CN106879192A - A kind of PCBA board manufacture method and system - Google Patents
A kind of PCBA board manufacture method and system Download PDFInfo
- Publication number
- CN106879192A CN106879192A CN201710287836.8A CN201710287836A CN106879192A CN 106879192 A CN106879192 A CN 106879192A CN 201710287836 A CN201710287836 A CN 201710287836A CN 106879192 A CN106879192 A CN 106879192A
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- Prior art keywords
- face
- tin cream
- substrate
- printed
- printing
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides a kind of PCBA board manufacture method and system, the method includes：The substrate of outside transmission is received, tin cream is printed in the first face of the substrate；By at least one first component mounters in the tin cream that first face is printed；The substrate after first face is mounted is overturn to the second face；Tin cream is printed in the second face of the substrate；By at least one second component mounters in the tin cream that second face is printed；The first face and the second face in the substrate is welded, PCBA board is obtained.Therefore the scheme that the present invention is provided can reduce the cost of PCBA board manufacturing process consumption.
Description
Technical field
The present invention relates to circuit board production techniques field, more particularly to a kind of PCBA board manufacture method and system.
Background technology
PCBA board (Printed Circuit Board+Assembly, printed circuit board (PCB)) is used as various circuits and electronics unit
The physical support of part so that the partial function of electronic equipment is achieved.Therefore, PCBA board be in electronic equipment important component it
One.
At present, PCBA board manufacturing process is usually：By the first face of PCBA board sequentially pass through paste solder printing, tin cream detection,
5 manufacture links such as part attachment, reflow soldering, optical detection.After the completion for the treatment of the first face manufacture of PCBA board, then by PCBA board
The second face sequentially pass through the manufacture links of paste solder printing, tin cream detection, part attachment, reflow soldering, optical detection etc. 5.Treat
After the completion of the manufacture in the second face of PCBA board, the whole manufacturing process of PCBA board is just completed, obtain PCBA board.
But, existing mode needs reflow soldering twice to manufacture link, and Reflow Soldering in the manufacturing process of PCBA board
Connect as the manufacture link of most critical, time-consuming, power consumption is big, it is necessary to artificial many.That therefore consumes is relatively costly.
The content of the invention
The invention provides a kind of PCBA board manufacture method and system, can reduce the consumption of PCBA board manufacturing process into
This.
In a first aspect, the invention provides a kind of PCBA board manufacture method, the method includes：
The substrate of outside transmission is received, tin cream is printed in the first face of the substrate；
By at least one first component mounters in the tin cream that first face is printed；
The substrate after first face is mounted is overturn to the second face；
Tin cream is printed in the second face of the substrate；
By at least one second component mounters in the tin cream that second face is printed；
The first face and the second face in the substrate is welded, PCBA board is obtained.
Preferably,
It is described by least one first component mounters in the tin cream that first face is printed, including：
Each described first element is immersed in the tin cream, wherein, the upper surface of each first element and institute
There is the distance of setting between stating the upper surface of tin cream.
Preferably,
It is described by least one the second component mounter in the tin cream that second face is printed, including：
Each described second element is immersed in the tin cream, wherein, the upper surface of each second element and institute
There is the distance of setting between stating the upper surface of tin cream.
Preferably,
When there is the second element described in the first element and at least two described at least two,
It is described by least one first component mounters in the tin cream that first face is printed, including：
The first element by size in described at least two first elements less than first threshold, is mounted on the first face print
In the tin cream of system；
The first element by size in described at least two first elements more than or equal to first threshold, is mounted on described the
In the tin cream simultaneously printed.
Preferably,
When there is the second element described in the first element and at least two described at least two,
It is described by least one the second component mounter in the tin cream that second face is printed, including：
Size in described at least two second elements is printed less than the second component mounter of Second Threshold in second face
In the tin cream of system；
The second element by size in described at least two second elements more than or equal to Second Threshold, is mounted on described the
In the tin cream of two faces printing.
Preferably,
Further include：
Detect whether the thickness and area of the first face printing tin cream reach numerical value set in advance, if it is,
By at least one first component mounters in the tin cream that first face is printed, otherwise, the substrate is rejected.
Preferably,
Further include：
Detect whether the thickness and area of the second face printing tin cream reach numerical value set in advance, if it is,
By at least one second component mounters in the tin cream that second face is printed, otherwise, the substrate is rejected.
Preferably,
Further include：
With the presence or absence of missing solder in the PCBA board that detection is obtained, and/or, short circuit line,
If it is, determining that the PCBA board is unqualified；
Otherwise, it determines the PCBA board is qualified.
Second aspect, the invention provides a kind of PCBA board manufacture system, the system includes：
Stencil printer, the substrate for receiving outside transmission, prints tin cream, by the first face in the first face of the substrate
Print the substrate output of tin cream；The upset of the panel turnover machine output to the substrate in the second face is received, in the substrate
The second face printing tin cream, by the second face print tin cream after the substrate output；
The substrate of tin cream is printed in chip mounter, the first face for receiving stencil printer output, will at least one
In the tin cream that first face is printed, the substrate after the first face is mounted is exported to the turnover panel individual first component mounter
Machine；The substrate after the second face printing tin cream of the stencil printer output is received, by least one second component mounters
In the tin cream of second face printing, the substrate after the second face is mounted is exported to the reflow oven；
Panel turnover machine, for the substrate after the first face attachment for receiving the chip mounter output, by first face patch
The substrate after dress is overturn to the second face, and the substrate overturn to the second face is exported to the stencil printer；
Reflow oven, for the substrate after the second face attachment for receiving the chip mounter output, in the substrate
First face and the second face are welded, and obtain PCBA board.
