JPH0885869A - Method for forming electrode of electronic part and jig used therefor - Google Patents

Abstract

PURPOSE: To provide a method for forming the electrode of electronic part& stabilized in electrical characteristic and rich in reliability without lowering productivity and to provide a jig used therefor. CONSTITUTION: A first film forming pattern mask sheet 24 having film forming holes 48, 50 and 60 is arranged on the rear of a work 80 to be used as a substrate, and a second film forming pattern mask sheet 26 having a film forming hole 68 is arranged on the front of the work 80. A first auxiliary mask sheet 98 having holes corresponding to the film forming holes 48, 50 and 60 is arranged on the rear of the first film forming pattern mask sheet 26. A second auxiliary mask sheet 100 having holes corresponding to the film forming hole 68 is arranged on the front of the second film forming pattern mask sheet 26. Further, the work 80 is held between the first film forming pattern mask sheet 24 and the second film forming pattern mask sheet 26, and the work 80 is placed at a specified position. Subsequently, an electrode is selectively formed on the front and rear of the work 80 by sputtering.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode forming method for an electronic component and a jig used for the method, and more particularly to a method for forming an electrode for an electronic component such as an oscillator or a resonator in which electrodes are formed on a substrate. And a jig used in the method.

[0002]

2. Description of the Related Art FIG. 12 is an enlarged cross-sectional view of a main part showing a conventional example which is the background of the present invention. In the electrode forming method of this conventional example, metal pattern mask plates 3 and 5 having film forming holes 3a and 3b are provided on the front surface and the back surface of a work 1 which is a substrate of a piezoelectric oscillation element, and thereafter, a sputtering process is performed. By applying it, it is possible to reduce the variation of the thin film which becomes the electrode adhered to the front surface and the back surface of the work 1 and to increase the adhesion strength of the thin film. Furthermore, in order to stabilize the electrical characteristics of the product and reduce the breakage of the film that becomes the electrode, so-called solder breakage, the film thickness of the film that is attached to the substrate is increased to form the electrode. It has been proposed to reduce the electrical resistance of the membrane.

[0003]

However, when the amount of film formation is increased at one time in order to increase the thickness of the film deposited on the surface of the substrate during the sputtering process, the metal pattern mask plates 3 and 5 themselves are also affected. Due to the electrode material attached, the metal pattern mask plates 3 and 5 themselves are heated to a high temperature. Therefore, the metal pattern mask plates 3 and 5 themselves are distorted by thermal deformation, and the film attaching holes 3a and 3b of the metal pattern mask plates 3 and 5 are deformed. In this case, the desired film formation pattern shape cannot be obtained, and the shape of the electrode formed on the substrate is not stable.

Therefore, as a countermeasure against the above problems, the following methods are currently taken. That is, one is to increase the heat capacity of the metal pattern mask plates 3 and 5 by increasing the thickness of the metal pattern mask plates 3 and 5 themselves. However, according to this method, the pattern accuracy of the metal pattern mask plates 3 and 5 itself may be deteriorated, and it is difficult to maintain the flatness of the metal pattern mask plates 3 and 5, so that If they are deformed, they have problems such as not returning to the original.

Further, as another countermeasure, there is a method of performing the film forming work twice or more, or a method of forming a base of a film to be an electrode by sputtering and then forming a film by vapor deposition after the second time. . However, with these methods, the number of work steps is increased, and the productivity is poor.

Therefore, the main object of the present invention is to control the thickness of a metal film serving as an electrode formed on a substrate without lowering the productivity, thereby stabilizing the electrical characteristics and improving the reliability. An object of the present invention is to provide an electrode forming method for rich electronic components and a jig used in the method.

[0007]

The present invention is an electrode forming method of an electronic component for forming a film to be an electrode on a substrate of an electronic component by a sputtering process, which comprises a step of preparing a work to be a substrate, A step of disposing a first film formation pattern mask plate and a second film formation pattern mask plate each having a film formation hole on the one main surface and the other main surface side of the work; and the first film formation pattern mask plate On the back side of
A step of disposing a first auxiliary mask plate having holes corresponding to the film forming holes, and a second auxiliary mask plate having holes corresponding to the film forming holes on the surface side of the second film formation pattern mask plate. A step of arranging, a step of positioning the work at a predetermined position in a state where the work is sandwiched between the first film formation pattern mask plate and the second film formation pattern mask plate, and a sputtering process is performed on the positioned work. A method for forming an electrode of an electronic component, the method including:

Further, according to the present invention, a film to be an electrode is formed on a substrate of an electronic component by a sputtering process,
A jig for positioning a work, which is a substrate of an electronic component, at a predetermined position, the jig forming a positioning base plate having a positioning member, and a positioning hole and a film into which the positioning member of the positioning base plate is inserted. A first film formation pattern mask plate and a second film formation pattern mask plate which are provided on the one main surface side and the other main surface side of the work, respectively, and have film forming holes for A first auxiliary mask plate arranged on the back surface of the film pattern mask plate and having a hole for exposing the film formation hole; and a second auxiliary mask plate arranged on the surface of the second film formation pattern mask plate and having a hole for exposing the film formation hole. A second auxiliary mask plate, a positioning member for the positioning base plate, a positioning hole for the first film formation pattern mask plate and the second film formation pattern mask plate, a first auxiliary mask plate, and It is inserted into the hole of the second auxiliary mask plate, and cooperates with the positioning base plate to sandwich the work between the first film formation pattern mask plate and the second film formation pattern mask plate, and place the work at a predetermined position. To position,
It's a jig.

