JPH1126904A - Electronic circuit board and method for discriminating the kind of the same board and method for checking the board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit board in which the number of test pins brought into contact with a land can be the minimum, and discrimination incapability due to the contact failure of the test pin can be prevented, and a method for checking it. SOLUTION: Plural first land parts 2a-2c are respectively provided with first soldering land parts 2a2-2c2 for soldering a connecting means. Also, plural second land parts 2d-2f are respectively provided with second soldering land parts 2d1-2f1 for soldering the connecting means on each edge, and the other edges are connected with a ground terminal 2j2 for grounding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board, for example, which can automatically determine the type of an electronic circuit board when inspecting the circuit board.

[0002]

2. Description of the Related Art Electronic circuit boards mounted on today's electric equipment, electronic equipment and the like are composed of a printed circuit board on which a large number of electronic components (ICs, diodes, capacitors, resistors, etc.) are subjected to electrical wiring processing. It is provided so as to be connected by soldering or the like to perform a desired electric operation. Also,
Since electronic circuit boards are required to have various functions according to their uses, a plurality of electronic circuit boards are required for each required function. In the manufacturing process of such an electronic circuit board, it is usually inspected by a board inspection apparatus whether the electronic circuit board operates normally alone.

FIG. 5 is an explanatory view showing a conventional method for inspecting an electronic circuit board, and FIG. 6 is an explanatory view showing the electronic circuit board viewed from a direction V shown in FIG. As a conventional method for inspecting an electronic circuit board, there is a method disclosed in JP-A-8-32191. In the figure, 101 is an electronic circuit board, 102
Reference numeral denotes a printed wiring provided on the electronic circuit board 101, and a plurality of lands to which electronic components (not shown) mounted on the electronic circuit board 101 are soldered, and each of the lands is electrically connected to each other. The components are wired to perform desired operations. The printed wiring 102 is provided on both front and back surfaces of the electronic circuit board 101.

[0004] Further, reference numeral 201 denotes an inspection apparatus main body;
Reference numeral 201c denotes a test pin provided on the inspection apparatus main body, supported so as to be able to move up and down on the inspection apparatus main body 201, and provided so as to be electrically connected to the inspection apparatus main body 201 when moving downward. Note that, in FIG.
The state which protruded a-201c is shown. 201d
Is an external interface provided in the inspection apparatus main body 201, and is connected to the external interface 103 of the electronic circuit board 101 at the time of board inspection. Reference numeral 201e denotes a power interface unit, which includes a power supply terminal and a ground terminal for grounding.

A control unit 301 is provided so as to be electrically connected to the inspection apparatus main body 201 and determines the type of the electronic circuit board 101 and controls the board inspection process. The control unit 301 is configured by an electronic circuit (not shown) including a microcomputer and the like, and is provided with an internal memory (not shown) for storing a plurality of types of inspection programs. Reference numeral 401 denotes a monitor, which displays a board type determination result and an inspection result from the control unit 301. Reference numeral 501 denotes a board inspection apparatus, which includes components denoted by reference numerals 201 to 401.

In FIG. 6, reference numeral 103 denotes a printed wiring section 1
02 is an external interface unit provided for inputting and outputting signals to and from another electronic circuit board (not shown), an electric device or an electronic device (not shown) on which the electronic circuit board 101 is mounted. Reference numeral 104 denotes a power supply interface unit provided in the printed wiring unit 102, and includes a power supply terminal and a ground terminal for grounding. 105a-
Reference numeral 105c denotes a land for soldering.
01. A jumper wire 106 is connected to the lands 105a and 105b by soldering, and electrically connects the lands 105a and 105b.

Next, the operation will be described with reference to the drawings. The electronic circuit board 101 is moved from above the inspection apparatus main body 201 in the V1 direction shown in the figure, set on the inspection apparatus main body 201, and the external interface 103 and the external interface 201d are connected to each other. Connecting. At this time, test pins 201
a to 201c come into contact with the lands 105a to 105c, respectively, move downward with the downward movement of the electronic circuit board 101, and are electrically connected to the inspection apparatus main body 201. Next, when the operation unit (not shown) instructs the control unit 301 to execute the board inspection, the control unit 301 applies a predetermined voltage to the test pins 201a to 201c.
Instruct 01. The inspection device main body has test pins 201a-
A voltage is applied to 201c. Here, the test pin 201
Since the land 105a contacted by a and the land 105b contacted by the test pin 201b are electrically connected by the jumper wire 106, they have the same potential.
No voltage difference occurs between the test pin 01a and the test pin 201b.