Preferably,
The chip mounter, for each described first element to be immersed in the tin cream, wherein, each described first yuan
There is the distance of setting between the upper surface of the upper surface of part and the tin cream.
Preferably,
The chip mounter, for each described second element to be immersed in the tin cream, wherein, each described second yuan
There is the distance of setting between the upper surface of the upper surface of part and the tin cream.
Preferably,
When there is the second element described in the first element and at least two described at least two,
The chip mounter, including：First high speed placement system and first general uses chip mounter；
First high speed placement system, for size in described at least two first elements to be less than into the first of first threshold
Element, is mounted in the tin cream of first face printing, by attachment after the substrate export to described first and general use chip mounter；
The first general use chip mounter, for the substrate after the attachment for receiving the first high speed placement system output,
The first element by size in described at least two first elements more than or equal to first threshold, is mounted on the first face printing
Tin cream in, by attachment after the board transport to the panel turnover machine.
Preferably,
When there is the second element described in the first element and at least two described at least two,
The chip mounter, including：Second high speed placement system and second general uses chip mounter；
Second high speed placement system, for size in described at least two second elements to be less than into the second of Second Threshold
Component mounter in the tin cream that second face is printed, by attachment after the substrate export to described second and general use chip mounter；
The second general use chip mounter, for the substrate after the attachment for receiving the second high speed placement system output,
The second element by size in described at least two second elements more than or equal to Second Threshold, is mounted on the second face printing
Tin cream in, by attachment after the board transport to the reflow oven.
Preferably,
Further include：First tin cream detection machine；
The first tin cream detection machine, described in after the first face printing tin cream for receiving the stencil printer transmission
Substrate, detects whether the thickness and area of the first face printing tin cream reach numerical value set in advance, if it is, triggering
At least one first component mounters in the tin cream that first face is printed, otherwise, are rejected the substrate by the chip mounter.
Preferably,
Further include：Second tin cream detection machine；
The second tin cream detection machine, described in after the second face printing tin cream for receiving the stencil printer transmission
Substrate, detects whether the thickness and area of the second face printing tin cream reach numerical value set in advance, if it is, triggering
At least one second component mounters in the tin cream that second face is printed, otherwise, are rejected the substrate by the chip mounter.
Preferably,
Further include：PCBA board detection machine；
The PCBA board detection machine, for detecting with the presence or absence of missing solder in the PCBA board that the reflow oven is obtained, and/
Or, short circuit line, if it is, determining that the PCBA board is unqualified；Otherwise, it determines the PCBA board is qualified.
A kind of PCBA board manufacture method and system are the embodiment of the invention provides, by the first face of the substrate for receiving
Printing tin cream, by each component mounter to be mounted in the tin cream that the first face is printed.After the completion for the treatment of that the first face mounts, by substrate
Overturn to the second face.Then tin cream is printed in the second face of substrate, and each component mounter to be mounted is printed in the second face
Tin cream in.Treat the second face attachment after the completion of, to substrate in the first face and the second face weld, to obtain PCBA board.
By above-mentioned, this programme is not welded, but substrate is overturn after the completion of the face of substrate first mounts to the first face
To the second face, continue to mount the second face.After the completion of the second face is mounted, just to first face and the second face of substrate
Welded, because only need to once weld link in the manufacturing process of whole PCBA board, therefore, the scheme that the present invention is provided
The cost of PCBA board manufacturing process consumption can be reduced.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is a kind of flow chart of PCBA board manufacture method that one embodiment of the invention is provided；
Fig. 2 is a kind of structural representation of PCBA board manufacture system that one embodiment of the invention is provided；
Fig. 3 be one embodiment of the invention provide it is a kind of including the first high speed placement system and the first general use chip mounter
The structural representation of PCBA board manufacture system；
Fig. 4 be one embodiment of the invention provide it is a kind of including the second high speed placement system and the second general use chip mounter
The structural representation of PCBA board manufacture system；
Fig. 5 is a kind of knot of PCBA board manufacture system including the first tin cream detection machine that one embodiment of the invention is provided
Structure schematic diagram；
Fig. 6 is a kind of knot of PCBA board manufacture system including the second tin cream detection machine that one embodiment of the invention is provided
Structure schematic diagram；
Fig. 7 is a kind of structure of PCBA board manufacture system including PCBA board detection machine that one embodiment of the invention is provided
Schematic diagram；
Fig. 8 is a kind of flow chart of PCBA board manufacture method that another embodiment of the present invention is provided.
Specific embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments, based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained on the premise of creative work is not made, belongs to the scope of protection of the invention.
As shown in figure 1, the embodiment of the invention provides a kind of PCBA board manufacture method, the method can include following step
Suddenly：
Step 101：The substrate of outside transmission is received, tin cream is printed in the first face of the substrate；
Step 102：By at least one first component mounters in the tin cream that first face is printed；
Step 103：The substrate after first face is mounted is overturn to the second face；
Step 104：Tin cream is printed in the second face of the substrate；
Step 105：By at least one second component mounters in the tin cream that second face is printed；
Step 106：The first face and the second face in the substrate is welded, PCBA board is obtained.
