JPH0674498B2 - Masking device - Google Patents
Masking deviceInfo
- Publication number
- JPH0674498B2 JPH0674498B2 JP2117895A JP11789590A JPH0674498B2 JP H0674498 B2 JPH0674498 B2 JP H0674498B2 JP 2117895 A JP2117895 A JP 2117895A JP 11789590 A JP11789590 A JP 11789590A JP H0674498 B2 JPH0674498 B2 JP H0674498B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- mask plate
- spacer
- hole
- masked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】 「産業上の利用分野」 本発明は水晶振動子、セラミック素子などの電子部品に
膜付けするためのマスキング装置に関するものである。The present invention relates to a masking device for applying a film to electronic parts such as a crystal oscillator and a ceramic element.
「従来の技術」 一般に、円形、多角形その他の形状の水晶振動子、圧電
素子、その他の電子部品（１）には、第４図に示すよう
に、その表面および／または裏面に蒸着、スパッタリン
グ、スクリーン法などによって電極、低抗体などの膜付
け（２）が行なわれる。この膜付け（２）のため、被マ
スキング部材である電子部品（１）はマスキング装置に
よってマスキングされる。“Prior Art” Generally, in a crystal resonator, a piezoelectric element, or other electronic component (1) having a circular shape, a polygonal shape, or the like, as shown in FIG. 4, vapor deposition or sputtering is performed on the front surface and / or the back surface thereof. A film of electrodes, low antibody, etc. is attached (2) by a screen method or the like. Due to this film attachment (2), the electronic component (1) which is the member to be masked is masked by the masking device.
従来、このマスキング装置は、複数枚のステンレス板、
例えば第５図および第６図に示すように５枚のステンレ
ス板（3a）（3b）（3c）（3d）（3e）を重合して構成さ
れていた。最下部の下部補助板（3a）は比較的厚くて硬
い厚さ0.4〜1.5mmのステンレス板などからなり、後述す
る膜付け孔（４）よりやや大きなにげ孔（５）を有す
る。下から２番目の下部マスク板（3b）は、厚さ0.5mm
〜0.03mm程度のできるだけ薄いステンレス板などからな
り、電極、抵抗などの膜付け（２）をするための膜付け
孔（４）を有する。下から３番目のスペーサ（3c）は電
子部品（１）と同一形状のステンレス板などからなり、
部品嵌込み孔（６）を有する。下から４番目の上部マス
ク板（3d）は前記下部マスク板（3b）と同一目的の膜付
け孔（７）を有する。最上部の上部補助板（3e）は、前
記下部補助板（3a）と同様のにげ孔（８）を有する。Conventionally, this masking device is composed of a plurality of stainless steel plates,
For example, as shown in FIGS. 5 and 6, it was constituted by superimposing five stainless steel plates (3a) (3b) (3c) (3d) (3e). The lowermost lower auxiliary plate (3a) is made of a relatively thick and hard stainless steel plate having a thickness of 0.4 to 1.5 mm, and has a baffle hole (5) slightly larger than a film forming hole (4) described later. The second lower mask plate (3b) from the bottom is 0.5mm thick
It is made of a stainless steel plate or the like as thin as possible to about 0.03 mm, and has a film forming hole (4) for forming a film (2) for electrodes, resistors and the like. The third spacer (3c) from the bottom consists of a stainless steel plate of the same shape as the electronic component (1),
It has a component fitting hole (6). The fourth uppermost mask plate (3d) has a film forming hole (7) for the same purpose as the lower mask plate (3b). The uppermost upper auxiliary plate (3e) has a bale hole (8) similar to the lower auxiliary plate (3a).
前記下部補助板（3a）、下部マスク板（3b）、スペーサ
（3c）は、３枚重ねにし位置合せをして適当な間隔でス
ポット溶接（９）をして１枚の下部板（10）となし、ま
た、これには複数個のねじ通し孔（11）、ピン（12）を
差込んで位置合せをする複数個の位置決め孔（13）を有
し、かつ前記下部補助板（3a）の下面には各ねじ通し孔
（11）に一致してナット（14）が溶接されている。The lower auxiliary plate (3a), the lower mask plate (3b), and the spacer (3c) are stacked one on top of another, aligned and spot welded (9) at appropriate intervals to form one lower plate (10). In addition, it has a plurality of screw holes (11) and a plurality of positioning holes (13) for inserting pins (12) for positioning, and the lower auxiliary plate (3a). A nut (14) is welded to the lower surface of the so as to correspond to each screw through hole (11).
前記上部マスク板（3d）と上部補助板（3e）もまた２枚
重ねにし位置合せをしてスポット溶接（９）をして１枚
の上部板（15）とし、かつねじ通し孔（11）と位置決め
孔（13）とが複数個ずつ有する。The upper mask plate (3d) and the upper auxiliary plate (3e) are also overlapped with each other, aligned and spot-welded (9) to form one upper plate (15), and a screw through hole (11). And a plurality of positioning holes (13).
「発明が解決しようとする課題」 このような構成において、スペーサ（3c）の各部品嵌込
孔（６）…にそれぞれ電子部品を収納し、ピン（12）で
上部板（10）と下部板（15）とを、ピンの差込みにより
位置合せをし、その後、複数本のねじ（16）で上下板
（10）（15）全体を密着させる。この組込の後、膜付け
作業に入る。[Problems to be Solved by the Invention] In such a configuration, electronic components are respectively housed in the component fitting holes (6) of the spacer (3c), and the upper plate (10) and the lower plate are pinned by the pins (12). The (15) and (15) are aligned by inserting the pins, and then the upper and lower plates (10) (15) are brought into close contact with each other by a plurality of screws (16). After this assembling, the film attaching work is started.
しかるに、上部板（10）と下部板（15）はそれぞれわず
かな間隔をおいて多数個所をスポット溶接（９）するた
め、歪みが生じ、波をうって、隙間（17）が生じるなど
して膜付け（２）に問題があった。また、上下板（10）
（15）を隙間なく密着させるため、何本ものねじ（16）
を締めなければならず、膜付け作業前後の組立て、解体
が極めて面倒であるという問題があつた。However, since the upper plate (10) and the lower plate (15) are spot-welded (9) at a large number of places at a slight interval, distortion occurs, waves are generated, and a gap (17) occurs. There was a problem with film attachment (2). Also, upper and lower plates (10)
Lots of screws (16) to fit (15) tightly together
Had to be tightened, and assembly and disassembly before and after the film attaching work were extremely troublesome.
なお、従来例において、上下部マスク板（3b）（3d）の
厚さを厚くして上下部補助板（3a）（3e）を使用しない
ものもみうけられるが、このようにすると、蒸着、スパ
ッタリングなどが斜めに入射すると、マスク板の板厚で
かげになる部分が生じ、膜付け（２）の形状が不正確に
なり好ましくないという問題があった。In the conventional example, the upper and lower mask plates (3b) and (3d) may be thickened and the upper and lower auxiliary plates (3a) and (3e) may not be used. When the light beam is obliquely incident, there is a problem in that a part of the mask plate is obscured due to the thickness of the mask plate and the shape of the film formation (2) becomes inaccurate, which is not preferable.
本発明は、スポット溶接、膜付け作業前後のねじ止めが
なくても隙間のないマスキングができ、また、マスキン
グ部材の両側にマスク板を配置して１度に多数の部品の
画面を加工できる装置を得ることを目的とする。INDUSTRIAL APPLICABILITY The present invention is an apparatus capable of masking without gaps without screwing before and after spot welding and film forming work, and also capable of processing screens of many parts at once by disposing mask plates on both sides of the masking member. Aim to get.
