SE9500849D0 - Methods for the manufacturing of micromachined structures and micromachined structures manufactured using such methods - Google Patents

Methods for the manufacturing of micromachined structures and micromachined structures manufactured using such methods

Info

Publication number
SE9500849D0
SE9500849D0 SE9500849A SE9500849A SE9500849D0 SE 9500849 D0 SE9500849 D0 SE 9500849D0 SE 9500849 A SE9500849 A SE 9500849A SE 9500849 A SE9500849 A SE 9500849A SE 9500849 D0 SE9500849 D0 SE 9500849D0
Authority
SE
Sweden
Prior art keywords
methods
pct
micromachined structures
contact zone
substrate
Prior art date
Application number
SE9500849A
Other languages
English (en)
Inventor
Elisabeth Smela
Ove Oehman
Olle Inganaas
Ingemar Lundstroem
Original Assignee
Pharmacia Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pharmacia Ab filed Critical Pharmacia Ab
Priority to SE9500849A priority Critical patent/SE9500849D0/sv
Publication of SE9500849D0 publication Critical patent/SE9500849D0/sv
Priority to PCT/SE1996/000308 priority patent/WO1996028841A1/en
Priority to US08/913,232 priority patent/US6103399A/en
Priority to EP96906987A priority patent/EP0870319B1/en
Priority to AU50179/96A priority patent/AU5017996A/en
Priority to JP52751496A priority patent/JP4056559B2/ja
Priority to DE69634010T priority patent/DE69634010T2/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00952—Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y10T428/12396—Discontinuous surface component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y10T428/12549—Adjacent to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674—Ge- or Si-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
SE9500849A 1995-03-10 1995-03-10 Methods for the manufacturing of micromachined structures and micromachined structures manufactured using such methods SE9500849D0 (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE9500849A SE9500849D0 (sv) 1995-03-10 1995-03-10 Methods for the manufacturing of micromachined structures and micromachined structures manufactured using such methods
PCT/SE1996/000308 WO1996028841A1 (en) 1995-03-10 1996-03-08 A method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method
US08/913,232 US6103399A (en) 1995-03-10 1996-03-08 Method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method
EP96906987A EP0870319B1 (en) 1995-03-10 1996-03-08 A method for the manufacturing of micromachined structures
AU50179/96A AU5017996A (en) 1995-03-10 1996-03-08 A method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method
JP52751496A JP4056559B2 (ja) 1995-03-10 1996-03-08 マイクロ機械加工構造物の製法およびかかる方法を使用して製造されたマイクロ機械加工構造物
DE69634010T DE69634010T2 (de) 1995-03-10 1996-03-08 Ein verfahren zum herstellen von mikrogefertigten strukturen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9500849A SE9500849D0 (sv) 1995-03-10 1995-03-10 Methods for the manufacturing of micromachined structures and micromachined structures manufactured using such methods

Publications (1)

Publication Number Publication Date
SE9500849D0 true SE9500849D0 (sv) 1995-03-10

Family

ID=20397494

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9500849A SE9500849D0 (sv) 1995-03-10 1995-03-10 Methods for the manufacturing of micromachined structures and micromachined structures manufactured using such methods

Country Status (7)

Country Link
US (1) US6103399A (sv)
EP (1) EP0870319B1 (sv)
JP (1) JP4056559B2 (sv)
AU (1) AU5017996A (sv)
DE (1) DE69634010T2 (sv)
SE (1) SE9500849D0 (sv)
WO (1) WO1996028841A1 (sv)