According to embodiment as shown in Figure 1, tin cream is printed by the first face of the substrate for receiving, each is to be mounted
Component mounter is in the tin cream that the first face is printed.Treat after the completion of the attachment of the first face, substrate is overturn to the second face.Then in substrate
The second face printing tin cream, and by each component mounter to be mounted in the tin cream that the second face is printed.Treat that the second face has mounted
Cheng Hou, to substrate in the first face and the second face weld, to obtain PCBA board.By above-mentioned, this programme is in base
After the completion of the attachment of the face of plate first, the first face is not welded, but substrate is turned to the second face, continuation is entered to the second face
Row attachment.After the completion of the second face is mounted, just the first face and the second face to substrate are welded, because in whole PCBA
Only need to once weld link in the manufacturing process of plate, therefore, the embodiment that the present invention is provided can reduce PCBA board and manufacture
The cost that journey consumes.
In an embodiment of the invention, involved by the step 101 in flow chart shown in above-mentioned Fig. 1 the first of substrate
Tin cream is printed in face, and step 104 prints tin cream in the second face of substrate.Can be completed by same paste solder printing equipment,
Can also be completed by two paste solder printing equipment respectively.The paste solder printing equipment is stencil printer, and stencil printer
Pattern can determine according to business need.
In an embodiment of the invention, the step 102 in flow chart shown in above-mentioned Fig. 1 pastes at least one first elements
In the tin cream of first face printing, and step 105 prints at least one second component mounters in second face
Tin cream in.Can be completed by same mounting device, it is also possible to completed by two mounting devices respectively.The printed apparatus
It is placement equipment, and the pattern of placement equipment can determine according to business need.
In an embodiment of the invention, the step 102 in flow chart shown in above-mentioned Fig. 1 pastes at least one first elements
In the tin cream of first face printing, can include：
Each described first element is immersed in the tin cream, wherein, the upper surface of each first element and institute
There is the distance of setting between stating the upper surface of tin cream.
In the present embodiment, distance value between the upper surface of each the first element and tin cream upper surface, can be according to business
It is required that determining.Wherein, because the height of each the first element has inconsistent situation, therefore the setting of the distance there may be
Below at least three kinds situations：
Situation one：On the basis of height highest element in each first element, the distance of setting is just height highest
Distance between the upper surface of element and the upper surface of tin cream；
Situation one：On the basis of element highly minimum in each first element, the distance of setting is just highly minimum
The upper surface of element and between distance；
Situation three：On the basis of being in the element of average height level by the height of each the first element, the distance of setting is just
It is the distance between the upper surface of the element in average height level and the upper surface of tin cream.
Above-mentioned situation two exposes first due to that may there is upper surface of the height more than the other elements of lowest component
The situation of face tin cream upper surface, therefore the first face tin cream is not enough for exposing each element degree of sticking together of tin cream upper surface, is inciting somebody to action
Substrate is overturn to can there is the situation that element drops during the second face, therefore not as preferred mode.
In an embodiment of the invention, the step 105 in above-mentioned Fig. 1 by least one the second component mounter described
In the tin cream of the second face printing, can include：
Each described second element is immersed in the tin cream, wherein, the upper surface of each second element and institute
There is the distance of setting between stating the upper surface of tin cream.
In the present embodiment, distance value between the upper surface of each the second element and tin cream upper surface, can be according to business
It is required that determining.Wherein, because the height of each the second element has inconsistent situation, therefore the setting of the distance can also be deposited
In at least three kinds situations, these three situations please refer to the embodiment that the first above-mentioned face mounts at least one first elements.
According to above-described embodiment, when by each component mounter in the tin cream that the face of substrate first or the second face are printed, will
Each element is immersed in the tin cream, wherein, there is the distance of setting between the upper surface of each element and the upper surface of tin cream.
Substrate carry out follow-up turnover panel, welding etc. operate when, to reduce the possibility that element comes off from tin cream.
In an embodiment of the invention, when in the presence of second yuan described in the first element and at least two described at least two
During part,
Then the step 102 in above-mentioned Fig. 1 is wrapped by least one first component mounters in the tin cream that first face is printed
Include：
The first element by size in described at least two first elements less than first threshold, is mounted on the first face print
In the tin cream of system；
The first element by size in described at least two first elements more than or equal to first threshold, is mounted on described the
In the tin cream simultaneously printed.
In the present embodiment, for the precision for determining to mount, size first being pasted less than first threshold in each element
Dress, after size is finished less than each component mounter of first threshold, is just carried out size more than or equal to the element of first threshold
Attachment.Wherein first threshold can determine according to business need.
In addition, attachment size can determine less than the mounting device that the element of first threshold is used according to business need, than
It such as can be Chip-shooter.Attachment size can also be according to industry more than or equal to the mounting device that the element of first threshold is used
Business requires determination, such as can use placement equipment from general.
According to above-described embodiment, during by least two component mounters in the tin cream that the face of substrate first is printed, first by each
Size is mounted in the tin cream of the first face printing less than the first element of first threshold in first element.Then again by each
Size is mounted in the tin cream of the first face printing more than or equal to the first element of first threshold in one element.Due to difference
The element of size is mounted respectively, therefore can improve the accuracy and efficiency of attachment.
In an embodiment of the invention, when in the presence of second yuan described in the first element and at least two described at least two
During part,
Then the step 105 in above-mentioned Fig. 1 by least one the second component mounter in the tin cream that second face is printed,
Including：
Size in described at least two second elements is printed less than the second component mounter of Second Threshold in second face
In the tin cream of system；
The second element by size in described at least two second elements more than or equal to Second Threshold, is mounted on described the
In the tin cream of two faces printing.
In the present embodiment, for the precision for determining to mount, size first being pasted less than Second Threshold in each element
Dress, after size is finished less than each component mounter of Second Threshold, is just carried out size more than or equal to the element of Second Threshold
Attachment.Wherein Second Threshold can determine according to business need.
