
23) Based on the mark position data stored in
Read the X coordinate 'I T J and Y coordinate 'YT' of 'T', and by rotation of the X axis motor (2) and Y axis motor (3), the printed circuit board (5) is located at the position (XT, YT). The board recognition camera (20
) to a predetermined position in the imaging area.

Next, the camera (20) captures an image of the display section (38), and the captured screen is recognized by the recognition circuit (34), and the presence of a defective board mark is detected.

Therefore, the CPU (22) can determine that there is a bad mark in any of the marking parts, and therefore starts the operation of detecting the presence or absence of a bad mark in each marking part.

First, the CPU (22) stores the mark position data in the RAM (23) as shown in FIG.
YAJ is read, and based on the data, the XY child table 1) is moved to move the marking part <37A) corresponding to the board part (36A) to a predetermined position in the imaging area of the board recognition camera <20>. Then, the recognition circuit (34) performs recognition processing on the captured screen captured by the marking unit (37A) of the camera (20), and detects the absence of a bad mark.

Next, the CPU (22) reads the mark position data rB.

(7) Read the X coordinate 'XB, Y coordinate 'YB, and place the marking part (37B) on the board recognition camera (2
0) to a predetermined position in the imaging area. Then, the presence of a bad mark is detected through recognition processing by the recognition circuit (34) on the captured screen of the camera (20).

Thereafter, the presence or absence of a bad mark in each marking part is checked in the same manner.
7F), no bad mark is detected. Based on the results of checking these marking sections, the CPU (22) determines that only the substrate section (36B) is defective.

Next, the CPU (22) first starts the component mounting operation on the board section (36A>) based on the NC data shown in FIG.
The supply device (7) for supplying is moved by the rotation of the motor 8), the supply table (6) is guided by the linear guide (10) through the rotation of the ball screw (9), and
The suction nozzle (12) of the suction station stops at a position to suction the component (4).

Next, the mounting head (13) stopped at the suction station.
The suction nozzle (12) attached to the suction nozzle (12) suctions the part (4) of type "R1". The nozzle (
The mounting head (13) having a turntable (12)
11) is stopped at the recognition station by intermittent rotation due to rotation of the rotary disk motor (31), and the recognition camera (16)
The recognition circuit (33) then recognizes the positional deviation of the component stack 4>.

After that, the suction nozzle (12) that has suctioned the part (4) is rotated by the nozzle rotation roller (17) at the angle correction station based on the recognition result at the recognition station, and the positional deviation of the rotation angle is corrected. .

Next, when the mounting head (13) stops at the mounting station due to the intermittent rotation of the turntable (11), the X coordinate '
o,, the substrate part (36A) (7) shown in step M1 with the y coordinate "0" as the origin; the X coordinate 'xi;

Part (4) of the relevant type 'R1' at the Y coordinate 'Yl'
is installed.

Below, Step M2 and Step M of the substrate part (36A)
3, the mounting operation of the component (4) is performed similarly to step M1.

When the mounting of the parts 4 to the board part (36A>) is completed as described above, the CPU (22) determines that the board part (36B) is defective, and the parts (4) to the board part (36B>) are installed. Attachment of item 4> is not performed and is skipped.

Next, the CPU (22) starts mounting components on the board section (36C) based on step M6 of the NC data and the mounting data section. First, as mentioned above, the suction nozzle (12) that has suctioned the part (4) of type 1R1 is moved to step M.
6's X coordinate 1x5'' and the Y coordinate ``O'' as the origin, the X coordinate of the substrate part (36C) shown in step M1 is 1x1''
and the Y coordinate 1Y1'' position. Thereafter, parts mounting of steps M2 and M3 of the board section (36C) is performed in the same manner.

Next, parts are mounted on the board sections (36D) to (36F) in the same manner, and the control command rE is executed.

The component mounting operation ends. Thereafter, the substrate (5) is ejected from the XY child table 1) by a transfer means (not shown).

Next, when the board (5) as shown in Fig. 6, which has no bad mark on each marking part and therefore has no board defect mark on the display part (38), is placed on the XY child table 1), as shown in Fig. 1. In the same manner as the board (5), the display section (38) is first imaged by the board recognition camera (20) and then recognized by the recognition circuit (33).

As a result, since no board defect mark is detected, the CP
U (22) determines that there are no bad marks in any of the marking parts, that is, that the board (5) is not defective. Then, the component mounting operation is performed according to the NC data in the same way as described above, but in this case, the aforementioned CPU (22)
Components are mounted on all board sections based on the determination results.

In addition, in this embodiment, when each marking part is arranged side by side on the outside of the board part, there is a board defect mark that indicates whether there is a bad mark in any of the marking parts or whether there is no bad mark in all the marking parts. Although we have shown an example in which a display section is provided, even if a bad mark is to be placed inside each board section, if the board defect mark display section is provided at a predetermined position on the printed circuit board, the board defect mark will be displayed in the board defect mark display section. If there is no bad mark and it is known that there is no defect in the board, it is possible to avoid checking whether there is a bad mark on each board part.

In addition, in this embodiment, the marking part and the board defect mark display part are provided on the outer part that does not belong to any board part, but if there is no such outer part, they can be placed in the outside part that does not belong to any board part. It may turn out to be a problem.

Further, although a large number of marking portions are imaged one by one, all or part of them may be imaged at one time and the recognition processing of the recognition circuit may be performed one by one.

Additionally, instead of the board recognition camera (20) of this embodiment, a reflective photosensor may be used to detect the presence or absence of board defect marks and bad marks.

Furthermore, before the printed circuit board (5) is placed on the XY child table 1), the presence or absence of board defect marks and bad marks may be checked.

(g) Effects of the Invention As described above, the present invention does not detect the presence or absence of a defective mark on the board when there is no defective mark on the board, so it is possible to shorten the time required to detect the presence or absence of a defective mark. can.

[Brief explanation of the drawing]

1 and 6 are plan views of a multi-panel board, FIG. 2 is a plan view of a component mounting device to which the present invention is applied, FIG. 3 is a diagram showing a control block of the present invention, and FIG. 4 is a diagram showing NC data. A diagram showing
FIG. 5 is a diagram showing mark position data. (4)...Chip parts, (5)...Printed circuit board (multi-panel board), (20)...Board recognition camera (
(detection means), (22)...CPU (control means),
(34)... Board recognition circuit (detection means).

Claims (1)

[Claims] (1) When the detection means detects that there is a defective board mark corresponding to a defective board part on a multi-panel board, the chip part is not mounted on the relevant board part, but the chip part is mounted on another board part. In the component mounting apparatus, a board defective mark is displayed when any of the board parts of the board is defective, and when the detecting means detects that there is no board defective mark, A component mounting apparatus comprising: a control means for controlling the detection means so as not to perform an operation of detecting the presence or absence of a defective mark on each board part.