The inspection apparatus main body 201 includes a test pin 201a.
A signal indicating that the test pin 201b and the test pin 201b have the same potential is output to the control unit 301. The control unit 301 controls the electronic circuit board 101 under inspection based on a signal from the inspection apparatus main body 201.
Is determined, the determination result is displayed on the monitor 401, an inspection program corresponding to the determination result is read from an internal memory (not shown), and the electronic circuit board 101 is read via the inspection apparatus main body 101 by the inspection program. Is performed, and the test result is displayed on the monitor 401.

[0009]

SUMMARY OF THE INVENTION Conventional electronic circuit board 1
01 and the inspection method thereof are configured as described above. Therefore, in order to determine the type of the electronic circuit board 101, a jumper wire 1 is connected to the lands 105a and lands 105b.
06, the test pin 201a and the land 105a are in contact with each other, and the test pin 201b is
05b must touch. That is, the conventional device detects the potential between the test pins 201a to 201c in order to determine the type of the electronic circuit board 101.
One test pin must contact the connected one and the other lands of the jumper wire 104. Since a very large number of types of electronic circuit boards 101 are inspected, for example, the test pins 201a to 201c may have test pins 201a to 20c due to mechanical deterioration of a vertical movement mechanism (not shown).
In one of the test pins 1c, one or both of the test pins that need to be in contact with the lands may have a poor contact with the lands, and the type of the electronic circuit board 101 may not be determined. Some of the plurality of electronic circuit boards 101 have a large mounting dimensional error of the jumper wire 106 connecting any two of the lands 105a to 105c.
In some cases, the jumper wire 106 prevents the contact of the test pin with the land, causing a contact failure of the test pin similarly, so that the type of the electronic circuit board 101 cannot be determined.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can minimize the number of test pins that come into contact with lands to determine the type of electronic circuit board. An object of the present invention is to provide an electronic circuit board capable of preventing indetermination due to poor contact of the electronic circuit board and a method of inspecting the electronic circuit board.

[0011]

An electronic circuit board according to the present invention comprises a plurality of first and second lands and a connecting means for electrically connecting the plurality of first and second lands. An electronic circuit board, wherein the board type can be automatically determined by an inspection unit based on a connection state of the plurality of first and second lands by the connection unit, wherein the plurality of first lands are each connected to the connection portion. A first soldering land for soldering the means, wherein the plurality of second lands are respectively connected to one end of the second land for soldering the connection means;
And the other end is connected to a ground terminal for grounding to ground.

Further, in the electronic circuit board according to the present invention, the plurality of first lands are each soldered to one end by a contact land to which a test pin of an inspection means abuts to determine the type of the board and a connection to the other end. And a first soldering land portion to be attached.

Further, in the electronic circuit board according to the present invention, the plurality of second lands are connected to ground terminals via common ground wiring for grounding the other ends to ground.

Further, in the electronic circuit board according to the present invention, the plurality of first and second lands are provided at the edge of the board.

Further, in the electronic circuit board according to the present invention, the contact lands of the plurality of first lands are respectively provided closer to the edge of the board than the first lands for soldering.

Further, in the substrate type determining method according to the present invention, the plurality of first lands, the plurality of second lands whose one ends are grounded to the ground, and the plurality of first and second lands are formed. A board type determining method for automatically determining a board type of an electronic circuit board having a connection means for electrically connecting the plurality of first and second land portions by the connection means; Contacting the plurality of test pins of the inspection means with the plurality of first lands and grounding one ends of the plurality of second lands, applying a predetermined voltage to the plurality of test pins; Detecting a voltage drop of the predetermined voltage applied to the plurality of test pins; and determining a substrate type based on a result of the detection of the voltage drop.

