JPH05337421A - Dispenser and parts mounting device using the same - Google Patents

Abstract

PURPOSE:To provide the parts mounting device with a dispenser which can apply an adhesive while correcting the position of an applying needle and simultaneously mounts chip parts. CONSTITUTION:This device has an applying means including the dispenser for applying the adhesive or solder onto a printed circuit board, a camera 15 for recognizing the image of the applying needle position of the dispenser and a means for setting the correct position by calculating the deviation between the image obtd. by this camera and a reference line and correcting the position of the applying needle. Further, the device is juxtaposed with the device for applying the adhesive and mounting the parts by moving a working head 14 to a parts supply corner 18, attracting the desired parts by means of a mounting device 14b, picking up the image of the parts attraction state similarly by means of the camera 15 for image recognition, calculating the deviation of the parts attraction position and setting the correct parts mounting position by correcting the previously stored reference mounting position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dispensing device and a component mounting device using the same, and more specifically,
The present invention relates to a dispensing device that corrects the position of an applicator at the time of applying an adhesive or solder in the previous step of mounting a chip-shaped electronic component on a printed circuit board, and a component mounting device using the dispensing device.

[0002]

2. Description of the Related Art Conventionally, for example, a board component manufacturing line constructed by a board supply device, a dispenser, a chip component mounting device, a reflow furnace, a substrate housing device and the like shown in FIG. 8 has been known. Among such a board component manufacturing line, a dispenser for automatically applying adhesive or paste-like solder on a printed circuit board, and a chip part for automatically mounting a large number of chip-shaped electronic components such as ICs, resistors and capacitors on the printed circuit board The on-board device is well known as a device for performing precise work.

The dispenser is adhesive or solder (hereinafter referred to as "adhesive" or "solder" (hereinafter referred to as "adhesive" or "solder")) supported by a coating head which is movably supported in a two-dimensional manner by a vertical plane at a predetermined position on a printed circuit board which is automatically loaded and accurately positioned. Simply, say the adhesive) is applied automatically and quickly. At this time, the dispenser pre-stores the coating position on the substrate as design data, and automatically moves the coating head to a predetermined position on the substrate based on the stored design data, and grips the coating head. The application was performed by an application needle (needle) attached to the tip of the adhesive container.

Further, the chip component mounting apparatus also has a component mounting head which is movably supported in a two-dimensional vertical plane, and a print is carried in after an adhesive is applied by a dispenser. A component mounting head mounts a prescribed chip component at a prescribed position on the substrate.

[0005]

By the way, in recent years, the chip manufacturing technology has been improved and the design dimensions of the chip have been miniaturized. Small chip size is 0.5 mm
Some of them are 1.0mm, and the size is 2c, for example.
Even if it is as large as m-square, the interval between many lead wires coming out of the chip is hundreds of microns, which is extremely narrow.

[0006] As described above, as the size of the mounted chips and the design size of the lead wire spacing become finer year by year, even in the work of applying the adhesive, which is performed in the preceding stage when mounting those chips on the substrate, The positioning of the work is required to have a high degree of accuracy corresponding to the miniaturization of design dimensions.

However, the needle position at the tip of the container for storing the adhesive, which is gripped by the coating head of the dispenser, may not be correctly located at the center of the gripping position of the coating head. In this way, if the gripping position of the needle is incorrect,
The problem often arises that the adhesive is not applied in the correct position even when the bending angle application head is moved to a predetermined position on the substrate. Even if this is solved by twisting the gripping position or correcting the position of the coating head with respect to the substrate by inspection at the start of work, etc., if the storage container for adhesive is replaced during the work, the coating needle will be reapplied. There was a problem that the adhesive was not applied to the correct position due to the positional deviation of.

The positional deviation of the coating needle occurs not only when the adhesive container is replaced, but also when the temperature changes, and also when the needle fatigues.

Further, as shown in FIG. 8, the dispenser is a dedicated device that only applies an adhesive in the board component manufacturing line and is extremely expensive. In addition, the processing operations such as the positioning of the substrate by the dispenser and the movement of the work head to the coating position (which is also the chip component mounting position) overlap with the processing operation of the chip component mounting device in many points. Therefore, improvement has been demanded from the viewpoint of improving the efficiency of working time.

