JPH08510598A - 表面の微小機械的構造の製造方法 - Google Patents
表面の微小機械的構造の製造方法Info
- Publication number
- JPH08510598A JPH08510598A JP6524696A JP52469694A JPH08510598A JP H08510598 A JPH08510598 A JP H08510598A JP 6524696 A JP6524696 A JP 6524696A JP 52469694 A JP52469694 A JP 52469694A JP H08510598 A JPH08510598 A JP H08510598A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- etch
- vapor phase
- silicon
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
- B81C1/00936—Releasing the movable structure without liquid etchant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Weting (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.珪素基板(9)上に犠牲エッチ層(14)が析出されかつ構造化され、犠牲 エッチ層(14)上に第二層(15)が析出されかつ構造化され、犠牲エッチ層 (14)が、エッチプロセスで犠牲エッチ層(14)をエッチするが、第二層( 15)をエッチしないエッチ媒体で除去され、それによって除去された犠牲エッ チ層(14)の厚さの間隔をおいて珪素基板(9)上に自立しておりかつ珪素基 板(9)上の若干の位置で固定されている構造(7)が形成されることから成る 、表面微小機械的構造の製造方法において、微小機械的構造(7)の露出のため に珪素基板(9)が弗化水素酸(HF)及び水から成る混合物の蒸気相に暴露さ れることを特徴とする、表面微小機械的構造の製造方法。 2.珪素ウエファー(3)が蒸気相エッチングの際、共沸弗化水素酸溶液(38 .26%)を含有する容器(2)の上方に配置されておりかつ露出すべき構造を 有する珪素ウエファー(3)の表面(4)が容器内室に向けられておりかつ飽和 蒸気相に暴露されている、請求項1記載の方法。 3.珪素ウエファー(3)が蒸気相エッチングの間加熱される(加熱装置5)、 請求項1又は2記載の方法。 4.凝縮がポンプによって防止される、請求項1から3までのいずれか1項記載 の方法。 5.第二層(15)が多珪素(Polysilizium)から成り、犠牲エッチ層(14) がドープされていない酸化珪素から成りかつ無水弗化水素酸と水とから成る混合 物の蒸気相中での蒸気相エッチングで除去され、次の洗浄及び乾燥が行われない 、請求項1から4までのいずれか1項記載の方法。 6.蒸気相エッチングの際、エッチ速度を制御するために、珪素ウエファー(3 )の表面(4)上の水分が特定の値に調節される、請求項5記載の方法。 7.珪素ウエファー(3)上に配置された付加的電気回路が、蒸気相エッチング 前にエッチ媒体からの保護のためにフォトレジストから成る保護膜によって被わ れかつ同保護膜が蒸気相エッチング後にフォトレジストストリッパー(Fotolack stripper)で酸素プラズマを用いて除去される、請求項5又は6記載の方法。 8.蒸気相エッチング前に、フォトレジストから成る補強部材(11)が、特に 大きい構造を有する露出すべき構造(プレート7)と珪素基板(9)との間のブ リッジとして製作され;蒸気相エッチングの際に犠牲エッチ層の除去によって構 造(プレート7)が露出されかつエッチ抵抗性フォトレジスト補強部材(11) によって同構造の出発位置で安定化され ;かつ蒸気相エッチング後に補強部材(11)が酸素プラズマで除去される、請 求項5から7までのいずれか1項記載の方法。 9.閉鎖された構造を製造するためには、蒸気相エッチング前に、蒸気相中で徐 々にかつ残留物なしにエッチされかつLPCVD−蒸着(Low Pressure Chemica l Vapor Disposed)にも適合している材料から成る補強部材(11)が、特に大 きな構造の露出すべき構造(プレート7)と珪素基板(9)との間のブリッジと して製作され;LPCVD−蒸着における閉鎖部材(Kapselung)として、露出 すべき構造へ通じるエッチ孔(13)を有するもう一つの層(カバー12)が取 付けられており;蒸気相エッチングによる第1エッチ工程で犠牲エッチ層の酸化 珪素が完全に除去され、徐々にエッチされる補強部材(11)は一部分しかエッ チされず;引続くエッチによる第2エッチ工程では補強部材(11)が除去され かつ構造が露出されかつ次にもう一つの層の析出によって閉鎖部材が閉じられ、 ウエファーが引続き加工されかつ個別化される、請求項5又は6記載の方法。 10.一時的補強部材(11)として薄い多珪素層が使用され、酸化珪素から成る 犠牲エッチ層に対する多珪素層のエッチ選択性が酸素移植によって適確に調節さ れる、請求項9記載の方法。 11.個別化(Vereinzelung)が蒸気相エッチング前に行われかつ蒸気相エッチン グがチップ面上で行われる、請求項5から10までのいずれか1項記載の方法。 12.さらにテスト構造が取付けられていて、そこには多珪素から成る第二層(1 5)の範囲及び珪素基板(9)がそれらの間に存在する、誘電体としての犠牲エ ッチ層を有するコンデンサ極板として接触され(接触先端部18,19)、蒸気 相エッチングの間に犠牲エッチ層(14)を空気と代えると有効相対誘電率が下 りかつ相応の容量信号によりエッチの進行が追求され、場合により制御される、 請求項5から11までのいずれか1項記載の方法。 13.第二層(15)上に接触先端部(18)が圧力で装着されていて、テスト構 造が犠牲エッチ層(14)の除去後に接触先端部(18)によって圧縮され、こ れによって第二層(15)が珪素基板(9)に密着して、ショートもしくは容量 信号の急激な増大が行われ、これによってエッチプロセスの終了が表示される、 請求項1記載の方法。 14.第二層が多珪素から成り、犠牲エッチ層がドープされた酸化珪素から成り; 犠牲エッチ層を除去するためのエッチプロセス前に、徐々にエッチされる材料、 特に酸素移植による多珪素から成る補強部材が露出すべき構造と珪素基板との間 のブリッジとして 製作され;エッチ媒体の液相中での第1エッチ工程で犠牲エッチ層が完全に除去 され、この際徐々にエッチされる補強部材は一部分しかエッチされず、該部材の 補強機能を引続き果しており;珪素ウエファーが洗浄されかつ遠心分離によって 乾燥され、この際補強部材はそれらの位置で構造を保持しかつ基板表面上での付 着を防止し;かつ蒸気相エッチングによる第2工程で補強部材が除去され、これ によって構造が露出される、請求項1から4までのいずれか1項記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4317274A DE4317274A1 (de) | 1993-05-25 | 1993-05-25 | Verfahren zur Herstellung oberflächen-mikromechanischer Strukturen |