The work to be the substrate can be formed in a rectangular plate shape. In that case, the first film forming pattern mask plate and / or the second film forming plate of the jig used in the electrode forming method of this electronic component. The film pattern mask plate may be formed with a guide member that regulates the arrangement of the workpiece in the longitudinal direction and / or the width direction.

[0010]

The first film formation pattern mask plate and the second film formation pattern mask plate cooperate with the positioning base plate in a state that the work is sandwiched between the first film formation pattern mask plate and the second film formation pattern mask plate. It is positioned at a predetermined position together with the two auxiliary mask plates.

Further, in this state, the work is subjected to the sputtering treatment, so that the holes of the first and second auxiliary mask plates and the first and second auxiliary mask plates and the first and second main mask surfaces become the substrate. The electrode material collides with and adheres to the portion exposed through the film formation hole of the second film formation pattern mask plate,
A film to be an electrode is formed. Further, the electrode unnecessary portions on the one main surface and the other main surface of the work are the portions where the holes of the first and second auxiliary mask plates are not provided and the film forming holes of the first and second film formation pattern mask plates. Since it is shielded by the portion where is not provided, the electrode material does not adhere and the film that becomes the electrode is not formed.

Since the first auxiliary mask plate and the second auxiliary mask plate are used, heat is applied directly to the first film formation pattern mask plate and the second film formation pattern mask plate during sputtering. Will not be added. That is, most of the electrode material that does not pass through the holes of the first and second auxiliary mask plates and the film forming holes of the first and second film formation pattern mask plates has the holes of the first and second auxiliary mask plates. Since it collides with the portion not provided, the film hardly adheres to the first and second film formation pattern mask plates.
Therefore, the first and second film formation pattern mask plates do not increase in temperature due to the collision energy (condensation heat) of the electrode material. Further, the condensation heat generated by the collision of the electrode material with the exposed portion of the work is radiated to the first and second film formation pattern mask plates, so that the temperature rise of the work as the substrate is suppressed.

When the work to be the substrate is formed in a rectangular shape,
By forming a guide member on the first film formation pattern mask plate and / or the second film formation pattern mask plate to regulate the arrangement of the work in the longitudinal direction and / or the width direction, the work can be positioned more accurately. Surely done.

[0014]

According to the present invention, since the temperature rise of the first and second film forming pattern mask plates themselves is prevented during the sputtering process, the first and second film forming pattern masks due to thermal deformation. The plate can be prevented from being distorted, and the film forming hole is not likely to be deformed. Therefore, it is possible to adjust the film thickness such as increasing the thickness of the film attached to the work as the substrate, and moreover, the shape of the electrode can be stable. Therefore, by increasing the film thickness of the film to be attached to the substrate, the electric resistance value of the film to be an electrode can be lowered, and the electrical characteristics of the product can be stabilized and the film is less susceptible to cracking, that is, soldering. You can also measure the reduction of bruise. Further, since heat is not directly applied to the first and second film formation pattern mask plates, the influence of heat can be minimized, so that the life of the first and second film formation pattern mask plates themselves is increased. become longer.

Further, according to the present invention, when the thickness of the film to be attached to the substrate is increased, the thickness of the film is increased in one step as compared with the conventional method which requires a plurality of film forming operation steps. Further, by controlling the film formation amount, it is possible to reduce work steps such as forming adjustment using solder resist ink or the like. Therefore, productivity can be improved. Further, according to the present invention, since the electrode material does not directly adhere to the first and second film formation pattern mask plates, it is possible to extend the etching cycle for cleaning unnecessary films. Therefore, according to the present invention, by controlling the thickness of the metal film serving as an electrode formed on the substrate without lowering the productivity, it is possible to provide a highly reliable electronic component with stable electrical characteristics. An electrode forming method is obtained.

The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the detailed description of the following embodiments made with reference to the drawings.

[0017]

EXAMPLE In this example, a method of forming electrodes of, for example, a piezoelectric oscillation element and a jig used in the method will be described as an example of electronic components. FIG. 1 (A) is a perspective view showing an example of a piezoelectric oscillation element formed by the method of the present invention, and FIG. 1 (B) is a sectional view thereof.