In addition, attachment size can determine less than the mounting device that the element of Second Threshold is used according to business need, than
It such as can be Chip-shooter.Attachment size can also be according to industry more than or equal to the mounting device that the element of Second Threshold is used
Business requires determination, such as can use placement equipment from general.
According to above-described embodiment, during by least two component mounters in the tin cream that the face of substrate second is printed, first by each
Size is mounted in the tin cream of the second face printing less than the second element of Second Threshold in first element.Then again by each
Size is mounted in the tin cream of the second face printing more than or equal to the second element of Second Threshold in two element.Due to difference
The element of size is mounted respectively, therefore can improve the accuracy and efficiency of attachment.
In an embodiment of the invention, PCBA board manufacture method can further include：Detect the first face print
Whether the thickness and area of tin cream processed reach numerical value set in advance, if it is, at least one first component mounters are existed
In the tin cream of the first face printing, otherwise, the substrate is rejected.
In the present embodiment, the area of tin cream is printed in the corresponding data of thickness of the first face printing tin cream and the first face
Corresponding data can determine according to business need.Such as thickness can be 1 millimeter.The corresponding data of area are preferably substrate
The entire area in the first face.
In the present embodiment, when the thickness and area that detect the face of substrate first printing tin cream have reached and preset
Data when, then illustrate thickness and area that tin cream is printed in the face of substrate first meet follow-up component mounter, turnover panel with
And the requirement of welding.When any one has been not up to and sets in advance in the thickness and area for detect the face of substrate first printing tin cream
During fixed data, then illustrate that printing tin cream in the face of substrate first can not meet follow-up component mounter, turnover panel and welding
Requirement.The substrate can not carry out the operation of subsequent handling, it should reject, and the probability of unqualified PCBA board is generated to reduce.
According to above-described embodiment, when the thickness and area that detect the first face printing tin cream reach numerical value set in advance
When, by each component mounter to be mounted in the tin cream that the first face is printed.When the thickness and face that detect the first face printing tin cream
When any one is not up to numerical value set in advance in product, substrate is rejected.Unqualified PCBA board is produced such that it is able to reduce
Probability.
In an embodiment of the invention, PCBA board manufacture method can further include：Detect the second face print
Whether the thickness and area of tin cream processed reach numerical value set in advance, if it is, at least one second component mounters are existed
In the tin cream of the second face printing, otherwise, the substrate is rejected.
In the present embodiment, the area of tin cream is printed in the corresponding data of thickness of the second face printing tin cream and the second face
Corresponding data can determine according to business need.Such as thickness can be 1 millimeter.The corresponding data of area preferably elect base as
The entire area in the face of plate second.
In the present embodiment, when the thickness and area that detect the face of substrate second printing tin cream have reached and preset
Data, then illustrate that thickness and area that tin cream is printed in the face of substrate second meet follow-up component mounter and welding
It is required that.When any one has been not up to data set in advance in the thickness and area for detect the face of substrate second printing tin cream
When, then illustrating to print in the face of substrate second tin cream can not meet the requirement of follow-up component mounter and welding.The substrate
The operation of subsequent handling can not be carried out, it should reject, the probability of unqualified PCBA board is generated to reduce.
According to above-described embodiment, when the thickness and area that detect the second face printing tin cream reach numerical value set in advance
When, by each component mounter to be mounted in the tin cream that the second face is printed.When the thickness and face that detect the second face printing tin cream
When any one is not up to numerical value set in advance in product, substrate is rejected.Unqualified PCBA board is generated such that it is able to reduce
Probability.
In an embodiment of the invention, whether the thickness and area of detection substrate first face printing tin cream reach pre-
Whether the process of the numerical value for first setting, and the thickness and area of detection substrate second face printing tin cream reach and preset
Numerical value process, can be completed by same tin cream testing equipment, it is also possible to complete by two tin cream testing equipments respectively
Into.The tin cream testing equipment is tin cream detection machine, and the pattern of tin cream detection machine can determine according to business need.
In an embodiment of the invention, PCBA board manufacture method can further include：It is described that detection is obtained
Whether there is missing solder in PCBA board, and/or, short circuit line,
If it is, determining that the PCBA board is unqualified；
Otherwise, it determines the PCBA board is qualified.
In the present embodiment, the PCBA board for obtaining can be detected by testing equipment, the testing equipment can basis
Business need determines.Such as, can be automatic optical detector.Can determine to whether there is sky in PCBA board by optical analysis
Any one situation in weldering and short circuit line.If there is then illustrating that the PCBA board is unqualified, if be installed in electronic equipment,
The normal work of electronic equipment will be influenceed, therefore should given up.When in the absence of when, then illustrate that the PCBA board is qualified, then can install
To in electronic equipment.
According to above-described embodiment, after the completion of reflow oven is to the first face of substrate and the welding of the second face, when detection is obtained
When there is at least one of missing solder and short circuit line situation in PCBA board, it is determined that PCBA board is unqualified.When detection is obtained
When not existing at least one of missing solder and short circuit line situation in PCBA board, it is determined that PCBA board is qualified.Therefore can be according to inspection
The testing result of PCBA board is surveyed, unqualified PCBA board is rejected in time.
