KR101619721B1 - Device testing printed circuit board - Google Patents

Device testing printed circuit board Download PDF

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Publication number
KR101619721B1
KR101619721B1 KR1020150165625A KR20150165625A KR101619721B1 KR 101619721 B1 KR101619721 B1 KR 101619721B1 KR 1020150165625 A KR1020150165625 A KR 1020150165625A KR 20150165625 A KR20150165625 A KR 20150165625A KR 101619721 B1 KR101619721 B1 KR 101619721B1
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KR
South Korea
Prior art keywords
pcb
inspection
unit
image
zone
Prior art date
Application number
KR1020150165625A
Other languages
Korean (ko)
Inventor
김동후
Original Assignee
주식회사 케이엔케이
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Publication date
Application filed by 주식회사 케이엔케이 filed Critical 주식회사 케이엔케이
Priority to KR1020150165625A priority Critical patent/KR101619721B1/en
Application granted granted Critical
Publication of KR101619721B1 publication Critical patent/KR101619721B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R13/00—Arrangements for displaying electric variables or waveforms
    • G01R13/02—Arrangements for displaying electric variables or waveforms for displaying measured electric variables in digital form
    • G01R31/024—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The present invention relates to a PCB test device, which comprises: a test performing unit which sequentially tests a PCB by each area to detect a defective area of the PCB; a display panel which displays a layout image of the PCB including at least one of an actual picture of the PCB or a wiring printed on the PCB and an element mounted on the PCB; and a test image providing unit which receives information on the defective area of the PCB detected by the test performing unit, and provides the display panel with a picture image of the PCB on which the defective area is displayed.

Description

[0001] DEVICE TESTING PRINTED CIRCUIT BOARD [0002]

The present invention relates to an inspection apparatus for inspecting PCBs.

Recently, as the development of electronic communication technology and the demands of consumers have diversified, the production method of conventional small-quantity-type mass production has been converted into the production method of small-quantity small-quantity production.

Conventional PCB inspection apparatuses are not suitable for inspecting various kinds of PCBs manufactured in a small quantity production system of multiple kinds because they have a fixed inspection mounting section, inspection measurement terminals, and inspection programs. However, the operator performing the actual part inspection needs to confirm only the occurrence of the error, rather than knowing the details of the error occurrence of the part.

However, the conventional PCB inspection apparatus does not intuitively indicate whether an error has occurred. Therefore, it is required to introduce an inspection device capable of intuitively grasping the occurrence of an error, while appropriately inspecting various types of PCBs in order to suit a small quantity production method of a variety of types.

Korean Patent Publication No. 10-2005-0087716 " Control apparatus and inspection apparatus using the same "

An object of the present invention is to provide a PCB inspection apparatus which can display a defective portion of a PCB detected in an inspection process on a layout image of a PCB so that a general worker who does not have the expertise of the relevant part can intuitively and quickly check the defective portion .

It is another object of the present invention to provide a PCB inspection apparatus capable of replacing and inserting an inspection performing unit according to a type of PCB to be inspected.

According to an aspect of the present invention, there is provided an inspection apparatus for a printed circuit board (PCB), comprising: an inspection execution unit for sequentially inspecting the PCB by area to detect a defective area of the PCB; A display panel for displaying a layout image of a PCB including at least one of a physical photograph of the PCB, wiring printed on the PCB, and elements mounted on the PCB; And an inspection image providing unit for receiving the defective area information of the PCB detected by the inspection performing unit and providing a photographic image of the PCB with the defective area to the display panel.

At this time, the inspection performing unit may make electrical contact with a node on the PCB to inspect at least one of whether the wiring is short-circuited / open, the parasitic capacitance between the wiring, and the parasitic inductance of the wiring.

In addition, the inspection performing unit may check at least one of a normal operation state of the mounted device and an electrical contact state between the mounted device and the wiring, by electrically contacting the node on the PCB.

In addition, the inspection performing unit performs sequential inspection in the order of a general wiring area, a connector mounting area for external input / output, a passive device mounting area, an active device mounting area, and a logic device mounting area, can do.

On the other hand, the inspection image providing unit may receive the defective details of the defective area from the inspection performing unit, and display symbols of different colors on the photographic image of the PCB according to the defective details, and provide the display image to the display panel.