The piezoelectric oscillator 10 includes a piezoelectric substrate 12 having a rectangular shape, for example. The piezoelectric substrate 12 is formed of, for example, piezoelectric ceramics. Electrodes 14 and 16 are formed on the front surface and the back surface of the piezoelectric substrate 12, respectively. The electrode 14 is formed from one end in the width direction of the piezoelectric substrate 12 to the central portion, and the electrode 16 is formed from the other end in the width direction of the piezoelectric substrate 12 to the central portion.

Next, with reference to FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, FIG. 7, FIG. 8, FIG.
An example of a jig used in the method of forming the electrodes formed on the piezoelectric substrate 12 of the piezoelectric oscillation element 10 will be described. The jig 20 includes a positioning base plate 22, a first film formation pattern mask plate 24, and a second film formation pattern mask plate 2.
6, a first auxiliary mask plate 98, a second auxiliary mask plate 100 and the like.

First, the positioning base plate 22 will be described mainly with reference to FIG. The positioning base plate 22 includes a rectangular plate-shaped positioning base body 28 made of metal, for example. At one end and the other end of the positioning base body 28 in the width direction, substantially rectangular fixing legs 30a and 30 are provided.
0b is formed. The fixed legs 30a and 30b are fixed to the positioning base body 28 with a plurality of screws 32, for example. The positioning base body 28 is provided with a plurality of elongated holes 34 at intervals in the longitudinal direction thereof. Each of these elongated holes 34 is formed, for example, in a rectangular plane shape, and is formed so as to extend in the width direction of the positioning base body 28.

Further, a plurality of positioning members 36 are formed on the positioning base body 28 at intervals. Since the positioning members 36 have the same structure, one positioning member 36 will be described below. The positioning member 36 has holes 38 at both ends in the axial direction.
A pin 40 of, for example, a cylindrical shape having a and 38b is included, and a compression spring 42 is wound around the intermediate portion of the pin 40 in the axial direction in the circumferential direction. The one positioning member 36 is provided with two spring pins as a stopper. The positioning member 36 is inserted through the positioning base body 28, and then the spring pin 42 is inserted through the holes 38a and 38b. In this embodiment, the positioning base body 28 is separated by a predetermined distance L in the width direction.
The five positioning members 36 are arranged in five rows at predetermined intervals W in the longitudinal direction of the positioning base body 28. That is, the positioning base body 28 is provided with 15 positioning members 36 at predetermined intervals in the vertical and horizontal directions.

Further, the positioning base body 28 is provided with
For example, four positioning assistance bolts 44 are inserted at intervals. Four positioning auxiliary bolts 44 are two
As a set, two sets are arranged facing each other. The four positioning assisting bolts 44 work in cooperation with the positioning member 36, and position the first film formation pattern mask plate 24, the second film formation pattern mask plate 26, and the like, which will be described later. It is for.

Next, the first film formation pattern mask plate 24 mounted on the positioning base plate 22 will be described mainly with reference to FIG. On the one positioning base plate 22, two first film formation pattern mask plates 24 are attached side by side in the longitudinal direction. The first film formation pattern mask plate 24 includes a rectangular plate-shaped first mask plate body 46 made of, for example, a metal. In this embodiment, the first film-forming pattern mask plate 24 is formed of a magnetic chromium-based stainless steel such as SUS430. The first mask plate body 46 is
The length in the width direction is formed to be approximately half the length in the longitudinal direction of the positioning base 22. The first mask plate main body 46 is provided with four elongated holes 48 of, for example, a rectangular shape at the center in the width direction and at intervals in the longitudinal direction. In addition, on both sides of these elongated holes 48 in the width direction, the first
The four rectangular long holes 50 arranged side by side at a slight interval in the longitudinal direction of the mask plate body 46 are provided in three rows, respectively, at intervals in the width direction of the first mask plate body 46. . These elongated holes 48 and 50 are provided as film forming holes.

The first mask plate main body 46 extends from one end in the longitudinal direction to the other end at the center in the width direction,
For example, the guide member 52 having a substantially rectangular plate shape is formed. The guide member 52 is formed on the first mask plate body 46 so as to extend over the four elongated holes 48. In addition, the first mask plate body 46 has three three members on both sides in the width direction of the guide member 52, which are parallel to the guide member 52 and spaced in the width direction of the first mask plate body 46. Another guide member 54 is formed. Each of these guide members 54 is formed in a substantially rectangular plate shape and is formed to extend from one end in the longitudinal direction of the first mask plate body 46 to the other end side. Each of these guide members 54 is formed on the first mask plate body 46 so as to straddle over the four elongated holes 50 arranged in the longitudinal direction of the first mask plate body 46. The width of each of the guide members 54 is about half the width of the guide member 52.