An object of the present invention is to automatically detect and correct a position change of a needle with respect to a reference gripping position by an application head, thereby accurately adhering even to a substrate having a miniaturized design dimension. To be able to apply the agent,
In addition, it is also possible to mount a chip component together with this, and to improve the efficiency of working time.

[0011]

The means of the present invention are as follows. In the dispensing apparatus according to the first aspect of the present invention, the coating means coats the adhesive or solder on the printed circuit board for mounting the chip-shaped electronic component, and the correcting means sets the position of the coating means, for example, in the second aspect. As described above, the correction is performed based on the image recognition.

According to a third aspect of the present invention, in addition to the dispenser according to the first aspect or the second aspect, the transfer means takes out the chip-shaped electronic component from the component storage portion and a predetermined position of the printed circuit board. Automatically, and the mounting means automatically mounts the chip-shaped electronic component transferred by the transfer means on a predetermined position of the printed board to which the adhesive or solder is applied by the dispensing device.

[0013]

The operation of the means of the present invention is as follows. First, in the dispensing apparatus according to claim 1, the correction means corrects the position of the coating means based on the image recognition, and after the position correction, the coating means applies an adhesive or a adhesive on the printed circuit board for mounting the chip-shaped electronic component. Apply solder.

As a result, it becomes possible to accurately apply the adhesive (or solder) even to a substrate whose design size is miniaturized. Next, in the component mounting apparatus with a dispensing device according to the third aspect, in addition to the function of the dispensing device, the chip-shaped electronic component is taken out from the component storage section by the transfer means and automatically transferred to a predetermined position on the printed circuit board. Then, the transferred chip-shaped electronic component is automatically mounted by the mounting means at a predetermined position of the printed circuit board coated with the adhesive or the solder by the dispensing device.

As a result, the processing operations which have been duplicated in many respects, such as the positioning of the substrate by the dispenser and the chip component mounting device, the movement of the work head to the chip component mounting position, are unified, and the efficiency of the working time is improved. It will be realized.

[0016]

EXAMPLES Examples will be described below with reference to the drawings. FIG. 1 is a plan view of a component mounting device 10 with a dispensing device according to an embodiment of the present invention, and FIG. 2 is a front view thereof.

In FIG. 1 and FIG. 2, a component mounting device (hereinafter, referred to as a main body device) 10 with a dispensing device is arranged in a horizontal direction (hereinafter, referred to as an X direction) on the device base 11 in the front and the back. Is provided with a component supply cassette corner 18 in which a chip-shaped electronic component (hereinafter, simply referred to as a component) stored in a tape shape is delivered one by one and a cassette for each component to be supplied to a mounting device described later is mounted. In addition, two parallel belt conveyors 11 for carrying a printed circuit board (hereinafter simply referred to as a board) 17 are provided in the center of the apparatus base 11.
a, 11a '. Belt conveyors 11a, 1
The reference numeral 1a 'includes a pair of rails extending horizontally in the X direction, and a conveying belt stretched on the pair of rails so as to run. These belt conveyors 11a and 11a 'are driven by a substrate carrying motor (not shown). The board 17 on which the components are mounted has a belt conveyor 11a on both sides,
The belt conveyors 11a and 11a 'are supported by 11a'.
With the rotation of, the sheet is conveyed in the direction of arrow A from the right side to the left side in the figure.

Along the outer side of the belt conveyor 11a ', the positioning pins 16 and 16' are attached to the apparatus base 11 respectively.
It is rotatably supported by. Positioning pins 16, 1
6'is rotated by a driving device such as an air cylinder so that the leading end portion advances into the substrate transport path, the substrate 17 transported by the belt conveyors 11a and 11a 'is stopped, and the substrate 17 in the X direction. Perform positioning.

