JPH08148395A - Formation of electrode of electronic component - Google Patents

Abstract

PURPOSE: To provide formation of an external electrode whereby an electrode of an electronic component can be formed with high precision by dry plating. CONSTITUTION: By feeding an electronic component 1 under pressure into a hole 12 provided in an elastic plate 11, then warping a metal plate 13 having a pair of apertures 14, 14 at positions corresponding to the hole 12, and putting this plate 13 upon the elastic plate 11 with the peripheral portions thereof fixed, the metal plate 13 closely contacts the elastic plate 11 and the electronic component 1. By implementing dry plating to the electronic component 1 exposed in the apertures 14, 14, electrodes 16, 16 having no misalignment and sharp boundary portions can be formed. Thus, plating on other portions of the electronic component 1 which do not require plating may be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming electrodes on an electronic component by dry plating.

[0002]

2. Description of the Related Art Conventionally, in a method of forming an external electrode on an electronic component by dry plating, for example, as shown in FIGS. 4 and 5, a metal plate made of stainless steel or the like having a large number of cavities 2 for accommodating the electronic component 1 arranged side by side. Using the tool 3 and the metal mask 6 which is fixed on the metal jig 3 with screws 4 and provided with a pair of openings 5 and 5 at each position corresponding to each cavity 2, The electronic component 1 is housed in each of the cavities 2 and the metal mask 6 is fixed on the jig 3, and dry plating such as sputtering is performed from above the metal mask 6 toward the openings 5 and 5. As shown in FIG. 6, external electrodes 7 and 7 are provided in portions of the electronic component 1 facing the openings 5 and 5.
Was formed.

[0003]

However, in the conventional method for forming the external electrode, the cavity 2 is formed slightly larger than the electronic component 1 in order to deal with the dimensional variation of the electronic component 1 and the cavity 2, and the clearance is increased. It is necessary to store the electronic component 1 while keeping it. Therefore, the external electrodes 7, 7 formed on the electronic component 1 are misaligned, blurring occurs at the end boundary, and the clearance passes through the clearance portion. There is a problem that electrodes are attached to extra places.

Even if the metal mask 6 is fixed to the metal jig 3 with a few screws 4, the metal mask 6 is bent and floats due to heat applied during dry plating.
Since there is a gap between the electronic component 1 in the cavity 2 and the end boundaries of the external electrodes 7 and 7, blurring occurs, and
Since the structure is such that the metal jig 3 and the metal mask 6 are fixed by the screws 4, it takes time to assemble and disassemble, and there is a problem that workability is poor.

Therefore, an object of the present invention is to prevent misalignment in the formation of the electrodes, prevent the blurring of the end boundaries and the attachment of the electrodes to an extra portion, and improve the workability of the electronic parts. It is to provide a forming method.

[0006]

In order to solve the above-mentioned problems, the present invention has an elastic plate having a hole smaller than that of an electronic component, an opening for forming an electrode, and a warpage process. Using the metal plate for the mask that has been subjected to the mask, the electronic parts are press-fitted and attached to the holes of the elastic plate, the metal plate is overlaid and fixed on the elastic plate, and the electronic parts are dry-typed from the opening of the metal plate. This is a structure in which electrodes are formed by plating.

[0007]

[Function] When the electronic parts are press-fitted into the holes provided in the elastic plate and the portions where the electrodes are to be formed are exposed and a metal plate is overlaid and fixed on the elastic plate, the warping process applied to the metal plate is performed. As a result, the elastic plate and the electronic component come into close contact with the metal plate.

In this state, if the electronic component is dry-plated through the opening provided in the metal plate, an electrode can be formed on the electronic component, and the electronic component is elastically held by the hole of the elastic body. Therefore, the positioning is accurate, the displacement of the electrodes does not occur, the end boundary becomes clear, and the adhesion of the electrodes to the extra portions can be prevented.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.

As shown in the figure, the elastic plate 11 is made of a relatively hard rubber or an elastic material having the same effect, and is provided with a large number of holes 12 which are slightly smaller than the electronic component 1 side by side. The metal plate 13 on top is
The elastic plate 11 has a planar size substantially equal to that of the elastic plate 11, and a pair of openings 14, 14 are provided at positions corresponding to the holes 12.
Is provided.