Further, the first film formation pattern mask plate 24
Is the positioning member 3 of the positioning base plate 22 described above.
A positioning hole 56 is provided at a position corresponding to 6.
In this case, one first film formation pattern mask plate 26 is provided with, for example, three rectangular positioning holes 56 at predetermined intervals in the longitudinal direction of the guide member 52. The three positioning holes 56 are provided so as to penetrate the guide member 52 and the first mask plate body 46. These positioning holes 56 correspond to the positioning member 36 so that the positioning member 36 of the positioning base plate 22 can be inserted when the positioning base plate 22 and the first film formation pattern mask plate 24 are superposed. Formed in position.

Further, the first film formation pattern mask plate 24 is provided with auxiliary positioning holes 58 at positions corresponding to the auxiliary positioning bolts 44 of the positioning base plate 22 described above. In this case, the three first positioning holes 5 of the guide member 52 are formed in one first film formation pattern mask plate 24.
Two positioning assisting holes 58 are provided between the positions 6. Two
One positioning auxiliary hole 58 is provided so as to penetrate the guide member 52 and the first mask plate body 46. In this case, one positioning auxiliary hole 58 is formed, for example, in a circular shape, and the other positioning auxiliary hole 58 is formed in a substantially elliptical elongated hole. Therefore, the positioning auxiliary hole 58
When the positioning assist bolt 44 is inserted into the slot, the insertion position of the positioning assist bolt 44 can be adjusted in the slot direction at the slot portion.

On the other hand, at one end and the other end in the width direction of the first mask plate body 46, four notches 60 are provided as film forming holes at intervals in the longitudinal direction thereof. Further, substantially rectangular plate-shaped adjacent portion guide members 62 are formed at one end and the other end of the first mask plate main body 46 in the width direction. Adjacent part guide member 62 is 4
The first mask plate main body 46 is formed from one end to the other end in the longitudinal direction of the first mask plate main body 46 so as to extend over the one notch portion 60. It should be noted that one end side in the longitudinal direction of the guide members 52, 54 and the adjacent portion guide member 62 is formed integrally with, for example, a rectangular plate-shaped holding member 63, and when viewed as a whole, it has a substantially comb-like planar shape. It is formed.

Further, the adjacent guide member 62 is provided with, for example, five positioning hole notches 64 at intervals in the longitudinal direction thereof. Therefore, when two first film formation pattern mask plates 24 are arranged side by side, the adjacent end portions thereof are provided with five positioning hole notches 64 that are adjacent to each other and are spaced apart in the longitudinal direction by five. A rectangular positioning window will be configured. These positioning hole windows are for inserting the positioning member 36 and the positioning auxiliary bolt 44 described above.

Next, the work 80, which is disposed above the first film formation pattern mask plate 24 and cooperates with the positioning base plate 22, forms the substrate 12 between the first film formation pattern mask plate 24 and the first film formation pattern mask plate 24. Second film formation pattern mask plate 26 for sandwiching
This will be described below.

The second film-forming pattern mask plate 26 is a substantially rectangular plate-shaped second mask plate body 66 made of metal, for example.
including. In this second mask plate body 66, four rectangular long holes 68 are provided as film forming holes arranged in the longitudinal direction of the second mask plate body 66 with a slight gap therebetween.
For example, 8 rows are provided at intervals in the width direction of. Further, three rectangular positioning holes 70 are provided at the center of the second mask plate main body 66 in the width direction at predetermined intervals L in the longitudinal direction. Further, two positioning auxiliary holes 72 are provided between the three positioning holes 70. One positioning auxiliary hole 72 is formed in a circle, and the other positioning auxiliary hole 72 is formed in a substantially elliptical elongated hole. Therefore, when the positioning auxiliary bolt 44 is inserted into the positioning auxiliary hole 72, the insertion position of the positioning auxiliary bolt 44 can be adjusted in the elongated hole portion at the elongated hole portion.

Further, on the back surface of the second mask plate main body 66, a comb-toothed plate-shaped guide member 74 is formed at one end side in the longitudinal direction thereof. That is, the guide member 74
Eight comb tooth guide pieces 76, for example, are formed at a distance in the longitudinal direction. In this case, in the guide member 74, when the second film formation pattern mask plate 26 and the first film formation pattern mask plate 24 are superposed on each other, the guide piece 76 of the guide member 74 is of the first film formation pattern mask plate 24. It is arranged on the back surface of the second mask plate main body 66 so as to be fitted between the other end sides of the guide member 54 in the longitudinal direction.

On the other hand, five positioning hole notches 78 are provided at one end and the other end of the second mask plate main body 66 in the width direction at intervals in the longitudinal direction thereof.
Therefore, when the two second film formation pattern mask plates 26 are arranged side by side, five adjacent positioning hole notches 78 are formed in the adjacent end portions of the second film formation pattern mask plates 26 at intervals in the longitudinal direction. A rectangular positioning window will be configured. These positioning hole windows are for inserting the positioning member 36 and the positioning auxiliary bolt 44 described above.

