JPH08762Y2 - 半導体装置用フレ−ム - Google Patents

半導体装置用フレ−ム

Info

Publication number
JPH08762Y2
JPH08762Y2 JP10044086U JP10044086U JPH08762Y2 JP H08762 Y2 JPH08762 Y2 JP H08762Y2 JP 10044086 U JP10044086 U JP 10044086U JP 10044086 U JP10044086 U JP 10044086U JP H08762 Y2 JPH08762 Y2 JP H08762Y2
Authority
JP
Japan
Prior art keywords
lead
leads
semiconductor device
frame
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP10044086U
Other languages
English (en)
Japanese (ja)
Other versions
JPS636747U (US07642317-20100105-C00010.png
Inventor
将昭 下斗米
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10044086U priority Critical patent/JPH08762Y2/ja
Publication of JPS636747U publication Critical patent/JPS636747U/ja
Application granted granted Critical
Publication of JPH08762Y2 publication Critical patent/JPH08762Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP10044086U 1986-06-30 1986-06-30 半導体装置用フレ−ム Expired - Lifetime JPH08762Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10044086U JPH08762Y2 (ja) 1986-06-30 1986-06-30 半導体装置用フレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10044086U JPH08762Y2 (ja) 1986-06-30 1986-06-30 半導体装置用フレ−ム

Publications (2)

Publication Number Publication Date
JPS636747U JPS636747U (US07642317-20100105-C00010.png) 1988-01-18
JPH08762Y2 true JPH08762Y2 (ja) 1996-01-10

Family

ID=30970265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10044086U Expired - Lifetime JPH08762Y2 (ja) 1986-06-30 1986-06-30 半導体装置用フレ−ム

Country Status (1)

Country Link
JP (1) JPH08762Y2 (US07642317-20100105-C00010.png)

Also Published As

Publication number Publication date
JPS636747U (US07642317-20100105-C00010.png) 1988-01-18

Similar Documents

Publication Publication Date Title
JPS6298759A (ja) 電子デバイス
JPH08762Y2 (ja) 半導体装置用フレ−ム
JPS63179557A (ja) 半導体装置用リ−ドフレ−ム
JP2890621B2 (ja) 混成集積回路装置
JPH073645Y2 (ja) 半導体装置用リードフレーム
JPH0519958Y2 (US07642317-20100105-C00010.png)
JPH043508Y2 (US07642317-20100105-C00010.png)
JPH02285665A (ja) リードフレーム
JPH0546282Y2 (US07642317-20100105-C00010.png)
JP2548071B2 (ja) ワイヤーボンディング用テーブル及びワイヤーボンディング方法
JPH0526743Y2 (US07642317-20100105-C00010.png)
US6651868B2 (en) Workpiece retainer for a bonding apparatus
JP2805912B2 (ja) 半導体素子認識補正方法
JPS6233344Y2 (US07642317-20100105-C00010.png)
JPH01258436A (ja) Ｔａｂ　ｉｃのリードフレーム
JP3336834B2 (ja) リードフレーム
JPH0546280Y2 (US07642317-20100105-C00010.png)
JPS63248155A (ja) 半導体装置
JPH02240954A (ja) 半導体装置用リードフレーム
JPH0471288A (ja) 半導体実装基板
JPH02253649A (ja) 半導体装置用リードフレーム
JPH03104146A (ja) 樹脂封止型半導体装置用リードフレーム
JPH02156662A (ja) 樹脂封止型半導体装置
JPH06112394A (ja) 集積回路装置
JPS61255043A (ja) 電子部品装置