Further, in the substrate inspection method of the present invention, the plurality of first lands and the plurality of second lands each having one end grounded may be provided.
And a plurality of first and second lands by the connecting means, the board type of an electronic circuit board comprising: a land portion; and connection means for electrically connecting the plurality of first and second land portions. In the board inspection method of automatically determining based on the connection state of the parts and inspecting the electronic circuit board based on the determination result, a plurality of test pins of inspection means are respectively brought into contact with the plurality of first lands. And grounding one ends of the plurality of second lands and connecting a signal transmission / reception interface between the electronic circuit board and the inspection means, applying a predetermined voltage to the plurality of test pins, Detecting a voltage drop of the predetermined voltage applied to the plurality of test pins; determining a substrate type based on the detection result of the voltage drop; Setting a test program have, in which a step of performing a substrate inspection based on the inspection program.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. An embodiment of an electronic circuit board, a board type determining method, and a board inspection method of the present invention will be described. FIG. 1 is an explanatory view showing an electronic circuit board according to the first embodiment, and FIG. 2 is an explanatory view showing a board inspection apparatus. In FIG. 1, reference numeral 1 denotes an electronic circuit board, 2 denotes a printed wiring board provided on the electronic circuit board 1, and a plurality of lands to which electronic components mounted on the electronic circuit board 1 are soldered, and a space between these lands. Each electronic component is wired and provided so as to perform a desired operation by being electrically connected. The printed wiring section 2 is provided on both front and back surfaces of the electronic circuit board 1, and the drawing shows the front surface. 2a to 2c are first land portions provided on the surface of the electronic circuit board 1,
One end has contact lands 2a1-2c1 with which test pins 3a-3c (which will be described later) come into contact at the time of board inspection, and the other end has solder lands 2a2-2c2.
The contact lands 2a1-2c1 each have a diameter of 2 mm.
It is formed in the above-mentioned circular shape.
An area of at least square millimeters is provided. 2d ~
Reference numeral 2f denotes a second land portion provided on the printed wiring portion 2 on the front surface side of the electronic circuit board 1, and a soldering portion 2d at one end.
1 to 2f1 are arranged close to and opposed to the soldering portions 2a2 to 2c2, respectively.

The first and second land portions 2a to 2c,
2 d to 2 f are provided at the edge of the electronic circuit board 1.
Therefore, at the time of discriminating the board type, the test pins 3a to 3c can contact the first lands 2a to 2c without being hindered by the electronic components in order to fulfill the function of the electronic circuit board 1. Also, the contact land portions 2a1-2c1
The test pins 3a to 3c can be more easily brought into contact with the contact lands 2a2 to 2c2 because the test pins 3a to 3c are arranged closer to the edge than the soldering lands 2a2 to 2c2.

Reference numeral 2g denotes a chip component, which uses an electronic component having low electric resistance. In the electronic circuit board 1 according to the first embodiment, the chip component 2g is soldered to the soldering land 2a2 and the soldering land 2d1. The chip component 2g is mounted by a chip mounter (not shown) in the same manner as electronic components such as an IC, a capacitor, and a resistor mounted on the electronic circuit board 1.

Reference numeral 2h denotes a common ground wiring provided in the printed wiring section 3, which is short-circuited (grounded) among electronic components (not shown) such as an IC, a capacitor, and a resistor mounted on the electronic circuit board 1. Electronic components are electrically connected. The common ground wiring 2h is connected to the second ground portions 2d to 2f and the ground terminals 2i2 and 2j2.

Reference numeral 2i denotes an external interface section provided in the printed wiring section 2, which is connected to other electronic circuit boards (not shown), electric equipment on which the electronic circuit board 1 is mounted, electronic equipment and the like (not shown). Input and output. 2i1 is a signal terminal group provided in the external interface unit 2i, 2i2
Is a ground terminal provided to the external interface unit 2i for earth ground. Reference numeral 2j denotes a power supply interface unit provided in the printed wiring unit 2, which is constituted by a power supply terminal 2j1 and a ground terminal 2j2 for grounding to ground.

In FIG. 2, reference numeral 3 denotes an inspection apparatus main body;
It has an electronic circuit (not shown) including electronic components such as a microcomputer, an IC, and a memory, and outputs detection information of the type of the electronic circuit board 1, executes inspection of the electronic circuit board 1, and outputs the inspection result. Reference numerals 3a to 3c denote test pins provided on the inspection apparatus main body 3;
It is supported so as to be able to move up and down and can be electrically connected to the inspection apparatus main body 3 when moving in the V2 direction. FIG. 2 shows a state where the test pins 3a to 3c are projected.

Reference numeral 3d denotes an external interface provided on the inspection apparatus main body 3, which is connected to the external interface 2i of the electronic circuit board 1 at the time of board inspection. Reference numeral 3e denotes a power supply interface unit provided in the inspection apparatus main body 3, and is constituted by a power supply terminal (not shown) and a ground terminal (not shown) for grounding to ground. The external interface 3d and the power interface 3
Reference character e denotes a pin probe-shaped terminal, which is inserted into through holes (not shown) of the external interface unit 2i and the power supply interface unit 2j (shown in FIG. 1) at the time of board inspection to be electrically connected thereto.