Next, the first auxiliary mask plate 98 arranged below the first film formation pattern mask plate 24 and the second auxiliary mask arranged above the second film formation pattern mask plate 26. The plate 100 will be described below with reference to FIGS.
This will be described with reference to FIGS. 7, 8 and 9. The first auxiliary mask mask 98 is formed in the same structure as the first film formation pattern mask plate 24 shown in FIG. That is, the first auxiliary mask plate 98 has the long holes 48 and 5 as the film forming holes provided in the first film formation pattern mask plate 24.
Holes corresponding to 0, the notch portion 60, the positioning hole 56, and the positioning auxiliary hole 58 are provided.

Next, the second auxiliary mask 100 will be described. As shown in FIG. 9, the second auxiliary mask plate 100 includes a magnet positioning plate 102, a magnet holding plate 104, a top plate 106, a plurality of magnets 108, and the like. The magnet positioning plate 102 is non-magnetic, and is formed in a substantially rectangular plate shape, for example, from chromium-nickel-based stainless steel such as SUS304. As shown in FIG. 5, the magnet positioning plate 102 is provided with positioning pins 110 at its four corners, for example. This locating pin 110 attaches it to the magnet locating plate 102.
After being press-fitted into, it is fixed by spot welding, for example. The positioning pin 110 has a pin hole 109, and a snap pin or the like is inserted into the pin hole 109 as a stopper.

Further, the magnet positioning plate 102
Is provided with a plurality of elongated holes 112 that expose the plurality of film formation holes of the second film formation pattern mask plate 26. In this case, the elongated holes 112 are provided in eight rows at intervals in the width direction of the magnet positioning plate 102, and two rows are provided in each row in the longitudinal direction of the magnet positioning plate 102. Further, the magnet positioning plate 102 is provided with a plurality of, for example, rectangular magnet positioning holes 114 penetrating both sides of the elongated hole 112 in the width direction at predetermined intervals in the longitudinal direction of the magnet positioning plate 102. To be

On the other hand, the magnet holding plate 104 is
For example, as shown in FIG. 6, it is formed in a substantially rectangular plate shape, and insertion holes 116 for inserting the positioning pins 110 of the magnet positioning plate 102 are provided at the four corners thereof. Also, this magnet holding plate 104
Is the long hole 112 of the magnet positioning plate 102.
The elongated holes 118 having the same role are provided at positions corresponding to. The top plate 106 has the same shape and size as the magnet holding plate 104. In this case, the magnet holding plate 104 is made of chrome-based stainless steel such as SUS430 having magnetism. The top plate 106 is made of non-magnetic chromium-nickel-based stainless steel such as SUS304.

Next, the positioning base plate 22, the first film formation pattern mask plate 24, the second film formation pattern mask plate 26, the first auxiliary mask plate 98, and the second auxiliary mask plate 100 are formed. A method of forming electrodes on the piezoelectric substrate 12 of the piezoelectric oscillation element 10 shown in FIG. 1 using the jig 20 described above will be described mainly with reference to FIGS. 7, 8, 9, 10, and 11 and the like. .

First, a work 80, for example, in the shape of a rectangular plate, which will be the piezoelectric substrate 12, is prepared. In this work 80,
A so-called piezoelectric ceramic that has been polarized is used. The work 80 is cut into a predetermined length. Further, the positioning base plate 22, the first film formation pattern mask plate 24, the second film formation pattern mask plate 26, the first auxiliary mask plate 98, and the second auxiliary mask plate 100, which form the jig 80, are prepared. To be done. Further, this work 80 is, as shown in FIG.
0 is set on the work insertion table 92.

Next, one positioning base plate 22 is arranged along the surface of the work insertion table 92 of the work automatic insertion machine 90. Then, two first auxiliary mask plates 98 are mounted side by side on one positioning base plate 22, and two first auxiliary mask plates 98 are attached from above.
The film formation pattern mask plate 24 of is superposed and attached. The positioning member 36 of the positioning base plate 22 is inserted into the positioning holes 56 of the first auxiliary mask plate 98 and the first film formation pattern mask plate 24, and the positioning auxiliary bolt 44 is inserted into the positioning auxiliary hole 58. As a result, the first auxiliary mask plate 98 and the first film formation pattern mask plate 24 are set on the positioning base plate 22. In this case, each two first auxiliary mask plates 98
And, the first film formation pattern mask plate 24 has the other end side in the longitudinal direction thereof, that is, the guide members 52, 54 and 62.
Are arranged in the same direction.

Further, the first film formation pattern mask plate 24
A second film formation pattern mask plate 26 is attached on the above. In the second film formation pattern mask plate 26, the positioning member 36 is inserted into the positioning hole 70, and the positioning auxiliary bolt 44 is inserted into the positioning auxiliary hole 72, whereby the first film formation pattern mask plate 24. The second film formation pattern mask plate 26 is set on the above.