As shown in Fig. 2 the embodiment of the invention provides a kind of PCBA board manufacture system, the system includes：
Stencil printer 201, the substrate for receiving outside transmission, tin cream is printed in the first face of the substrate, by the
The simultaneously substrate output of printing tin cream；The upset of the panel turnover machine output to the substrate in the second face is received, described
The second face printing tin cream of substrate, the second face is printed the substrate output after tin cream；
The substrate of tin cream is printed in chip mounter 202, the first face for receiving the output of the stencil printer 201, will
In the tin cream that first face is printed, the substrate after the first face is mounted is exported to institute at least one first component mounters
State panel turnover machine 203；The substrate after the second face printing tin cream of the output of the stencil printer 201 is received, by least one
In the tin cream that second face is printed, the substrate after the second face is mounted is exported to the reflow oven second component mounter
204；
Panel turnover machine 203, for the substrate after the first face attachment for receiving the output of the chip mounter 202, by described the
The substrate after simultaneously mounting is overturn to the second face, and the substrate overturn to the second face is exported to the stencil printer
201；
Reflow oven 204, for the substrate after the second face attachment for receiving the output of the chip mounter 202, to the base
The first face and the second face in plate are welded, and obtain PCBA board.
According to embodiment as shown in Figure 2, the PCBA board manufacture system includes：Stencil printer, chip mounter, panel turnover machine with
And reflow oven.Tin cream is printed in the first face of substrate by stencil printer, the substrate of the first face printing tin cream is exported to patch
Piece machine.Recycle chip mounter by each component mounter in the tin cream that the first face is printed, the substrate after then the first face is mounted
Export to panel turnover machine.Substrate after the first face is mounted using panel turnover machine is overturn to the second face, will overturn the substrate to the second face
Export to stencil printer.Then tin cream is printed in the second face of substrate using stencil printer, and tin cream is printed into the second face
Board transport afterwards is to chip mounter.Near each component mounter of chip mounter is recycled in the tin cream that the second face is printed, by second
Substrate after the attachment of face is exported to reflow oven.Then using reflow oven to substrate in the first face and the second face weld,
Obtain PCBA board.By above-mentioned, this programme only needs to a welding for reflow oven in the manufacturing process of whole PCBA board
Link, therefore, the embodiment that the present invention is provided can reduce the cost of PCBA board manufacturing process consumption.
In an embodiment of the invention, the chip mounter 202 in structural representation shown in above-mentioned Fig. 2, for by each institute
The first element is stated to be immersed in the tin cream, wherein, between the upper surface of each first element and the upper surface of the tin cream
Distance with setting.
In an embodiment of the invention, the chip mounter 202 in structural representation shown in above-mentioned Fig. 2, for by each institute
The second element is stated to be immersed in the tin cream, wherein, between the upper surface of each second element and the upper surface of the tin cream
Distance with setting.
In an embodiment of the invention, as shown in figure 3, when in the presence of the first element and at least two described at least two
During second element,
The chip mounter 202 can include：First high speed placement system 301 and the first general use chip mounter 302；
First high speed placement system 301, for size in described at least two first elements to be less than into first threshold
First element, is mounted in the tin cream of first face printing, by attachment after the substrate export to the described first general patch
Piece machine 302；
The first general use chip mounter 302, described in after the attachment for receiving the output of the first high speed placement system 301
Substrate, the first element by size in described at least two first elements more than or equal to first threshold, is mounted on described first
In the tin cream of face printing, by attachment after the board transport to the panel turnover machine 203.
In an embodiment of the invention, as shown in figure 4, when in the presence of the first element and at least two described at least two
During second element,
The chip mounter 202 can include：Second high speed placement system 401 and the second general use chip mounter 402；
Second high speed placement system 401, for size in described at least two second elements to be less than into Second Threshold
Second component mounter in the tin cream that second face is printed, by attachment after the substrate export to described second and general use paster
Machine 402；
The second general use chip mounter 402, described in after the attachment for receiving the output of the second high speed placement system 401
Substrate, the second element by size in described at least two second elements more than or equal to Second Threshold, is mounted on described second
In the tin cream of face printing, by attachment after the board transport to the reflow oven 204.
In an embodiment of the invention, as shown in figure 5, PCBA board manufacture system may further include：First tin cream
Detection machine 501；
The first tin cream detection machine 501, for after the first face printing tin cream for receiving the transmission of the stencil printer 201
The substrate, detect whether the thickness and area of first face printing tin cream reach numerical value set in advance, if it is,
The chip mounter 202 is triggered by least one first component mounters in the tin cream that first face is printed, otherwise, rejects described
Substrate.
In an embodiment of the invention, as shown in fig. 6, PCBA board manufacture system may further include：Second tin cream
Detection machine 601；
The second tin cream detection machine 601, for after the second face printing tin cream for receiving the transmission of the stencil printer 201
The substrate, detect whether the thickness and area of second face printing tin cream reach numerical value set in advance, if it is,
The chip mounter 202 is triggered by least one second component mounters in the tin cream that second face is printed, otherwise, rejects described
Substrate.
In an embodiment of the invention, as shown in fig. 7, PCBA board manufacture system may further include：PCBA board is examined
Survey machine 701；
The PCBA board detection machine 701, for detecting in the PCBA board that the reflow oven 204 is obtained with the presence or absence of sky
Weldering, and/or, short circuit line, if it is, determining that the PCBA board is unqualified；Otherwise, it determines the PCBA board is qualified.
The contents such as the information exchange between each unit, implementation procedure in said apparatus, due to implementing with the inventive method
Example is based on same design, and particular content can be found in the narration in the inventive method embodiment, and here is omitted.
Below with PCBA board manufacture system include stencil printer, tin cream detection machine, high speed placement system, general use chip mounter,
Panel turnover machine, reflow oven, PCBA board detection machine, wherein, the attachment in the face of substrate first and the second face uses same high speed placement system
Chip mounter is used with general；The tin cream detection in the face of substrate first and the second face is using as a example by same tin cream detection machine.Launch explanation
PCBA board manufacture method, as shown in figure 8, the PCBA board manufacture method, may include steps of：
Step 801：The substrate of outside transmission is received using stencil printer, tin cream is printed in the first face of substrate.