Reference numeral 4 denotes a control unit which is provided so as to be electrically connected to the inspection apparatus main body 3 and controls the process of determining the type of the electronic circuit board 1 and the base inspection. This control unit 4
Is constituted by an electronic circuit (not shown) including a microcomputer, an IC, and the like, and is provided with an internal memory (not shown) for storing a plurality of types of inspection programs. 5
Denotes a monitor, which displays a result of discriminating the substrate type and an inspection result from the control unit 4. Reference numeral 6 denotes a board inspection apparatus, and reference numerals 3 to
5 is included.

Next, the operation will be described with reference to the drawings. FIG. 3 is an explanatory diagram showing an information table storing detection information of the type of the board. In the figure, reference numeral 7 denotes an information table in which detection information of the type of the substrate is stored, A to C denote detection information of the type of the substrate stored in the information table 7, and the detection information A is a voltage applied to the test pin 3a. Dropping, detection information B
Is detection information that the voltage applied to the test pin 3b has dropped, and detection information C is detection information that the voltage applied to the test pin 3c has dropped. The information table shown in FIG. 3 is stored in an internal memory (not shown) of the inspection apparatus main body 3.

FIG. 4 is a flowchart showing a method of inspecting the electronic circuit board 1. First, when the operator moves the electronic circuit board 1 (shown in FIG. 2) in the direction V2 in the figure and sets it on the inspection apparatus main body 3, the external interface unit 3d (shown in FIG. 2)
Of the power interface unit 3e (shown in FIG. 2) enters the through-hole (not shown) of the external interface unit 2i (shown in FIG. 1). ) Is the power supply interface unit 2j
1 (shown in FIG. 1) and electrically connected to the test pins 3a to 3c.
(Shown in FIG. 2) are contact lands 2a1-2c1, respectively.
(Shown in FIG. 1). At this time, the test pins 3 a to 3 c move downward with the movement of the electronic circuit board 1 and are electrically connected to the inspection apparatus main body 3.

Here, the first land portion 2a having the contact land portion 2a1 with which the test pin 3a comes in contact is a chip component 2g (shown in FIG. 1) soldered to the soldering land portion 2a2 and the soldering land 2d1. The test pin 3a is electrically connected to the common ground line 2h (shown in FIG. 1) via the first land portion 2a, the chip component 2g, and the second land portion 2d. 2
h. Note that other test pins 3
b and 3c are contact land portions 2a1 and 2c with which they contact.
1 of the first land portions 2b and 2c having
Since the chip component 2g is not soldered to 2, 2c2, it is not electrically connected to the common ground wiring 2h.
Further, since the ground terminal of the power supply interface unit 3e is electrically connected to the ground terminal 2j2 of the power supply interface unit 2j, the potential of the common ground wiring 2h is equal to the ground potential.

Next, when the control unit 4 (shown in FIG. 2) is instructed to execute the board inspection via an operation unit (not shown), the control unit 4 tests the inspection apparatus main body 3 with a predetermined voltage. An instruction is given to apply the voltage to the pins 3a to 3c (step S
1). The inspection apparatus main body 3 applies a predetermined voltage to the test pins 3a to 3c (Step S2), and detects whether the applied voltage drops (Step S3). In the first embodiment, since the chip component 2g of the first land portion 2a and the second land portion 2d is soldered, the test pin 3
The voltage “a” drops to the ground potential by the common ground wiring 2h. The inspection device main body 3 detects the voltage drop of the test pin 3a, extracts the detection information A from the information table 7 shown in FIG. 3 stored in advance in an internal memory (not shown), and outputs it to the control unit 4 (step S4). .

The control section 4 receives the detection information A from the inspection apparatus main body 3, and determines the type of the electronic circuit board 1 under inspection according to the detection information (step S5). Next, the control unit 4 reads the relevant inspection program 4a from the inspection programs 4a to 4c stored in the internal memory (not shown) and causes the inspection apparatus main body 3 to execute the substrate inspection of the electronic circuit board 1 (Steps S6a to S6a). Step S6c). Further, the control unit 4 causes the monitor 5 to display the result of the discrimination of the type of the substrate.