In this case, the second film formation pattern mask plate 2
6, each comb tooth guide piece 76 of the guide member 74 is on the other end side in the longitudinal direction of the first film formation pattern mask plate 24,
In addition, it is attached so as to fit between the guide members 52, 54 and 62. That is, the second film formation pattern mask plate 2 is formed on the first film formation pattern mask plate 24.
When 6 is set, as shown in FIGS. 10 and 11,
The guide members 52, 54, 62, 74 cooperate with each other to form a guide accommodating portion 82 for guiding the work between the first film formation pattern mask plate 24 and the second film formation pattern mask plate 26. It

In this way, the positioning base plate 22,
The mutual arrangement positions of the first auxiliary mask plate 98, the first film formation pattern mask plate 24, and the second film formation pattern mask plate 26 are positioned. Then, the second film formation pattern mask plate 26 is once removed.

Further, as shown in FIG. 7, the work 80 is pushed by the pusher 96 of the automatic work inserting machine 90 so that the work guide table 92 guides the guide members 52, 52 on the first film formation pattern mask plate 24. Guided between 54 and 62. In this case, one end side of the work 80 in the longitudinal direction hits the holding member 63 of the first film formation pattern mask plate 24, and the work 80 is prevented from coming off from the end of the first film formation pattern mask plate 24 in the longitudinal direction. ing. That is, the holding member 63 regulates the arrangement of the work 80 guided on the first film formation pattern mask plate 24 in the longitudinal direction.

Then, the first film-forming pattern mask plate 2
A second film formation pattern mask plate 26 is attached on the upper surface of the film 4. That is, the work 80 is sandwiched between the first film formation pattern mask plate 24 and the second film formation pattern mask plate 26, and is positioned in the guide accommodating portion 82 for guiding. In this case, as shown in FIGS. 10 and 11, the work 80 has guide members 52 of the first film formation pattern mask plate 24 whose fixed positions on one end side and the other end side in the width direction are fixed.
54, 62, 64, the fixed position on one end side in the longitudinal direction thereof is restricted by the holding member 63 of the first film formation pattern mask plate 24, and the fixed position on the other end side in the longitudinal direction is the second position. It is regulated by the comb-teeth guide pieces 76 of the film-forming pattern mask plate 26. In this manner, the plurality of works 80 are guided to predetermined positions by the positioning base plate 22, the first auxiliary mask plate 98, the first film formation pattern mask plate 24, and the second film formation pattern mask plate 26. And it is positioned.

Further, a second auxiliary mask plate 100 is mounted on the second film formation pattern mask plate 26. In this case, the second auxiliary mask plate 100 is prepared in advance. That is, the magnet positioning plate 102
The magnet holding plate 104 and the top plate 106 are inserted into the positioning pin 110 in a state of being overlapped with each other, and the pin hole 10 of the positioning pin 110 is further inserted.
By attaching a snap pin (not shown) to 9, the magnet positioning plate 102, the magnet holding plate 104, and the top plate 106 are superposed and set in that order. Further, by fitting the magnet 108 into the magnet positioning hole 114 of the magnet positioning plate 102, the magnet 108 is held by the magnet holding plate 104. In this way, the prepared second auxiliary mask plate 100 is mounted on the second film formation pattern mask plate 26. Second
The auxiliary mask plate 100 is adhered onto the second film formation pattern mask plate 26 by the magnetic force of the magnet 108.

After that, the second film forming pattern mask plate 26 is formed.
The sputtering process is performed with the second auxiliary mask plate 100 mounted on the substrate. In this case, the sputtering is performed in the direction orthogonal to the main surfaces of the first film formation pattern mask plate 24 and the second film formation pattern mask plate 26. Then, a film is attached to each of the one main surface and the other main surface of the work 80 to form electrodes.

That is, the first and second auxiliary mask plates 9 are provided on one main surface and the other main surface of the work 80 to be the substrate.
The electrode material collides with the portions exposed through the holes 48, 50, 60, 118 of 8, 100 and the film forming holes 48, 50, 60, 68 of the first and second film formation pattern mask plates 24, 26. A film that adheres and becomes an electrode is formed. Further, the electrode unnecessary portions on the one main surface and the other main surface of the work 80 are the portions where the holes of the first and second auxiliary mask plates 98 and 100 are not provided and the first and second film formation pattern masks. Film forming holes 48, 50, 60 in the plates 24, 26
Since the electrodes and 68 are shielded by the portions where they are not provided, the electrode material does not adhere and the film that becomes the electrode is not formed.

