JPH085550Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH085550Y2
JPH085550Y2 JP1989124255U JP12425589U JPH085550Y2 JP H085550 Y2 JPH085550 Y2 JP H085550Y2 JP 1989124255 U JP1989124255 U JP 1989124255U JP 12425589 U JP12425589 U JP 12425589U JP H085550 Y2 JPH085550 Y2 JP H085550Y2
Authority
JP
Japan
Prior art keywords
conductive adhesive
bump electrode
adhesive layer
bonding pad
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989124255U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363929U (enExample
Inventor
勇次 松田
久雄 川口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989124255U priority Critical patent/JPH085550Y2/ja
Publication of JPH0363929U publication Critical patent/JPH0363929U/ja
Application granted granted Critical
Publication of JPH085550Y2 publication Critical patent/JPH085550Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/071—
    • H10W72/01215—
    • H10W72/245—

Landscapes

  • Wire Bonding (AREA)
JP1989124255U 1989-10-23 1989-10-23 半導体装置 Expired - Lifetime JPH085550Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989124255U JPH085550Y2 (ja) 1989-10-23 1989-10-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989124255U JPH085550Y2 (ja) 1989-10-23 1989-10-23 半導体装置

Publications (2)

Publication Number Publication Date
JPH0363929U JPH0363929U (enExample) 1991-06-21
JPH085550Y2 true JPH085550Y2 (ja) 1996-02-14

Family

ID=31672187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989124255U Expired - Lifetime JPH085550Y2 (ja) 1989-10-23 1989-10-23 半導体装置

Country Status (1)

Country Link
JP (1) JPH085550Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008136304A1 (ja) * 2007-04-28 2008-11-13 Futoshi Kimura ゴルフパター練習装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276237A (ja) * 1987-05-08 1988-11-14 Citizen Watch Co Ltd 基板へのｉｃボンディング方法
JPH0793306B2 (ja) * 1987-08-05 1995-10-09 日本電装株式会社 半導体集積回路装置
JPH06103701B2 (ja) * 1988-03-11 1994-12-14 松下電器産業株式会社 半導体装置の実装体

Also Published As

Publication number Publication date
JPH0363929U (enExample) 1991-06-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term