Along the outer side of the belt conveyor 11a ', the positioning pins 16 and 16' are slightly separated to the outside of the apparatus base 11, and the two image recognition cameras 15 and 15 are provided.
The suction nozzle exchanger 16 is arranged so as to be integrally movable in the X direction.

One of the two image recognition cameras 15 and 15 picks up an application needle (needle) held by a dispensing device 14a of the work head 14 described later from below, and also two image recognition cameras. The cameras 15 and 15 are mounted on the mounting device 14 of the work head 14, which will also be described later.
The two pick-up nozzles of b pick up and pick up the picked-up parts from below. The imaged image data is sent to a central control unit of the main body device 10 (not shown). In the central control unit, the input image data is arithmetically processed to detect the positional deviation of the image. This detection data is used for position correction when applying an adhesive to the substrate 17 or mounting a component.

A large number of storage pits are formed in the suction nozzle exchanger 16, and various kinds of suction nozzles for sucking and picking up components are held in the storage pits for insertion and removal. I have it.

Further, on the apparatus base 11, straddling the belt conveyors 11a and 11a ', the substrate transfer direction (X
A pair of left and right fixing bases 12 and 12 'extending parallel to a direction (hereinafter, referred to as Y direction) perpendicular to the (direction) are arranged. On these fixed bases 12 and 12 ', rails 12e,
12e 'is laid.

On the rails 12e and 12e ', long moving bases 13 are slidably supported in the Y direction by ball bearings (not shown) provided at both ends in the longitudinal direction thereof. A work head 14 for applying an adhesive to the substrate 17 and mounting components is suspended on the board.

Further, a Y-axis drive servomotor 12a for driving the movable table 13 in the Y direction is arranged on the fixed table 12, and the fixed table 12 and 12 'respectively drive the servomotor 12a on the movable table 13. A Y-axis driving ball screw 12c and a Y-axis driven ball screw 12c 'for transmitting are arranged.

One end of the Y-axis drive ball screw 12c is connected to the drive shaft of the servomotor 12a via a coupling 12b, and the other end of the Y-axis drive ball screw 12c is a toothed pulley 12d and one of the toothed pulley 12d. A toothed belt (not shown) around which the loop is wound, and the other loop of the toothed belt is connected to one end of a Y-axis driven ball screw 12c 'through a toothed pulley 12d' around which the loop is wound so as to be synchronously rotatable. There is.

The Y-axis drive ball screw 12c and the Y-axis driven ball screw 12c 'are connected to the longitudinal ends of the movable table 13 via nut members (not shown) screwed onto the respective ball screws.

Therefore, if the Y-axis drive servomotor 12a connected to the Y-axis drive ball screw 12c is operated,
The Y-axis drive ball screw 12c and the Y-axis driven ball screw 12c ', which are connected by the toothed pulleys 12d and 12d' and the toothed belt, rotate in synchronization with each other, whereby the movable table 13 on which the work head 14 is suspended is moved to the rails 12e and 12e '. Move in the Y direction.

The movable table 13 has a longitudinal direction (X
Direction), an X-axis drive ball screw 13 and an X-axis drive servomotor 13a for driving the work head in the X direction are provided. The X-axis drive ball screw 13 has an X-axis drive servomotor 13a at one end on the right side in the drawing via a coupling 13b.
Drive shaft, the other end is supported by a bearing 13e, and is connected to the work head 14 via a nut member 13d screwed to the ball screw.

Therefore, if the X-axis drive servomotor 13a connected to the X-axis drive ball screw 13 is operated, X
The shaft driving ball screw 13 rotates and the working head 14 moves in the X direction.

That is, the aforementioned Y-axis drive servomotor 12a
Is rotated in both the forward and reverse directions, the movable table 13 can be reciprocally moved linearly in the Y direction together with the work head 14, and the X-axis drive servomotor 13a is rotated in both the forward and reverse directions. It is possible to reciprocate 14 in the X direction. Further, the ball screw has a characteristic that the frictional resistance between the screw and the nut is small and that the backlash can be easily removed. Therefore, the work head 14 can be moved at high speed and positioned with high accuracy.