In response to an instruction from the control section 4, the inspection apparatus main body 3 performs a board inspection according to the inspection program 4a included in the instruction (step S7), and outputs an inspection result to the control section 4 (step S8). The control unit 4 includes the inspection device main body 3
The inspection result is displayed on the monitor 5 (step S9).

In the first embodiment, the second lands 2d to 2f are connected to the common ground wiring 2h.
The present invention is not limited to this, and the second land portions 2d to 2f
And a wiring dedicated to discriminating the board type connected to the ground terminals 2i2 and 2j2 may be provided to detect the voltage drop applied to the test pins 3a to 3c in the same manner.

As described above, according to the electronic circuit board 1 of the first embodiment, the first lands 2a to 2c having the contact lands 2a1 to 2c1 contacting the test pins 3a to 3c, A second land portion 2d to 2f connected to the common ground wiring 2h and a first land portion 2a
2c and any one of the second lands 2d to 2f is provided with a chip component 2g, so that any one of the test pins 3a to 3c is connected to the chip component 2g.
By contacting g with the contact land of the soldered first land, it is possible to determine the type of the board. That is, according to the board type determination method and the board inspection method according to the first embodiment, first, at the time of board type determination, the inspection apparatus main body 3 applies the test pins 3a to 3c to the contact lands 2a2 to 2c2, respectively. At the same time, a predetermined voltage is applied to the test pins 3a to 3c, the voltage drop is detected, and the detection information A to C is extracted from the information table 7 according to the test pin having the voltage drop. .
Since the control unit 4 determines the board type based on the detection information A to C, any one of the test pins 3a to 3c solders the chip component among the first lands 2a to 2c of the electronic circuit board 1. It is only necessary to contact the contact land portion of the first land portion, and it is not necessary to contact a large number of test pins with the land. The type of substrate can be determined efficiently. Further, when inspecting the electronic circuit board 1, the control unit 4 sets an inspection program according to the discrimination result of the substrate type and causes the inspection apparatus main body 3 to execute the substrate inspection. The circuit board 1 can be inspected, and the work efficiency can be easily improved.

The electronic circuit board 1 is connected to the contact lands 2a1-2c1 for contact of the test pins 3a-3c with the first lands 2a-2c, and soldering for electrically connecting the chip components 2g. Since the test pins 3a to 3c are provided with the first land portions 2a to 2c,
Component 2g connecting the second land portions 2d to 2f
Even if the mounting position is slightly displaced, the contact lands 2a1-2c1 can be normally contacted without being hindered by the chip component 2g, and the number of contact failures can be reduced. can do.

[0035]

According to the electronic circuit board of the present invention,
Each of the plurality of first lands is provided with a first soldering land for soldering the connecting means, and each of the plurality of second lands is connected to one end of the second land for soldering the connecting means.
Since the soldering lands are provided and the other end is connected to a ground terminal for grounding to ground, one test pin is applied to each of the plurality of first lands when discriminating the board type. Then, a predetermined voltage is applied to the test pins, and the type of the board can be determined based on which test pin voltage drops.

Further, according to the electronic circuit board of the present invention, each of the plurality of first lands has one end provided with a contact land for contacting a test pin of the inspection means with the test pin for discriminating the board type, and the other end provided with connection means. Since the first soldering land portion to be soldered is provided, the test pin can contact the contact land portion without being hindered by the connecting means.

Further, according to the electronic circuit board of the present invention, the other ends of the plurality of second lands are connected to the ground terminals via the common ground wiring for grounding to the ground, respectively. The land can be easily grounded to ground.

Further, according to the electronic circuit board of the present invention, since the plurality of first and second lands are provided on the edge of the board, the test pins for determining the type of the board are provided on the electronic circuit board. First without being disturbed by electronic components mounted on
Can contact the land.

Further, according to the electronic circuit board of the present invention, the contact lands of the plurality of first lands are provided closer to the edge of the board than the first lands for soldering. The test pin for determining the type of the board can easily contact the first land without being hindered by the electronic components mounted on the electronic circuit board.

Further, according to the board type determining method of the present invention, the step of bringing the plurality of test pins of the inspection means into contact with the plurality of first lands and grounding one ends of the plurality of second lands, respectively. Applying a predetermined voltage of the plurality of test pins, detecting a voltage drop of the predetermined voltage applied to the plurality of test pins, and determining a substrate type based on a detection result of the voltage drop. Therefore, one of the plurality of test pins is connected to the first land to which the connecting means is connected and electrically connected to the ground.
By contacting the two, a voltage drop can be detected, and the type of the substrate can be determined.

