JPH09107689A - 静電チャックのためのバリアシール - Google Patents

静電チャックのためのバリアシール

Info

Publication number
JPH09107689A
JPH09107689A JP8118086A JP11808696A JPH09107689A JP H09107689 A JPH09107689 A JP H09107689A JP 8118086 A JP8118086 A JP 8118086A JP 11808696 A JP11808696 A JP 11808696A JP H09107689 A JPH09107689 A JP H09107689A
Authority
JP
Japan
Prior art keywords
substrate
electrostatic
barrier
electrostatic chuck
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8118086A
Other languages
English (en)
Japanese (ja)
Inventor
Joseph Salfelder
サルフェルダ ジョセフ
Dennis Grimard
グリマード デニス
John F Cameron
エフ． キャメロン ジョン
Chandra Deshpandey
デシュパンディ チャンドラ
Robert Ryan
ライアン ロバート
Michael G Chafin
ジー． チャフィン マイケル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
International Business Machines Corp
Original Assignee
Applied Materials Inc
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, International Business Machines Corp filed Critical Applied Materials Inc
Publication of JPH09107689A publication Critical patent/JPH09107689A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP8118086A 1995-05-11 1996-05-13 静電チャックのためのバリアシール Pending JPH09107689A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/439,010 US5636098A (en) 1994-01-06 1995-05-11 Barrier seal for electrostatic chuck
US08/439010 1995-05-11

Publications (1)

Publication Number Publication Date
JPH09107689A true JPH09107689A (ja) 1997-04-22

Family

ID=23742919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8118086A Pending JPH09107689A (ja) 1995-05-11 1996-05-13 静電チャックのためのバリアシール

Country Status (4)