In this step, can be by transmitting device, such as transmission belt is by board transport to stencil printer.Can also lead to
Operating personnel are crossed manually by board transport to stencil printer.When stencil printer receives substrate, then the first of substrate
Tin cream is printed on face.Can now be printed according to tin cream thickness set in advance and tin cream area coverage.When the first face print
After the completion of system, substrate is exported and gives tin cream detection machine.
Step 802：Whether reached in advance using the thickness and area of tin cream detection machine testing first face printing tin cream
The numerical value of setting, if it is, performing step 803, otherwise, rejects substrate.
In this step, when detect the face of substrate first printing tin cream thickness and area reached it is set in advance
During data, then illustrate thickness and area that tin cream is printed in the face of substrate first meet follow-up component mounter, turnover panel and
The requirement of welding, then perform step 803.When detect the face of substrate first printing tin cream thickness and area in any one not
When having reached data set in advance, then illustrate to print in the face of substrate first tin cream can not meet follow-up component mounter,
Turnover panel and the requirement of welding, then reject substrate.
Step 803：The first element using high speed placement system by size at least two first elements less than first threshold,
It is mounted in the tin cream of the first face printing.
In this step, size in each first element is less than such as 5 millimeters of first threshold using high speed placement system
Element, is mounted in the tin cream of qualified the first face printing of tin cream detection machine testing.
Step 804：Using it is general with chip mounter by size at least two first elements more than or equal to the of first threshold
One element, is mounted in the tin cream of the first face printing.
In this step, size in each first element is more than or equal to first threshold such as 5 with chip mounter using general
First element of millimeter, is mounted in the tin cream of the first face printing.
Step 805：Substrate after the first face is mounted using panel turnover machine is overturn to the second face.
Step 806：Using stencil printer tin cream is printed in the second face of substrate.
In this step, can be printed according to tin cream thickness set in advance and tin cream area coverage.When the second face
After the completion of printing, substrate is exported and gives tin cream detection machine.
Step 807：Whether reached in advance using the thickness and area of tin cream detection machine testing second face printing tin cream
The numerical value of setting, if it is, performing step 808, otherwise, rejects substrate.
In this step, when detect the face of substrate second printing tin cream thickness and area reached it is set in advance
During data, then illustrate thickness and area that tin cream is printed in the face of substrate second meet follow-up component mounter, turnover panel and
The requirement of welding, then perform step 808.When detect the face of substrate second printing tin cream thickness and area in any one not
When having reached data set in advance, then illustrate to print in the face of substrate second tin cream can not meet follow-up component mounter,
Turnover panel and the requirement of welding, then reject substrate.
Step 808：The second element using high speed placement system by size at least two second elements less than Second Threshold
It is mounted in the tin cream of the second face printing.
In this step, size in each second element is less than such as 5 millimeters of Second Threshold using high speed placement system
Element, is mounted in the tin cream of qualified the second face printing of tin cream detection machine testing.
Step 809：Using it is general with chip mounter by size at least two second elements more than or equal to the of Second Threshold
Two element, is mounted in the tin cream of the second face printing.
In this step, size in each second element is more than or equal to Second Threshold such as 5 with chip mounter using general
Second element of millimeter, is mounted in the tin cream of the second face printing.
Step 810：Using reflow oven to substrate in the first face and the second face weld, obtain PCBA board.
In this step, using reflow oven to substrate in the first face and the second face weld, by each element point
It is not welded in the first face and the second face, so as to obtain PCBA board.
Step 811：Whether there is missing solder in detecting the PCBA board that machine testing is obtained using PCBA board, and/or, short-circuit line
Road, if it is, determining that PCBA board is unqualified；Otherwise, it determines PCBA board is qualified.
In this step, by detection machine can determine in PCBA board with the presence or absence of in missing solder and short circuit line any one
Situation.If there is then illustrating that the PCBA board is unqualified, if be installed in electronic equipment, the normal work of electronic equipment will be influenceed
Make, therefore should give up.When in the absence of when, then illustrate that the PCBA board is qualified, then can be installed in electronic equipment.
In sum, each embodiment of the invention can at least realize following beneficial effect：
1st, in embodiments of the present invention, tin cream is printed by the first face of the substrate for receiving, by each unit to be mounted
Part is mounted in the tin cream of the first face printing.Treat after the completion of the attachment of the first face, substrate is overturn to the second face.Then in substrate
Tin cream is printed in second face, and by each component mounter to be mounted in the tin cream that the second face is printed.Treat that the attachment of the second face is completed
Afterwards, to substrate in the first face and the second face weld, to obtain PCBA board.By above-mentioned, this programme is in substrate
After the completion of the attachment of first face, the first face is not welded, but substrate is turned to the second face, continuation is carried out to the second face
Attachment.After the completion of the second face is mounted, just the first face and the second face to substrate are welded, because in whole PCBA board
Manufacturing process in only need to once weld link, therefore, the present invention provide embodiment can reduce PCBA board manufacturing process
The cost of consumption.
2nd, in embodiments of the present invention, by each component mounter in the tin cream that the face of substrate first or the second face are printed
When, each element is immersed in the tin cream, wherein, there is setting between the upper surface of each element and the upper surface of tin cream
Distance.Substrate carry out follow-up turnover panel, welding etc. operate when, to reduce the possibility that element comes off from tin cream.