「課題を解決するための手段」 本発明は以上のような課題を解決するためになされたも
ので、所定間隔で多数穿設された嵌込孔にそれぞれ被マ
スキング部材を収納した薄板からなるスペーサと、前記
スペーサの上部に配置され、各被マスキング部材の位置
に合わせて所定間隔で膜付け孔が穿設された磁性体の薄
板からなる上部マスク板と、前記スペーサの下部に配置
され、各被マスキング部材の位置に合わせて所定間隔で
膜付け孔が穿設され、多数の透磁孔が穿設された非磁性
体の薄板からなる下部マスク板と、前記下部マスク板の
下部に配置され、前記下部マスク板の膜付け孔の位置に
合わせてにげ孔を穿設され、各被マスキング部材に対し
て少なくとも１個のマグネットが設けられた非磁性体の
薄板からなるマグネット保持板とを具備し、前記スペー
サに穿設された透磁孔を前記マグネット保持板に設けら
れたマグネットの位置に合わせて配置し、前記スペーサ
の嵌込孔に収納された多数の被マスキング部材と上部マ
スク板および下部マスク板を前記マグネットの磁力によ
り密着せしめてなるものである。"Means for Solving the Problems" The present invention has been made to solve the above problems, and is a spacer made of a thin plate in which a plurality of fitting holes, each of which is provided at a predetermined interval, contain a member to be masked. And an upper mask plate made of a thin plate of a magnetic material having a film forming hole formed at a predetermined interval in accordance with the position of each member to be masked, and an upper mask plate arranged below the spacer. A lower mask plate made of a thin plate of a non-magnetic material having a plurality of magnetic perforation holes perforated at predetermined intervals according to the position of the member to be masked, and a lower mask plate disposed below the lower mask plate. A magnet holding plate made of a non-magnetic thin plate in which a baffle hole is formed in accordance with the position of the film forming hole of the lower mask plate, and at least one magnet is provided for each masked member. Equipped , A plurality of members to be masked and an upper mask plate and a lower part which are arranged in the spacer holding holes and are aligned with the position of a magnet provided in the magnet holding plate The mask plate is closely attached by the magnetic force of the magnet.
「作用」 電子部品の両面に膜付けをする場合、スペーサの電子部
品嵌込孔に電子部品を収納し、このスペーサの上面と下
面に、それぞれ膜付け孔を有する上部マスク板と下部マ
スク板を、位置合せピン等に差込んで重合し、これら
に、さらにマグネットを嵌込んだマグネット保持板を重
合する。上部マスク板を鉄、ニッケルなどを含む磁性体
で形成することによりすべてが一体に固定的に重合され
る。また、マグネットの磁力が透磁孔を通して有効に上
部マスク板に届き、良好な吸着力が得られる。"Function" When attaching a film to both sides of an electronic component, the electronic component is stored in the electronic component fitting hole of the spacer, and the upper mask plate and the lower mask plate having the film attaching holes are provided on the upper surface and the lower surface of the spacer, respectively. , And is superposed by inserting them into alignment pins and the like, and superposed on them by a magnet holding plate in which a magnet is fitted. By forming the upper mask plate with a magnetic material containing iron, nickel, etc., everything is integrally and fixedly polymerized. Further, the magnetic force of the magnet effectively reaches the upper mask plate through the magnetically permeable holes, and a good attractive force is obtained.
「実施例」 以下、本発明の一実施例を図面に基き説明する。[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.
第１図において、下部より補助板（20a）、マグネット
保持板（20b）、下部マスク板（20c）、スペーサ（20
d）、上部マスク板（20e）である。これらのうち、補助
板（20a）、スペーサ（20d）、上部マスク板（20e）が
磁性材料（SUS430など）からなるステンレス薄板で、マ
グネット保持板（20b）と下部マスク板（20c）が非磁性
材料（SUS304など）からなるステンレス薄板である。前
記スペーサ（20d）は、電子部品（１）の厚さと略同じ
厚さを有し、かつ電子部品嵌込孔（６）が多数穿設され
ている。In FIG. 1, from the bottom, an auxiliary plate (20a), a magnet holding plate (20b), a lower mask plate (20c), a spacer (20
d), the upper mask plate (20e). Of these, the auxiliary plate (20a), spacer (20d), and upper mask plate (20e) are stainless steel thin plates made of magnetic material (SUS430, etc.), and the magnet holding plate (20b) and lower mask plate (20c) are non-magnetic. A thin stainless plate made of a material (SUS304, etc.). The spacer (20d) has substantially the same thickness as the electronic component (1), and has a large number of electronic component fitting holes (6).