The working head 14 is a flexible belt-shaped cord 1.
By connecting 3f, it is connected to the central control unit of the main body device 10. The work head 14 is supplied with electric power and a control signal from the central control unit via the belt-shaped cord 13f, and also transmits image data indicating a position to be worked on a substrate, which will be described later, to the central control unit.

The work head 14 is provided with an adhesive on the substrate 1.
7, a dispensing device 14a for applying to 7; a mounting device 14b having two suction nozzles for picking up a component from a component tape or a component tray and mounting it on a substrate; and an adhesive application position of the substrate 17 and a component mounting position. An image recognition camera 14c for position correction is provided.

FIG. 3 is a partial cross-sectional view of the dispensing device 14a arranged on the working head 14. In the figure, a pulse motor 32 is arranged on a mounting base 31 of the working head 14, and a pair of upper and lower rotary bearings 31 are provided.
A cylindrical rotor 33, which is an intermediate support member, is supported via a and 31b.

A toothed pulley 32b is fixed to a rotary shaft 32a of the pulse motor 32, and a toothed belt 32 is formed.
One loop of c is wound. This pulse motor 32
Is connected to the central control unit via the work head 14 and the strip cord 13f.

On the other hand, a toothed pulley 33c is fixed to the upper end of the rotor 33, and the other loop of the toothed belt 32c is wound around the toothed pulley 33c. As a result, the rotation of the pulse motor 32 is controlled by the toothed pulley 32b,
It is transmitted to the rotor 33 via the toothed belt 32c and the toothed pulley 33c. A spline shaft 34 is integrally rotatably and axially slidably supported inside the rotor 33 through a pair of upper and lower spline bearings 33a and 33b.

Therefore, when the pulse motor 32 is operated, the spline shaft 34 is rotated at an arbitrary angle of 360 degrees, and the pouring nozzle 36 in the coating head 36, which will be described later, fixed to the lower end of the spline shaft 34.
The angle can be positioned or corrected with respect to the reference position of c.

A plurality of sliding grooves 34a are formed on the peripheral surface of the spline shaft 34 along the axial direction thereof, and a disc 35 is formed at the upper end of the spline shaft 34.
Is fixed to the lower end of the holder 36a and the holder 36a.
Adhesive storage tank 36b to be gripped by the adhesive, and a pouring nozzle 36c connected to the tip of the adhesive storage tank 36b
The holder 36a of the coating head 36 consisting of is fixed.

A tension spring 37 is stretched between the disc 35 and the toothed pulley 33c, and by this, the spline shaft 34 is urged downward through the disc 35. In addition, the mounting base 31 on the right side of the spline shaft 34 in the drawing
An air cylinder 38a, a piston rod 38b supported downward by the air cylinder 38a and linearly driven up and down, an intermediate support member 38c fixed to the upper end of the piston rod 38b, and an intermediate support member thereof. Three
A linear drive mechanism 38 including a roller member 38d rotatably supported at the tip of 8c is fixed.

The roller member 38d is a lower surface 35 of the disk 35.
The piston 35 is abutted against a and transmits the ascending drive of the piston rod 38b to the spline shaft 34 through the disc 35 without hindering the rotation of the disc 35.
At the time of descending 8b, it descends while supporting the disk 35 against the urging force of the tension spring 37.

Therefore, by operating the air cylinder 38a, the spline shaft 34 can be arbitrarily moved up and down, and when the adhesive is applied, the spline shaft 34 is lowered and the application head 36 fixed to the lower end of the spline shaft 34 is lowered. The dispensing nozzle 36c can be brought close to the substrate to accurately apply the adhesive.

The pouring nozzle 36c is, as shown in FIG.
Two needles 36c for pouring and applying adhesive-
1, 36c-1 '(or a single needle in some cases) and two stoppers 36c-2 (not visible because they are doubled in the figure). The image recognition camera 15 will be described later in detail. The image of the state of the position is captured from below, and if the position is incorrect, it is corrected.