3rd, in embodiments of the present invention, during by least two component mounters in the tin cream that the face of substrate first is printed, first will
Size is mounted in the tin cream of the first face printing less than the first element of first threshold in each first element.Then again will be each
Size is mounted in the tin cream of the first face printing more than or equal to the first element of first threshold in individual first element.Due to right
Various sizes of element is mounted respectively, therefore can improve the accuracy and efficiency of attachment.
4th, in embodiments of the present invention, during by least two component mounters in the tin cream that the face of substrate second is printed, first will
Size is mounted in the tin cream of the second face printing less than the second element of Second Threshold in each first element.Then again will be each
Size is mounted in the tin cream of the second face printing more than or equal to the second element of Second Threshold in individual second element.Due to right
Various sizes of element is mounted respectively, therefore can improve the accuracy and efficiency of attachment.
5th, in embodiments of the present invention, when detect the first face printing tin cream thickness and area reach it is set in advance
During numerical value, by each component mounter to be mounted in the tin cream that the first face is printed.When detect the first face printing tin cream thickness with
And in area when any one is not up to numerical value set in advance, reject substrate.Unqualified PCBA is produced such that it is able to reduce
The probability of plate.
6th, in embodiments of the present invention, when detect the second face printing tin cream thickness and area reach it is set in advance
During numerical value, by each component mounter to be mounted in the tin cream that the second face is printed.When detect the second face printing tin cream thickness with
And in area when any one is not up to numerical value set in advance, reject substrate.Unqualified PCBA is generated such that it is able to reduce
The probability of plate.
7th, in embodiments of the present invention, after the completion of reflow oven is to the first face of substrate and the welding of the second face, when detecting
To PCBA board in there is at least one of missing solder and short circuit line situation when, it is determined that PCBA board is unqualified.When detection is obtained
PCBA board in the absence of at least one of missing solder and short circuit line situation when, it is determined that PCBA board is qualified.Therefore can basis
The testing result of PCBA board is detected, unqualified PCBA board is rejected in time.
8th, in embodiments of the present invention, the PCBA board manufacture system includes：Stencil printer, chip mounter, panel turnover machine and
Reflow oven.Tin cream is printed in the first face of substrate by stencil printer, the substrate of the first face printing tin cream is exported to paster
Machine.Recycle chip mounter by each component mounter in the tin cream that the first face is printed, the substrate after then the first face is mounted is defeated
Go out to panel turnover machine.Substrate after the first face is mounted using panel turnover machine is overturn to the second face, and the substrate that will be overturn to the second face is defeated
Go out to stencil printer.Then tin cream is printed in the second face of substrate using stencil printer, and by after the second face printing tin cream
Board transport to chip mounter.Near each component mounter of chip mounter is recycled in the tin cream that the second face is printed, by the second face
Substrate after attachment is exported to reflow oven.Then using reflow oven to substrate in the first face and the second face weld, obtain
To PCBA board.By above-mentioned, this programme only needs to a welding ring for reflow oven in the manufacturing process of whole PCBA board
Section, therefore, the embodiment that the present invention is provided can reduce the cost of PCBA board manufacturing process consumption.
It should be noted that herein, such as first and second etc relational terms are used merely to an entity
Or operation makes a distinction with another entity or operation, and not necessarily require or imply these entities or exist between operating
Any this actual relation or order.And, term " including ", "comprising" or its any other variant be intended to it is non-
It is exclusive to include, so that process, method, article or equipment including a series of key elements not only include those key elements,
But also other key elements including being not expressly set out, or also include by this process, method, article or equipment are solid
Some key elements.In the absence of more restrictions, the key element limited by sentence " including ", does not arrange
Except also there is other identical factor in the process including the key element, method, article or equipment.
One of ordinary skill in the art will appreciate that：Realizing all or part of step of above method embodiment can pass through
Programmed instruction related hardware is completed, and foregoing program can be stored in the storage medium of embodied on computer readable, the program
Upon execution, the step of including above method embodiment is performed；And foregoing storage medium includes：ROM, RAM, magnetic disc or light
Disk etc. is various can be with the medium of store program codes.
It is last it should be noted that：Presently preferred embodiments of the present invention is the foregoing is only, skill of the invention is merely to illustrate
Art scheme, is not intended to limit the scope of the present invention.All any modifications made within the spirit and principles in the present invention,
Equivalent, improvement etc., are all contained in protection scope of the present invention.
Claims (10)
1. a kind of PCBA board manufacture method, it is characterised in that including：
The substrate of outside transmission is received, tin cream is printed in the first face of the substrate；
By at least one first component mounters in the tin cream that first face is printed；
The substrate after first face is mounted is overturn to the second face；
Tin cream is printed in the second face of the substrate；
By at least one second component mounters in the tin cream that second face is printed；
The first face and the second face in the substrate is welded, printing board PCB A plates are obtained.
2. method according to claim 1, it is characterised in that
It is described by least one first component mounters in the tin cream that first face is printed, including：
Each described first element is immersed in the tin cream, wherein, upper surface and the tin of each first element
There is the distance of setting between the upper surface of cream；
And/or,
It is described by least one the second component mounter in the tin cream that second face is printed, including：
Each described second element is immersed in the tin cream, wherein, upper surface and the tin of each second element
There is the distance of setting between the upper surface of cream.
