JPH08779Y2 - 多層プリント板 - Google Patents

多層プリント板

Info

Publication number
JPH08779Y2
JPH08779Y2 JP1990086209U JP8620990U JPH08779Y2 JP H08779 Y2 JPH08779 Y2 JP H08779Y2 JP 1990086209 U JP1990086209 U JP 1990086209U JP 8620990 U JP8620990 U JP 8620990U JP H08779 Y2 JPH08779 Y2 JP H08779Y2
Authority
JP
Japan
Prior art keywords
pad
pattern
printed board
multilayer printed
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990086209U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0444177U (OSRAM
Inventor
淳 小嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP1990086209U priority Critical patent/JPH08779Y2/ja
Publication of JPH0444177U publication Critical patent/JPH0444177U/ja
Application granted granted Critical
Publication of JPH08779Y2 publication Critical patent/JPH08779Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1990086209U 1990-08-16 1990-08-16 多層プリント板 Expired - Fee Related JPH08779Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990086209U JPH08779Y2 (ja) 1990-08-16 1990-08-16 多層プリント板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990086209U JPH08779Y2 (ja) 1990-08-16 1990-08-16 多層プリント板

Publications (2)

Publication Number Publication Date
JPH0444177U JPH0444177U (OSRAM) 1992-04-15
JPH08779Y2 true JPH08779Y2 (ja) 1996-01-10

Family

ID=31817758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990086209U Expired - Fee Related JPH08779Y2 (ja) 1990-08-16 1990-08-16 多層プリント板

Country Status (1)

Country Link
JP (1) JPH08779Y2 (OSRAM)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5429055A (en) * 1977-08-09 1979-03-03 Shindo Denshi Kougiyou Kk Method of making print wiring substrate
JPS56148840A (en) * 1980-04-22 1981-11-18 Citizen Watch Co Ltd Mounting structure for ic
JPS61182096U (OSRAM) * 1985-05-07 1986-11-13
JPS62184774U (OSRAM) * 1986-05-15 1987-11-24
JPS6379064U (OSRAM) * 1986-11-11 1988-05-25
JPS6437079U (OSRAM) * 1987-08-31 1989-03-06
JPH0216035A (ja) * 1988-07-05 1990-01-19 Kubota Ltd 不等直径穴付ｆｒｐ成形品の製造法

Also Published As

Publication number Publication date
JPH0444177U (OSRAM) 1992-04-15

Similar Documents

Publication Publication Date Title
US6509530B2 (en) Via intersect pad for electronic components and methods of manufacture
JP3111053B2 (ja) 一次スルー・ホールおよび二次スルー・ホールを有する多層回路板
US5095407A (en) Double-sided memory board
US5083237A (en) Electronic parts and electronic device incorporating the same
JPH05198732A (ja) 集積回路モジュールの機能を変更する方法および装置
EP0204004B1 (en) Wiring structure of a terminal circuit
TW480691B (en) Printed-circuit board and method of mounting electric components thereon
JPH08779Y2 (ja) 多層プリント板
JP2642922B2 (ja) プリント配線基板
JP2789406B2 (ja) 回路基板
JP2715945B2 (ja) ボールグリッドアレイパッケージの実装構造
US20040055782A1 (en) Surface-mounting type electronic circuit unit having no melting of solder attaching electric part thereto
JPH05102621A (ja) 導電パターン
JPH07183627A (ja) 部品実装プリント基板
JP2000244128A (ja) 多層プリント配線基板及びそれを用いたチップ型３端子ノイズフィルタの実装構造
JPH0231800Y2 (OSRAM)
JP2004327605A (ja) プリント基板の接続構造
JPH11112152A (ja) フリップチップ実装の多層プリント基板
JP2817715B2 (ja) ボールグリッドアレイ型回路基板
JP2522585Y2 (ja) ドーナツ型ジヤンパ線ユニツト
JPH06314885A (ja) プリント多層配線基板モジュール
JPS62208691A (ja) 両面実装型混成集積回路
JPH06216477A (ja) 配線基板及びこれを用いた電子回路装置
JPS62132396A (ja) チツプ部品の実装方法
JPH05121261A (ja) チツプ部品およびチツプ部品取付構造

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees