JPH086033Y2 - ハンダディップコータの消火装置 - Google Patents
ハンダディップコータの消火装置Info
- Publication number
- JPH086033Y2 JPH086033Y2 JP1990014495U JP1449590U JPH086033Y2 JP H086033 Y2 JPH086033 Y2 JP H086033Y2 JP 1990014495 U JP1990014495 U JP 1990014495U JP 1449590 U JP1449590 U JP 1449590U JP H086033 Y2 JPH086033 Y2 JP H086033Y2
- Authority
- JP
- Japan
- Prior art keywords
- injection nozzle
- solder dip
- dip coater
- solder
- fire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 34
- 238000002347 injection Methods 0.000 claims description 37
- 239000007924 injection Substances 0.000 claims description 37
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 230000002159 abnormal effect Effects 0.000 claims description 4
- 239000003595 mist Substances 0.000 description 7
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/006—Safety devices for welding or cutting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Coating With Molten Metal (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990014495U JPH086033Y2 (ja) | 1990-02-15 | 1990-02-15 | ハンダディップコータの消火装置 |
| KR1019910002409A KR920005829A (ko) | 1990-02-15 | 1991-02-13 | 땜납디프코오터의 소화장치 및 이 장치를 가지는 땜납디프코오터 |
| KR2019930024409U KR940002031Y1 (ko) | 1990-02-15 | 1993-11-19 | 땜납디프코오터의 소화장치 및 이 장치를 가지는 땜납디프코오터 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990014495U JPH086033Y2 (ja) | 1990-02-15 | 1990-02-15 | ハンダディップコータの消火装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03106351U JPH03106351U (enrdf_load_stackoverflow) | 1991-11-01 |
| JPH086033Y2 true JPH086033Y2 (ja) | 1996-02-21 |
Family
ID=11862641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990014495U Expired - Lifetime JPH086033Y2 (ja) | 1990-02-15 | 1990-02-15 | ハンダディップコータの消火装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH086033Y2 (enrdf_load_stackoverflow) |
| KR (2) | KR920005829A (enrdf_load_stackoverflow) |
-
1990
- 1990-02-15 JP JP1990014495U patent/JPH086033Y2/ja not_active Expired - Lifetime
-
1991
- 1991-02-13 KR KR1019910002409A patent/KR920005829A/ko not_active Withdrawn
-
1993
- 1993-11-19 KR KR2019930024409U patent/KR940002031Y1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR920005829A (ko) | 1992-04-03 |
| JPH03106351U (enrdf_load_stackoverflow) | 1991-11-01 |
| KR940002031Y1 (ko) | 1994-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2001050660A5 (enrdf_load_stackoverflow) | ||
| JPH086033Y2 (ja) | ハンダディップコータの消火装置 | |
| KR20200102082A (ko) | 엔진룸 온도감지 및 소화시스템 | |
| JPH0390579A (ja) | 薄膜形成装置 | |
| WO2000042373A1 (fr) | Technique de séchage de substrat et dispositif correspondant | |
| KR19980051761A (ko) | 반도체 제조용 자동시너공급장치 및 자동시너공급방법 | |
| JPH0541155A (ja) | 塗膜形成装置 | |
| JP3247673B2 (ja) | ウェハ乾燥装置及び方法 | |
| JPH0783173B2 (ja) | フラックス被着装置 | |
| JP2000065334A (ja) | 灰溶融炉用灰加湿供給装置 | |
| JP3623654B2 (ja) | 基板処理装置 | |
| JP2000031112A (ja) | 基板処理装置 | |
| JP3859756B2 (ja) | 消火システム | |
| JPS63104781A (ja) | 消火装置を備えたフラクサ− | |
| JP2001146212A (ja) | 給湿装置 | |
| JP2003179336A (ja) | 部分フラックス塗布方法 | |
| KR19990017913A (ko) | 차체 자동도장기의 자동화재진압장치 | |
| JP2019209335A (ja) | 塗布装置および塗布方法 | |
| KR200141648Y1 (ko) | 차량도장용 에어커튼건 유닛 | |
| JPS56124468A (en) | Method and apparatus for coating | |
| JPH051339Y2 (enrdf_load_stackoverflow) | ||
| JPH11172396A (ja) | 溶融めっき設備の空中浮揚ポット | |
| JPH04280996A (ja) | メッキ装置 | |
| JPH10290066A (ja) | 部品搭載方法及び装置 | |
| JPH0549980A (ja) | 自動塗装装置 |