DE4317274.1 | 1993-05-25 | ||
PCT/DE1994/000538 WO1994028426A1 (de) | 1993-05-25 | 1994-05-11 | Verfahren zur herstellung oberflächen-mikromechanischer strukturen |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08510598A true JPH08510598A (ja) | 1996-11-05 |
JP3691056B2 JP3691056B2 (ja) | 2005-08-31 |
Family
ID=6488803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52469694A Expired - Lifetime JP3691056B2 (ja) | 1993-05-25 | 1994-05-11 | 表面の微小機械的構造の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5683591A (ja) |
EP (1) | EP0700524B1 (ja) |
JP (1) | JP3691056B2 (ja) |
DE (2) | DE4317274A1 (ja) |
WO (1) | WO1994028426A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005212032A (ja) * | 2004-01-29 | 2005-08-11 | M Fsi Kk | Memsデバイス向け基板表面の処理方法 |
JP4727794B2 (ja) * | 1999-08-28 | 2011-07-20 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 表面マイクロマシニング型構造体の製法 |
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GB2198611B (en) * | 1986-12-13 | 1990-04-04 | Spectrol Reliance Ltd | Method of forming a sealed diaphragm on a substrate |
US5174855A (en) * | 1989-04-28 | 1992-12-29 | Dainippon Screen Mfg. Co. Ltd. | Surface treating apparatus and method using vapor |
EP0456029B1 (en) * | 1990-05-10 | 1994-12-14 | Yokogawa Electric Corporation | Vibrating type pressure measuring device |
US5369544A (en) * | 1993-04-05 | 1994-11-29 | Ford Motor Company | Silicon-on-insulator capacitive surface micromachined absolute pressure sensor |
-
1993
- 1993-05-25 DE DE4317274A patent/DE4317274A1/de not_active Ceased
-
1994
- 1994-05-11 WO PCT/DE1994/000538 patent/WO1994028426A1/de active IP Right Grant
- 1994-05-11 DE DE59409076T patent/DE59409076D1/de not_active Expired - Lifetime
- 1994-05-11 EP EP94915017A patent/EP0700524B1/de not_active Expired - Lifetime
- 1994-05-11 US US08/553,571 patent/US5683591A/en not_active Expired - Lifetime
- 1994-05-11 JP JP52469694A patent/JP3691056B2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4727794B2 (ja) * | 1999-08-28 | 2011-07-20 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 表面マイクロマシニング型構造体の製法 |
JP2005212032A (ja) * | 2004-01-29 | 2005-08-11 | M Fsi Kk | Memsデバイス向け基板表面の処理方法 |
Also Published As
Publication number | Publication date |
---|---|
DE59409076D1 (de) | 2000-02-17 |
EP0700524A1 (de) | 1996-03-13 |
EP0700524B1 (de) | 2000-01-12 |
US5683591A (en) | 1997-11-04 |
WO1994028426A1 (de) | 1994-12-08 |
DE4317274A1 (de) | 1994-12-01 |
JP3691056B2 (ja) | 2005-08-31 |
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