前記上部マスク板（20e）は電子部品（１）の電極、抵
抗などの膜付け（２）をするための膜付け孔（７）が多
数穿設されている。The upper mask plate (20e) is provided with a large number of film forming holes (7) for forming a film (2) of electrodes and resistors of the electronic component (1).
前記下部マスク板（20c）は同様の膜付け孔（４）が多
数穿設されるとともに、透磁孔（21）が多数穿設されて
いる。The lower mask plate (20c) has a large number of similar film forming holes (4) and a large number of magnetic permeability holes (21).
前記マグネット保持板（20b）はマグネット（22）を保
持するためのマグネット保持孔（23）が多数穿設される
とともに、膜付け孔（４）よりやや大きいにげ孔（24）
が穿設されている。The magnet holding plate (20b) is provided with a large number of magnet holding holes (23) for holding the magnets (22), and at the same time, the baffle holes (24) are slightly larger than the film attaching holes (4).
Has been drilled.
前記補助板（20a）は前記にげ孔（24）と同様のにげ孔
（25）が穿設されている。The auxiliary plate (20a) has a burr hole (25) similar to the bail hole (24).
それぞれの板のそれぞれの孔の大きさと位置関係は第１
図および第３図に示すように、電子部品嵌込孔（６）と
膜付け孔（４）（７）は電子部品（１）の規格に応じて
予め決められる。The size and positional relationship of each hole in each plate is
As shown in FIGS. 3 and 4, the electronic component fitting hole (6) and the film forming holes (4) and (7) are predetermined according to the standard of the electronic component (1).
マグネット保持孔（23）は電子部品（１）の外周に配置
するように穿設される。この際、上部マスク板（20e）
まで磁力線が有効に届くように、電子部品嵌込孔（６）
よりやや内側まで位置し、また、透磁孔（21）は磁力線
スペーサ（20d）と上部マスク板（20e）へ有効に届き、
かつマグネット（22）の移動防止のため、マグネット保
持孔（23）よりやや小さくなるように穿設する。The magnet holding hole (23) is formed so as to be arranged on the outer periphery of the electronic component (1). At this time, the upper mask plate (20e)
Electronic component fitting hole (6) so that the magnetic field lines can reach effectively
It is located slightly inside, and the magnetic permeability hole (21) effectively reaches the magnetic field line spacer (20d) and the upper mask plate (20e).
Moreover, in order to prevent the movement of the magnet (22), the magnet (22) is formed so as to be slightly smaller than the magnet holding hole (23).
さらに、これら５枚の板（20a）（20b）（20c）（20d）
（20e）には、左右両端に位置合せピン（12）の挿入さ
れる位置合せ孔（13）が穿設される。Furthermore, these five plates (20a) (20b) (20c) (20d)
Alignment holes (13) into which alignment pins (12) are inserted are formed in both ends (20e).
以上のような構成において、補助板（20a）の上にマグ
ネット保持板（20b）をのせ、各マグネット保持孔（2
3）…にマグネット（22）を収納し、その上に下部マス
ク板（20c）をのせ、さらにスペーサ（20d）をのせる。
すると、マグネット（22）にて補助板（20a）とスペー
サ（20d）が吸着され、４枚の板の重合した状態は、膜
付け作業の前後に拘らず一体に重合状態にある。In the above structure, the magnet holding plate (20b) is placed on the auxiliary plate (20a), and each magnet holding hole (2
3) Store the magnet (22) in ..., put the lower mask plate (20c) on it, and put the spacer (20d) on it.