In addition, the inspection image providing unit may display on the photographic image of the PCB in real time the PCB area where the inspection performing unit performs the inspection, and provide the PCB area to the display panel.

In addition, the inspection image providing unit may include a defect information recording DB for recording defect incidence rates of the PCB in the zone, and the inspection performing unit may check the zone recorded with a high defect occurrence frequency by referring to the defect information record DB .

Here, the bad information record DB shares a bad occurrence record performed by other PCB test apparatuses connected to the network, and the test execution unit refers to the shared bad information record DB to prioritize the zone where the defect occurrence frequency is high .

The marking unit may further include a marking unit for marking the PCB, wherein the marking unit receives the defect zone information of the PCB detected by the inspection performing unit, Zone information can be marked with a symbol.

The test execution unit may further include: a contact driver for performing electrical contact with a node on the PCB; And an inspection engine that stores inspection items of the PCB and performs inspection according to the inspection items, and may be installed in the PCB inspection apparatus according to the type of PCB to be inspected.

According to the PCB inspection apparatus according to the embodiment of the present invention,

First, the PCB test results are displayed along with the PCB image so that the inspector can immediately see which areas of the PCB have failed. That is, even if the inspector is a general worker who does not have expertise in the part, it is easy to recognize whether the part is defective or not. Therefore, it is possible to quickly identify the defective part of the component, and to identify the cause of defect early in product mass production and reflect it on the manufacturing line.

Second, since the test execution unit can be installed separately from the main body housing, it is possible to perform various types of PCB inspection by using a single PCB inspection apparatus

1 is a block diagram of a PCB inspection apparatus according to an embodiment of the present invention.
2 is a perspective view of a PCB inspection apparatus according to an embodiment of the present invention.
FIG. 3 is a view for explaining an example in which the inspection performing unit is detachably mounted to the main housing; FIG.
4A is a photograph image of the PCB to be inspected, and FIG. 4B is a layout image of the PCB to be inspected.
5 shows a PCB image displayed on the display panel when the PCB to be inspected is mounted on the test execution unit.
6 shows a PCB image displayed on the display panel during the process of inspecting the PCB 200 to be inspected by the PCB inspection apparatus.
7 shows a PCB image displayed on the display panel when a defect is detected in the PCB to be inspected.
FIG. 8 is a view for explaining an example in which a plurality of PCB inspection apparatuses are connected by a network to share test results.
9 and 10 are actual photographs of a PCB inspection apparatus according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that, in the drawings, the same components are denoted by the same reference symbols as possible. Further, the detailed description of known functions and configurations that may obscure the gist of the present invention will be omitted. For the same reason, some of the components in the drawings are exaggerated, omitted, or schematically illustrated.

FIG. 1 is a block diagram of a PCB inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view of a PCB inspection apparatus according to an embodiment of the present invention.

1 and 2, a PCB inspection apparatus 100 according to the present invention includes an inspection performing unit 110, a inspection image providing unit 120, and a display panel 130. The inspection performing unit 110, The inspection image providing unit 120 and the display panel 130 are provided in the housing 150.

The PCB inspection apparatus 100 according to the present invention can perform inspection on a PCB in which a device is not mounted, a PCB in a semi-assembled state in which a device or a part of the device is partially mounted, or a printed board assembly (PBA) . Therefore, the PCB 200 to be inspected will be used to refer to the PCB before the device is mounted, the PCB in the semi-assembled state, and the assembled PBA.

The inspection execution unit 110 sequentially inspects the PCB 200 to be inspected on a zone-by-zone basis to detect a defective zone of the PCB 200 to be inspected.

For example, the inspection performing unit 110 may make electrical contact with a node on the PCB to inspect at least one of whether the wiring is short-circuited / open, the parasitic capacitance between the wiring, and the parasitic inductance of the wiring.

As another example, the inspection performing unit 110 may make electrical contact with a node on the PCB to check at least any of normal operation of the mounted device and electrical contact between the mounted device and the wiring.

For this, the test execution unit 110 includes a contact driver 111 and an inspection engine 112.

The contact driver 111 performs electrical contact with the node on the PCB.