In the method of forming the electrodes of the piezoelectric oscillation element 10 according to the present invention, the first auxiliary mask plate 98 and the second auxiliary mask plate 100 are used. Membrane pattern mask plate 2
No heat is directly applied to the fourth and second film formation pattern mask plates 26. That is, the holes 48, 50, 60, 118 of the first and second auxiliary mask plates 98, 100 and the film forming holes 48, 50, 60, 68 of the first and second film formation pattern mask plates 24, 26 are formed. Most of the electrode material that does not pass through the first and second auxiliary mask plates 98 and 100.
Since the holes collide with the portions where the holes 48, 50, 60 and 118 are not provided, the film hardly adheres to the first and second film formation pattern mask plates 24 and 26. Therefore, the first and second film formation pattern mask plates 24, 2
In No. 6, there is no temperature rise due to the collision energy (condensation heat) of the electrode material. Further, the condensation heat generated by the collision of the electrode material with the exposed portion of the work 80 is radiated to the first and second film formation pattern mask plates 24 and 26, so that the temperature rise of the work 80 serving as the substrate is suppressed. To be done.

Further, the piezoelectric oscillator 10 according to the present invention.
In the jig 20 used in the electrode forming method described above, a guide that guides and regulates the attachment position of the work 80 in the longitudinal direction and the width direction of the first film formation pattern mask plate 24 and the second film formation pattern mask plate 26. Members 52, 54, 6
Since 2, 64 and 74 are formed, the positioning of the work 80 is more accurate and reliable.

According to the electrode forming method of the piezoelectric oscillation element 10 and the jig 20 used therefor according to the present invention, the temperature rise of the first and second film formation pattern mask plates 24 and 26 themselves is prevented during the sputtering process. Therefore, distortion of the first and second film formation pattern mask plates 24, 26 due to thermal deformation can be prevented, and the film forming holes 48, 50, 60, 68 and the like are not likely to be deformed. Therefore, it is possible to adjust the film thickness such as increasing the thickness of the film adhered to the work 80 as the substrate, and moreover, the shape of the electrode can be stable. Therefore, by increasing the film thickness of the film to be attached to the substrate, the electric resistance value of the film to be an electrode can be lowered, and the electrical characteristics of the product can be stabilized and the film is less susceptible to cracking, that is, soldering. You can also measure the reduction of bruise. Moreover, since heat is not directly applied to the first and second film formation pattern mask plates 24 and 26, the influence of heat can be minimized.
Also, the life of the second film formation pattern mask plates 24, 26 themselves is extended.

Further, the piezoelectric oscillator 1 according to the present invention.
According to the electrode forming method of No. 0 and the jig 20 used therefor, when increasing the thickness of the film to be attached to the substrate, the film can be formed in one step as compared with the conventional method that requires a plurality of film forming operation steps. Can be made thicker, and by controlling the amount of film formation, it is possible to reduce work steps such as forming adjustment using solder resist ink or the like. Therefore, productivity can be improved. In addition, the first and second film formation pattern mask plates 2
Since the electrode material does not directly adhere to 4, 26, the etching cycle for cleaning the unnecessary film can be extended.

The piezoelectric oscillator 10 according to the present invention.
In the electrode forming method of 1), the thin film attached to the surface of the second auxiliary mask plate 100 needs to be regularly cleaned by etching or the like to be removed. According to the jig 20 used in this embodiment, In particular, the second auxiliary mask plate 100
However, each member such as the magnet positioning plate 102, the magnet holding plate 104, the top plate 106, and the plurality of magnets 108 has a structure that can be easily attached and detached. Therefore, by removing only the top plate 106, the top plate 106 is removed. Only the film attached to the surface needs to be washed.
In this case, since the top plate 106 is made of a non-magnetic material, only the top plate 106 can be removed from the second auxiliary mask plate 100 relatively easily. Therefore,
According to the structure of the second auxiliary mask plate 100, it is not necessary to wash the entire second auxiliary mask plate 100 as it is, that is, it is not necessary to wash the second auxiliary mask plate 100 with the magnet 108 attached. Problems such as deterioration of the magnet 108 and reduction of magnetic force due to reaction do not occur.

In the above embodiment, the second auxiliary mask 10 is used.
0 is the magnet positioning plate 102, the magnet holding plate 104, the top plate 106, and the magnet 108.
And the magnet 108 enhances the adhesion to the work 80. However, the second auxiliary mask plate 100 is
For example, a single plate having a thickness of 3 to 4 mm may be used, and its own weight may enhance the adhesion to the work 80. In that case, as the second auxiliary plate 100, it is possible to use the second film formation pattern mask plate 26 having a thickness of 3 to 4 mm, for example.

In the above embodiment, the first and second
Although the film forming hole provided in the film forming pattern mask plate of No. 1 was formed in a rectangular shape, it is merely an example, and the shape of the film forming hole may be arbitrarily changed to another shape depending on the desired electrode shape. You may change it. The shapes of the guide members of the first and second film formation pattern mask plates can be appropriately changed according to the shape of the work.

[Brief description of drawings]

FIG. 1A is a perspective view showing an example of a piezoelectric oscillation element formed by the method of the present invention, and FIG. 1B is a sectional view thereof.