According to the board inspection method of the present invention,
A plurality of test pins of the inspection means are respectively brought into contact with the plurality of first lands, one ends of the plurality of second lands are grounded, and a signal transmission / reception interface between the electronic circuit board and the inspection means is connected. Applying a predetermined voltage to a plurality of test pins, detecting a voltage drop of the predetermined voltage applied to the plurality of test pins, determining a substrate type based on a detection result of the voltage drop, Since the method includes the steps of setting an inspection program based on the determination result and performing a substrate inspection based on the inspection program, the inspection program can be set in accordance with the determination result of the substrate type and the substrate inspection can be executed. A plurality of types of electronic circuit boards can be inspected.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating an electronic circuit board according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram illustrating the substrate inspection apparatus according to the first embodiment of the present invention;

FIG. 3 is an explanatory diagram showing an information table in which detection information is stored.

FIG. 4 is a flowchart showing a board type determination method and a board inspection method.

FIG. 5 is an explanatory view showing a conventional electronic circuit board and an inspection apparatus.

FIG. 6 is an explanatory view showing the electronic circuit board viewed from a direction V shown in FIG.

[Explanation of symbols]

1 electronic circuit board, 2 printed wiring section, 2a-2c
1st land part, 2a1-2c1 Contact land part, 2a
2-2c2 soldering land portion, 2d-2f second land portion, 2d1-2f2 soldering land portion, 2g chip component, 2h common ground wiring, 2i external interface portion, 2i1 signal terminal group, 2i2 ground terminal,
2j power interface unit, 2j1 power terminal, 2j
2 ground terminal, 3 inspection device main body, 3a to 3c test pin, 4 control unit, 5 monitor, 6 substrate inspection device.

Claims (7)

[Claims] A plurality of first and second lands; and a connecting means for electrically connecting the plurality of first and second lands, wherein the plurality of first and second lands are electrically connected by the connecting means. In an electronic circuit board in which a board type can be automatically determined by an inspection means based on a connection state of a second land part, the plurality of first lands are each a first soldering land for soldering the connection means. Part, the plurality of second
An electronic circuit board, wherein each of the land portions is provided with a second soldering land portion for soldering the connection means at one end, and the other end is connected to a ground terminal for grounding to ground. 2. A method according to claim 1, wherein one of the plurality of first lands is soldered to one end with a contact land contacted with a test pin of the inspection means for discriminating the type of the board and the other end to the connection means.
2. The electronic circuit board according to claim 1, further comprising: a soldering land portion. 3. The electronic device according to claim 1, wherein each of the plurality of second lands is connected to a ground terminal via a common ground wire for grounding the other end to ground. Circuit board. 4. The electronic circuit board according to claim 1, wherein the plurality of first and second lands are provided at an edge of the board. 5. The electronic device according to claim 4, wherein the contact lands of the plurality of first lands are provided closer to the edge of the substrate than the first solder lands. Circuit board. 6. A plurality of first lands, a plurality of second lands having one end grounded to the ground, and the plurality of first lands,
A board for automatically determining the board type of an electronic circuit board having connection means for electrically connecting a second land part based on a connection state of the plurality of first and second land parts by the connection means. In the type determining method, a plurality of test pins of an inspection unit are respectively brought into contact with the plurality of first lands, and one ends of the plurality of second lands are grounded. Applying a voltage, detecting a voltage drop of the predetermined voltage applied to the plurality of test pins, and determining a substrate type based on the detection result of the voltage drop. Substrate type discrimination method to be performed. 7. A plurality of first lands, a plurality of second lands having one end grounded to the ground, and the plurality of first and second lands.
The type of the electronic circuit board including the connection means for electrically connecting the second land portions is automatically determined based on the connection state of the plurality of first and second land portions by the connection means. In the board inspection method for inspecting the electronic circuit board based on a result of the determination, a plurality of test pins of an inspection unit are respectively brought into contact with the plurality of first lands, and the plurality of second lands are contacted. Grounding one end and connecting a signal transmission / reception interface between the electronic circuit board and the inspection means, applying a predetermined voltage to the plurality of test pins, and applying the predetermined voltage applied to the plurality of test pins. Detecting the voltage drop of the voltage, determining the substrate type based on the detection result of the voltage drop, and setting an inspection program based on the determination result. Step, substrate inspection method characterized by comprising the steps of performing a substrate inspection based on the inspection program.