JPS6033064A - Method and device for inspecting pattern of printed wiring board - Google Patents

Abstract

PURPOSE:To allow an inspecting device to diagnose optionally its functions by itself by interposing a solid pattern substrate, and short-circuiting when an optional couple of probe pins of the inspecting device are brought into contact with each other. CONSTITUTION:Tips of probe pins of the inspecting device A contact the solid pattern substrate 8 which has a conductive surface 10 as its top surface, and a previously specified couple of pins which do not short-circuit also short-circuit by contacting the conductive surface in addition to couples of pins, e.g. B1 and B2, and C1 and C2 which conduct to each other, so short-circuit display is obtained for all. Thus, when the inspecting device A makes a self-diagnosis, the solid pattern is interposed to short-circuit each couple of pins, so data on that is stored in an IC memory then the inspection of the pattern of the printed wiring board and the self-diagnosis of the inspecting device are executed optionally and simultaneously.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board pattern inspection method and an apparatus therefor, and more specifically, the present invention relates to a printed wiring board pattern inspection method and an apparatus for inspecting the pattern, and more specifically, to inspect the pattern of a printed wiring board and to check whether the inspection apparatus used for this inspection is functioning normally. The present invention relates to a printed wiring board pattern inspection method and apparatus that can easily and quickly self-diagnose whether the

In general, pattern inspection of printed wiring boards involves placing a probe bin in contact with lands that are part of the pattern of the printed wiring board to be inspected, and inspecting the presence or absence of continuity between each land. By comparing the standard data of patterns of good printed wiring boards stored in the device (IC memory) with the data of each test object, printed wiring boards with defective circuit parts such as disconnections or short circuits in the patterns can be detected. This is a way to discover.

However, with the above inspection method, if there is a defective part in the probe bin of the inspection equipment used for this, or if there is a disconnection in the relay cable connecting the probe bin and the inspection machine main body, the printed wiring board may be damaged. It is not possible to perform a regular cone inspection of the pattern.

Therefore, when inspecting the pattern of a printed wiring board, it is necessary to constantly diagnose whether the function of the inspection device used for the inspection is normal or not.

In view of this, conventionally, part of the base ring data of the printed wiring board pattern, which was stored in the IC memory, is stored on a cassette tape, etc., in order to self-diagnose the function of the inspection equipment. A method has been adopted in which the data of the test device is written into the IC memory, and it is periodically checked whether the testing device is functioning normally in such a state.

However, these operations have to be carried out every time the type of pattern on a printed wiring board is changed, and also because of the need to maintain and manage the frequently used functions of the inspection equipment in order to improve the reliability of inspection. The current situation is that a considerable amount of time is spent on self-diagnosis.

This was considered to be unavoidable in view of the fact that it is essential and important to confirm that the inspection equipment functions normally when inspecting reliable printed wiring board patterns.

The present invention eliminates the drawbacks of the conventional printed wiring board inspection method and provides a conductive surface on the surface of the printed wiring board instead of the printed wiring board to be inspected in order to perform self-diagnosis of the inspection device easily and quickly. A printed wiring board (hereinafter also referred to as a solid pattern board) with An object of the present invention is to provide a highly reliable printed wiring board pattern inspection method and its device, characterized in that a self-diagnosis of the function of the inspection device is performed at any time by short-circuiting a pair of bottles when they come into contact with each other. shall be.

Hereinafter, embodiments of the printed wiring board pattern inspection method and apparatus of the present invention will be specifically described based on 14 pages.

FIG. 1 is a schematic explanatory diagram of a method for inspecting a pattern of a printed wiring board, and FIG. 2 is a schematic explanatory diagram of a self-diagnosis of the inspection apparatus using a peta-pattern board.

In Fig. 1, 1 is the substrate of the printed wiring board which is the object to be inspected, 2 is the pattern (conductor circuit) on the printed wiring board which is the object to be inspected, and 3 is the land (on the printed wiring board which is the object to be inspected). 4 is the probe bin in the inspection device, 5 is the probe bin holder, 6 is the relay cable, 7 is the inspection machine body, and the central control unit (IC memory) which is the main part of the 8-piece inspection machine body. ).

In FIG. 2, 1 to 8 are the same as in FIG. 1 above, 9 is a printed wiring board (solid pattern board) having a conductive surface on the entire surface, and 1o is a conductive surface (for example, a copper foil surface).