Image recognition in this embodiment will be briefly described with reference to FIGS. 5 (a) and 5 (b). Same figure (a), (b)
Is imaged from below from the position state of the tip of the pouring nozzle 36c, the image data is transmitted to the central control unit, and the central control unit causes the central control unit to display the image data (not shown). 6 is a diagram showing an image formed in an image memory. The same figure (a) shows two needles 36c
-1 and 36c-1 ', and FIG. 2B is an image of single needle 36c-1 ". Two needles 3
The distance between 6c-1 and 36c-1 'is usually about 1 mm (in the figure, it is shown relatively large for the sake of explanation).

These images are also projected on a display device (not shown) provided on the front surface of the main body device 10 so that the operator can observe them. The image field of view 15a shown in FIGS. 1A and 1B is approximately 40 m in the lateral direction (X direction).
m is approximately 20 mm in the vertical direction (Y direction). The screen configuration is 900 pixels in the X direction and 500 pixels in the Y direction. Therefore, the resolution is almost 40 microns (4/100
mm).

Window (window) 15b in image field 15a
Alternatively, 15b 'is set at the center of the image visual field by the operator. Further, when recognizing an image for a part, the window is not set if the size of the part to be worked is large. In the central control unit, the window 15b or 15
Only the image in b'is recognized and controlled. In the windows 15b and 15b 'shown in FIGS. 1A and 1B, the two recognition stoppers 36c-2 and 36c-2 are excluded so that the needles and the stoppers may be confused or confused. This is set in order to prevent the above-mentioned problem and to improve the efficiency of the recognition work by limiting the image scanning range within the window.

Next, the basic pattern of the operation in the present embodiment having the above-mentioned structure will be described below with reference to the processing flowchart shown in FIG. It should be noted that this processing is performed every time the substrate 17 to be carried in is correctly fixed at a predetermined position by the positioning pins 16 and 16 'after the main body device 10 shown in FIGS. 1 and 2 is powered on. It is started by 10 central control units.

Further, in the dispensing device 14a of the working head 14 shown in FIG. 3, an adhesive storage tank 36b is connected to the pouring nozzle 36c at its tip and is held in advance by the holder 36a of the coating head 36. Is assumed.
Further, the pouring nozzle 36c described here has a structure of two needles 36c-1 and 36c-1 'shown in FIG. 5 (a).

First, the central control unit operates the Y-axis drive servomotor 12a and the X-axis drive servomotor 13a in order to detect the needle position deviation of the pouring nozzle 36c,
The work head 14 is moved in the Y direction and also in the X direction, and stopped above the image recognition cameras 15, 15.
Next, the working head 14 is lowered, and the state of the needle position of the pouring nozzle 36c is imaged from below by one of the image recognition cameras 15 and 15 to perform image recognition of the needle position state, The needle position of 0 degree is detected (step S61).

In this process, as shown in FIG. 7A, first, the window 15b is scanned and the two needles 36c-
The image of 1, 36c-1 'is recognized, and the main axis of the image (the straight line connecting the centers of the two needles 36c-1, 36c-1') and the reference axis (the X direction frame of the window 15b or the visual field 15a) The tilt angle θ of is calculated. Next, the pulse motor 32 shown in FIG. 3 is drive-controlled to rotate the spline shaft 34 counterclockwise in FIG. 7 by the angle θ calculated above. That is, the pouring nozzle 36c attached to the coating head 36 at the lower end is rotated, and the inclination angle θ becomes 0 degree as shown in FIG. 7 (b), and the needle position 0 degree is detected.

Thus, the two needles 36c-1,
The inclination of the main axis with respect to the reference position due to kinking or sag of 36c-1 'is corrected. Then, the center coordinates (x1, y1) of the main axis at this time are calculated and stored in a register or the like in the central control unit.

Subsequently, the central control section further detects the needle position of 180 degrees by recognizing the image of the needle position state (step S62). In this process, the pulse motor 32 is further driven, and the spline shaft 34, that is, the spout nozzle 36c is rotated 180 times in either the forward or reverse direction. As a result, the 2
The position images of the needles 36c-1 and 36c-1 'of the book are
The axis of the spline shaft 34, which is the reference point, is rotated 180 degrees horizontally in the window 15b, as shown in FIG.
As shown in (c), the positions of the needles 36c-1 and 36c-1 'are exchanged while the main axis of the image is kept at the inclination angle θ = 0 degree. Once again, the central coordinates of the main axis (x
2, y2) is calculated and stored in another register in the central control unit.