FIG. 2A is a schematic plan view showing an example of a positioning base plate, and FIG. 2B is a side schematic view thereof.

FIG. 3A is a plan view showing an example of a first film formation pattern mask plate, and FIG. 3B is a side view showing the same.

FIG. 4A is a plan view showing an example of a second film formation pattern mask plate, and FIG. 4B is a side view showing it.

5A is a plan view showing an example of a magnet positioning plate of a second auxiliary mask plate, and FIG. 5B is a side view showing the same.

FIG. 6A is a plan view showing an example of a magnet holding plate of a second auxiliary mask plate, and FIG. 6B is a side view showing the same.

FIG. 7 is an exploded perspective view showing an example of a method of forming electrodes of the piezoelectric oscillation element of FIG.

8 is a side view solution diagram showing an example of a method for forming electrodes of the piezoelectric oscillation element of FIG. 1. FIG.

FIG. 9 is an exploded cross-sectional view showing an example of a method for forming electrodes of the piezoelectric oscillation element of FIG.

FIG. 10 shows a state in which a work is positioned by a jig,
In particular, it is a cross-sectional view showing a state in which the arrangement of one end side and the other end side in the width direction of the work is restricted by the guide member of the first film formation pattern mask plate.

FIG. 11 shows a state in which a work is positioned by a jig,
In particular, it is a cross-sectional view showing a state in which the arrangement of one end side and the other end side in the longitudinal direction of the work is restricted by the guide members of the first and second film formation pattern mask plates.

FIG. 12 is an essential part exploded cross-sectional view showing an example of a conventional electrode forming method which is the background of the present invention.

[Explanation of symbols]

 10 Piezoelectric Oscillation Element 12 Substrate 14, 16 Electrode 20 Jig 22 Positioning Base Plate 24 First Film Forming Pattern Mask Plate 26 Second Film Forming Pattern Mask Plate 36 Positioning Member 44 Positioning Auxiliary Bolt 34, 48, 50 Long Hole 52, 54,74 Guide member 60 Notch portion 62 Adjacent portion guide member 63 Holding member 64,78 Positioning hole notch 56,70 Positioning hole 58,72 Positioning auxiliary hole 80 Work 98 First auxiliary mask plate 100 2 auxiliary mask plate 102 magnet positioning plate 104 magnet holding plate 106 top plate 108 magnet 110 positioning pin

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display H03H 3/02 B

Claims (4)

[Claims] 1. A method of forming an electrode of an electronic component for forming a film to be an electrode on a substrate of an electronic component by a sputtering process, the step of preparing a workpiece to be the substrate, one main surface of the workpiece and the other. On the main surface side,
A step of arranging a first film formation pattern mask plate and a second film formation pattern mask plate having a film formation hole; a hole corresponding to the film formation hole is provided on the back surface side of the first film formation pattern mask plate. Arranging a first auxiliary mask plate that has, a step of arranging a second auxiliary mask plate having holes corresponding to the film formation holes on the front surface side of the second film formation pattern mask plate, the first In a state where the work is sandwiched between the film formation pattern mask plate and the second film formation pattern mask plate,
An electrode forming method for an electronic component, comprising: positioning the work at a predetermined position; and subjecting the positioned work to a sputtering process. 2. The work is formed in a rectangular plate shape, and the first film formation pattern mask plate and / or the second film formation pattern mask plate are formed in a longitudinal direction of the work and / or. Alternatively, the electrode forming method of the electronic component according to claim 1, further comprising a guide member that regulates the arrangement in the width direction. 3. A jig for positioning a work, which is a substrate of the electronic component, at a predetermined position in order to form a film to be an electrode on the substrate of the electronic component by a sputtering process. The jig is a positioning device. A positioning base plate having a member, a positioning hole into which the positioning member of the positioning base plate is inserted, and a film forming hole for forming the film, and one main surface side and the other main surface of the work A first film formation pattern mask plate and a second film formation pattern mask plate which are respectively arranged on the sides, and holes which are arranged on the back surface of the first film formation pattern mask plate and expose the film formation holes. A second auxiliary mask plate disposed on the surfaces of the first auxiliary mask plate and the second film formation pattern mask plate and having a hole for exposing the film forming hole; The positioning member because the base plate, said first
Of the film forming pattern mask plate and the second film forming pattern mask plate and the positioning holes of the first auxiliary mask plate and the second auxiliary mask plate, and the positioning base. A jig that cooperates with a plate to sandwich the work between the first film formation pattern mask plate and the second film formation pattern mask plate and position the work at a predetermined position. 4. The work is formed in a rectangular plate shape, and the first film formation pattern mask plate and / or the second film formation pattern mask plate are formed in a longitudinal direction of the work and / or. The jig according to claim 3, further comprising a guide member that regulates the arrangement in the width direction.