First, a method for inspecting the pattern of the printed wiring board shown in FIG. 1 will be explained. The printed wiring board that is the object to be inspected (
1) is usually a substrate made of glass/epoxy material or paper/phenol or epoxy material, and a pattern (2) which is a conductive circuit is formed on this substrate, and a part of this pattern has through holes. (2), and a land (3) as a conductive portion is formed around this pole. Therefore, the probe bin (4) in the inspection device (5) is lifted up by the holder (5) via a Tsubaki Genretsu Yubo Yubogo 1 Nof descending machine, etc., and the tip of the probe bin is lifted. By making contact with the lands (3) of the object to be inspected, it is possible to inspect the conduction state between the lands in the pattern of the printed wiring board. At this time, it is important to specify in advance each pair of pins that are not obviously short-circuited so that an indication that the printed wiring board is being inspected can be obtained.

Next, a self-diagnosis method of the inspection apparatus using the solid pattern board shown in FIG. 2 will be explained. The solid pattern board (9) having a conductive surface on its surface is usually a glass/epoxy material board, or a paper/phenol or epoxy material board, which is the base material of a printed wiring board, and at least one surface is coated with copper foil or the like. The conductive surface (10) is adhesively formed. Preferably, a conductive surface is adhered to the entire surface, which is advantageous for contacting each pair of probe bottles and short-circuiting them. However, portions that do not come into contact with the probe bin, such as the peripheral portion of the substrate, may be bonded nonconductive surfaces.

The probe pin (4) in the inspection device (2) is attached to its holder (5).
The tip of the probe bottle that has been moved by the press while being supported by contacts the solid pattern substrate (9) having a conductive surface (10) on the surface, and connects each pair of pins, for example, Bl and B2. Or, in addition to each pair of conductive pins such as C1 and C2, each pair of pins specified in advance that are not clearly shorted are also brought into contact with the conductive surface and shorted, so all short circuits are displayed. is done. Therefore, it is possible to distinguish between a printed wiring board inspection and a self-diagnosis of the inspection device by displaying short or open pins specified in advance.

In this way, self-diagnosis on the inspection device surface shorts each pair of pins by interposing a solid pattern, so if this data is stored in the IC memory, even if the standard data of the printed wiring board is stored separately. However, during -g, the inspection of the pattern of the printed wiring board and the self-diagnosis of the inspection device can be carried out at any time. At this time, by specifying in advance a pair of pins in a non-conducting part of the printed wiring board pattern that will not obviously be shorted, it is possible to
When this specified pin comes into contact with the solid pattern board placed at a predetermined position on the tangible device to be tested, a short circuit will be displayed, while the printed wiring board, which is the object to be tested, is placed in a predetermined position. In this case, when the pin comes into contact with a non-conducting part that is clearly not short-circuited, the pair of pins designated in advance will be displayed as open. In this way, the short-circuit display and the open display distinguish the inspection of the printed wiring board from the self-diagnosis of the inspection apparatus.

Therefore, by comparing the base Qlt and data of the pattern of the printed wiring board with the data of the solid printed circuit board, the pattern inspection of the printed wiring board and the self-diagnosis 11'Jr of the inspection equipment can be carried out instantaneously at any time. 4) (Since it can be performed all at once, the self-diagnosis of the inspection equipment, which conventionally required manual labor and a long time, can be done in an extremely short time, and reliable pattern inspection of printed wiring boards can be performed. .

As described above, according to the present invention, while inspecting the pattern of a printed wiring board, it is possible to simultaneously conduct a self-diagnosis at any time to confirm whether the function of the inspection bag is normal or not, in a simple and quick manner. Therefore, the work time required for inspection can be significantly shortened, work efficiency can be improved, and the reliability of inspection can be significantly increased.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing an outline of a method for inspecting a pattern of a printed wiring board, and FIG. 2 is an explanatory diagram showing an outline of a self-diagnosis method of the inspection apparatus. l......Printed wiring board substrate, 2...
...Conductor pattern, 3...Land, 4...Probe pin, 5...
...probe pin holder, 6. bending relay cable,
7...Inspection machine main body, 8...Music/central control unit, 9...---solid pattern board, lO
・・・・・・・・・Conductive surface (e.g. copper foil surface)

Claims (1)

[Claims] 1. Instead of testing a printed wiring board as an object to be inspected, a printed wiring board having a conductive surface on the surface is interposed, and each prespecified pair of probe pins of the testing device is inspected. 2. A pattern inspection method for a printed wiring board, characterized in that a self-diagnosis of the function of the inspection device is also performed by bringing pins into contact and causing a short circuit. 2.Instead of inspecting the printed wiring board, which is the object to be inspected, a printed wiring board with a conductive surface on the surface is used to check for short circuits in each pre-designated pair of pins of the probe bin of the inspection equipment. A printed wiring board pattern inspection device comprising a routine work for self-diagnosis.