If the values of the coordinates (x1, y1) and (x2, y2) obtained in the two registers by the above two operations are equal, it means that the reference point is rotated with the center position of the image main axis. Therefore, the two needles 36c
There is no eccentricity at the positions of -1, 36c-1 ', and both of the two coordinates are reference points.

On the other hand, if the values of the two coordinates are different, the center position of the image main axis has been swapped 180 degrees around the reference point, and therefore the two needles 36c-1 and 36c.
The position of c-1 'is eccentric, and the center of the two coordinates is the reference point.

Next, the central controller determines the coordinates (x, y) of the rotation centers (reference points) of the two needles 36c-1 and 36c-1 'based on the above-mentioned image recognition (x, y). y)
= (((X1 + x2) / 2), ((y1 + y2) /
2)) is calculated (step S63).

Subsequently, the calculated reference point coordinates (x,
Position correction in the X and Y directions is performed based on y) (step S64). In this process, first, the reference point coordinates (x, y) calculated by the above calculation and the final position coordinates (x2, x2, 36c-1 'of the two needles 36c-1 and 36c-1' shown in FIG.
The deviations "x2-x" and "y2-y" from y2) are obtained. Next, based on the design data, the coordinates (x0, y
0) is read out, and the deviation "x2" is added to the values of x0 and y0.
Position correction is performed by adding "-x" and "y2-y".

In this way, the deviations "x2-x" and "y2-y" in the X and Y directions as well as the inclination .theta. Of the main axis are corrected to set the coordinate data of the correct coating position.
Next, the central control unit stops the dispensing device 14a of the work head 14 at the correct application position of the substrate based on the corrected coordinate data, and starts the adhesive application operation (step S65).

This coating work processing includes component mounting work. That is, the central control unit operates the Y-axis drive servomotor 12a and the X-axis drive servomotor 13a again, and moves the work head 14 in the Y direction as well as in the X direction to supply the work head 14 with the components. The cassette corner 18 is stopped above the pickup position of the component to be picked up. Next, the working head 14 is lowered,
The two suction nozzles of the mounting device 14b simultaneously suction the two target components mounted on the board 17 and then raise them. If the two target components cannot be sucked simultaneously due to the arrangement relationship of the component supply cassettes, the work head 14 is moved in the X direction, for example, to pick up one by one.

Next, in order to detect the displacement of the suction position of the suction component, the work head 14 is moved to the image recognition cameras 15, 15.
The image pickup cameras 15 and 15 are moved upward, and the pickup state of the component by the two suction nozzles of the mounting device 14b is imaged from below by the image recognition cameras 15 and 15 to perform image recognition of the component suction state.

The image recognition and the component position correction processing based on the image recognition are the same as the above-described application needle position correction. That is, first, the image data of the component suction state imaged by the image recognition cameras 15 and 15 is sent to the central control unit. The central control unit processes this image data and calculates the deviation of the component suction position with respect to the reference position of the mounting device 14b by dividing it into the X direction, the Y direction, and the rotation angle. Based on the data of the suction position deviation detected in this way, the axis of the suction nozzle is rotated to correct the angle,
Further, the X of the stop position of the work head 14 stored in advance is stored.
The values in the direction and Y direction are respectively corrected.

As a result, the work head 14, that is, the mounting device 14b is stopped at the proper correction position in which the amount of displacement of the suction position is taken into consideration so that the suction component is located directly above the component mounting position, and the dispensing device 14a causes the adhesive to move. The suction component is correctly mounted at a predetermined position on the substrate 17 coated with.

Subsequently, the central control unit detects the remaining amount of the adhesive stored in the adhesive storage tank 36b of the dispensing device 14a, and determines whether the remaining amount is below the specified amount. If not insufficient, the application of the adhesive and the component mounting process in step S65 are repeated.