3. method according to claim 1, it is characterised in that
When there is the second element described in the first element and at least two described at least two,
It is described by least one first component mounters in the tin cream that first face is printed, including：
The first element by size in described at least two first elements less than first threshold, is mounted on the first face printing
In tin cream；
The first element by size in described at least two first elements more than or equal to first threshold, is mounted on first face
In the tin cream of printing；
And/or,
When there is the second element described in the first element and at least two described at least two,
It is described by least one the second component mounter in the tin cream that second face is printed, including：
Size in described at least two second elements is printed less than the second component mounter of Second Threshold in second face
In tin cream；
The second element by size in described at least two second elements more than or equal to Second Threshold, is mounted on second face
In the tin cream of printing.
4. according to any described method of claims 1 to 3, it is characterised in that
Further include：
Detect whether the thickness and area of the first face printing tin cream reach numerical value set in advance, if it is, near
Few first component mounter otherwise, rejects the substrate in the tin cream that first face is printed；
And/or,
Further include：
Detect whether the thickness and area of the second face printing tin cream reach numerical value set in advance, if it is, near
Few second component mounter otherwise, rejects the substrate in the tin cream that second face is printed.
5. the method according to claims 1 to 3, it is characterised in that
Further include：
With the presence or absence of missing solder in the PCBA board that detection is obtained, and/or, short circuit line,
If it is, determining that the PCBA board is unqualified；
Otherwise, it determines the PCBA board is qualified.
6. a kind of PCBA board manufacture system, it is characterised in that including：
Stencil printer, the substrate for receiving outside transmission, tin cream is printed in the first face of the substrate, by the printing of the first face
The substrate output of tin cream；The upset of panel turnover machine output to the substrate in the second face is received, the of the substrate
Tin cream is printed in two faces, and the second face is printed the substrate output after tin cream；
The substrate of tin cream is printed in chip mounter, the first face for receiving stencil printer output, by least one the
One element is mounted in the tin cream of the first face printing, and the substrate after the first face is mounted is exported to the panel turnover machine；
The substrate after the second face printing tin cream of the stencil printer output is received, by least one second component mounters in institute
State in the tin cream of the second face printing, the substrate after the second face is mounted is exported to the reflow oven；
Panel turnover machine, for the substrate after the first face attachment for receiving the chip mounter output, after first face is mounted
The substrate overturn to the second face, the substrate to the second face will be overturn and exported to the stencil printer；
Reflow oven, for the substrate after the second face attachment for receiving the chip mounter output, to first in the substrate
Face and the second face are welded, and obtain PCBA board.
7. system according to claim 6, it is characterised in that
The chip mounter, for each described first element to be immersed in the tin cream, wherein, each first element
There is the distance of setting between the upper surface of upper surface and the tin cream；
And/or,
The chip mounter, for each described second element to be immersed in the tin cream, wherein, each second element
There is the distance of setting between the upper surface of upper surface and the tin cream.
8. system according to claim 6, it is characterised in that
When there is the second element described in the first element and at least two described at least two,
The chip mounter, including：First high speed placement system and first general uses chip mounter；
First high speed placement system, for first yuan by size in described at least two first elements less than first threshold
Part, is mounted in the tin cream of first face printing, by attachment after the substrate export to described first and general use chip mounter；
The first general use chip mounter, for the substrate after the attachment for receiving the first high speed placement system output, by institute
Size is mounted on the tin of the first face printing more than or equal to the first element of first threshold in stating at least two first elements
In cream, by attachment after the board transport to the panel turnover machine；
And/or,
When there is the second element described in the first element and at least two described at least two,
The chip mounter, including：Second high speed placement system and second general uses chip mounter；
Second high speed placement system, for the second element by size in described at least two second elements less than Second Threshold
Be mounted in the tin cream of second face printing, by attachment after the substrate export to described second and general use chip mounter；
The second general use chip mounter, for the substrate after the attachment for receiving the second high speed placement system output, by institute
Size is mounted on the tin of the second face printing more than or equal to the second element of Second Threshold in stating at least two second elements
In cream, by attachment after the board transport to the reflow oven.
9. according to any described system of claim 6 to 8, it is characterised in that
Further include：First tin cream detection machine；
The first tin cream detection machine, for the base after the first face printing tin cream for receiving the stencil printer transmission
Plate, detects whether the thickness and area of the first face printing tin cream reach numerical value set in advance, if it is, triggering institute
Chip mounter is stated by least one first component mounters in the tin cream that first face is printed, otherwise, the substrate is rejected；
And/or,
Further include：Second tin cream detection machine；
The second tin cream detection machine, for the base after the second face printing tin cream for receiving the stencil printer transmission
Plate, detects whether the thickness and area of the second face printing tin cream reach numerical value set in advance, if it is, triggering institute
Chip mounter is stated by least one second component mounters in the tin cream that second face is printed, otherwise, the substrate is rejected.
10. according to any described system of claim 6 to 8, it is characterised in that
Further include：PCBA board detection machine；
The PCBA board detection machine, for detecting with the presence or absence of missing solder in the PCBA board that the reflow oven is obtained, and/or,
Short circuit line, if it is, determining that the PCBA board is unqualified；Otherwise, it determines the PCBA board is qualified.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710287836.8A CN106879192A (en) | 2017-04-27 | 2017-04-27 | A kind of PCBA board manufacture method and system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710287836.8A CN106879192A (en) | 2017-04-27 | 2017-04-27 | A kind of PCBA board manufacture method and system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112492753A (en) * | 2019-09-11 | 2021-03-12 | 川宝科技股份有限公司 | Automated substrate processing method and apparatus |
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| CN101528006A (en) * | 2008-03-07 | 2009-09-09 | 佛山市顺德区顺达电脑厂有限公司 | Bifacial circuit board surface assembly process |
| CN102131352A (en) * | 2010-01-13 | 2011-07-20 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing printed circuit board (PCB) |
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