Then, the auxiliary plate (20a) and the spacer (20d) are attracted to each other by the magnet (22), and the superposed state of the four plates is in the superposed state integrally before and after the film application work.
つぎに、スペーサ（20d）の各電子部品嵌込孔（６）…
にそれぞれ電子部品（１）…を嵌込む。最後に上部マス
ク板（20e）をのせると、この上部マスク板（20e）もマ
グネット（22）で吸着され、５枚すべて一体に重合す
る。Next, each electronic component fitting hole (6) of the spacer (20d) ...
The electronic parts (1) ... Finally, when the upper mask plate (20e) is placed, this upper mask plate (20e) is also attracted by the magnet (22), and all five sheets are polymerized together.
この状態で膜付け作業をし、膜付けが終ったら、最上部
の上部マスク板（20e）だけをはがして膜付け（２）さ
れた電子部品（１）…を取り出す。Film forming work is performed in this state, and when film forming is finished, only the uppermost upper mask plate (20e) is peeled off and the film-formed (2) electronic parts (1) ... Are taken out.
前記実施例では、被マスキング部材として電子部品の場
合について説明したが、これに限られるものではなく、
また、形状も円形、多角形、その他の形状のものでもよ
い。さらに、大きさも実施例の場合に限られるものでは
ない。In the above embodiment, the case where the masked member is an electronic component has been described, but the present invention is not limited to this.
Further, the shape may be circular, polygonal, or any other shape. Further, the size is not limited to that in the embodiment.
前記実施例では、マグネット（22）を被マスキング部材
（１）の外周の４方に配置したが、被マスキング部材
（１）の大きさ、形状などによって、マグネット（22）
の数、大きさ、配置などを変更することができる。Although the magnets (22) are arranged on four sides of the outer periphery of the member to be masked (1) in the above-mentioned embodiment, the magnet (22) may be arranged depending on the size and shape of the member to be masked (1).
You can change the number, size, arrangement, etc.
「発明の効果」 本発明は上述のように構成したのでつぎの効果を有す
る。"Effects of the Invention" Since the present invention is configured as described above, it has the following effects.
（１）マグネット保持板の各にげ孔（マスク板の膜付け
孔）に対して少なくとも１個のマグネットを設けたの
で、１個々々の膜付け孔を確実に被マスキング部材の表
面に密着させることができる。(1) Since at least one magnet is provided for each of the slits (film forming holes of the mask plate) of the magnet holding plate, each individual film forming hole is surely brought into close contact with the surface of the member to be masked. be able to.
（２）多数の膜付け孔を設け、小型のマグネットを全体
に渡って配置したので、局所的に強力に吸着されるよう
なことがなく、マスク板が全面に渡って均一に吸着さ
れ、マスク板の歪みによる位置ずれがなく、多数の被マ
スキング部材への正確な膜付けができる。(2) Since a large number of film forming holes are provided and small magnets are arranged over the entire surface, the mask plate is not attracted strongly locally, and the mask plate is evenly attracted over the entire surface. There is no displacement due to plate distortion, and accurate film attachment to many masked members is possible.
（３）マグネットの位置に合わせた透磁孔を下部マスク
板に設けたので、マグネットによる上部マスク板の吸着
を阻害することがなく、良好な吸着力を得ることができ
る。(3) Since the lower mask plate is provided with the magnetic permeability holes corresponding to the positions of the magnets, it is possible to obtain a good attracting force without obstructing the attraction of the upper mask plate by the magnets.
（４）膜付け作業前後の電子部品の嵌込みと取出しが、
上部マスク板を剥すだけであり、作業性が極めてよい。(4) Insertion and removal of electronic parts before and after film attachment work
Only the upper mask plate is peeled off, and workability is extremely good.
（５）膜付けパターンの変更時には、上部マスク板およ
び／または下部マスク板だけの交換が簡単にでき、多種
類のパターンに対する汎用性にすぐれている。(5) When changing the film forming pattern, only the upper mask plate and / or the lower mask plate can be easily replaced, and the versatility for various types of patterns is excellent.