When the amount of adhesive remaining in the detected adhesive storage tank 36b is less than the specified amount in the determination in step S66, the coating operation and the component mounting operation are stopped (step S67), and the adhesive storage tank 36b is stopped. Then, the adhesive is filled (step S68), and the process returns to the step S61 of detecting deviation of the application needle position and correcting it.

As described above, according to this embodiment,
Since the position changes of the needles 36c-1 and 36c-1 'with respect to the reference gripping position of the dispensing device 14a are automatically detected and corrected, even a substrate whose design size is miniaturized is accurately bonded. The agent can be applied. In addition, since the mounting device 14b also mounts the chip components in parallel, the efficiency of the working time can be improved.

In this embodiment, the adhesive storage tank 3
Only when 6b is filled with the adhesive, step S61
The process returns to the process of detecting the deviation of the application needle position and the correction thereof, but not limited to this, in step S66,
Not only the remaining amount of adhesive in the adhesive storage tank 36b is determined,
When the elapse of a fixed time is also determined, the process returns to step S61 every time the fixed time elapses, and the deviation detection of the application needle position and the correction processing thereof are performed. It is possible to correct the variation of the position due to the movement. Furthermore, step S66
By detecting the temperature change and returning to step S61 when there is a temperature change within a certain range, the position change of the application needle due to the temperature change can be corrected.

[0064]

According to the present invention, since the position change of the needle with respect to the reference gripping position by the coating head is automatically detected and corrected, the adhesive can be accurately applied even to a substrate whose design size is miniaturized. You can apply it. Further, since the adhesive is applied and the chip parts are mounted, the efficiency of the working time can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of a component mounting device with a dispensing device according to an embodiment of the present invention.

FIG. 2 is a front view of the component mounting device with a dispensing device of FIG.

FIG. 3 is a partial cross-sectional view of a dispensing device arranged on the working head.

FIG. 4 is a diagram showing a relationship between an adhesive application needle and an image recognition camera.

5A and 5B are diagrams illustrating an outline of image recognition.

FIG. 6 is a processing flowchart illustrating a basic pattern of operation.

FIG. 7 is a diagram illustrating a relationship between image recognition and position correction.

FIG. 8 is a diagram illustrating a configuration of a conventional board component manufacturing line.

[Explanation of symbols]

 10 Parts Mounting Device with Dispensing Device 11 Device Base 11a, 11a 'Belt Conveyor 12, 12' Fixing Base 12a Y-Axis Drive Servo Motor 12b, 13b Coupling 12c, 13c Ball Screw 12d, 12d 'Toothed Pulley 13 Moving Base 13a X Axis drive servo motor 13d Nut member 13f Belt cord 14 Working head 14a Dispensing device 14b Mounting device 14c, 15 Image recognition camera 16, 16 'Positioning pin 17 Substrate 18 Component supply cassette corner 31 Working head mounting base 31a, 31b Rotating bearing 32 pulse motor 32 32a rotating shaft 32b, 33c toothed pulley 32c toothed belt 33 rotor 33a, 33b spline bearing 34 spline shaft 34a sliding groove 35 disk 36 coating Head 36a Holder 36b Adhesive storage tank 36c Pouring nozzle 37 Tension spring 38 Linear drive mechanism 38a Air cylinder 38b Piston rod 38c Intermediate support member 38d Roller member

Claims (3)

[Claims] 1. A dispensing device comprising: a coating means for coating an adhesive or solder on a printed circuit board for mounting a chip-shaped electronic component; and a correction means for correcting the position of the coating means. .. 2. The dispensing device according to claim 1, wherein the correction unit corrects the position of the coating unit by image recognition. 3. The dispensing device according to claim 1 or 2, transfer means for taking out a chip-shaped electronic component from a component storage portion and automatically transferring it to a predetermined position on a printed circuit board, and an adhesive or a solder by the dispensing device. And a mounting means for automatically mounting the chip-shaped electronic component transferred by the transfer means at a predetermined position on the printed circuit board to which is applied.