The inspection engine 112 stores the inspection items of the PCB and performs inspection according to the inspection items. The contact driver 111 physically contacts the probe terminal with the node of the PCB 200 under the control of the inspection engine 112 and applies the voltage, current, or signal necessary for inspection according to the inspection item.

The inspection engine 112 analyzes the input / output response from the contact prove and, if the response value has a value within the normal range, inspects the next inspection area of the PCB according to the inspection order. If the response value is outside the normal range, It is judged to be defective.

The order of the inspection of each zone of the PCB can be appropriately adjusted according to the defect frequency of each zone according to the results of the previous inspection, which will be described in more detail with reference to FIG.

The contact driver 111 preferably has a shape optimized for the PCB 200 to be inspected so that the probe terminals can be quickly and accurately contacted with the nodes on the PCB 200 to be inspected for quick inspection of the PCB to be inspected. For example, the probe terminals are arranged so as to correspond to the node positions of the PCB to be inspected, and electrical contact can be made between the nodes on the PCB and the probe terminals by vertically shifting the probe terminals.

On the other hand, when it is desired to inspect other types of PCB, the contact driver 111 may be replaced to perform the inspection. However, since the contact driver 111 is under the control of the inspection engine 112, it is preferable to configure the contact driver 111 and the inspection engine 112 as one module in order to swiftly exchange the apparatus, It is preferable that the inspection performing unit 110 including the contact driver 111 and the inspection engine 112 is configured as a replaceable module.

FIG. 3 is a view for explaining an example in which the inspection performing unit is detachably mounted to the main housing; FIG.

When inspecting different kinds of PCBs, the inspectors replace only the inspecting unit 110, and it is possible to perform various kinds of PCB inspections without setting them separately.

In order to shorten the time required for the inspection, the inspection performing unit 110 divides the inspection target PCB 200 into zones and performs inspection.

For example, the inspection performing unit 110 may include a general wiring area in which inspection time is less frequently performed among the areas of the PCB 200 to be inspected, a connector mounting area for external input / output, a passive device mounting area, Sequential inspection can be performed in the order of the zones. Here, the inspection time required for each zone is shown for example, and the inspection time required for each zone may vary depending on the type of the mounted device or the inspection item.

That is, it takes the least time to inspect the logic device mounting area according to the PCB configuration, and it may take the longest inspection time in the general wiring area. Therefore, it is desirable to set the inspection order number for each area requiring less inspection time. The inspection order number may be stored in the inspection engine 112, and the order of inspection may be adjusted through a separate control unit (not shown).

As another example for shortening the inspection time, the inspection execution unit 110 receives the zone defect rate from the DB (not shown) that records the zone defect incidence rate of the PCB to be inspected, Can be performed.

In other words, the inspection performing unit 110 does not detect whether the PCB is defective in all the areas of the PCB, but rather inspects the area where the defect rate is high (i.e., the part where the defect is suspected) It is possible to shorten the time required for judging whether or not the target PCB is defective.

Meanwhile, the DB for recording the incidence of failure by zone may be located in the inspection execution unit 110 or may be located in another component of the PCB inspection apparatus 100. As another example, the DB for recording the failure occurrence rate of the PCB 200 to be inspected may be located in the server 400 connected to the PCB inspection apparatus 100 via a network (see FIG. 8).

The display panel 130 is positioned on the front surface of the PCB inspection apparatus 100 to provide a high image recognition capability to the inspector.

4A is a photograph image of the PCB to be inspected, and FIG. 4B is a layout image of the PCB to be inspected.

The display panel 130 receives an image of the PCB 200 to be inspected from the inspection image providing unit 120 and displays it on the screen. For example, the image of the PCB 200 to be inspected may be a physical image of a PCB to be inspected, or may be a layout image of a PCB including at least one of wiring printed on a PCB to be inspected and elements mounted on the PCB . For the sake of brevity, the following will be referred to as " physical image of PCB to be inspected " and " layout image of PCB to be inspected "

5 shows a PCB image displayed on the display panel when the PCB to be inspected is mounted on the test execution unit. Referring to FIG. 5, the inspection image providing unit 120 may provide an image of the PCB 200 to be inspected to the display panel 130 so as to intuitively recognize whether the inspection is ready for the inspection.