The metal plate 13 is, for example, 0.1 to 0.1.
A stainless plate having a thickness of about 0.2 mm is used, and is warped so as to have an arc shape in one direction. In this warp processing, for example, R is about 150 mm.

The elastic plate 11 and this plate 1
The metal plate 13 superposed on the 1 is fixed at a plurality of peripheral positions by using clips 15, setscrews or the like, and both are fixed in an overlapping state.

Next, in order to form, for example, an external electrode on the electronic component, first, the electronic component 1 is press-fitted into each hole 12 of the elastic plate 11. The plan shape of the hole 12 is the electronic component 1
Since it is formed to be a little smaller than the planar shape of the electronic component 1, the inner periphery of the hole 12 is in close contact with the periphery of the electronic component 1 and stably holds the electronic component 1 at a fixed position, as shown in FIG. Only the surface on which the external electrode is to be formed is exposed at the upper opening of the hole 12.

Next, a metal plate 13 serving as a mask is placed on the upper surface of the elastic plate 11, and this metal plate 13 is placed.
A plurality of peripheral portions are fixed to the elastic plate 11 by the clips 15 so as to extend the warp applied to the elastic plate 11.

As shown in FIG. 2, if the warp resistance of the elastic plate 11 is made larger than the restoring force due to the warp applied to the metal plate 13, the whole becomes flat.
The elastic plate 11 may be warped along the warp.

As described above, the warped metal plate 1
When 3 and the elastic plate 11 are overlapped and the periphery is fixed, the overlapping surfaces are in close contact with each other, and the metal plate 13 is in close contact with the upper surface of the electronic component 1 as shown in FIG.

When the metal plate 13 is overlaid and fixed on the elastic plate 11, the metal plate 1 is placed on the hole 12.
3, the openings 14 and 14 are aligned, and the openings 14 and 14 are exposed only in the portion of the electronic component 1 where the external electrodes are to be formed.
The other part is covered with the metal plate 13.

In the above state, if the upper surface of the electronic component 1 exposed from the metal plate 13 to the openings 14, 14 is dry-plated, a pair of external electrodes 16, 1 are formed on the upper surface of the electronic component 1.
6 are formed.

In this dry plating, the metal plate 1
Since 3 is warped in advance, even if heat is applied during dry plating, the occurrence of reverse warp can be prevented, the close contact state between the metal plate 13 and the elastic plate 11 can be maintained, and the external electrode 16,
It is possible to prevent blurring at the boundary of 16, and since the periphery of the hole 12 of the elastic plate 11 is in close contact with the periphery of the electronic component 1, it is possible to prevent plating from adhering to an extra portion. Also, there is no displacement of the external electrodes 16, 16.

After forming the external electrodes 16, 16 by dry plating, the metal plate 13 may be removed from the elastic plate 11 and the electronic component 1 may be taken out from the hole 12.

Although the electronic component 1 is a chip coil in FIG. 3, it may be another electronic component. Also,
The electrodes formed on the electronic component 1 are not necessarily external electrodes, and may be other electrodes.

[0024]

As described above, according to the present invention, in the formation of the external electrode by the dry plating, it is possible to form an electrode with a clear boundary and no blur, and the position can be accurately formed. There is no plating adhesion, and the defect rate after dry dry plating can be greatly reduced.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an elastic plate and a metal plate used for implementing the present invention.

FIG. 2 is a perspective view showing an assembled state of the above.

FIG. 3 is an enlarged vertical cross-sectional view showing a state where external electrodes are formed on an electronic component.

FIG. 4 is an exploded perspective view of a metal jig and a metal mask showing conventional electrode formation.

FIG. 5 is an enlarged vertical sectional view showing a formation state of external electrodes in the above.

FIG. 6 is a perspective view of an electronic component provided with external electrodes.

[Explanation of symbols]

 11 Elastic Plate 12 Hole 13 Metal Plate 14 Opening 15 Clip 16 External Electrode

Claims (1)

[Claims] 1. An elastic plate having a hole smaller than that of an electronic component, and a metal plate for a mask having an opening for forming an electrode and having a warpage process are used. An electrode forming method for an electronic component, comprising: press-fitting and mounting an electronic component; stacking and fixing a metal plate on the elastic plate; and forming electrodes on the electronic component by dry plating from an opening of the metal plate.