（６）極薄のスペーサを使用でき、かつ変形することが
ない。(6) Ultra-thin spacers can be used and are not deformed.
第１図は本発明によるマスキング装置の一部を拡大した
Ａ−Ａ線断面図、第２図は第１図における各板の分解平
面図、第３図は孔位置の説明図、第４図は電子部品の斜
視図、第５図は従来装置の一部拡大断面図、第６図は第
５図における各板の分解平面図である。 （１）……被マスキング部材としての電子部品、（２）
……膜付け、（４）……膜付け孔、（６）……嵌込孔、
（７）……膜付け孔、（12）……ピン、（13）……位置
決め孔、（20a）（30a）……補助板、（20b）（30b）…
…マグネット保持板、（20c）……下部マスク板、（20
d）……スペーサ、（20e）……上部マスク板、（21）…
…透磁孔、（22）……マグネット、（23）……マグネッ
ト保持孔、（24）……にげ孔、（25）……にげ孔。FIG. 1 is an enlarged sectional view taken along the line AA of a masking device according to the present invention, FIG. 2 is an exploded plan view of each plate in FIG. 1, FIG. 3 is an explanatory view of hole positions, and FIG. Is a perspective view of an electronic component, FIG. 5 is a partially enlarged cross-sectional view of a conventional device, and FIG. 6 is an exploded plan view of each plate in FIG. (1) ... Electronic parts as masking members, (2)
…… Membrane attachment (4) …… Membrane attachment hole (6) …… Insertion hole,
(7) ...... Membrane attachment hole, (12) ...... Pin, (13) ...... Positioning hole, (20a) (30a) ...... Auxiliary plate, (20b) (30b) ...
… Magnet holding plate, (20c) …… Lower mask plate, (20
d) ... spacer, (20e) ... upper mask plate, (21) ...
… Magnetic permeability hole, (22) …… magnet, (23) …… magnet holding hole, (24) …… bake hole, (25) …… bake hole.
Claims (2)
れ被マスキング部材を収納した薄板からなるスペーサ
と、 前記スペーサの上部に配置され、各被マスキング部材の
位置に合わせて所定間隔で膜付け孔が穿設された磁性体
の薄板からなる上部マスク板と、 前記スペーサの下部に配置され、各被マスキング部材の
位置に合わせて所定間隔で膜付け孔が穿設され、多数の
透磁孔が穿設された非磁性体の薄板からなる下部マスク
板と、 前記下部マスク板の下部に配置され、前記下部マスク板
の膜付け孔の位置に合わせてにげ孔が穿設され、各被マ
スキング部材に対して少なくとも１個のマグネットが設
けられた非磁性体の薄板からなるマグネット保持板とを
具備し、 前記スペーサに穿設された透磁孔を前記マグネット保持
板に設けられたマグネットの位置に合わせて配置し、 前記スペーサの嵌込孔に収納された多数の被マスキング
部材と上部マスク板および下部マスク板を前記マグネッ
トの磁力により密着せしめてなることを特徴とするマス
キング装置。1. A spacer made of a thin plate in which a member to be masked is housed in a plurality of fitting holes formed at a predetermined interval, and the spacer is disposed above the spacer and at a predetermined interval according to the position of each member to be masked. An upper mask plate made of a magnetic thin plate having a film forming hole formed therein, and a film forming hole arranged at a lower portion of the spacer at a predetermined interval according to the position of each member to be masked. A lower mask plate made of a non-magnetic thin plate having a magnetic hole formed therein, and a lower mask plate arranged below the lower mask plate, and a bagged hole is formed at a position corresponding to a film forming hole of the lower mask plate. A magnet holding plate made of a non-magnetic thin plate on which at least one magnet is provided for each masked member, and a magnetic permeability hole formed in the spacer is provided in the magnet holding plate. Mug A masking device, which is arranged according to the position of the net, and a large number of members to be masked, which are housed in the fitting holes of the spacer, and the upper mask plate and the lower mask plate are brought into close contact with each other by the magnetic force of the magnet.