For example, when the PCB 200 to be inspected is mounted on the jig of the inspection performing unit 110, the PCB image is displayed on the display panel 130, so that the inspector checks the PCB image displayed on the screen and operates the inspection start button PCB inspection can be started.

6 shows a PCB image displayed on the display panel during the process of inspecting the PCB 200 to be inspected by the PCB inspection apparatus. Referring to FIG. 6, the inspection image providing unit 120 displays a PCB area on the PCB image in real time, where the inspection performing unit 110 performs inspection. Therefore, the inspector can visually recognize in which area of the PCB 200 to be inspected the inspection is currently being performed.

7 shows a PCB image displayed on the display panel when a defect is detected in the PCB to be inspected. Referring to FIG. 7, the inspection image providing unit 120 receives bad areas and bad details from the inspection performing unit 110, displays symbols of different colors on the PCB image according to the bad details, .

 That is, the inspection result performed by the inspection performing unit 110 is displayed on the PCB image so that the inspection result is displayed on the display panel 130 in real time.

For example, if a device is defective, a red dot is displayed on the part where the device is placed in the PCB image. If the wiring is open, it is indicated as blue X. If the wiring is short-circuited, The history can be displayed. Also, although not shown in the drawings, the detected defective area may be displayed in a box shape or in a shape suitable for the shape of the area and displayed on the PCB image.

On the other hand, a character (for example, an NG character marked with a red color) for allowing the inspector to reliably recognize the occurrence of a defect can be displayed on the entire screen. In addition, related information such as the number of times of a bad zone, a bad history or a bad history may be briefly displayed on a message display window disposed on either side of the screen.

According to another embodiment of the present invention, the inspection image data providing unit 120 may include a defect information recording DB 121 for recording the defect occurrence rates of the PCBs to be inspected. At this time, the inspection performing unit 110 can check the zone recorded with a high frequency of occurrence of defect with priority by referring to the bad information record DB 121. [

FIG. 8 is a view for explaining an example in which a plurality of PCB inspection apparatuses are connected by a network to share test results.

As shown in the figure, the bad information record DB can be shared with the bad occurrence records performed in the other PCB test apparatuses 100-2, 100-3,..., 100-N connected through the network. Here, the sharing means collecting the inspection results performed in the plurality of PCB inspection apparatuses 100-2, 100-3,..., And 100-N.

That is, the inspection performing unit 110 can check the zone recorded with a high defect occurrence frequency by referring to the shared bad information record DB. According to the embodiment, the bad information record DB may be located in the inspection image providing unit 120 or may be located in a separate management server 400. [

That is, the inspection performing unit 110 can prioritize the area where the defect rate is high (that is, the part where the defect is suspected), thereby shortening the time required for determining whether the PCB 200 to be inspected is defective.

According to another embodiment of the present invention, the PCB inspection apparatus 100 may further include a marking unit (not shown).

The marking unit receives the defect zone information of the PCB 200 to be inspected detected by the inspection performing unit 110 and detects the portion where the device is not mounted or the portion where the marking and marking contents are easily distinguished from the surface of the PCB 200 to be inspected Can be marked with a symbol.

Referring to FIG. 4A, it is possible to mark the detected bad zone information in the connector wiring portion on the left upper end where the device is not mounted. For example, if a capacitor located between node 201 and node 202 is detected as defective, one mark indicated by a dot, and when a device 203 is detected as defective, And can be displayed on the surface of the target PCB 200.

Therefore, the inspector can check the markings on the PCB and easily separate them according to the defective contents.

9 and 10 are actual photographs of a PCB inspection apparatus according to an embodiment of the present invention. FIG. 9 is a front view of the PCB inspection apparatus, and FIG. 10 is a perspective view of the PCB inspection apparatus.

As described above, it can be seen that the inspection performing unit is detachably attached to the PCB inspection apparatus and configured to be replaceable depending on the type of PCB to be inspected.

In addition, a display panel is provided on the front surface of the PCB inspection apparatus, thereby providing a high screen recognition performance to the examiner.