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US6245444B1 (en) * 1997-10-02 2001-06-12 New Jersey Institute Of Technology Micromachined element and method of fabrication thereof
US6206914B1 (en) 1998-04-30 2001-03-27 Medtronic, Inc. Implantable system with drug-eluting cells for on-demand local drug delivery
US6101371A (en) * 1998-09-12 2000-08-08 Lucent Technologies, Inc. Article comprising an inductor
SE519023C2 (sv) 1999-06-21 2002-12-23 Micromuscle Ab Kateterburna mikrokirurgiska verktygsset
US6677225B1 (en) * 2000-07-14 2004-01-13 Zyvex Corporation System and method for constraining totally released microcomponents
WO2002041004A2 (en) * 2000-11-16 2002-05-23 Burstein Technologies, Inc. Optical biodiscs with reflective layers
US6812217B2 (en) 2000-12-04 2004-11-02 Medtronic, Inc. Medical device and methods of use
US6534249B2 (en) * 2001-02-09 2003-03-18 Xerox Corporation Method of making low cost integrated out-of-plane micro-device structures
US6838228B2 (en) * 2001-05-14 2005-01-04 Fairchild Semiconductor Corporation System to enable photolithography on severe structure topologies
DE10133014B4 (de) * 2001-07-06 2005-01-20 Forschungszentrum Karlsruhe Gmbh Verfahren zur Erzeugung von dreidimensionalen, mikrostrukturierten Komponenten
US7033514B2 (en) * 2001-08-27 2006-04-25 Micron Technology, Inc. Method and apparatus for micromachining using a magnetic field and plasma etching
WO2003025991A1 (en) * 2001-09-17 2003-03-27 Advion Biosciences, Inc. Fabrication of a microchip-based electrospray device
US6777319B2 (en) * 2001-12-19 2004-08-17 Formfactor, Inc. Microelectronic spring contact repair
SE0104452D0 (sv) * 2001-12-28 2001-12-28 Forskarpatent I Vaest Ab Metod för framställning av nanostrukturer in-situ, och in-situ framställda nanostrukturer
US6762116B1 (en) * 2002-06-12 2004-07-13 Zyvex Corporation System and method for fabricating microcomponent parts on a substrate having pre-fabricated electronic circuitry thereon
US7047638B2 (en) * 2002-07-24 2006-05-23 Formfactor, Inc Method of making microelectronic spring contact array
US7270940B2 (en) * 2002-12-18 2007-09-18 International Business Machines Corporation Method of structuring of a substrate
SE526192C2 (sv) * 2003-04-17 2005-07-26 Micromuscle Ab Metod för att framställa en anordning
US7096568B1 (en) 2003-07-10 2006-08-29 Zyvex Corporation Method of manufacturing a microcomponent assembly
US7025619B2 (en) * 2004-02-13 2006-04-11 Zyvex Corporation Sockets for microassembly
US6923669B1 (en) * 2004-02-13 2005-08-02 Zyvex Corporation Microconnectors and non-powered microassembly therewith
US6956219B2 (en) * 2004-03-12 2005-10-18 Zyvex Corporation MEMS based charged particle deflector design
US7081630B2 (en) * 2004-03-12 2006-07-25 Zyvex Corporation Compact microcolumn for automated assembly
US8152992B2 (en) * 2004-08-31 2012-04-10 University Of Maryland Cell-based sensing: biological transduction of chemical stimuli to electrical signals (nose-on-a-chip)
US7456092B2 (en) * 2004-10-07 2008-11-25 Palo Alto Research Center Incorporated Self-releasing spring structures and methods
US7314382B2 (en) 2005-05-18 2008-01-01 Zyvex Labs, Llc Apparatus and methods of manufacturing and assembling microscale and nanoscale components and assemblies
DE102006005517B3 (de) * 2006-02-07 2007-03-15 Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. Ventil
US9242073B2 (en) 2006-08-18 2016-01-26 Boston Scientific Scimed, Inc. Electrically actuated annelid
US7605377B2 (en) * 2006-10-17 2009-10-20 Zyvex Corporation On-chip reflectron and ion optics
US7761966B2 (en) * 2007-07-16 2010-07-27 Touchdown Technologies, Inc. Method for repairing a microelectromechanical system
DE102018203065A1 (de) * 2018-03-01 2019-09-05 Robert Bosch Gmbh Verfahren zur Herstellung eines Injektors
CN110643038A (zh) * 2019-09-30 2020-01-03 天津大学 一种基于聚吡咯-宣纸致动器的制备方法

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
US5015906A (en) * 1989-11-03 1991-05-14 Princeton University Electrostatic levitation control system for micromechanical devices
JP2923813B2 (ja) * 1991-06-11 1999-07-26 キヤノン株式会社 カンチレバー型変位素子、及びこれを用いた走査型トンネル顕微鏡、情報処理装置
DE4223215C2 (de) * 1992-07-15 1996-07-11 Bosch Gmbh Robert Verfahren zur Bearbeitung von Siliziumwafern
DE4317274A1 (de) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Verfahren zur Herstellung oberflächen-mikromechanischer Strukturen
US5475318A (en) * 1993-10-29 1995-12-12 Robert B. Marcus Microprobe
US5447600A (en) * 1994-03-21 1995-09-05 Texas Instruments Polymeric coatings for micromechanical devices
US5472539A (en) * 1994-06-06 1995-12-05 General Electric Company Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components
DE4423396C2 (de) * 1994-07-04 2001-10-25 Fraunhofer Ges Forschung Verfahren zum Herstellen einer mikromechanischen Oberflächenstruktur
US5658636A (en) * 1995-01-27 1997-08-19 Carnegie Mellon University Method to prevent adhesion of micromechanical structures
US5665648A (en) * 1995-12-21 1997-09-09 Hughes Electronics Integrated circuit spring contact fabrication methods
US5796152A (en) * 1997-01-24 1998-08-18 Roxburgh Ltd. Cantilevered microstructure

Also Published As

Publication number Publication date
WO1996028841A1 (en) 1996-09-19
EP0870319B1 (en) 2004-12-08
AU5017996A (en) 1996-10-02
JP4056559B2 (ja) 2008-03-05
EP0870319A1 (en) 1998-10-14
JPH11502061A (ja) 1999-02-16
DE69634010T2 (de) 2005-12-15
US6103399A (en) 2000-08-15
DE69634010D1 (de) 2005-01-13

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