れた補助板を重合してなることを特徴とする請求項１記
載のマスキング装置。2. The masking device according to claim 1, wherein an auxiliary plate made of a magnetic material is superposed on the lower part of the magnet holding plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2117895A JPH0674498B2 (en) | 1990-05-08 | 1990-05-08 | Masking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2117895A JPH0674498B2 (en) | 1990-05-08 | 1990-05-08 | Masking device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0413858A JPH0413858A (en) | 1992-01-17 |
| JPH0674498B2 true JPH0674498B2 (en) | 1994-09-21 |
Family
ID=14722870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2117895A Expired - Lifetime JPH0674498B2 (en) | 1990-05-08 | 1990-05-08 | Masking device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0674498B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4724926B2 (en) * | 2001-02-19 | 2011-07-13 | 株式会社村田製作所 | Film forming jig, magnet used therefor, film forming apparatus and film forming method |
| JP4959933B2 (en) * | 2004-09-30 | 2012-06-27 | 京セラクリスタルデバイス株式会社 | Method for forming annular electrode film on annular material |
| JP4349531B2 (en) | 2006-10-27 | 2009-10-21 | Ｔｄｋ株式会社 | Mask device |
| JP2015100745A (en) * | 2013-11-25 | 2015-06-04 | 名古屋油化株式会社 | Masking method |
| TWI580806B (en) * | 2015-05-29 | 2017-05-01 | Production method of wafer - type thin film resistors |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5247534U (en) * | 1975-09-30 | 1977-04-04 | ||
| JPS53163351U (en) * | 1977-05-30 | 1978-12-21 | ||
| JPS6342155U (en) * | 1986-09-04 | 1988-03-19 | ||
| JPH01242768A (en) * | 1988-03-24 | 1989-09-27 | Fujitsu Ltd | Mask vapor deposition method |
-
1990
- 1990-05-08 JP JP2117895A patent/JPH0674498B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0413858A (en) | 1992-01-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0674498B2 (en) | Masking device | |
| JP2016166380A (en) | Deposition mask device and method for manufacturing electronic element | |
| JP6525691B2 (en) | Metal film application jig and manufacturing method of quartz crystal element | |
| JPS6334986A (en) | Magnetic sensor | |
| JPH08176800A (en) | Film forming mask device | |
| JP2007288601A (en) | Electromagnetic transducer | |
| JPH1042496A (en) | Linear motor | |
| JPH09202959A (en) | Formation of electrode of electronic parts and masking device used for the same | |
| JP2000080462A (en) | Masking device | |
| JPH10151074A (en) | Device of fixing knob to cover of pot and knob set with magnetic plate and magnet | |
| JP2001011598A (en) | Film forming mask deivce | |
| EP1464977B1 (en) | Magnet structure for nuclear magnetic resonance imaging apparatus | |
| JPS585986B2 (en) | How to load a substrate into a jig for attaching vapor-deposited electrodes | |
| JPH08113285A (en) | Holder for electronic part, such as quartz resonator | |
| JPH05230618A (en) | Mask for formation of thin film pattern and formation of thin film using same mask | |
| JP2007053570A (en) | Metal mask for crystal electrode deposition | |
| WO2021131275A1 (en) | Manufacturing method for ceramic electronic component and mask plate used in said manufacturing method | |
| JPH08325705A (en) | Film forming mask device | |
| JP3674021B2 (en) | Deposition mask device | |
| JP4959933B2 (en) | Method for forming annular electrode film on annular material | |
| JP2009246563A (en) | Method for manufacturing piezoelectric vibrator | |
| JPH0336102Y2 (en) | ||
| JPH02297085A (en) | Magnetic sensor and production thereof | |
| JPS61158121A (en) | Magnetic film forming device | |
| JP4131096B2 (en) | Circuit board manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080921 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080921 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090921 Year of fee payment: 15 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100921 Year of fee payment: 16 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100921 Year of fee payment: 16 |