It should be noted that the embodiments of the present invention disclosed in the present specification and drawings are only illustrative of the present invention in order to facilitate the understanding of the present invention and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

100: PCB inspection device
110:
120: image offerer
130: Display panel
200: PCB to be inspected

Claims (10)

A printed circuit board (PCB) inspection apparatus comprising:
An inspection execution unit for sequentially inspecting the PCB by zone and detecting a defective zone of the PCB;
A display panel for displaying a layout image of a PCB including at least one of a physical photograph of the PCB, wiring printed on the PCB, and elements mounted on the PCB; And
And an inspection image providing unit for receiving the defective area information of the PCB detected by the inspection performing unit and providing a photographic image of the PCB with the defective area to the display panel,
The inspection execution unit,
And the electrical contact between the mounted element and the wiring is checked to determine whether the mounted element is in normal operation,
The inspection image providing unit,
And a bad information record DB for recording a defect occurrence rate of each zone of the PCB,
The bad information recording DB includes:
Sharing the failure occurrence record performed by other network-connected PCB inspection devices,
Wherein the inspection performing unit inspects the zone in which the defect occurrence frequency is high with priority by referring to the defect information record DB. The method according to claim 1,
The inspection execution unit,
Wherein the at least one of the parasitic inductance of the wiring and the parasitic capacitance of the wiring and the parasitic inductance of the wiring is checked by electrically contacting the node on the PCB. delete The method according to claim 1,
The inspection execution unit,
Wherein a sequential inspection is carried out in the order of a general wiring section, a connector mounting area for external input / output, a passive element mounting area, an active element mounting area, and a logic element mounting area, Device. The method according to claim 1,
The inspection image providing unit,
Wherein the defect inspection unit receives the defect details of the defective area from the inspection performing unit, and displays symbols of different colors on the photographic image of the PCB according to the defect details, and provides the display image to the display panel. The method according to claim 1,
The inspection image providing unit,
Wherein the inspection execution unit displays on the photographic image of the PCB in real time the area of the PCB on which the inspection is performed, and provides the area to the display panel. delete delete The method according to claim 1,
Further comprising a marking unit for performing marking on the PCB,
Wherein the marking unit receives bad zone information of the PCB detected by the test performing unit and marks bad zone information detected on a part of the surface of the PCB where the device is not mounted. The method according to claim 1,
The inspection execution unit,
A contact driver for making electrical contact with a node on the PCB; And
And an inspection engine that stores inspection items of the PCB and performs inspection according to the inspection items, wherein the inspection engine is replaceably mounted on the PCB inspection device according to a type of the PCB to be inspected.
KR1020150165625A 2015-11-25 2015-11-25 Device testing printed circuit board KR101619721B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101973385B1 (en) * 2017-12-28 2019-04-29 동명대학교산학협력단 Portable PCB defect detection device
KR20200134459A (en) * 2019-05-22 2020-12-02 금오공과대학교 산학협력단 Big data used smart factory system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100205733B1 (en) * 1995-04-20 1999-07-01 타테이시 요시오 Apparatus and method for outputing a tested result and substrate test system and substrate test method using the apparatus and the method,respectively
JP2000131242A (en) 1998-10-23 2000-05-12 Hitachi Ltd Defect analyzer
KR101408848B1 (en) * 2013-04-17 2014-06-19 (주)제이에스 시스템 Information tracing method of pcb test processing with multi-step mapping

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100205733B1 (en) * 1995-04-20 1999-07-01 타테이시 요시오 Apparatus and method for outputing a tested result and substrate test system and substrate test method using the apparatus and the method,respectively
JP2000131242A (en) 1998-10-23 2000-05-12 Hitachi Ltd Defect analyzer
KR101408848B1 (en) * 2013-04-17 2014-06-19 (주)제이에스 시스템 Information tracing method of pcb test processing with multi-step mapping

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101973385B1 (en) * 2017-12-28 2019-04-29 동명대학교산학협력단 Portable PCB defect detection device
KR20200134459A (en) * 2019-05-22 2020-12-02 금오공과대학교 산학협력단 Big data used smart factory system
KR102295438B1 (en) 2019-05-22 2021-08-30 금오공과대학교 산학협력단 Big data used smart factory system

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