Country Link
US (1) US5636098A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0742580A2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPH09107689A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100398817B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187315A (ja) * 1997-09-03 1999-03-30 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP2014099519A (ja) * 2012-11-15 2014-05-29 Tokyo Electron Ltd 基板載置台および基板処理装置
US9859142B2 (en) 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
JPH08507196A (ja) * 1994-01-31 1996-07-30 アプライド マテリアルズ インコーポレイテッド 共形な絶縁体フィルムを有する静電チャック
US5805408A (en) * 1995-12-22 1998-09-08 Lam Research Corporation Electrostatic clamp with lip seal for clamping substrates
US6786998B1 (en) * 1995-12-29 2004-09-07 Cypress Semiconductor Corporation Wafer temperature control apparatus and method
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US5740009A (en) * 1996-11-29 1998-04-14 Applied Materials, Inc. Apparatus for improving wafer and chuck edge protection
GB2325939B (en) * 1997-01-02 2001-12-19 Cvc Products Inc Thermally conductive chuck for vacuum processor
US5936829A (en) * 1997-01-02 1999-08-10 Cvc Products, Inc. Thermally conductive chuck for vacuum processor
US5870271A (en) * 1997-02-19 1999-02-09 Applied Materials, Inc. Pressure actuated sealing diaphragm for chucks
US6138745A (en) 1997-09-26 2000-10-31 Cvc Products, Inc. Two-stage sealing system for thermally conductive chuck
US6364957B1 (en) 1997-10-09 2002-04-02 Applied Materials, Inc. Support assembly with thermal expansion compensation
JP3918265B2 (ja) * 1997-11-21 2007-05-23 トヨタ自動車株式会社 燃料電池の製造方法
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
US6073577A (en) 1998-06-30 2000-06-13 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof
US6067222A (en) * 1998-11-25 2000-05-23 Applied Materials, Inc. Substrate support apparatus and method for fabricating same
US6319102B1 (en) * 1999-07-09 2001-11-20 International Business Machines Corporation Capacitor coupled chuck for carbon dioxide snow cleaning system
US6839217B1 (en) 1999-10-01 2005-01-04 Varian Semiconductor Equipment Associates, Inc. Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure
US6362946B1 (en) 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
US6771482B2 (en) * 2001-07-30 2004-08-03 Unaxis Usa Inc. Perimeter seal for backside cooling of substrates
US6913670B2 (en) * 2002-04-08 2005-07-05 Applied Materials, Inc. Substrate support having barrier capable of detecting fluid leakage
US6992014B2 (en) * 2002-11-13 2006-01-31 International Business Machines Corporation Method and apparatus for etch rate uniformity control
US6944006B2 (en) * 2003-04-03 2005-09-13 Applied Materials, Inc. Guard for electrostatic chuck
US7595972B2 (en) * 2004-04-09 2009-09-29 Varian Semiconductor Equipment Associates, Inc. Clamp for use in processing semiconductor workpieces
JP4350695B2 (ja) * 2004-12-01 2009-10-21 株式会社フューチャービジョン 処理装置
WO2007005925A1 (en) * 2005-06-30 2007-01-11 Varian Semiconductor Equipment Associates, Inc. Clamp for use in processing semiconductor workpieces
JP2007134575A (ja) * 2005-11-11 2007-05-31 Canon Inc レチクルカセットおよびそれを用いた露光装置
US20070139855A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus
US20080190364A1 (en) * 2007-02-13 2008-08-14 Applied Materials, Inc. Substrate support assembly
US9147588B2 (en) * 2007-03-09 2015-09-29 Tel Nexx, Inc. Substrate processing pallet with cooling
US9558980B2 (en) * 2008-04-30 2017-01-31 Axcelis Technologies, Inc. Vapor compression refrigeration chuck for ion implanters
US9036326B2 (en) * 2008-04-30 2015-05-19 Axcelis Technologies, Inc. Gas bearing electrostatic chuck
US9543181B2 (en) * 2008-07-30 2017-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Replaceable electrostatic chuck sidewall shield
WO2010024146A1 (ja) * 2008-08-27 2010-03-04 株式会社アルバック 静電チャック及び真空処理装置
TWI503920B (zh) * 2009-03-19 2015-10-11 Taiwan Semiconductor Mfg Co Ltd 半導體製程設備及其ｏ形環
US20100326602A1 (en) * 2009-06-30 2010-12-30 Intevac, Inc. Electrostatic chuck
US9176186B2 (en) * 2009-08-25 2015-11-03 Translarity, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed
KR101817170B1 (ko) 2010-05-28 2018-01-10 액셀리스 테크놀러지스, 인크. 냉각식 이온 주입 시스템의 가열식 로터리 시일 및 베어링
US8481969B2 (en) 2010-06-04 2013-07-09 Axcelis Technologies, Inc. Effective algorithm for warming a twist axis for cold ion implantations
US9105705B2 (en) * 2011-03-14 2015-08-11 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US8677586B2 (en) * 2012-04-04 2014-03-25 Lam Research Corporation Installation fixture for elastomer bands and methods of using the same
US9711324B2 (en) 2012-05-31 2017-07-18 Axcelis Technologies, Inc. Inert atmospheric pressure pre-chill and post-heat
US9502279B2 (en) 2013-06-28 2016-11-22 Lam Research Corporation Installation fixture having a micro-grooved non-stick surface
US9583377B2 (en) 2013-12-17 2017-02-28 Lam Research Corporation Installation fixture for elastomer bands
TWI613753B (zh) 2015-02-16 2018-02-01 靜電吸附承盤側壁之改良密封件
US10340171B2 (en) * 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US20180019104A1 (en) * 2016-07-14 2018-01-18 Applied Materials, Inc. Substrate processing chamber component assembly with plasma resistant seal
US10867829B2 (en) * 2018-07-17 2020-12-15 Applied Materials, Inc. Ceramic hybrid insulator plate
JP7308767B2 (ja) * 2020-01-08 2023-07-14 東京エレクトロン株式会社 載置台およびプラズマ処理装置
JP2021163831A (ja) * 2020-03-31 2021-10-11 東京エレクトロン株式会社 保持装置、及びプラズマ処理装置
JP7446176B2 (ja) * 2020-07-31 2024-03-08 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP2024030799A (ja) * 2022-08-25 2024-03-07 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988009054A1 (en) * 1987-05-06 1988-11-17 Labtam Limited Electrostatic chuck using ac field excitation
US5452177A (en) * 1990-06-08 1995-09-19 Varian Associates, Inc. Electrostatic wafer clamp
US5255153A (en) * 1990-07-20 1993-10-19 Tokyo Electron Limited Electrostatic chuck and plasma apparatus equipped therewith
US5539609A (en) * 1992-12-02 1996-07-23 Applied Materials, Inc. Electrostatic chuck usable in high density plasma
US5326725A (en) * 1993-03-11 1994-07-05 Applied Materials, Inc. Clamping ring and susceptor therefor
US5484485A (en) * 1993-10-29 1996-01-16 Chapman; Robert A. Plasma reactor with magnet for protecting an electrostatic chuck from the plasma
US5486975A (en) * 1994-01-31 1996-01-23 Applied Materials, Inc. Corrosion resistant electrostatic chuck

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1187315A (ja) * 1997-09-03 1999-03-30 Matsushita Electric Ind Co Ltd プラズマ処理装置
US9859142B2 (en) 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US12368025B2 (en) 2011-10-20 2025-07-22 Lam Research Corporation Edge seal for lower electrode assembly
JP2014099519A (ja) * 2012-11-15 2014-05-29 Tokyo Electron Ltd 基板載置台および基板処理装置
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
US10892197B2 (en) 2013-12-26 2021-01-12 Lam Research Corporation Edge seal configurations for a lower electrode assembly

Also Published As

Publication number Publication date
EP0742580A3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1996-12-11
KR100398817B1 (ko) 2003-12-18
US5636098A (en) 1997-06-03
EP0742580A2 (en) 1996-11-13

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